TB67H451FNG

Application Note

TB67H451FNG
Usage Considerations

Description
The TB67H451FNG is a PWM chopper type brushed DC motor driver.
This product includes one channel of motor output block.
Low ON-resistance MOSFETs and a PWM control provide efficient motor drive to the TB67H451FBG by
accomplishing lower heat generation.
Furthermore, the TB67H451FNG has two inputs, IN1 and IN2, which are capable of selecting of the four
operation modes; forward (clockwise), reverse (counter-clockwise), short brake, and stop modes.

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Application Note

Table of Contents
Description .............................................................................................................................................1
Table of Contents ...................................................................................................................................2
1. Power Supply Voltage ........................................................................................................................4
1.1. Operating Power Supply Voltage Range................................................................................................. 4
1.2. Power Supply Sequence ......................................................................................................................... 4
2. Output Current....................................................................................................................................4
3. Control Inputs .....................................................................................................................................4
4. Direct PWM Control ............................................................................................................................5
4.1. Input and Output Functions ..................................................................................................................... 5
4.2. Standby Mode .......................................................................................................................................... 5
5. Constant Current PWM Control ..........................................................................................................6
5.1. Constant Current Control Type (Mixed Decay) ....................................................................................... 6
5.2. Waveform of Mixed Decay Mode ............................................................................................................ 7
6. Switching Characteristics....................................................................................................................8
7. Application Circuit Example ................................................................................................................9
7.1. Application Circuit Example brushed DC motor drive ............................................................................. 9
7.2. Stepping motor drive ............................................................................................................................... 9
7.3. Capacitor for Power Supply Pin ............................................................................................................ 10
7.4. Current Detection Resistor .................................................................................................................... 10
7.5. Wiring Pattern for Power Supply and GND ............................................................................................11
7.6. Fuse ........................................................................................................................................................11
8. Fault Detection ................................................................................................................................. 12
9. Power consumption of IC.................................................................................................................. 13
10. Power Dissipation ........................................................................................................................... 14
11. Reference Land Pattern .................................................................................................................. 15
12. Evaluation Board (original board examples of our company) .......................................................... 16
12.1. Evaluation board pattern layout........................................................................................................... 16
12.2. Input ..................................................................................................................................................... 17
12.3. PCB options ......................................................................................................................................... 17
12.4. Board circuit diagram .......................................................................................................................... 18
Notes on Contents ................................................................................................................................ 19
IC Usage Considerations ...................................................................................................................... 19
Notes on handling of ICs .............................................................................................................................. 19
Points to remember on handling of ICs ........................................................................................................ 20
Revision history ............................................................................................................................................ 21
RESTRICTIONS ON PRODUCT USE .................................................................................................. 22

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List of Figures
Figure 1.1 Operating power supply voltage range ..................................................................................... 4
Figure 4.1 Standby mode operation ........................................................................................................... 5
Figure 5.1 Current waveform of Mixed Decay Mode .................................................................................. 6
Figure 5.2 Current waveform of Mixed Decay Mode (when the set current value increases) ................... 7
Figure 5.3 Current waveform of Mixed Decay Mode (when the set current value decreases).................. 7
Figure 6.1 Switching characteristics ........................................................................................................... 8
Figure 7.1 Application circuit example (Brushed DC motor) ...................................................................... 9
Figure 7.2 Application circuit example (stepping motor) ............................................................................ 9
Figure 8.1 Operation of over current detection......................................................................................... 12
Figure 12.1 Evaluation board pattern layout (silk, resist -A) .................................................................. 16
Figure 12.2 Evaluation board layout (layer -1) ....................................................................................... 16
Figure 12.3 Evaluation board pattern layout (layer -2) .......................................................................... 16
Figure 12.4 Evaluation board pattern layout (resist -B) ......................................................................... 16
Figure 12.5 Input ....................................................................................................................................... 17
Figure 12.6 PCB options ........................................................................................................................... 17
Figure 12.7 Board circuit diagram............................................................................................................. 18

List of Tables
Table 4.1 Input and output functions........................................................................................................... 5
Table 4.2 Time to standby ........................................................................................................................... 5
Table 6.1 Switching characteristics ............................................................................................................. 8
Table 7.1 Recommended capacitor values for power supply pin ............................................................. 10
Table 7.2 Recommended values for current detection resistor ................................................................ 10

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1. Power Supply Voltage

1.1. Operating Power Supply Voltage Range
In using TB67H451FNG, the voltage should be applied to the pins of VM and VREF. The absolute
maximum rating of VM supply voltage is 50V (no active). The usage range is 4.5 to 44V.
The absolute maximum rating of VREF supply voltage is 5.5V. The usage range is 0 to 4V.

VM usage range VM (min) = 4.5 V, UVLO (max) = 4.2 V

(min) = 4.5 V Operating margin has 0.3V.

UVLO (Under voltage lockout) threshold: 4.0 V ± 0.2 V

VM supply voltage

Figure 1.1 Operating power supply voltage range

1.2. Power Supply Sequence

There are no special procedures of inputting a power supply and shutdown because the TB67H451FNG
incorporates the under voltage lockout (UVLO). However, under the unstable state of inputting the power
supply (VM) and shutdown (transient area), setting the motor operation to OFF state is recommended.
After the power supply is in the stable state, the motor should be operated by switching the input signal.

2. Output Current
The absolute maximum rating of motor output current is 3.5A (Peak current is 6.2A (tw≤500ns)). Its
operating range is 3A or less. The maximum current of the actual usage is limited depending on the
usage conditions (the ambient temperature, the wiring pattern of the board, the radiation path, and the
exciting design). Configures the most appropriate current value after calculating the heat and evaluating
the board under the operating environment.

3. Control Inputs
When the logic signal is input under the condition that the voltage of VM is not supplied, the
electromotive force by an input signal is not generated. However, configures the input signal to low level
before the power supply is applied, referring to the description of the “1.2 Power Supply Sequence”.

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4. Direct PWM Control

4.1. Input and Output Functions
A speed of the motor can be controlled by Inputting PWM signal to pins IN1 and IN2, and operating them
with PWM control. It is recommended to control the input pulse width to be at least 600ns in
consideration of output followability.
In order to disable the constant current function, RS pin should be connected to GND, and the voltage of
1 to 5V should be applied to VREF pin.
Table 4.1 Input and output functions
IN1 IN2 OUT1 OUT2 Mode
Stop
L L OFF (Hi-Z) OFF (Hi-Z)
Standby mode after elapsing 1 ms
H L H L Forward

L H L H Reverse

H H L L Short brake
Current path: Forward: OUT1 to OUT2, Reverse: OUT2 to OUT1

4.2. Standby Mode

When both IN1 and IN2 pins are set to L for 1 ms (typ.), the operation mode translates to the standby
mode.
Table 4.2 Time to standby
Item Min Typ. Max Unit

Time to standby 0.7 1 1.5 ms

The following period in which both IN1 and IN2 pins are set to L is the standby transition period.
Do not change the input states during this period since the IC becomes unstable.

• If [STOP] mode is used, set period of IN1 =L and IN2 =L to 0.7 ms or less.
• If [Standby] mode is used, set period of IN1 =L and IN2 =L to 1.5 ms or more.

In standby mode, when IN1 or IN2 is set to H, the mode returns from the standby mode, and enters to the
operation mode.
Maximum 30 μs is required for the return time from the standby release.
The OUT1 and OUT2 outputs operate after 30 μs (max) from the standby release.
0.7 ms 30 μs (max)

1.5 ms
H
IN1
L

H
IN2
L

OUT1 OUT1: Hi-Z OUT1: H OUT1: Hi-Z OUT1: H OUT1: Hi-Z OUT1: H
OUT2 OUT2: Hi-Z OUT2: L OUT2: Hi-Z OUT2: L OUT2: Hi-Z OUT2: L

Stop Standby Standby Return

mode transition period mode time

Figure 4.1 Standby mode operation

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5. Constant Current PWM Control

5.1. Constant Current Control Type (Mixed Decay)
In this product, a constant current threshold (NFth) is set by the current detection resistor between RS
and GND, and VREF input voltage.
When the output current reaches the threshold due to forward rotation and reverse rotation, the constant
current control is performed in Mixed Decay mode.
In case of the constant current control, the OFF time (toff) is fixed to 25 μs (typ.) to determine the pulse
width of the current (current pulsating flow). The percentage of Mixed Decay Mode is as follows; Fast
Mode: 50% to Slow Mode: 50%.

For the constant current setting, refer to Section 7.4

toff (Fixed)

toff / 2 toff / 2

NF detection
NFth

Charge Fast Charge

Iout

Slow

Charge Mode -> NF detection: Reaches setting current value. ->

Fast Mode -> Mixed Decay Timing -> Slow Mode -> Charge Mode

Figure 5.1 Current waveform of Mixed Decay Mode

If the output current is zero-detected in Fast Mode, the outputs are in High impedance.

Timing charts may be simplified for explanatory purposes.

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5.2. Waveform of Mixed Decay Mode

● When the set current value increases
(Mixed Decay timing: OFF time is fixed, Fast: 50%/Slow: 50%)

toff (25 μs)

toff/2 toff/2 toff/2 toff/2 toff/2 toff/2 toff/2 toff/2

NFth NF NF NF

Fast Slow Charge Fast Slow

NF NF Charge
NFth

Charge Fast Slow Charge Fast Slow

Figure 5.2 Current waveform of Mixed Decay Mode (when the set current value increases)

● When the set current value decreases

(Mixed Decay timing: OFF time is fixed, Fast: 50%/Slow: 50%)

toff (25 μs)

toff/2 toff/2 toff/2 toff/2 toff/2 toff/2 toff/2 toff/2 toff/2 toff/2 toff/2 toff/2

NF NF
NFth The IC enters Charge Mode for a moment at which the internal RS
comparator compares the values. The IC immediately enters Fast Mode
NF
because the current value becomes more than the set current value.
Charge Fast Slow Charge Fast Slow
NF
Fast Slow NF NF
NFth
Fast Slow

Charge Fast Slow Charge Fast Slow

Figure 5.3 Current waveform of Mixed Decay Mode (when the set current value decreases)
When the Charge period starts and the output current reaches the set value, the RS comparator detects
the set current value (NF), and the IC enters to the Fast Mode. Then, the IC transmits from Fast Mode to
Slow Mode at the timing of 50% of the fixed OFF time, toff=25 μs (typ.). Moreover, after 50% of the time
elapses, the Slow Mode ends, and the Charge period starts again. Even if the set current is changed
during Decay operation, the Decay operation continues until completion of toff operation period.

Note: These figures are intended for illustrative purpose only. If designed more realistically, they would
show transient response curves.

Timing charts may be simplified for explanatory purposes.

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6. Switching Characteristics

90% 90%

10% 10%

tr tf

Figure 6.1 Switching characteristics

Table 6.1 Switching characteristics

Ta = 25°C, VM = 24 V, output load condition 6.8mH/5.7Ω
Item Typ. Unit

tr 60 ns
tf 80 ns

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7. Application Circuit Example

7.1. Application Circuit Example brushed DC motor drive

VM TB67H451FNG
VM
+

Control IN1 OUT1

I/O
Brushed
DC motor
IN2 OUT2

VREF
Vref
GND RS

Figure 7.1 Application circuit example (Brushed DC motor)

7.2. Stepping motor drive

TB67H451FNG
VM VM
+

IN1 OUT1
Stepping
Control motor
I/O IN2
OUT2
Vref VREF

GND RS

TB67H451FNG
+
VM

IN1 OUT1

IN2
OUT2
Vref VREF

GND RS

Figure 7.2 Application circuit example (stepping motor)

All the grounding wires of the TB67H451FNG must run on the solder within the mask of the PCB. It must
also be externally terminated at a single point. The application circuits shown in this document are
provided for reference purposes only. Thorough evaluation is required, especially at the mass production
design stage.

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7.3. Capacitor for Power Supply Pin

To stabilize the power supply voltage of the IC and reduce the noise, connect the appropriate capacitor to
each pin. It is recommended to connect the capacitor as close to the IC as possible. Especially, by
connecting the ceramic capacitor near the IC, the power voltage fluctuation at the high frequency range
and the noise can be reduced.

Table 7.1 Recommended capacitor values for power supply pin

Connection Components Typ. Recommended range

Electrolytic capacitor 100 μF 47 to 100 μF

Between VM and GND
Ceramic capacitor 0.1 μF 0.01 to 1 μF
(Between VREF and GND) Ceramic capacitor 0.1 μF 0.01 to 1 μF

* Between VREF and GND: Connect the capacitor by necessity depending on the usage environment.
* It is possible to reduce each component and use the capacitor with other than the recommended value,
depending on the motor load condition and the board design pattern.

7.4. Current Detection Resistor

This IC configures the threshold of the constant current detection by connecting the current detection
resistor between RS pin and GND pin. The detection resistor is recommended to connect near the IC.
(The motor can be controlled with the accurate current because the influence of the wire resistance of
the board can be reduced.)

Table 7.2 Recommended values for current detection resistor

Recommended
Connection Parts Typ.
range

Between RS and GND Chip / Lead resistor 0.22 Ω (1.5 to 3.0 A) 0.22 to 1.0 Ω
Between RS and GND Chip / Lead resistor 0.51 Ω (0 to 1.5 A) 0.22 to 1.0 Ω

The relation equation of the threshold of the constant current detection, Vref voltage, and the RS
detection resistor is as follows;

Vref ( V )
Iout(max) = Vref (gain) ×
RRS(Ω )

Vref(gain): Vref decay ratio is 1 / 10.0 (typ.).

Vref(V): The operation range of Vref is 0 to 4V.
The Vref voltage can also be used from 4 to 5V, however, the threshold of the constant
current detection is the same values as Vref = 4V setting. (Design guarantee at VM = 24V)

As for the current detection resistor, the constant number which is out of recommended range can be
adopted. In this case, please pay attentions to the followings when the used resistor value is high and
low.

* When the detection resistance is low, the difference voltage between RS and GND comparing to the internal
reference voltage becomes small.
So, the current may be largely different from the configured current value.
* When the detection resistance is high, the power applied to the detection resistance increases in motor
operation (P=I^2×R). So, in comparison with the same current flows in low resistance, the power dissipation
should be larger.

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7.5. Wiring Pattern for Power Supply and GND

Since large current may flow in VM, RS, and GND pattern especially, design the appropriate wiring
pattern in order to avoid the influence of wiring impedance. It is very important for surface mounting
package to radiate the heat from the heat sink of the IC’s back side to the GND. So, design the pattern by
considering the heat design.

7.6. Fuse
Use an appropriate power supply fuse for the power supply line to ensure that a large current does not
continuously flow in the case of over current and/or IC failure.
The IC will fully break down when used under conditions that exceed its absolute maximum ratings,
when the wiring is routed improperly or when an abnormal pulse noise occurs from the wiring or load,
causing a large current to continuously flow and the breakdown can lead to smoke or ignition. To
minimize the effects of the flow of a large current in the case of breakdown, appropriate settings, such as
fuse capacity, fusing time and insertion circuit location, are required.
This IC incorporates over current detection circuit (ISD) that turns off the output of the IC when over
current is detected in the IC. However, it does not necessarily protect ICs under all circumstances. If the
over current detection circuits operate against the over current, clear the over current status immediately.
Depending on the method of use and usage conditions, such as exceeding absolute maximum ratings
can cause the over current protection circuit to not operate properly or IC breakdown before operation. In
addition, depending on the method of use and usage conditions, if over current continues to flow for a
long time after operation, the IC may generate heat resulting in breakdown.
To avoid above IC destruction and malfunctions caused by noise, the over current detection circuit has a
dead band time. So, it is concerned that the over current detection circuit may not operate depending on
the output load conditions because of the dead band time. Therefore, in order to avoid continuing this
abnormal state, use the fuse for the power supply line.

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8. Fault Detection

• Thermal shutdown (TSD)

When the junction temperature of the IC reaches the TSD threshold, the TSD circuit is triggered; the
internal reset circuit then turns off the output transistors. In order to avoid malfunctions by switching
etc., detection mask time (tTSD(mask)) is prepared inside IC. Since the operating temperature of TSD
circuit has a hysteresis width, the IC reruns automatically when the junction temperature become
lower the return-temperature.
The TSD circuit is a backup function to detect a thermal error, therefore is not recommended to be
used aggressively.

Mask time of TSD (tTSD(mask)): 2 to 8 μs

• Over current detection (ISD)

When the output current reaches the threshold, the ISD circuit is triggered; the internal reset circuit
then turns off the output transistors. In order to avoid malfunction by switching etc., detection mask
time (tISD(mask)) is prepared inside IC. The IC operation recovers automatically after specified OFF
time (tISD(off)) passes.

Mask time of ISD (tISD(mask)): 1.5 μs (typ.)

OFF time of ISD (tISD(off)): 3 ms (typ.)

ISD operation level (4.9A(typ.))

tISD(off)

Output current
tISD(mask)

Output ON OFF (Normal operation)

Figure 8.1 Operation of over current detection

• Under voltage Lock out (UVLO)

The under voltage detection circuit operates when the applied voltage of VM pin falls 3.8V (typ.) or
less. All output power transistors are turned off. The UVLO operation is released when the voltage
applied to VM pin rises 4.0V (typ.) or more.

* The operation thresholds and mask time of the fault detection shown above are reference values.

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9. Power consumption of IC

Power consumption of the IC is consumed by the transistor of the output block and that of the logic block
mainly.

P(total) = P(out) + P(bias)

• Power consumption of the motor output block

Power of the output block (P(out)) is consumed by MOSFET of upper and lower H-Bridge.

P(out) = Iout (A) × VDS (V) = Iout (A) × Iout (A) × Ron (Ω) ………………………….. (1)

When the current waveform of the motor output corresponds to the ideal waveform, the average power
of the output block can be provided as follows;

When Ron = 0.60Ω, Iout (peak: max) = 1.5 A, VM = 24 V

P(out) = 1.5 (A) × 1.5 (A) × 0.60 (Ω) ……………………………………………………. (2)
= 1.35 (W)

• Power consumption of logic and IM systems

Power consumption of logic and IM systems are calculated separately by the state of operating and
stopping.

I (IM3) = 3.5 mA (typ.): Operating (fPWM=30 kHz)

I (IM2) = 3.0 mA (typ.): Stopping (Brake Mode)

The outputs are connected to VM (24V). (Outputs: Current consumed by the circuit connected to VM +
Current consumed by switching output stages)

Power consumption is calculated as follows;

P(bias) = 24 (V) × 0.0035 (A) ……………………………………………………………. (3)

= 0.084 (W)

• Power consumption
Total power consumption P (total) is calculated from the values of equation (2) and (3).

P(total) = P(out) + P(bias) = 1.35 + 0.084 = 1.434 (W)

The power consumption in non-operation mode (stopping) of the motor is calculated as follows;

P = 24 (V) × 0.003 (A) = 0.072 (W)

Additionally, the power consumption can be reduced by stopping the operation with the standby mode.
(IM1=1μA (max))

In actual motor operation, the average current becomes lower than the calculated value because of
transition time of the current steps and the ripple of the constant current PWM. Refer to the above
equations, evaluate the heat design of the board by the actual board enough, and configure the
appropriate margin.

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10. Power Dissipation

Relation equation of the ambient temperature (Ta), junction temperature (Tj), and the thermal resistance
(Rth(j-a)) between junction temperature to ambient temperature is as follows;

Tj = Ta + PD ×Rth(j-a)

(Reference) Relation between power dissipation and ambient temperature

PD - Ta

Ta (°C)
When mounted on the board (JEDEC 4 layers)

Pay attention that Ta, Rth(j-a), and P (total) depend on the usage environment. When ambient
temperature is high, the allowable power consumption decreases.

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11. Reference Land Pattern

P-HSOP8-0405-1.27-002
“Unit: mm”

Notes
• All linear dimensions are given in millimeters unless otherwise specified.
• This drawing is based on JEITA ET-7501 Level3 and should be treated as a reference only.
TOSHIBA is not responsible for any incorrect or incomplete drawings and information.
• You are solely responsible for all aspects of your own land pattern, including but not limited to
soldering processes.
• The drawing shown may not accurately represent the actual shape or dimensions.
• Before creating and producing designs and using, customers must also refer to and comply with the
latest versions of all relevant TOSHIBA information and the instructions for the application that Product
will be used with or for.

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12. Evaluation Board (original board examples of our company)

12.1. Evaluation board pattern layout

Figure 12.1 Evaluation board pattern layout Figure 12.2 Evaluation board layout
(silk, resist -A) (layer -1)

Figure 12.3 Evaluation board pattern layout Figure 12.4 Evaluation board pattern layout
(layer -2) (resist -B)

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12.2. Input

IN2

IN1
Connect the motor.

VREF GND Apply (VM) power voltage.

Figure 12.5 Input

Input each power supply and control signals according to the figure shown above.

12.3. PCB options

To use a power source for logic “High” level inputs and for VCC voltage
divider for Vref, supply 5V to the VCC pin.

Ceramic capacitor for VCC

Use these patterns to

supply voltage for Vref,
from a voltage divider
of VCC.

Jumper (JP3) for Vref input selector

FR: use resistors (R1 and R2) as a Vref Open: For external power supply.
voltage divider Apply voltage to the VREF pin.

VR: use potentiometer (VR1) as a Vref

voltage divider

Figure 12.6 PCB options

Silk name on the board are different because the series products have the common board.

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12.4. Board circuit diagram

Figure 12.7 Board circuit diagram

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Notes on Contents
1. Block Diagrams
Some of the functional blocks, circuits, or constants in the block diagram may be omitted or simplified
for explanatory purposes.

2. Equivalent Circuits
The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory
purposes.

3. Timing Charts
Timing charts may be simplified for explanatory purposes.

4. Application Circuits
The application circuits shown in this document are provided for reference purposes only. Thorough
evaluation is required, especially at the mass production design stage.
Providing these application circuit examples does not grant a license for industrial property rights.

IC Usage Considerations
Notes on handling of ICs
(1) The absolute maximum ratings of a semiconductor device are a set of ratings that must not be
exceeded, even for a moment. Do not exceed any of these ratings. Exceeding the rating(s) may cause
the device breakdown, damage or deterioration, and may result injury by explosion or combustion.

(2) Do not insert devices in the wrong orientation or incorrectly. Make sure that the positive and negative
terminals of power supplies are connected properly. Otherwise, the current or power consumption may
exceed the absolute maximum rating, and exceeding the rating(s) may cause the device breakdown,
damage or deterioration, and may result injury by explosion or combustion. In addition, do not use any
device that is applied the current with inserting in the wrong orientation or incorrectly even just one time.

(3) Use an appropriate power supply fuse to ensure that a large current does not continuously flow in case
of over current and/or IC failure. The IC will fully break down when used under conditions that exceed its
absolute maximum ratings, when the wiring is routed improperly or when an abnormal pulse noise
occurs from the wiring or load, causing a large current to continuously flow and the breakdown can lead
smoke or ignition. To minimize the effects of the flow of a large current in case of breakdown,
appropriate settings, such as fuse capacity, fusing time and insertion circuit location, are required.

(4) If your design includes an inductive load such as a motor coil, incorporate a protection circuit into the
design to prevent device malfunction or breakdown caused by the current resulting from the inrush
current at power ON or the negative current resulting from the back electromotive force at power OFF.
IC breakdown may cause injury, smoke or ignition. Use a stable power supply with ICs with built-in
protection functions. If the power supply is unstable, the protection function may not operate, causing IC
breakdown. IC breakdown may cause injury, smoke or ignition.

(5) Carefully select external components (such as inputs and negative feedback capacitors) and load
components (such as speakers), for example, power amp and regulator. If there is a large amount of
leakage current such as input or negative feedback condenser, the IC output DC voltage will increase. If
this output voltage is connected to a speaker with low input withstand voltage, overcurrent or IC failure
can cause smoke or ignition. (The over current can cause smoke or ignition from the IC itself.) In
particular, please pay attention when using a Bridge Tied Load (BTL) connection type IC that inputs
output DC voltage to a speaker directly.

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Points to remember on handling of ICs

(1) Over current Protection Circuit

Over current protection circuits (referred to as current limiter circuits) do not necessarily protect ICs under
all circumstances. If the over current protection circuits operate against the over current, clear the over
current status immediately.
Depending on the method of use and usage conditions, such as exceeding absolute maximum ratings can
cause the over current protection circuit to not operate properly or IC breakdown before operation. In
addition, depending on the method of use and usage conditions, if over current continues to flow for a long
time after operation, the IC may generate heat resulting in breakdown.

(2) Thermal Shutdown Circuit

Thermal shutdown circuits do not necessarily protect ICs under all circumstances. If the thermal shutdown
circuits operate against the over temperature, clear the heat generation status immediately.
Depending on the method of use and usage conditions, such as exceeding absolute maximum ratings can
cause the thermal shutdown circuit to not operate properly or IC breakdown before operation.

(3) Heat Radiation Design

In using an IC with large current flow such as power amp, regulator or driver, please design the device so
that heat is appropriately radiated, not to exceed the specified junction temperature (Tj) at any time and
condition. These ICs generate heat even during normal use. An inadequate IC heat radiation design can
lead to decrease in IC life, deterioration of IC characteristics or IC breakdown. In addition, please design
the device taking into considerate the effect of IC heat radiation with peripheral components.

(4) Back-EMF
When a motor reverses the rotation direction, stops or slows down abruptly, a current flow back to the
motor’s power supply due to the effect of back-EMF. If the current sink capability of the power supply is
small, the device’s motor power supply and output pins might be exposed to conditions beyond absolute
maximum ratings. To avoid this problem, take the effect of back-EMF into consideration in system design.

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Revision history
Version Notes Revision date

1.0 New release 2020-03-09

2.0 Added the explanation to the standby mode 2020-11-26

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RESTRICTIONS ON PRODUCT USE

Toshiba Corporation and its subsidiaries and affiliates are collectively referred to as “TOSHIBA”.
Hardware, software and systems described in this document are collectively referred to as “Product”.
• TOSHIBA reserves the right to make changes to the information in this document and related Product without notice.
• This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with TOSHIBA's
written permission, reproduction is permissible only if reproduction is without alteration/omission.
• Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are responsible for
complying with safety standards and for providing adequate designs and safeguards for their hardware, software and systems which minimize
risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury or damage to property,
including data loss or corruption. Before customers use the Product, create designs including the Product, or incorporate the Product into their
own applications, customers must also refer to and comply with (a) the latest versions of all relevant TOSHIBA information, including without
limitation, this document, the specifications, the data sheets and application notes for Product and the precautions and conditions set forth in
the "TOSHIBA Semiconductor Reliability Handbook" and (b) the instructions for the application with which the Product will be used with or for.
Customers are solely responsible for all aspects of their own product design or applications, including but not limited to (a) determining the
appropriateness of the use of this Product in such design or applications; (b) evaluating and determining the applicability of any information
contained in this document, or in charts, diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and
(c) validating all operating parameters for such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS'
PRODUCT DESIGN OR APPLICATIONS.
• PRODUCT IS NEITHER INTENDED NOR WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE EXTRAORDINARILY
HIGH LEVELS OF QUALITY AND/OR RELIABILITY, AND/OR A MALFUNCTION OR FAILURE OF WHICH MAY CAUSE LOSS OF
HUMAN LIFE, BODILY INJURY, SERIOUS PROPERTY DAMAGE AND/OR SERIOUS PUBLIC IMPACT ("UNINTENDED USE"). Except for
specific applications as expressly stated in this document, Unintended Use includes, without limitation, equipment used in nuclear facilities,
equipment used in the aerospace industry, lifesaving and/or life supporting medical equipment, equipment used for automobiles, trains, ships
and other transportation, traffic signaling equipment, equipment used to control combustions or explosions, safety devices, elevators and
escalators, and devices related to power plant. IF YOU USE PRODUCT FOR UNINTENDED USE, TOSHIBA ASSUMES NO LIABILITY FOR
PRODUCT. For details, please contact your TOSHIBA sales representative or contact us via our website.
• Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part.
• Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable
laws or regulations.
• The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any
infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to any
intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise.
• ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE FOR
PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY WHATSOEVER,
INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR LOSS, INCLUDING
WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND LOSS OF DATA, AND (2)
DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO SALE, USE OF PRODUCT, OR
INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE,
ACCURACY OF INFORMATION, OR NONINFRINGEMENT.
• Do not use or otherwise make available Product or related software or technology for any military purposes, including without limitation, for the
design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile technology products (mass
destruction weapons). Product and related software and technology may be controlled under the applicable export laws and regulations
including, without limitation, the Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration Regulations. Export
and re-export of Product or related software or technology are strictly prohibited except in compliance with all applicable export laws and
regulations.
• Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product. Please
use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, including without
limitation, the EU RoHS Directive. TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES OCCURRING AS A RESULT OF
NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS.

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22 2020-11-26