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Infineon Solutions For Industrial Drives ABR v10 00 en

The document discusses solutions for industrial drives using electronic speed control systems to improve energy efficiency and performance. It describes the key components in drive systems including rectifiers, DC links, and inverters. Infineon provides various power semiconductor modules, chips, and design support to enable efficient and reliable motor control solutions.

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0% found this document useful (0 votes)
43 views16 pages

Infineon Solutions For Industrial Drives ABR v10 00 en

The document discusses solutions for industrial drives using electronic speed control systems to improve energy efficiency and performance. It describes the key components in drive systems including rectifiers, DC links, and inverters. Infineon provides various power semiconductor modules, chips, and design support to enable efficient and reliable motor control solutions.

Uploaded by

kondurumahi50
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
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Solutions for industrial drives

Electronic speed control systems for energy and performance gains

www.infineon.com/drives
2
Introduction

Solutions for industrial drives

Electrical drive systems play a key role in energy savings. Nearly all static converters for electrical drives used today
They account for two-thirds of electrical energy consumed employ a combination of input rectifier, DC link and
in industry and they are a central component of automation output inverter. If no regeneration system is required for
systems. There are two distinct industrial drive technology the electrical drive, the most competitive semiconductor
groups. The first group includes electrically driven components for the input rectifier are bipolar thyristors
machines requiring position control. This group includes, and/or diodes offered in various topologies, such as
for example, machine tools, measuring machines and complete 6-pack modules, half-bridge modules or single
packaging machines where precision in movement is modules. In high-power electrical drives, the input rectifier
required. The second group covers all applications where consists of thyristors and/or diodes in Presspack housings.
a fluid is moved by pumps and fans. Here variable speed If regeneration is required, an active front end can be
drives allow the flow to be aligned with the needs of the designed using IGBT modules. In the low-power range,
process. Compared with traditional methods of flow control where power factor correction is mandatory in some
like throttling and bypassing, electronic speed control applications, PFC (power factor correction) circuits can
significantly increases overall efficiency. Furthermore, an be designed using discrete IGBTs and diodes or dedicated
inverter enables more efficient motor technologies, modules.
like permanent magnet synchronous motors and
reluctance motors, to be used. Today, these drives can be Visit us on www.infineon.com whenever you need
implemented in a power range from watts up to megawatts. best-in-class active power switches.

Our contribution to your success

We provide the latest chip technology embedded into We shorten customer development cycle time and cost
innovative mechanical module designs. This enables our by providing design-in support through:
customers to develop highly reliable and efficient solutions. ››Our worldwide application engineering team
››Evaluation boards for fast prototyping and testing
Based on our leading industrial techno­logy, the highest ››In-depth technical and system support from a
quality standards and our in-depth manufacturing dedicated regional team
know-how, we offer:
››A variety of innovative power components Our in-depth application insight and extensive technical
››Reliable and highest-quality products support combine to help our customers achieve
cost-competitive and innovative ­solutions.

3
Power converter solution
Rectifier Rectifier
Brake chopper Brake chopper Inverter Inverter

Current Current
Sensing M Sensing M
Position Position
sensing sensing

Hall & GMR Hall & GMR


sensors sensors
Driver Driver
stage stage

Microcontroller Microcontroller

Auxiliary power supplies


Auxiliary power supplies Standard Standard
motor control solution motor control solution
Drivers & Drivers & High-performance
DC/DC DC/DC
voltage regulators voltage regulatorsHigh-performance
motor control solution motor control solution

Applications: Motor control solution Applications: High-performance


››Fans motor-control solution
››Pumps ››Servo drives
››Compressors ››CNC machines
››Air-conditioning systems ››Process controls
››Home appliance ››Robotics
››General-purpose drives ››High-precision drives

4
Application examples

discrete IGBTs IPM - integrated power modules low-power modules medium-power modules high-power modules

50 W inverter output power 2MW

Examples of module configurations

1ph-PIM + NTC 3ph-PIM + NTC bridge + NTC 3ph full-bridge half-bridge

ϑ ϑ

3ph full-bridge + shunt chopper (FD) + chopper (DF) 4-pack 1ph-PIM + PFC + NTC

Input rectifier

TT

TT
TD

TT TD TZ TZ ND ND TZ TZ ND ND
DD DZ DZ DZ DZ
T T D D T T D D

TD
DD

DD

5
IGBT4
Features The IGBT4 generation combined with the improved emitter
››Operating temperature up to 150 °C Controlled diode from Infineon provides three optimized chip versions for low,
››Higher RMS current in the
application up to 17 % possible
medium and high power IGBT modules. These chips are designed to the needs
››Increased power cycling capability of the next generation of inverter concepts for the different applications.
››Optimized switching characteristic
––softness
These three optimized chip versions are the IGBT4-T4 chip with fast
––reduced switching losses
››Short circuit capability switching behavior for low power modules with Inom = 10 - 300 A, the IGBT4-E4
tp=10μs @ Tvj=150°C chip with optimized switching and on state characteristics for medium power
››Existing packages with higher modules with Inom = 150 - 1000 A and the IGBT4-P4 chip with soft switching
current capability possible
behavior for high power modules with Inom > 900 A.

The improved softness of the high power IGBT4-P4 chip simplifies the
use and controllability for high power applications. The low- and the medium
power IGBT4 chips offer reduced total losses in comparison to the previous
generation at same conditions.

As a further benefit the IGBT4 technology allows a high maximum


junction operation temperature of Tvjop = 150°C.

The optimization of the IGBT4 chip, the assembly and contact technology
ensure a noteworthy power cycling (PC) improvement and this offers an
increased PC lifetime expectation.

6
PrimePACK™ with IGBT5 and .XT
Features The dawning of a new era
››Reduced static and dynamic losses The tremendous success of PrimePACK™ since the introduction in 2006
››Increased thermal and power
cycling capabilities
confirms that it is the optimal choice for the majority of high-power inverters.
››Increased operation temperature Now, PrimePACK™ is the first product family using the next generation of IGBTs.
up to Tvjop = 175 °C IGBT5 and .XT mark a new era in IGBT chip and interconnection technologies.
IGBT5 allows higher power densities, while the new interconnection technology
Benefits .XT extends lifetime through enhanced thermal and power cycling capabilities.
››Increases power density by 25 %
or 10 times longer lifetime
››Less cooling effort for same output
power
››Enables higher system overload
conditions

7
Gate Driver ICs and boards
Features Infineon’s Gate Driver ICs are the expert’s choice. We offer over 200 devices
› Features with a wide range of topologies, voltage classes, current capabilities, switching
› Gate Driver Boards up to 1700 V
› Gate Driver ICs from 20 V up to 1200 V speeds, and integrated protection features. By combining Infineon drivers with
› One-stop solution for drivers and power Infineon power devices, customers can quickly design and build efficient and
switches robust systems.

Applications The breadth and depth of the Infineon Gate Driver IC portfolio provides a
› General-purpose drives solution for virtually every application.
› Servo drives
› Decentralize drives Visit the Gate Driver IC selection tool at www.infineon.com/gatedriver
› Direct drives
› Active front ends
› Solar inverters EiceDRIVER™ Boards are suitable for all IGBT modules up to 1700V. Outstanding
protection measures and integrated fault management provide safe operation,
even if used within noise-intense industrial environments. Furthermore, these
boards are an attractive solution for the parallel connection of IGBT modules.
Evaluation Boards are offered as an application support tool. These boards are
accompanied by compressive application notes containing all information
needed to test, modify and qualify a design for production.

8
9
10
Thyristor / Diode Modules
Infineon® Power Start Customer Values
Soft starter specific product design:
Main benefit of the new designed Power Start modules for soft starters up ››ONE foot-print (55 mm) fits ALL current
to 300 kW is their high current capability in a compact design (LxWxH classes
134x55x100 mm) and double side cooling for low thermal resistance. ››Up to 2200 A overload current for 21s
in small design space allows 20% space
Another big advantage in comparison to existing soft starters is that one
savings compared to module based
foot-print fits all current classes. solutions
››Easy mounting (pre-assembled and
Furthermore the modules provide integrated heatsink and can be mounted ready to use)

without thermal grease. By using pressure contact technology, these modules


››Faster time2market (no design effort on
heat sink)
can withstand overload currents up to 2200 A for a 21s duration of overload. ››Excellent design-in support

Samples and Support? Go to www.infineon.com/powerstart

Customer Values
Infineon® Eco & Power Block ››One-stop-shop due to complete module
technology portfolio
We offer a broad range of Power Block modules which are designed and assem-
bled in pressure contact technology for highest reliability. The modules contain Pressure Contact Modules:
thyristor and diode pellets in a voltage range of 1600 V to 4400 V and a current ››Short-on-fail
range of 60 A up to 1100 A. ››Designed for high overload requirements
››Excellent power cycling capability
With the release of the 34 mm and 50 mm Eco Block modules in solder bond Solder Bond Modules:
technology Infineon Technologies Bipolar complemented the existing product ››Cost effective solution for higher
competitiveness
portfolio of bipolar modules.
››Solid base plate for fast and easy
mounting
Solder Bond Modules are offered as dual modules in topologies thyristor/ ››Predictably high performance and
thyristor, thyristor/diode & diode/diode with blocking voltages of 1600 V and lifetime due to 100% x-ray monitoring

in current ranges from 60 A to 130 A for 20 mm from 160 A to 190 A for


34 mm and from 280 A to 330 A for 50 mm. The Rectifier Diode Modules (DD)
in 34 and 50 mm are also available in 1800 V, 2000 V and 2200 V for high
production volumes.

All Power Block modules are also available with pre-applied silicone-free
Thermal Interface Material (TIM). The optimized pattern of this reversible phase
change material results in a stable thermal performance over life time which
increases reliability and lifetime of your system.

For more information go to www.infineon.com/solderbond


and www.infineon.com/pressure-contact

11
Summary
Great opportunities The technology of energy conversion systems for VSDs (Variable Speed Drives)
››Best energy efficiency is often driven by innovations in power electronic switches. Improvements to
››Innovative module housings and
interfaces
our semiconductor technology and packaging enable our customers to meet the
››Proven high quality most demanding technical and commercial requirements.
››Product portfolio with wide range of
voltages and currents
Our new IGBT chip technologies with trench structures and field stop ­concept,
››Popular topologies often implemented in
one module housing
partially empowerred by SiC freewheeling diodes, together with innovative
››Easy modularity and ­scalability packaging guarantee robust and reliable devices with the highest power
››Proven reliability by best connection integration and the lowest power losses. We meet our customers’ requirements
techniques
by offering a broad range of IGBT modules, from EasyPIM™ / EasyPACK for
low-power applications up to 6.5 kV IHV devices for megawatt-rated systems.

Over the years, we have set the standards in module packaging. Our leading
position is reflected in the fact that our early products subsequently became
industry standard. Most of them such as EconoPACK™, EconoPIM™, IHM and
IHV are now widely in use. The recently introduced PrimePACK™ IGBT module
housing has also become a worldwide industry standard.

We believe our competence in implementing the latest technologies in power


electronic switches has revolutionized the industrial drive market. We provide
high-quality products and meet the most challenging customer requirements.

12
Thermal Interface Material (TIM)
The only Infineon-qualified solution

Features The demand for high power densities in power electronics poses great
› Best-in-class thermal resistance challenges to the thermal interface between the power module and the
› Pre-applied to Infineon modules
› Dry to the touch heat sink. In addition a short manufacturing process time is essential to
› Optimized for dedicated Infineon modules make the production of converters more efficient. The easy handling and
reproducible application of thermal interface material is one way to improve
the manufacturing and obtain a stable process result.
Benefits
› Reduced process time in manufacturing A specially developed thermal interface material pre-applied to our power
› Simplified mounting
› Increased system reliability modules outperforms the general-purpose materials available. TIM not only
› Increased system lifetime provides the lowest thermal resistance, it also fulfills the highest quality standards
› Optimized thermal management for power modules to achieve the longest lifetime and highest system reliability.
› Improved handling in case of maintenance
TIM has been developed to fit most of our existing power module packages
› Broadest Portfolio of TIM modules: as well as upcoming future designs. Using modules with pre-applied TIM will
www.infineon.com/TIM enable reproducible thermal performance of power electronic applications.

Thermal improvement and long-term stability


110

100

90
Tj–Tamb [K]

80

70

60 Mod-3: Material with gradual degradation


Mod-2: Material with unexpected degradation
50 Mod-1: Stable behavior as demanded
1 2 3 4 5
Infineon TIM with superior performance
Time in HTS* [Weeks] *HTS: High Temperature Storing, Stresstest 1000 h, 125 °C

13
IPOSIM
The Infineon Power Simulation program for loss and
thermal calculation of Infineon power modules and disk devices

IPOSIM is an easy to use yet sophisticated online simulation tool for loss Features
and thermal calculation of Infineon power modules and disk devices. › Calculation of thermal performance
› Direct comparison between products
IPOSIM helps you to select the right Infineon bipolar modules or disk › Calculation of complete load cycles
› Save calculations for later revision
devices for your rectifier or AC switch applications as well as suited IGBT
modules for your inverter or DC converter applications. B2, B6, M3.2, M6,
W1C, W3C, 2-Level, 3-Level, buck and boost topologies can be calculated. › Where to find IPOSIM:
www.infineon.com/iposim
IPOSIM performs a calculation of switching and conduction losses for all
components, taking into account conduction and switching characteristics
as well as thermal ratings. Where applicable, different control algorithms
can be applied.

Thermal conditions can be adapted by user defined or predefined heat


sinks. Beside single operation points complete load cycles may be calculated.
Results will be shown in tabular and graphic representation and can be saved
for later revision or printed as PDF file.

14
Our business philosophy is
“the customer always comes first”
We always strive to have an open dialogue with our customers, who benefit from
our innovative technologies, services and marketing support. Many product
innovations have been developed on this collaborative basis.

Our experienced team of regional application engineers actively supports our


customers in designing our products into their solutions. We provide evaluation
boards to enable fast and reliable integration of our modules and devices into
variable-speed drives.

Regular quality certification audits of our company operated together with our
customers strengthen our confidence and make our highly reliable production
processes more transparent.

As a result of all our efforts, we enjoy outstanding customer satisfaction. Our aim
is to build long-term partnerships based on open and intensive cooperation in all
areas of our business.

We work together. Visit www.infineon.com and find the right product.

15
Where to buy
Infineon distribution partners and sales offices:
www.infineon.com/WhereToBuy

Service hotline
Infineon offers its toll-free 0800/4001 service hotline as one central number,
available 24/7 in English, Mandarin and German.

››Germany ..................... 0800 951 951 951 (German/English)


››China, mainland ........ 4001 200 951 (Mandarin/English)
››India ........................... 000 800 4402 951 (English)
››USA ............................. 1-866 951 9519 (English/German)
››Other countries .......... 00* 800 951 951 951 (English/German)
››Direct access .............. +49 89 234-0 (interconnection fee, German/English)
* Please note: Some countries may require you to dial a code other than “00” to access this international number.
Please visit www.infineon.com/service for your country!

www.infineon.com Please note!


THIS DOCUMENT IS FOR INFORMATION PURPOSES ONLY AND
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Date: 05 / 2017 can result in personal injury.

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