Product Data Sheet
92
NC-SMQ
®
NC-SMQ®92J-UV
Solder Paste
®
Benefits Standard Product Specifications
• Excellent wetting reflow in air Alloy Metal Load Mesh Size Particle Size
• Probe-testable UV fluorescing, post reflow residue Printing Dispensing Type 3 25-45 µ
• Extended open time Sn63 & Sn62
90.0% 85% -325/+500 0.001-0.0018”
• Consistent fine-pitch printing
• Strong initial tack strength and long-term stability
• High humidity resistance Packaging
• Halide-free Standard packaging for stencil printing applications
includes 4oz. jars and 6oz. or 12oz. cartridges. Packaging
Introduction for enclosed print head systems is also readily available.
NC-SMQ 92J-UV is a halide-free, air reflow, no-clean
®
For dispensing applications, 10cc and 30cc syringes
solder paste formulated to leave a UV Fluorescing, are standard. Other packaging options are available on
probe-testable residue. The post reflow flux residue request.
contains a UV tracer that allows instant identification of
any extraneous flux residues when inspected under a UV Storage and Handling Procedures
light. This is especially useful in applications where gold Refrigerated storage will prolong the shelf life of solder
fingers or contacts, such as memory modules, are used. paste. The shelf life of NC-SMQ92J-UV is 6 months when
This product has other qualities such as consistent fine- stored at <10°C. Solder paste packaged in syringes and
pitch paste deposition, unsurpassed stencil life and tack cartridges should be stored tip down.
time, and excellent wetting. NC-SMQ92J-UV will perform
well on high speed surface mount lines utilizing fast print Solder paste should be allowed to reach ambient working
speeds and rapid chip placement. NC-SMQ92J-UV meets temperature prior to use. Generally, paste should be
or surpasses all ANSI/J-STD-004, -005 specifications and removed from refrigeration at least two hours before use.
Bellcore test criteria. Actual time to reach thermal equilibrium will vary with
container size. Paste temperature should be verified
Alloys before use. Jars and cartridges should be labeled with
Indium Corporation manufactures low-oxide spherical date and time of opening.
powder composed of Sn-Pb and Sn-Pb-Ag in the industry
standard type 3 mesh size. Other, non-standard, mesh Material Safety Data Sheets
sizes are available upon request. The weight ratio of the The MSDS for this product can be found online at
flux/vehicle to the solder powder is referred to as the http://www.indium.com/techlibrary/msds.php
metal load and is typically in the range of 85-92% for
standard alloy compositions.
OVER—>
BELLCORE AND J-STD TESTS & RESULTS
Test Result Test Result
J-STD-004 (IPC-TM-650) J-STD-005 (IPC-TM-650)
• Flux Type Classification ROL0 • Typical Solder Paste Viscosity
• Flux Induced Corrosion (Sn63, 90%, Type 3
(Copper Mirror) Pass Malcom (10 rpm), 1950 poise
• Typical Thixotropic Index; SSF -0.75
• Presence of Halide (ICA Test)
Fluoride Spot Test Pass • Slump Test Pass
Elemental Analysis (Br, C1, F) 0% • Solder Ball Test Pass
• Post Reflow Flux Residue • Typical Tackiness 38 grams
(ICA Test) 45% • Wetting Test Pass
• Corrosion Pass BELLCORE GR-78
• SIR Pass • SIR Pass
• Electromigration Pass
All information is for reference only. Not to be used as incoming product specifications.
Form No. 97732 R4
www.indium.com [email protected]
ASIA: Singapore, Cheongju: +65 6268 8678
CHINA: Suzhou, Shenzhen, Liuzhou: +86 (0)512 628 34900
EUROPE: Milton Keynes, Torino: +44 (0) 1908 580400
USA: Utica, Clinton, Chicago: +1 315 853 4900
©2008 Indium Corporation
NC-SMQ®92J-UV Solder Paste
Printing Reflow
Stencil Design: Recommended Profile:
Electroformed and laser cut/electropolished stencils
produce the best printing characteristics among stencil
types. Stencil aperture design is a crucial step in
optimizing the print process. The following are a few
general recommendations:
• Discrete components — A 10-20% reduction of
stencil aperture has significantly reduced or
eliminated the occurrence of mid-chip solder beads.
The “home plate” design is a common method for
achieving this reduction.
• Fine pitch components — A surface area reduction
is recommended for apertures of 20 mil pitch and This profile is designed for use with Sn63/Pb37 and
finer. This reduction will help minimize solder balling Sn62/Pb36/Ag2 and can serve as a general guideline
and bridging that can lead to electrical shorts. The
amount of reduction necessary is process dependent in establishing a reflow profile for use with other alloys.
(5-15% is common). Adjustments to this profile may be necessary based on
specific process requirements.
• For adequate release of solder paste from stencil
apertures, a minimum aspect ratio of 1.5 is
suggested. The aspect ratio is defined as the Heating Stage:
width of the aperture divided by the thickness of A linear ramp rate of 0.5°-2°C/second allows gradual
the stencil. evaporation of volatile flux constituents and prevents
defects such as solder balling/beading and bridging as a
Printer Operation: result of hot slump. It also prevents unnecessary
The following are general recommendations for stencil depletion of fluxing capacity when using higher temperature
printer optimization. Adjustments may be necessary alloys. A profile with an extended soak above 150°C can
based on specific process requirements: be implemented to reduce void formation and minimize
• Solder Paste Bead Size: 20-25mm diameter tombstoning when required.
• Print Speed: 25-100mm/sec.
• Squeegee Pressure: 0.018-0.027kg/mm of Liquidus Stage:
blade length A peak temperature of 25°-45°C (215°C shown) above the
• Underside Stencil Wipe: Once every 10-25 prints melting point of the solder alloy is needed to form a quality
• Solder Paste Stencil Life: >12 hrs. 30-60% R.H. & solder joint and achieve acceptable wetting due to the
22-28°C formation of an intermetallic layer. If the peak temperature is
Cleaning excessive, or the time above liquidus greater than the
NC-SMQ92J-UV is designed for no-clean applications. recommended 30-90 seconds, flux charring, excessive
However, the flux can be removed if necessary by using intermetallic formation and damage to the board and
a commercially available flux residue remover. components can occur.
Stencil Cleaning: This is best-performed using an
automated stencil cleaning system for both stencil and Cooling Stage:
misprint cleaning to prevent extraneous solder balls. A rapid cool down of <4°C/second is desired to form a
Most commercially available stencil cleaning formulations fine grain structure. Slow cooling will form a large grain
including isopropyl alcohol (IPA) work well. structure, which typically exhibit poor fatigue resistance.
If excessive cooling >4°C/second is used, both the
Compatible Products components and the solder joint can be stressed due
• Rework Flux: TACFlux 020 to a high CTE mismatch.
• Cored Wire: Core 92
This product data sheet is provided for general information only. It is not intended, described which are sold subject exclusively to written warranties and limitations
and shall not be construed, to warrant or guarantee the performance of the products thereon included in product packaging and invoices.
www.indium.com [email protected]
ASIA: Singapore, Cheongju: +65 6268 8678
CHINA: Suzhou, Shenzhen, Liuzhou: +86 (0)512 628 34900
EUROPE: Milton Keynes, Torino: +44 (0) 1908 580400
USA: Utica, Clinton, Chicago: +1 315 853 4900
©2008 Indium Corporation
