Current Sensors Design Guide Application Note Melexis
Current Sensors Design Guide Application Note Melexis
This document describes several reference designs for current sensing applications with either
conventional or planar IMC-Hall® sensors. The design solutions cover various current ranges (from 2
to 2000A) and conductor types (bus bar, PCB, cable). Also included is a quick selection guide for
Melexis Hall effect current sensors, general magnetic design guidelines and information on
ferromagnetic materials.
CURRENT SENSORS
REFERENCE DESIGN GUIDE
TABLE OF CONTENTS
CURRENT SENSOR TYPES.......................................................................................................................... 4
O CONVENTIONAL HALL SENSORS ........................................................................................................... 4
O PLANAR IMC-HALL® SENSORS ............................................................................................................ 4
1 CONVENTIONAL HALL SENSORS........................................................................................................ 5
1.1 QUICK SELECTION GUIDE ................................................................................................................ 6
Examples............................................................................................................................ 7
1.2 QUICK SELECTION GUIDE ................................................................................................................ 8
Main features (typical)....................................................................................................... 8
Option code and sensitivity ................................................................................................ 9
1.3 ERROR BUDGET CALCULATION .......................................................................................................... 9
2 PLANAR IMC-HALL® SENSORS ......................................................................................................... 11
2.1 IMC VERSIONS............................................................................................................................ 12
2.2 MAGNETIC DESIGN ...................................................................................................................... 13
Magnetic field estimation with shield .............................................................................. 13
Magnetic field estimation without shield......................................................................... 14
Dimensioning examples ................................................................................................... 15
Conductor with neck-down .............................................................................................. 16
Use of laminated shields .................................................................................................. 16
Cancelling stray field without shield ................................................................................ 17
Avoiding cross-talk without shield ................................................................................... 17
2.3 QUICK SELECTION GUIDE .............................................................................................................. 18
Main features (typical)..................................................................................................... 18
Option code and sensitivity range .................................................................................... 19
2.4 ERROR BUDGET CALCULATION ........................................................................................................ 19
2.5 PCB DESIGN: GUIDELINE .............................................................................................................. 20
2.6 REFERENCE DESIGNS .................................................................................................................... 22
PCB application, 2-10A range, multi-layer/multi-turn solution ........................................ 23
PCB application, 2-10A range, ferromagnetic shield solution .......................................... 24
PCB application, 10-50A range ........................................................................................ 25
Bus bar application, 50-250A range ................................................................................ 26
Bus bar application, 300-700A range .............................................................................. 27
Bus bar application, dual range 5A/200A ........................................................................ 28
Cable application, 10-100A range.................................................................................... 29
3 FERROMAGNETIC MATERIALS......................................................................................................... 30
3.1 SUPPLIERS .................................................................................................................................. 30
3.2 FERROMAGNETIC SHIELDS ............................................................................................................. 30
U-Shield ........................................................................................................................... 30
Mechanical assembly....................................................................................................... 31
3.3 FERROMAGNETIC CORES ............................................................................................................... 32
3.4 FERROMAGNETIC MATERIALS COMPARISON ...................................................................................... 32
4 END-OF-LINE CALIBRATION............................................................................................................. 33
4.1 INTRODUCTION ........................................................................................................................... 33
4.2 DIRECT SENSOR CALIBRATION ........................................................................................................ 33
4.3 MICRO-CONTROLLER LEVEL CALIBRATION ......................................................................................... 33
ADDITIONAL INFORMATION................................................................................................................... 34
CONTACT US .......................................................................................................................................... 34
DISCLAIMER ........................................................................................................................................... 35
Pros
▪ Strong magnetic gain from the core
▪ Very robust against cross-talk
▪ Suitable for medium to very high currents
Cons
▪ Performance limited by the core (geometry
and material): saturation, hysteresis,
frequency response and thermal drift
▪ Bigger footprint (size, weight) than solutions
based on IMC-Hall® sensors
Pros
▪ Sensitive to magnetic field parallel to the chip
surface, for easy integration and low footprint
▪ IMC is made of amorphous magnetic material
featuring very high permeability and very low
hysteresis
▪ Magnetic gain from IMC
Cons
▪ Requires magnetic shielding or specific design
to avoid cross-talk and/or noise from external
fields
I
d
The magnetic field B at the sensor position (in the center of the air gap), for a current I and a
ferromagnetic core with air gap d, can be approximated as:
𝐼𝐼 [𝐴𝐴]
B [mT] = 1.25 ×
𝑑𝑑 [𝑚𝑚𝑚𝑚]
Equation 1: Magnetic field estimation formula for core configuration.
The naming convention for ferromagnetic cores is C followed by the air gap dimension (for instance,
C5 for a 5mm air gap shield).
Examples
C-5
5 I = 500A B = 1.25 x 500 [A] / 5 [mm] = 125 [mT]
required sensor sensitivity: S = 2000 [mV] / 125 [mT] = 16 [mV/mT]
Figure 1: Different leads bending options: (a) straight leads, (b, c) bent leads, (d) and planar leads.
𝜖𝜖𝑆𝑆,𝑜𝑜𝑜𝑜𝑜𝑜 = �� 𝜖𝜖𝑆𝑆,𝑜𝑜𝑜𝑜𝑓𝑓𝑖𝑖 2
𝑖𝑖
The error budget is then calculated by multiplying the applied current times the sensitivity error and
then summing the offset error, as in Equation 3.
An example of budget error plot (Figure 2) and data (Table 3) are shown for device MLX91217.
Error MLX91217
Table 3: Error contributions and values for Figure 2: Budget error plot for sensor
sensitivity and offset errors for sensor MLX91217 MLX91217, and different cores configurations.
Table 4: Optimal IMC configuration for different current ranges. Saturation of shields should also be
considered. Contact our technical support team to optimize the choice of shields.
In a typical application, a U-shaped ferromagnetic shield is wrapped around the current conductor to
protect the sensor from external fields and improve the overall robustness of the sensing solution.
The most important dimension of the shield is the inner width. In this configuration, the magnetic field
B measured by the sensor for a current I and an inner width W can be estimated as:
𝐼𝐼 [𝐴𝐴]
B [mT] = 1.25 ×
𝑊𝑊 [𝑚𝑚𝑚𝑚]
Equation 4: Magnetic field estimation formula for shield configuration.
The current in the conductor generates a magnetic field around it. The ferromagnetic shield will guide
the magnetic field lines such that a homogeneous magnetic field is generated in the U-shield between
the two legs of the shield, as it is shown in Figure 6.
Melexis Sensor
Current Conductor
Shield
𝑊𝑊
𝐻𝐻 ′ ≥
2
Equation 5: Optimal distance of sensor to the top of the shield.
Typically, the shield thickness ranges between 0.8 and 1.5mm (proportional to current range). The
height and depth are between 12 and 15mm, in order to properly surround the sensor in each
direction. The naming convention of ferromagnetic shields is U (for standard shields) or LU (for
laminated shields) followed by the width number (for instance, L20). NiFe and SiFe are two available
materials. Different properties are described in section 3.4.
Depending on application environment and requirements, the ferromagnetic shield is not necessarily
required. However, this configuration would lead to a drastic reduction of stray field immunity.
Without shield, the magnetic field B measured by the sensor for a current I, a trace width W and a
vertical position H can be approximated as:
𝐼𝐼 [𝐴𝐴]
B [mT] = 1.25 ×
2 × (𝑊𝑊 + 2𝐻𝐻) [𝑚𝑚𝑚𝑚]
Equation 6: Magnetic field estimation formula for a configuration without shield.
Dimensioning examples
Table 5 provides suggested system dimensions for various current ranges, based on a typical design
with a sensor on top of a straight bus bar surrounded by a U-shaped ferromagnetic shield. These
dimensions can be easily scaled up or down for higher or lower currents according to the magnetic
field estimation formula provided above, even if a solution with narrow shields is preferable.
Table 5: Example of configurations for different current peaks. Other combinations are possible,
please contact Melexis sales department in case interested.
Figure 8: Example of 3-phase inverter current sensing solution with IMC-Hall® sensors.
In order to limit the cost, size and weight of the shield on systems with wide bus bars, we recommend
reducing its cross-section locally, as illustrated in Figure 9. Such a neck-down has minimal impact on
the electrical resistance and allows for a much more compact current sensing solution.
≈12
≈18 ≈10
Laminated shields are made of a stack of thin sheets separated by insulators. This allows to reduce the
effect of eddy currents (that are generated in the shield by time oscillating fields, and cause gain
reduction and phase shift of the sensor signal), boosting the sensing performances. Moreover, for
very high currents (typically above 800A), it is often more efficient and cost-effective to use a
laminated shield so that the in-plane thickness can be increased, decreasing the depth and overall
footprint for the same performance.
In AC applications, external stray fields can be cancelled out by the microcontroller. Computing the
difference between max and min sensor output values provides a signal independent of any parasitic
DC field.
Even without ferromagnetic shield, cross-talk between adjacent current tracks can be avoided by
design. Figure 12 illustrates a concept of current trace layout with slots to force the current to flow
perpendicular to the main track axis. The sensors are rotated by 90° with their sensitive axis (blue
arrow) parallel to the current trace. With such a configuration, there is virtually no cross-talk between
phases.
Figure 12: Current trace layout with slots and rotated sensors to avoid cross-talk between phases.
Table 7: Option code and sensitivity range of planar IMC-Hall® current sensors (supply voltage equal
to 5V unless otherwise specified). Please contact the Melexis sales department to have customized
versions.
* Supply voltage 3.3V
Error MLX91216
Table 8: Error contributions and values for Figure 13: Budget error plot for sensor MLX91216,
sensitivity and offset errors for sensor and different shields configurations.
MLX91216.
Figure 14: Current sensing structure. Expanded Ground Layer on PCB in order to reduce the parasitic
coupling capacitance (coming from voltage transients).
At the same time, the ground layer can have a big impact on the response time.
If the ground layer covers all the surface of the PCB and surrounds the two legs of the shield, Eddy
currents will start to flow circularly around them, generating a counter-magnetic field which slows
down the response time of the sensor.
In order to avoid increased response time, the ground layer should be divided such that it interrupts
the circulations of Eddy currents around the shield.
Figure 15: Current Sensing Structure – Designing the Ground Layer on the PCB such that Eddy Currents
circulations is interrupted
Bus bar
High field sensor with 12mm U-
shaped ferromagnetic shield
50-250A
Bus bar
Very high field sensor with 12mm
U-shaped ferromagnetic shield
300-700A
Non-intrusive current
sensing from cable Simple PCB with clamp-on shield
wrapped around the cable
10-100A
Table 9: Overview of the reference designs based on planar IMC-Hall® current sensors.
▪ PCB with multiple layers and trace windings (current loops) for very high sensitivity.
▪ Can be used with or without ferromagnetic shield, depending on sensitivity and accuracy
requirements.
Figure 16: PCB layout example for very high sensitivity with 6 windings on 3 layers.
550mV/A
330mV/A
Figure 17: Example of output functions for a six-winding evaluation board, with/without shield.
▪ PCB with one layer and a single current trace (no windings).
▪ Closed ferromagnetic shield for high magnetic gain.
Assembly Concepts
Figure 18: Shield in one piece inserted through slots on the PCB edge.
Figure 19: Shield in two parts inserted in PCB slits and assembled together.
167mV/A
Figure 20: Example of output function for a single-layer PCB with closed shield.
65mV/A
40mV/A
Figure 23: Example of output function for a single-layer PCB, with/without shield.
▪ The high field (HF) sensor on PCB is mounted directly above the conductor.
▪ A simple, low-cost and compact U-shaped shield is mounted around the sensor to protect it from
stray fields and ensure good signal robustness against vibrations and displacements.
▪ With the dimensions demonstrated here, the linearity error is lower than ± 1.5A up to ±250A.
Figure 24: Demonstrator based on MLX91206 HF sensor and U12 shield with 0.8mm thickness.
20mV/A
Figure 26: Typical output and non-linearity of a sensor calibrated for ±100A.
▪ With the very high field (VHF) sensor, the measurement range can be extended to 700A while
keeping the same inner width than for the previous design (12mm). Only the shield thickness must
be adapted from 0.8 to 1.5mm.
▪ The linearity error is lower than ±5A up to ±650A.
▪ Very compact solution to measure 700A with a footprint of less than 2cm2.
12
1.5
Figure 27: Demonstrator based on MLX91208 VHF sensor and U12 shield with 1.5mm thickness.
thickness = 0.8mm
S=400mV/A S=10mV/A
20-25mA accuracy 200mA accuracy
▪ The clamp-on shield gathers the magnetic field around the cable and concentrates it above the
sensor package. Small air gap ensures high magnetic gain.
▪ Shield geometry can be adapted to match various cable diameters and current ranges.
Figure 30: Cable clamp concepts (left: monolithic shield, right: two-part shield in plastic housing).
Figure 31: Implementation examples (monolithic and two-part shield in plastic housing).
50mV/A
Figure 32: Example of output function with a cable-clamp demonstrator calibrated for ±40A.
3 Ferromagnetic materials
3.1 Suppliers
Melexis partnered with MagLab and PML India for ferromagnetic material supply.
www.maglab.ch www.pmlindia.com
Recently, PML and MagLab signed an exclusive collaboration in the field of contactless current sensing.
This cooperation between MagLab and PML offers an efficient and cost-effective solution for
customers requiring magnetic shields. MagLab takes care of the engineering side, while PML
manufactures the products to our specifications.
Standard (U) and laminated (LU) shields can be ordered using the following order codes convention
(valid for both types).
Figure 33: Ordering information for the standard U-shield from MagLab.
Mechanical assembly
Ferromagnetic shields can be assembled by crimping, screwing or bonding (glue or tape). They can
also be encapsulated in a pre-molded plastic case. The optimal solution depends on the application.
In any case, care should be taken to avoid mechanical stress on the part of the shield involved in the
magnetic measuring circuit.
One of the most common solutions is to use a pre-molded plastic case, with slots to insert the shields,
as illustrated on the pictures below.
AMC1R5 – L
Order code example L [mm]
AMC1R5 – 5 5
Laminated cores can be ordered using the following order codes convention.
Ca – b – c
4 End-of-line Calibration
4.1 Introduction
Each current sensor is individually tested and calibrated over temperature on the Melexis production
line. However, in order to achieve optimal accuracy, a final calibration is required at customer-side
after assembly to compensate for mechanical tolerances (sensor position deviations, shield
dimensions, etc.)
This final calibration can be done in two ways: either by using the Melexis tools to directly program
the sensor EEPROM, or by adjusting the gain/offset at microcontroller level.
Additional Information
Please refer to the following document for additional information on specific topics:
Contact us
To get in contact with our current sensors application team, please fill and submit the technical inquiry
form.
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