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ECT362-QP - June 2022

This document appears to be an exam for a course on Introduction to MEMS. It contains 20 questions across 5 modules. The questions cover topics like: - The basic block diagram of microsensors and actuators - Operating principles of different MEMS devices like inertia sensors, piezoelectric sensors and actuators - Stress and strain in MEMS structures - Fabrication techniques like ion implantation, photolithography, and LIGA - Packaging and applications of MEMS/BioMEMS/RFMEMS The exam seems to assess students' understanding of key concepts in MEMS design, fabrication, packaging and applications through questions requiring definitions, explanations, comparisons, and derivations.

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2K views2 pages

ECT362-QP - June 2022

This document appears to be an exam for a course on Introduction to MEMS. It contains 20 questions across 5 modules. The questions cover topics like: - The basic block diagram of microsensors and actuators - Operating principles of different MEMS devices like inertia sensors, piezoelectric sensors and actuators - Stress and strain in MEMS structures - Fabrication techniques like ion implantation, photolithography, and LIGA - Packaging and applications of MEMS/BioMEMS/RFMEMS The exam seems to assess students' understanding of key concepts in MEMS design, fabrication, packaging and applications through questions requiring definitions, explanations, comparisons, and derivations.

Uploaded by

rijovsk
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PDF, TXT or read online on Scribd
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D 0300ECT362052201 Pages: 2

Reg No.:_______________ Name:__________________________


APJ ABDUL KALAM TECHNOLOGICAL UNIVERSITY
Sixth Semester B.Tech Degree Examination June 2022 (2019 Scheme)

Course Code: ECT362


Course Name: INTRODUCTION TO MEMS
Max. Marks: 100 Duration: 3 Hours
PART A
Answer all questions, each carries 3 marks. Marks
1 Explain the basic block diagram of Micro sensors & Actuators with neat (3)
sketches
2 Explain the working principle of micro inertia sensor (3)
3 Define normal stress and strain, how it is different from shear stress and strain (3)
4 Describe the different boundary conditions that are encountered in MEMS (3)
systems.
5 Define Trimmer force scaling vector (3)
6 State three relevant properties of Silicon for use in Microsystem (3)
7 Explain the basic block diagram of Ion implantation process with neat sketches (3)
8 Discuss the various fabrication challenges associated with surface (3)
micromachining
9 State the various levels of micro system packaging (3)
10 List three applications of BioMEMS & RFMEMS (3)
PART B
Answer one full question from each module, each carries 14 marks.
Module I
11 a) Differentiate the operating principle of thermal sensors and actuators. State (6)
any two applications
b) Explain the operating principle of piezoelectric sensors and actuators with (8)
relevant sketches
OR
12 a) Describe the operating principle of Linear Micro motors with neat diagrams (6)
b) Explain the principle of operation of MEMS based electrostatic sensors and (8)
actuators.
Module II
13 a) Identify the relation between tensile stress and strain in terms of compliance (6)
matrix

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0300ECT362052201

b) Discriminate how plates and diaphragms can be used for the design of MEMS (8)
with examples
OR
14 a) Determine the moment of inertia for a beam under longitudinal strain and also (8)
find Flexural formula
b) State the reasons of intrinsic stress in thin film materials under room temperature (6)
and zero loading conditions
Module III
15 a) Derive the expressions for Electromagnetic potential energy and force with (8)
reference to scaling of electromagnetic forces
b) Explain Langmuir-Blodgett process with relevant figures (6)
OR
16 a) Derive the equations for acceleration, time and power density based on force (8)
scaling vector
b) Identify the reasons for preferring electrostatic forces over electromagnetic (6)
forces for scaling
Module IV
17 a) Explain the steps involved in photolithography with neat sketches. (8)
b) Describe steps of fabrication of a square tube using LIGA process. (6)
OR
18 a) Explain the Oxide growth process in Silicon with relevant figures (8)
b) Give any six relevant points of comparison between bulk and surface (6)
micromachining
Module V
19 a) Explain the following bonding techniques with figures (8)
a) Silicon-on-Insulator b) Wire bonding
b) State the objectives and explain the general considerations in packaging design (6)
of MEMS
OR
20 a) Explain the different steps in Micro assembly processes (6)
b) Explain two applications which use NEMS technology (8)
****

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