MOBILE PHONE INTERGRATED CIRCUIT (ICS)

INTRODUCTION ABOUT MOBILE PHONE INTEGRATED CIRCUIT

Integrated Circuits

There are Complete notes about Main IC's in mobile phones and How can you
identify its. Not only that but also you can get a real idea about mobile phone
damages or faults which are comes with IC. Specially there are three main type IC s
in mobile phone. These are

i. Pin IC
ii. Path IC
iii. MBGA ( Micro Ball Grid Array )/Ball type IC

Pin IC

Integrated Circuits are complex circuits which have been etched onto tiny chips of
semiconductor. When we think about Pin IC, The chip is packaged in a plastic holder
with pins which will fit the holes on stripboard and breadboards. Very fine wires
inside the package link the chip to the pins.

How Can we numbering the Pins in IC

These pins are which is in Pin IC have been numbered for finding more 100%
correctly details about its circuitit. Number 1 is which we can see when we checking
anti-clockwise around the IC (chip) starting near the notch or dot.
You can mount and unmount or replace these IC s using SMD rework station.
However when you replace like this IC you must mount all pin to the PCB and do not
short circuit.Specially Latest mobile phones have not like this IC s. But when you
training to mount and unmount these Ic s then you will be able to replace chinease
phone display , Switches ... etc.

Path IC
When you check your mobile phone PCB , you will be unable to find these
ICs quickly .But when you unmount these ICs you can easily identify thats. following
images will be helpfull for undersanding about its ecternal appearance.

Majority ,Power Amp and Antenna Switch are come as this type of IC.However you
can mount and unmount easily using SMD Rework station. But unfortunately we can
see only two or three ICs on common mobile phones.

MBGA( Micro Ball Grid Array)

The BGA is descended from the pin grid array (PGA), which is a package with one
face covered (or partly covered) with pins in a grid pattern. These pins conduct
electrical signals from the integrated circuit to the printed circuit board (PCB) on
which it is placed. In a BGA, the pins are replaced by balls of solder stuck to the
bottom of the package.
These solder spheres can be placed manually or with automated equipment. The
solder spheres are held in place with a tacky flux until soldering occurs.The device is
placed on a PCB with copper pads in a pattern that matches the solder balls. The
assembly is then heated, either in a reflow oven or by an infrared heater, causing the
solder balls to melt. Surface tension causes the molten solder to hold the package in
alignment with the circuit board, at the correct separation distance, while the solder
cools and solidifies.(wikipedia)

You can use Infared , Laser or manual SMD rework station for removing or mounting
for BGA. When you have remove BGA IC firstly you want Clean PCB surface and
Reballing IC and pcb surface.

After Reballing you can see IC and PCB as following

Finally you can mount new or reballed IC using Laser, Infared or manual SMD
Rework stations.

Specially Before you Remove your BGA IC firstly try to solve damage soldering or
heating. then you can remove that damage IC and try to replace new one. When you
replace that IC some times your phone will be short circuit , if it is short circuit never
try to Switch on and try to Soldering otherwise replace again it. However you want
get a good experience for doing that therefore you can practice with dead or damage
phones.

LIST OF MAJOR MOBILE PHONE INTERGRATED CIRCUIT WITH THEIR

FUNCTIONS AND FAULTS

We can divide all Mobile phone damages as Hardware , Software and Settings
faults. when we think about hardware damages or faults mainly we want to know
what are the main ICs and faults comes with IC. Old phones had ICs more than latest
phones. However when you get complete idea about that ICs then you will be able to
find solution for damages in your phone properly.Check following list of ICs and try to
understand about that faults.

 Power Amp
 Antenna Switch
 RF Processor (hagar IC)
 Power IC
 CPU
 Charging IC
 Flash IC ( ROM orEEPROM)
 Oscillator (VCO)
 Sim IC
 Key Pad IC
  LCD Light control IC

Power Amp
This is a very important IC for Transmiting signal(Tx) in your phone. This IC is work
as a Tx amplifier and it get high voltage directly from the battery.When it is
damage we can see following faults.

i. Signal Drop
ii. No Network or Access
iii. Battery low quickly
iv. Cant make a call ( Tx not work properly )
v. Power on failure
vi. Phone will heat

Antenna Switch
Antenna switch is help to filtering frequency Bands as 900Mhz , 1800Mhz and
connect Rx ,Tx( Receiver and Transmitter). Therefore when damage this IC we can
see faults as following.

i. Signal Drop
ii. No Network found
iii. Some Frequency band are not worked properly
RF Processor ( Hagar IC)
RF( Radio Frequency ) Processor is a main IC in your phone PCB. This IC is used
for processing Rx and Tx signal ( for Modulating and Demodulating). sometimes it
make a low frequency clock signal is used to start CPU functions. Therefore when
damage this IC we can see faults as following.

i. Power on failure
ii. Signal drop
iii. No network
iv. Caller drop
v. Rx or Tx or both are not work properly
vi. Battery empty quickly and phone will heat

Power IC
Power IC distribute current to all the components and IC in PCB. we can think that, it
is work as voltage regulator therefore if it is worked not properly phone will not
be power on. specially we can see some times some applications are not working
because of Power IC is damage.(when power ic not distribute current for circuits that
circuits are not worked).

i. Power on failure
ii. Battery empty quickly
iii. Phone will heat
iv. Insert Sim
 v. No Charging
vi. Some applications are not worked properly
vii. Auto Restart

CPU (Central Process Unit)/Processor/Microprocessor

Central Process Unit is the brain in your mobile phone and controller all commands
which we have given. Specially this IC check flash IC before booting mobile phone
after that it will give command to Power IC. When it damages we can see following
faults.

i. Power on failure
ii. Auto Restart/Rebot
iii. Commant not accepted
iv. KeyPad not working or responding
v. Battery empty
vi. Phone will be heat
vii. Phone will stuck

Charging IC
This IC is not a common IC among latest phone. However it is used for controlling
charging.when it is damage we can see charging faults like these No charging , Not
Charging , Auto charging or Charger not support( Bad contact charger). Nowadays
Power IC ( UEM) working as a charging controll IC.

Flash IC ( ROM or EEPROM)

This IC holds flash or booting information(program). When this IC damage we can
see software problems in your phone as follwoings.
 i. Power on failure
ii. Booting faults.( only booting screen)
iii. Phone will stuck
iv. Battery empty quickly
v. Some applications are not worked( camera ,Mp3,Video Bluetooth ...etc )
vi. Phone work as a unconditional

VCO(Voltage Controll Oscillator)

VCO is the RF signal generator. It makes clock frequency which is used to run digital
components. When this IC is damaged digital components fail to work and the result
is power on failure.

i. Power on failure
ii. Signal faults

SIM IC
This IC is used for controlling SIM card data. when it is damage you can see
following faults. This is a crystal IC because of that when fallen down your phon like
this IC will be damage easily. Therefore we can say following faults are common
faults in nowadays.

i. Insert Sim
ii. unablet to power on with sim card
 iii. Sim not accepted.

Key Pad IC
This IC is used for Controlling Key pad circuit.We can see this IC as crystal and
normal type.because of that when fallen down your phon like this IC will be damage
easily. Therefore we can say following faults are common faults in nowadays.

i. Key pad not work as a order

ii. Key pad stuck
iii. When power on one key is dialing continuously
iv. When press a key phone will shut down or restart
v. Key pad work as a unconditional

LCD Light controll IC

This IC is used for controlling keypad and LCD lights. We can see this IC as crystal
and normal type. when this is damaged we can see following faults.

i. Key pad lights not work

ii. LCD lights not work
iii. White Display
iv. Display not work

When you see like above damages dont try to do remove that ICs. Because there
have a method for solving any faults in mobile phone. Therefore firstly try to
understand about mobile phone ICs and about its works and also damages.