ST4SIM-110M

Data brief

SIM and eSIM system-on-chip solution for secure M2M industrial applications

Features
WLCSP11
• Cellular network connectivity configuration provided by trusted partners
• Compliant with 2G / 3G / 4G (LTE) / CDMA / NB-IoT / CAT–M networks
• Network access applications supported: SIM / USIM / ISIM / CSIM
VFDFPN8 WLCSP11 • Secure element access control (ARF / PKCS#15)
5 × 6 mm, Wettable • OTA capability over SMS, CAT-TP & HTTPS (including DNS)
flanks (MFF2)
• Multi-interfaces able to combine (U)SIM + eSE

Hardware
• Product available on ST33G1M2M
• ST33 product based on a 32-bit Arm® SecurCore® SC300™ RISC core
• Supply voltage: Class A (5 V), Class B (3 V), Class C (1.8 V)
• Asynchronous serial I/O port ISO/IEC 7816-3 compatible (T=0 protocol)
Card plugin 2FF, 3FF or 4FF (Based on • Serial peripheral interface (SPI), depending on packages
D16 micromodule) • Industrial qualification (JEDEC JESD47)
• Operating temperature: -40°C to +105°C
• Common Criteria EAL5+

ECOPACK-compliant packages
• 2FF, 3FF or 4FF plugin card (based on D16 micromodule)
• DFN8 with wettable flanks (MFF2)
Product status link • WLCSP11
ST4SIM-110M
Security
• Symmetric cryptography DES / 3DES / AES
• Asymmetric cryptography RSA (up to 2048 bits)
• HTTPS remote management TLS v1.0, v1.1 and v1.2
• Elliptic curve cryptography (up to 521 bits) including preloaded curve NIST
P-256 and brainpool P256r1
• Authentication algorithm: Comp128-2/-3, MILENAGE, TUAK, CAVE

Software standard compliancy

• Java® Card v3.0.4 Classic

• GlobalPlatform® card specification v2.2, including GP amendments A, B, C, D
and E
• ETSI, 3GPP and 3GPP2 release 12 (for further information, contact the local
STMicroelectronics sales office)
• Power saving features (PSM and eDRX) defined by ETSI release 13

DB4083 - Rev 2 - January 2021 www.st.com

For further information contact your local STMicroelectronics sales office.
 ST4SIM-110M

Applications
• Cellular Connected Nodes
• LTE: Cat M1 and NBIoT
• Surveillance
• IoT for smart home and city such as gas metering
• IoT for smart industry such as tracking

DB4083 - Rev 2 page 2/24

 ST4SIM-110M
Description

1 Description

The ST4SIM-110M is an STMicroelectronics SIM and embedded SIM (eSIM or eUICC) product designed for all
industrial devices.
The ST4SIM-110M pre-integrates a cellular connectivity configuration provided by trusted partners. In this way,
the product is ready to be deployed to the field.
The device ensures the appropriate security level to all eSIM stakeholders (user, MNO, OEM, hardware
integrator, service provider, and so on).
The device can include an embedded secure element to store credentials and/or independent applications directly
managed by the MCU (or by another OEM element).
The device provides a secure and interoperable Java® Card environment compliant with Java® Card v3.0.4
classic. Moreover, the device integrates the most advanced UICC features compliant with GlobalPlatform®, ETSI,
3GPP, 3GPP2 specifications.
The device integrates a dynamic memory management with Java® Card garbage collection mechanism
optimizing the usage of the memory.
The device is based on the ST33G1M2M, an industrial grade hardware solution (JEDEC) supporting severe
conditions. This solution is a tamper-resistant secure element certified by Common Criteria EAL5+, with a
powerful 32-bit Arm® SecurCore® SC300™ RISC core.
Note: Arm is a registered trademark of Arm Limited (or its subsidiaries) in the US and/or elsewhere.
Note: Java is a registered trademark of Oracle and/or its affiliates.

DB4083 - Rev 2 page 3/24

 ST4SIM-110M
Cellular connectivity solutions overview

2 Cellular connectivity solutions overview

A cellular connectivity solution enables devices to be used by the edge mobile network operators (also called
MNO) or mobile virtual network operators (MVNO). This solution increases network coverage and it maintains
seamless connectivity.
Moreover, a cellular solution is simple to deploy. This solution is mainly composed of the modem (baseband), the
SIM card connector and the plastic SIM card. This is the traditional SIM concept inherited from the mobile phone.
It is also possible to have an embedded SIM (eSIM) solution. In this case, there is no SIM card connector. It
reduces the board footprint and there is no need for a SIM connector.

Figure 1. SIM and eSIM architecture overview

DB4083 - Rev 2 page 4/24

 ST4SIM-110M
Additional embedded secure element (eSE)

3 Additional embedded secure element (eSE)

The ST4SIM-110M is able to combine the eSIM solution with an embedded secure element (eSE) section inside
the same chip.
This eSE section is used to provide secure storage, cryptographic services, and so on via Java® Card applets.

Figure 2. ST4SIM-110M architecture eSIM & eSE overview

ST4SIM

eSIM eSE

ISO/IEC 7816 SPI

Modem MCU / ...

The eSE section is accessible through a dedicated serial peripheral interface (SPI) protocol and the eSIM uses
the ISO/IEC 7816 protocol in parallel. Consequently, the eSE is only available on WLCSP packages including ISO
and SPI protocols.
The embedded secure element is optional and configurable.
Contact the local STMicroelectronics sales office for more details on the pin configuration.

DB4083 - Rev 2 page 5/24

 ST4SIM-110M
Card OS technical features

4 Card OS technical features

4.1 Supported standards and networks

The ST4SIM-110M solution complies with the standard networks (2G / 3G / 4G LTE) and low power networks
(CAT-M / NB-IoT).
From a technical point of view, the ST4SIM-110M solution integrates all advanced NAAs for eSIM solution:
• USIM applications providing access to universal mobile telecommunications system (UMTS) networks,
• IP multimedia services identity module (ISIM) to access IP multimedia subsystem (IMS) networks,
• CDMA subscriber identity module (CSIM) including CAVE algorithm.
To grant mobile network operators (MNO) the best solution for UICC-centric services either owned by the MNO or
by third parties, the ST4SIM-110M complies with GlobalPlatform® Card Specifications v2.2 (depending on UICC
configuration) and related amendments.

4.2 Algorithms and cryptography

The ST4SIM-110M supports the following standard authentication algorithms:
• CAVE
• MILENAGE
• TUAK
The MILENAGE algorithm enables authorized access to UMTS/LTE networks with an easy and flexible parameter
customization, according to specific MNO requirements.
The TUAK authentication algorithm is supported with both 128-bit key length and 256-bit key length.
In addition to these algorithms, the ST4SIM-110M also supports the "3GPP test algorithm" for test profiles.
In order to increase security performance, the ST4SIM-110M also incorporates a ratification counter that limits
the number of authentication attempts to prevent brute-force attacks designed to break algorithms. In addition, all
algorithms support dedicated DPA/SPA attack countermeasures.
Besides standard symmetric cryptography and hashing algorithms (DES, Triple DES, AES, MD5, and so on), the
ST4SIM-110M provides a cryptographic co-processor with asymmetric cryptography capabilities.
For applications requiring the strongest level of cryptography, the ST4SIM-110M supports:
• RSA with a key length of up to 2048 bits
• elliptic curve cryptography (ECC) with a key length of up to 521 bits.
In addition, the ST4SIM-110M fully supports the PKCS#15 standard and offers a rule-based access control
mechanism such as digital signature/certificates for data/applications requiring a strong level of cryptography.
The security algorithm implementation adheres to the chip security guidelines of the ST33G1M2M to guarantee
the best security level (for more information, contact the local STMicroelectronics sales office).

4.3 Over the air (OTA) functionality

The ST4SIM-110M supports over the air protocol for remote application management (RAM) and remote file
management (RFM) compliant with ETSI standard (ETSI TS 102 225 and ETSI TS 102 226 specifications
Release 12).
The RAM application is also fully supported by GlobalPlatform v2.2 and the related amendment B (which enables
remote applet management and remote file management over HTTP/TLS).
TLS v1.0, 1.1 and 1.2 are available in the ST4SIM-110M . In addition, the ST4SIM-110M integrates a DNS
mechanism allowing the card to request the HTTPS server address from a DNS server.
The ST4SIM-110M is able to remotely control the execution of APDU commands over the air, to administrate the
card content. It also allows proactive commands to interact with the host device.
The ST4SIM-110M supports the secured packet structure and the remote APDU structure for (U)SIM toolkit
applications, conforming 3GPP TS 31.115 and TS 31.116 specifications.
The CAT-TP protocol defined by ETSI release 7 is supported.

DB4083 - Rev 2 page 6/24

 ST4SIM-110M
Memory management

As it is compliant with the ETSI, 3GPP and 3GPP2, the ST4SIM-110M can easily be integrated into any OTA
platform compliant with relevant standards. STMicroelectronics cards are field-proven to be interoperable with the
mainstream OTA platforms commonly chosen by mobile network operators.

4.4 Memory management

The OTA mechanism includes the support of 3G UICC administrative commands as specified by ETSI TS 102
222.
These commands are integrated by a powerful dynamic memory management that allows complete smart
memory defragmentation.
Dynamic memory management provides:
• Common space for files, packages, applets and objects
• Memory recovery on deletion operations
• Total free memory available in the select MF response.
The OTA mechanism is designed to allow a very fast and silent memory recovery, absolutely safe for the end user
data.
The ST4SIM-110M is capable of enhancing intrinsic Flash memory cells for files requiring intense update and high
reliability.
Memory quota mechanism based on the GlobalPlatform Amendment C (CGM) is supported. The mechanism can
be disabled at card configuration.

DB4083 - Rev 2 page 7/24

 ST4SIM-110M
Electrical characteristics

5 Electrical characteristics

This section summarizes the operating and measurement conditions, and the DC and AC characteristics of the
device. The parameters in the DC and AC characteristic tables that follow are derived from tests performed under
the measurement conditions summarized in the relevant tables. Users should check that the operating conditions
in their circuit match the measurement conditions when relying on the quoted parameters.

5.1 Absolute maximum ratings

Table 1. Absolute maximum ratings

Symbol Parameter Value Unit

VCC Supply voltage –0.3 to 6.5 V

VIO Input or output voltage relative to ground –0.3 to VCC +0.3 V

TA Ambient operating temperature –40 to +105 °C

TSTG Storage temperature (Please refer to package specification) –65 to +150 °C

TLEAD Lead temperature during soldering See (1) °C

VESD Electrostatic discharge voltage according to JESD22-A114, Human Body Model 4000 V

1. Compliant with JEDEC standard J-STD-020D (for small-body, Sn-Pb or Pb-free assembly), the ST ECOPACK® 7191395
specification, and the European directive on Restrictions on Hazardous Substances (RoHS directive 2011/65/EU of July
2011).

Note: Stresses listed above may cause permanent damage to the device. This is a stress rating only and functional
operation of the device at these or any other conditions above those indicated in the operational sections of the
specification is not implied.
Exposure to absolute maximum rating conditions for extended periods may affect device reliability.

5.2 Recommended power supply filtering

As mentioned in Section 6.1.2 Pinout information, the power supply of the circuit must be filtered using the circuit
shown in the following figure.

Figure 3. Recommended filtering capacitors on VCC

Interface device

I/O

CLK
RST
Vcc

100 nF 1 µF
+

GND

DB4083 - Rev 2 page 8/24

 ST4SIM-110M
AC and DC characteristics

Table 2. Maximum VCC rising slope

Symbol Parameter Value Unit

SVCC Maximum VCC rising slope 5 V / µs

5.3 AC and DC characteristics

These characteristics are compliant with ETSI TS 102 671 release 12.

DB4083 - Rev 2 page 9/24

 ST4SIM-110M
Package information

6 Package information

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages,
depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product
status are available at: www.st.com. ECOPACK is an ST trademark.

6.1 VFDFPN8 package information

VFDFPN8 is a "very thin fine pitch dual flat no lead package" with wettable flanks, dimensions 5 × 6 mm and
1.27 mm pitch.
This package is compliant with JEDEC J-STD-020D and MSL 1 specifications.
It is also compliant with MFF2 (Machine-to-machine form factor 2) ETSI specifications (M2M UICC - TS102.671).

Figure 4. VFDFPN8 - outline

D2
A (Datum A)
A1 D D
A3
7 8
L

E2
(Datum B)

K
Pin 1 IDR0.200

1 2 2 1
Seatingplane

Top view Side view Bottom view

(0.05)

(0.05)
(0.10)
(0.30)
(0.40)

Section “D–D”Scale: 3:1

A06D_ME_V1

Note: Drawing is not to scale.

DB4083 - Rev 2 page 10/24

 ST4SIM-110M
VFDFPN8 package information

Table 3. VFDFPN8 - mechanical data

Millimeters Inches (1)

Symbol
Min Typ Max Min Typ Max

A 0.700 0.850 1.000 0.0276 0.0335 0.0393

A1 0 0.020 0.050 0 0.0008 0.0012
A3 - 0.200 - - 0.0079 -
b 0.350 0.400 0.480 0.0138 0.0157 0.0189
D - 5.000 - - 0.1969 -
E - 6.000 - - 0.2362 -
e - 1.270 - - 0.0500 -
L 0.400 0.500 0.600 0.0157 0.0197 0.0236
D2 4.100 4.200 4.300 0.1614 0.1654 0.1693
E2 3.300 3.400 3.500 0.1299 0.1339 0.1378

1. The dimensions are converted from mm and rounded to 4 decimal digits.

6.1.1 Wettable flank for manufacture of inspectable solder joint

Traditional lead free packages tend be critical components in high reliability application, due to inspection issues
of the solder joint between the leads and the PCB pads.

Figure 5. Regular DFN (non-wettable flank) Figure 6. DFN wettable flank

VFDFPN8 package is constructed with "WETTABLE" flanks, a "dimpled" pad formed during the half-etching step
of the lead frame manufacturing process.
The wettable flank feature, in conjunction with an optimized board mount process, promotes formation of solder
joints which can be easily inspected. The presence of a solder fillet improves the inspection capability of the
solder joints by automated optical inspection.

DB4083 - Rev 2 page 11/24

 ST4SIM-110M
VFDFPN8 package information

Figure 7. Solder joint side view Figure 8. Solder joint top view

This package is compliant with machine to machine form factor defined by ETSI in TS 102 671.

6.1.2 Pinout information

This package is compatible with the MFF2 package defined by ETSI 102 671 release 12. The pinout details are
described in the following figure and table together with PCB integrations recommendations in Figure 10.

Figure 9. VFDFPN8 pinout (top view)

GND 1 8 VCC

SWIO 2 7 RESET

I/O 3 6 CLK

NC 4 5 NC

Table 4. Pin descriptions

Name Description Pin state

GND Ground supply -

SWIO Not used Input pull-up
RESET External reset Input pull-down
I/O Input/output Pull-down then pull-up after card activation
CLK External clock Pull-down
VCC Power supply -
NC Not connected internally -

DB4083 - Rev 2 page 12/24

 ST4SIM-110M
VFDFPN8 package information

Figure 10. ST4SIM-110M PCB integration recommendations

VCC ST4SIM-110M C1 Modem

GND
R1 GND VCC
VCC
SWIO RST

RST
I/O CLK

CLK
N/C N/C
I/O

Note: C1 decoupling capacitors as recommended in Figure 3. Recommended filtering capacitors on VCC.

R1: 20 kΩ external pull-up recommended on I/O.

6.1.3 Tape and reel packing

Surface-mount packages is available in tape and reel packing . The reels have a 13" nominal diameter and
contain 4000 devices each.
Reels are in, either antistatic or conductive, plastic with a black conductive cavity tape. The cover tape is
transparent antistatic or conductive.
The devices are positioned in the cavities with the identifying pin (normally Pin “1”) on the same side as the
sprocket holes in the tape.
The STMicroelectronics Tape & Reel specifications are compliant to the EIA 481-A standard specification.

Table 5. Packing on tape and reel

Package Description Tape width Tape pitch Reel diameter Quantity per reel

VFDFPN8
Flat package, no lead 5 x 6 mm. 12 mm 8 mm 13 in. 4000
5x6

DB4083 - Rev 2 page 13/24

 ST4SIM-110M
VFDFPN8 package information

Figure 11. 13 " reel diagram

A N

D C

Table 6. 13" reel dimensions

Reel size Tape size A max B min C D min G max N min T max Unit

13” 12 mm 330 1,5 13 ±0.25 20.2 12.6 100 18.4 mm

Figure 12. Leader and trailer

DB4083 - Rev 2 page 14/24

 ST4SIM-110M
VFDFPN8 package information

Figure 13. Embossed carrier tape for VFDFPN8 (5 × 6 mm)

Ko Po
Do E
T P2

F
W
Bo B2

Ao P1
D1

USER DIRECTION OF FEED

Note: 1. Cumulative tolerance of 10 sprocket hole pitch = ±0.20 mm.

2. Pocket position relative to sprocket hole is measured as the true position of the pocket, not the pocket hole.
3. A0 and B0 are calculated on a plane at a distance “R” above the bottom of the pocket.
4. Unless otherwise specified, all dimensions are in millimeters, and decimal values of the form x.x are with
±0.2 tolerance whereas values of the form x.xx are with ±0.10 tolerance.
5. Drawing is not to scale

Figure 14. Component orientation

#4000 #0001

Index

DB4083 - Rev 2 page 15/24

 ST4SIM-110M
2FF, 3FF or 4FF plugin card package information (based on D16 micromodule)

6.2 2FF, 3FF or 4FF plugin card package information (based on D16 micromodule)
The ST4SIM-110M card is based on flexible plastic chip cards, composed of ABS and Polycarbonate, improving
all round resistance in an industrial environment. This card contains a STMicroelectronics industrial grade D16
micromodule.
All elements; card and micromodule, are designed to run at a temperature of -40 °C to +105 °C.
The ST4SIM-110M is available for different card plugin packages as detailed in the table below.

Table 7. SIM plugin package types and dimensions

Package Mini SIM (2FF) Micro SIM (3FF) Nano SIM (4FF)

Package format

Height 25 mm (±0.1 mm) 15 mm (±0.1 mm) 12.3 mm (±0.1 mm)

Width 15 mm (±0.1 mm) 12 mm (±0.1 mm) 8.8 mm (±0.1 mm)
Thickness 0.76 mm (±0.08 mm) 0.76 mm (±0.08 mm) 0.67 mm (+ 0.03 mm / - 0.07 mm)

Note: These formats comply to the ISO/IEC 7810 and ETSI TS 102 221 standards.

6.2.1 D16 micromodule pinout information

The contact of D16 micromodule are compliant with ISO/IEC 7816-3 standard. The contact assignment layout is
given in the figure below and contact description is in the following table.

DB4083 - Rev 2 page 16/24

 ST4SIM-110M
2FF, 3FF or 4FF plugin card package information (based on D16 micromodule)

Figure 15. D16 micromodule contact assignment

Table 8. D16 contact descriptions

Name Contact number Description

VCC C1 Power supply

ISO_RST/GPIO5 C2 ISO 7816-3 interface reset
ISO_CLK/GPIO6 C3 ISO 7816-3 interface CLK
Reserved for future use C4 Not used
GND C5 Ground supply
SWIO C6 Not used
ISO_IO0/GPIO7 C7 ISO 7816-3 interface serial input/output

6.2.2 WLCSP11 package information

For information on the wafer level chip scale package (WLCSP11) pinout, contact the local STMicroelectronics
sales office.

DB4083 - Rev 2 page 17/24

 ST4SIM-110M
Acronyms

7 Acronyms

Table 9. Glossary

Term Description

3GPP 3rd Generation Partnership Project

AES Advanced encryption standard
AID Application identifier
APDU Application protocol data unit
ARF Access rule file
ASN.1 Abstract syntax notation 1
CAT-M LTE card application toolkit (CAT) M
CAT-TP Card application toolkit transport protocol
CAVE Cellular authentication and voice encryption
CDMA Code division multiple access
CSIM CDMA subscriber identity module
DES Data encryption standard
DFN Dual flat no-lead package
DNS Domain name server
EAL Evaluation assurance level
eDRX Extended discontinuous reception
eSE Embedded secure element
eSIM Embedded SIM
ETSI European Telecommunications Standards Institute
eUICC Embedded Universal integrated circuit card
HTTPS Secured HTTP
IEC International electrotechnical commission
IP multimedia service or IP Multimedia Core Network Subsystem (IMS) is an architectural framework for delivering
IMS
IP multimedia services
IoT Internet of things
ISO International organization for standardization
ISIM IP multimedia services identity module
JEDEC Joint electron device engineering council (semiconductor engineering standardization)
LTE Long-term evolution
M2M Machine to machine
MD5 The MD5 message-digest algorithm is a widely used hash function producing a 128-bit hash value
MNO Mobile network operator
NAA Network access application
NB-IoT Narrow band Internet of Things
NIST National Institute of Standards and Technology
NMI Non-maskable interrupt
OEM Original equipment manufacturer

DB4083 - Rev 2 page 18/24

 ST4SIM-110M
Acronyms

Term Description

OTA Over the air

PIN Personal identification number
PKCS Public key cryptographic standards
PoC Proof of concept
PUK PIN unlock key
RAM Remote application management
RFM Remote file management
RISC Reduced instruction set computer
RSA Ron Rivest, Adi Shamir and Leonard Adleman Public-key cryptosystem
SCP Secure channel protocol
SE Secure element
SIM Subscriber identity module
SMS Simple message system
TAR Toolkit application reference
TLS Transport layer security
UICC Universal integrated circuit card
UMTS Universal mobile telecommunications systems
WLCSP Wafer level chip size package

DB4083 - Rev 2 page 19/24

 ST4SIM-110M

Revision history

Table 10. Document revision history

Date Version Change

25-Nov-2019 1 Initial release.

Updated:
• Document title
• Features
• Section 1 Description
Added:
• Section 2 Cellular connectivity solutions overview
19-Jan-2020 2
• Section 4 Card OS technical features
• Section 4.1 Supported standards and networks
• Section 5 Electrical characteristics
• Section 6 Package information
Removed
• Supported standards and networks section

DB4083 - Rev 2 page 20/24

 ST4SIM-110M
Contents

Contents
1 Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3
2 Cellular connectivity solutions overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
3 Additional embedded secure element (eSE) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
4 Card OS technical features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
4.1 Supported standards and networks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
4.2 Algorithms and cryptography . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
4.3 Over the air (OTA) functionality . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
4.4 Memory management. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

5 Electrical characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
5.1 Absolute maximum ratings. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
5.2 Recommended power supply filtering. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
5.3 AC and DC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

6 Package information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10

6.1 VFDFPN8 package information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
6.1.1 Wettable flank for manufacture of inspectable solder joint. . . . . . . . . . . . . . . . . . . . . . . . . 11

6.1.2 Pinout information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

6.1.3 Tape and reel packing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

6.2 2FF, 3FF or 4FF plugin card package information (based on D16 micromodule) . . . . . . . . . 16
6.2.1 D16 micromodule pinout information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

6.2.2 WLCSP11 package information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

7 Acronyms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20

DB4083 - Rev 2 page 21/24

 ST4SIM-110M
List of tables

List of tables
Table 1. Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Table 2. Maximum VCC rising slope . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Table 3. VFDFPN8 - mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Table 4. Pin descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Table 5. Packing on tape and reel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Table 6. 13" reel dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Table 7. SIM plugin package types and dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Table 8. D16 contact descriptions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Table 9. Glossary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Table 10. Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

DB4083 - Rev 2 page 22/24

 ST4SIM-110M
List of figures

List of figures
Figure 1. SIM and eSIM architecture overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Figure 2. ST4SIM-110M architecture eSIM & eSE overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Figure 3. Recommended filtering capacitors on VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Figure 4. VFDFPN8 - outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Figure 5. Regular DFN (non-wettable flank) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Figure 6. DFN wettable flank . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Figure 7. Solder joint side view. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Figure 8. Solder joint top view . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Figure 9. VFDFPN8 pinout (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Figure 10. ST4SIM-110M PCB integration recommendations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Figure 11. 13 " reel diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Figure 12. Leader and trailer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Figure 13. Embossed carrier tape for VFDFPN8 (5 × 6 mm) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Figure 14. Component orientation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Figure 15. D16 micromodule contact assignment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

DB4083 - Rev 2 page 23/24

 ST4SIM-110M

IMPORTANT NOTICE – PLEASE READ CAREFULLY

STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST
products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST
products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement.
Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of
Purchasers’ products.
No license, express or implied, to any intellectual property right is granted by ST herein.
Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product.
ST and the ST logo are trademarks of ST. For additional information about ST trademarks, please refer to www.st.com/trademarks. All other product or service
names are the property of their respective owners.
Information in this document supersedes and replaces information previously supplied in any prior versions of this document.
© 2021 STMicroelectronics – All rights reserved

DB4083 - Rev 2 page 24/24