Lecture 2

Industry Standards

Daniel D., AAiT, SECE 1

 In this lecture

• Definitions
• Standards Organizations
• Classes and Types of PCB
• Standard Dimensions

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 Definitions
PCB

• Printed Circuit Board

• Electronic Board that connects circuit components
• PCB populated with electronic components is a
printed circuit assembly (PCA)
• PCBs are rugged, inexpensive, and can be highly
reliable
• Mass manufacturing
• Professional

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 Definitions
Elements of A PCB

• Components
• Footprints
• Pads
• Traces
• Vias
• Conducting Layers
• Non-Conducting Layers

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 Definitions
Components
• Components are the actual devices used in
the circuit.
• This includes input/output connections.
• I/O ports, including power supply connections,
are also important in the PCB design.

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 Definitions
Footprints

• Footprints are land patterns on PCB Where

components are placed and soldered
• Includes pads for I/O pins and metal surfaces
• May include non-metal structures

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 Definitions
Pads
• Location that components connect to.
• You will solder components to the pads on the PCB.
• Pads will connect to traces.
• Pads can be surface pads or through pads.
• Pads have standard types and dimensions

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 Definitions
Traces
• Traces connect pads together.
• Traces are essentially the wiring of the PCB.
• Traces sometimes connect to vias.
• High current traces should be wide and high voltage
traces should be places far apart

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 Definitions
Via
• Pad with a plated hole connecting traces from one layer of
board to other layers.
• Vias can be thru, Blind or buried

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 Definitions
Metal Layers
• Layers where electrical connections can be made
– Top Layer (component Layer)
many components, few traces

– Bottom Layer (Solder Layer – for single layer board)

few or no components, many traces, soldering

– Inner copper Layers (Multi-layer Board)

usually solid coper planes for power and ground

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 Definitions
Non-conducting Layers
• Layers where no electrical connections can be made
– Substrate (core)
Paper, fiber glass epoxy, special materials
– Prepeg (thin, unsolidified substrate layer – for ML)
will be cured and solidified with high pressure press
– Solder Mask
Thin solder resistant layer (protection and appearance)
– Silk Screen
For labeling and putting text on finished PCB

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 Definitions
Layer Stack-up
• Cross sectional structure of a PCB
• Always in even number of layers

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 Measurements
Standard Units
– Metric system: mm
– Imperial system: mil (mili-inch)
1 mm = ~ 40mil

PCB Copper weight

– Measured in ounce per square feet (oz/ft2) or simply oz
– 1oz Cu board is roughly 35um thickness of copper cladding

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 5 - Questions

How big and what shape?

Where should the parts be Placed?

What kind of layer stack-up?

How wide and how far should traces be?

What grounding and shielding techniques?

What is the “right” way ?

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 Standards Organizations

• Institute for Printed Circuits (IPC)

The main and governing body – 2400+ members
• Electronic Industries Alliance (EIA)
Umbrella organization for standards like JEDEC
• Joint Electron Device Engineering Council (JEDEC)
Standard for semiconductor devices and packaging
• International Engineering Consortium (IEC)
Focus on Research, publication and education
• And Many Others
ANSI, IEEE, NEMA, etc.

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 Classes of PCBs

Performance Classes
Class 1 – General Electronics Products
- Consumer Products (TV, PC, games, …)
- Not expected to have extended service time and requirements
Class 2 – Dedicated Service Electronics Products
- Specific Function (Telecom, Instrumentation, …)
- High-perf. Is expected for a longer period of time
Class 3 – High Reliability Electronics Products
- High reliability under stress conditions is expected
- Medical, military, space… (mission critical applications)

IPC-7351; IPC-D-330; IPC-CM-770E

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 Classes of PCBs

Producibility Levels
Level A – General Design
- Proffered complexity (1/2 layers, thru-via only, …)

Level B – Moderate Design

- Standard complexity (up to 6-layer, blind/buried vias,…)

Level C – High Design

- Reduced Producibilty design
- Intricate designs for specialized systems

IPC-7351; IPC-D-330; IPC-CM-770E

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 Classes of PCBs

Fabrication Classes
Type1/2 – Single Sided PCB/Double sided PCB

Type3 – ML PCB without blind or buried vias

Type4 – ML PCB with blind and/or buried vias

Type5 – ML metal-core PCB without blind or buried vias

Type6 – ML metal-core PCB with blind or buried vias

IPC-CM-770E, Sec 1.2.3

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 Classes of PCBs

Assembly Sub-Classes
Subclass A – Through-hole device (THD) only

Subclass B – Surface Mount device (SMD) only

Subclass C – Mixed THD and SMD (simple)

Subclass X – Complex mixed with fine pitch BGA packages

Subclass Y – Complex mixed with ultrafine pitch CSP components

Subclass z – Complex mixed with fine pitch flip-chip packages

IPC-CM-770E, sec 1.2.2

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Standard Dimensions

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 Standard Dimensions

Panel Area

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 Standard Dimensions

Finished Board Thickness

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Standard Dimensions

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 Standard Dimensions

Etching Tolerance

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