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AML Overview

AML was founded in 1992 and focuses on wafer bonding equipment and services. They have developed in-situ wafer aligners and bonders that perform alignment and bonding within the same machine. This allows for higher throughput compared to traditional mask aligners. AML offers wafer bonding machines, process development support, and a commercial wafer bonding service. Their equipment can perform several bonding techniques including anodic, direct, glass frit, eutectic, and adhesive bonding.

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223 views

AML Overview

AML was founded in 1992 and focuses on wafer bonding equipment and services. They have developed in-situ wafer aligners and bonders that perform alignment and bonding within the same machine. This allows for higher throughput compared to traditional mask aligners. AML offers wafer bonding machines, process development support, and a commercial wafer bonding service. Their equipment can perform several bonding techniques including anodic, direct, glass frit, eutectic, and adhesive bonding.

Uploaded by

api-3709410
Copyright
© Attribution Non-Commercial (BY-NC)
Available Formats
Download as PDF, TXT or read online on Scribd
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AML Overview

AML – Wafer Bonding Machines & Services


AML- Company History

• Company founded 1992

• MEMS Design, Manufacture & Process Development background

• Founders made first in-situ aligner-wafer bonder in 1985

• AML focus on & Provide Wafer Bonding equipment & Wafer bonding
services (BONDCENTRE)

•Worldwide installed base of machines

From MEMS
background not Mask
Aligner for IC

AML – Wafer Bonding Machines & Services


Basic features of AML bonders

AML – Wafer Bonding Machines & Services


AML AWB04 Aligner Bonder

AML – Wafer Bonding Machines & Services


Schematic of Unique in-situ Activation, Alignment &
Bond

T <560 C

HV <2500V
• Heat + Pump + Align
• Independent platen T
• Flexible
• 2 to 8 inch wafers
AML – Wafer Bonding Machines & Services
• Fast cycles times
AML Wafer Bonders
Wafer bonding capabilities:-

• Anodic Bonding Si-Glass


• Direct Bonding e.g. Si-Si
• Glass Frit Bonding
• Eutectic Bonding
• Thermo-compression
• Adhesive Bonding
• Aligned Embossing

In bond chamber alignment


& bonding
in one machine
= higher throughput
AML – Wafer Bonding Machines & Services
AML Advantages
• In-bond chamber alignment at bond temperature
• No alignment shiftage between align & bond
• No mask aligner required
• NOTE:-You are free to choose the best mask
aligner for your ‘mask aligning’- not tied to one
needed by the wafer bonder system
• Small footprint
• No alignment jig required (smaller mass) *
• Simultaneous alignment and vac pump-down *
• No flags in contact with bond surfaces
• In chamber RAD activation option
• Forced cooling *
* = faster throughput

AML – Wafer Bonding Machines & Services


Commercial benefits of the
In-situ AML Wafer bonders
•Lowest cost per bond & ownership
•Easy to install, (2-3 days) use/ maintain/ service – minimal training
needed.
•Very high reliability.
•Small footprint
•No time required on customer’s mask aligner
•Standard machines & custom options to suit customer needs
•Excellent technical process support – fast response
•System is complete – no other equipment required
•Extensive machine & bonding process experience.
•Worldwide Machine base UK, Europe, USA , India & Far East.

AML – Wafer Bonding Machines & Services


New system features, now
and planned

AML – Wafer Bonding Machines & Services


New Processes on AML Wafer Bonders
• Hot Embossing – Characterisation has just started

New Developments on AML Wafer Bonders


• Inclusion of RAD in-situ surface activation for low temperature bonding
(available for new orders) see pages 19-24

• Addition of Pattern recognition software


• Improvements for sub-micron alignment accuracy
• Upgrading of manipulators from manual to stepper motor control
• Motorised Z Drive
Development pipeline:- System Automation

AML – Wafer Bonding Machines & Services


New Polymer Micro Hot Embossing
& Nano Print tool

• Applications: e.g. Bio-sensors &


Microfluidic devices
• Polymers: SU8, PDMS, PMMA..
• Tool fits AML bonder platform or
stand alone machine

Outline Specification
Force up to 5000N Stroke up to 750 microns
T up to 500 C (cooling) up to 6” wafers
2 micron alignment between
Operation in Vacuum
stamp & substrate

AML – Wafer Bonding Machines & Services


Radical Activation Tool

Experimental set-up using glass vacuum chamber – showing


electrical discharge confined between the ring electrodes

AML – Wafer Bonding Machines & Services


IR transmission Image
150mm RAD activated
bond

Void free in situ activated bond


– annealed at 200C for 1 hr

AML – Wafer Bonding Machines & Services


Radical Activation Benefits

¾Produces less roughening of the surface than plasma activation


¾Uniform activation (no edge effects as typically seen for plasmas)
¾Wider process time window for activation
¾In situ process eliminates variation in activation strength with
time
¾No exposure of wafers to energetic ions
¾Bond can be heated and contacted at bonding temperature =
significant advantage for dissimilar substrates or “hard to bond”
substrates

AML – Wafer Bonding Machines & Services


AML Wafer Bonding Machines
One System does it all!

AML – Wafer Bonding Machines & Services


BONDCENTRE

Wafer Bonding Services

AML – Wafer Bonding Machines & Services


AML’s Strengths

• Very strong MEMS design & process background –


especially with respect to Wafer Bonding
• Relevant customer base
• Strong network of partners built up over many years
• Equipment supplier – transfer the process onto a machine
• Selected by UK government to be best to provide the
service

AML – Wafer Bonding Machines & Services


BONDCENTRE SERVICES OFFERED

• Wafer Bonding Process Development e.g. for many novel materials;


silicon, glass, sapphire, strained silicon, InP, GaAs,…
• Wafer Bonding process selection & design for your application
• Commercial Wafer Bonding Service prototype to production
• Wafer Bonding Technology Transfer (inc Equipment) & Training
• Associated Processes (Pre & Post Bond)
• Applications knowledge for:
MEMS Smart cut layer transfer
Advanced Substrates Wafer Level Packaging
3D integration Vacuum Encapsulation
Temporary Bonding LEDs

AML – Wafer Bonding Machines & Services


Associated Pre & Post Bond Services:

• Wafer Cleaning & Activation


• Wafer Characterisation e.g. Profiling & Surface
Roughness
• Wafer Structuring: e.g. Channels, Holes &
Conducting Vias
• Wafer Processing: e.g. Deposition, Electroplating
• Wafer Preparation: Thin to required Thickness &
Surface Finish - Planarisation (CMP)
• Inspection of bonded assemblies - SAM & IR

AML – Wafer Bonding Machines & Services


Equipment Set Available:
• WAFER ALIGNER BONDERS 4 machines in Class 10
• METROLOGY; AFM, Ra, PROFILE, TTV
• MEGASONIC WAFER CLEANING
• NEW ‘RAD’ ACTIVATION
• INSPECTION: ACOUSTIC MICROSCOPE (SAM) & IR
• ELECTROPLATING
• SCREEN PRINT - GLASS FRIT/ADHESIVE
• POWDER BLASTING E.G. GLASS MACHINING
• WAFER THINNING
• CMP

• Also access via long term collaboration with CMF @ Rutherford to:
• PHOTOLITHOGRAPHY DEPOSITION- PVD & CVD & FURNACES
• ETCHING – DRY & WET
• WAFER SAW WIRE & BUMP BONDING
• METROLOGY: THIN FILM, LINE WIDTH, SEM
AML – Wafer Bonding Machines & Services
AML Wafer Bonding Machines &
Services
One Company does it all!

AML – Wafer Bonding Machines & Services

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