Bob Willis

SOLDER PASTE
Print Inspection
& Defect Guide

BOB WILLIS
1
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 Bob Willis

BOB WILLIS
Solder Paste Print Inspection & Defect Guide

Contents

04 Introduction
05 Solder Paste Storage
06 Solder Paste Stencil Inspection
07 Printing First Off Boards
09 Manual Solder Paste Inspection
16 Solder Paste Printing Defects
37 Solder Paste Washoffs
39 International Standards & Reference Guides
39 Technical Books on Solder Paste & Printing
40 Author’s Profile
41 Links to Related Videos

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Solder Paste Print Inspection & Defect Guide

Introduction
This is our latest defect guide aimed at one of three fundamental processes in surface mount
assembly. Solder paste printing is the first step in the process, and it is essential to achieving the
highest yields. Consistent printing, placement and reflow allows reliable solder joints to be formed
that easily exceed the requirements of IPC and other industry inspection criteria.

Solder paste quality and consistency have improved greatly over the years as has stencil manufacture
and printer platforms to make zero defect achievable. There has also been a revolution in paste
dispensing systems which, in turn, have required suppliers to develop new materials. With the
increasing use of automated Solder Paste Inspection (SPI) engineers can detect variation in their
process and quickly correct and avoid end of line defects. This guide focuses on solder paste defects
and why they could occur plus some guidance on practical methods of inspection. Specifications
and books covering printing, stencils and solder paste materials are listed for reference.

We hope newcomers to surface mount and the expert user will find this a useful guide and invite
you to share the download links with your team and company colleagues to obtain their
own copy plus future updates and other defect topics. Remember you can also see defects
happen in real time with our unique defect videos. Any time you see My Caricature in the
defects section there is a link to an online defect video to watch and share.

In conjunction with the release of this defect guide we will be presenting online webinars “Solder
Paste Print Inspection & Defects – Causes & Cures” if you have missed the live event don’t worry as
its available to watch with the rest of your team.

Many thanks to Claire & Rob Saunders who I have worked with on so many projects and exhibitions
over many years and hope to continue to do so.

Bobwillis.co.uk

Copyright and Disclaimer

Text and images remain copyright of Bob Willis unless stated in the text and should not be copied or transmitted through any
medium without prior agreement in writing from the author. Although the author has made every effort to achieve accuracy of the
content, no responsibility is assumed for errors or omissions to any of the text or references to other publications and documents.
This book includes hyperlinks to other websites owned and operated by third parties. These links are not recommendations. We
have no control over the contents of third-party websites, and we accept no responsibility for them or for any loss or damage that
may arise from your use of them.

4
 Bob Willis

Solder Paste Storage

When solder paste is delivered to a customer’s site suppliers normally provide guidance on the
short and long term storage of paste. You should always follow the supplier’s recommendation.
The most common recommendation is to store paste in a fridge when removed from their original
delivery packaging. Some products are specifically designed not to need cold storage on site in a
factory. Always check paste specification to avoid poor performance.

Check that the paste being used is the correct product and alloy, either Lead-Free or Tin/Lead.
Make sure your shop floor team are aware of the element symbols and their meaning to correctly
identify incorrect materials. The supplier’s packaging and logo may be the same but it is possible
the material is not. A common fault is supplier’s evaluation paste samples stored with production
paste, you know we have all seen it. Assembly documentation file or batch travel card should
always state the paste to be used

Sn = Tin Ag = Silver
Pb = Lead Bi = Bismuth
Cu = Copper In = Indium
Storing paste in a fridge is common when the paste is to be stored for long periods. A guide of
2-10oC may be used as a reference but always confirm with the supplier and use in strict rotation,
oldest date code first. Wherever possible solder paste cartridges should be stored vertically tip
down, equally paste cassettes stored flat or as recommended by suppliers.

New stocks should be placed at the back of the fridge, so it is used in strict date code order. The
date code should be checked before use. Solder paste should not be taken for use from the back
of the fridge.

Solder paste should be allowed to return to ambient temperature and container should be left
sealed. Paste required for next day’s production should be removed from the fridge the night
before to avoid delays or mistakes. Solder paste may be opened, and the seal removed when the
paste has had time to reach ambient temperature overnight.

5
Solder Paste Print Inspection & Defect Guide

Slowly mix the solder paste before use if any separation has occurred in the container. Solder paste
may be mixed on the stencil surface as an alternative to the jar or if a paste cartridge is being used
in production before running pre print test cycles or test prints. Flux vehicle can separate in some
solder paste materials during storage more noticeably in jars. The paste can be mixed but inspect
the first few prints and the rolling action of the paste bead on the stencil surface.

Solder paste containers should be resealed after removing the required amount of paste and held
at ambient temperature. The container should NOT be put back in the fridge as it will be required
during production.

If solder paste is suitable for re-use remove it from the stencil surface and place it into a
USED container. The paste should NOT be placed in the fresh paste container. Paste can be
transferred direct to the next stencil if the quality of the printing is still satisfactory. This avoids
unnecessary handling.

The USED paste should NOT be put in the fridge. Regularly check paste stock and re-order well in
advance of your production requirements. It is simple to record your daily usage and scrap and
good practice to forecast your production stock requirements.

Solder Paste Stencil Inspection

All new designs should be checked for manufacture, this is particularly true in contract assembly.
Many cases are seen where contractors just accept the stencil files from the customer with their
design. This is not good practice; fortunately many of the mistakes are picked up by stencil suppliers’
front end engineers.

All new stencils should be checked prior to release to the shop floor for production. The stencils
should be checked with reference to the design data used to produce the foils when first received.
It is recommended that selected apertures be measured and compared with the Gerber files to
check for any aperture modification previously confirmed with the supplier. Normally all stencil
suppliers offer a check plot stencil file on new jobs so engineers can confirm the design.

On receipt into Goods Inwards, the stencil should be marked with the reference number, stencil
thickness and issue number. This information can of course be included on the surface of the
stencil by the manufacturer if required, the same as referenced on route cards or work instructions.
A stencil log sheet may be attached to the stencil box for monitoring its use, age, any damage and
request to re-order.

Stencil should be inspected for any obvious faults i.e. kinks, poor adhesion to the frame or mesh,
missing or blocked apertures, thickness, correct orientation missing fiducial marks. The stencil
should also be checked with a bare PCB. The stencil log should be completed to show condition of
the stencil and used to record usage.

Stencil should be placed in store until needed for production and will be issued with the kit or taken
from the stencil library. When printing has been completed and the stencil cleaned the operator
will check visually. It is recommended that apertures in the four corners and the centre of the
stencil be checked for correct cleaning. If the stencil has a box frame it should be checked for good

6
 Bob Willis

adhesion of the bonding material to the foil and that the tension has not been lost allowing stencil
ripples.

After cleaning check the smallest apertures and any step-down areas for paste residues. If the
stencil is in poor condition the supervisor should be informed and should make a decision to scrap
the stencil. If the stencil is in good condition it should be returned to the library. It is good practice
to have a light box available to inspect stencils when received or after cleaning. It makes it easier
to spot any blocked apertures.

If any stencils are defective, Material Control should be notified to enable a new one to be ordered
promptly. The log should be removed from the box and given to Material Control to indicate that
the stencil has been scrapped.

All stencils should be check prior to loading on the printer and before the application of paste.
Again the apertures in the four corners and the centre of the stencil should be checked for paste
residue as well as the finest pitch. It is much faster to check the stencil than load and have to
remove it and the paste to start again. Any previous paste blockage will require the stencil to be
re-cleaned prior to use.

Printing First Off Boards

There are simple and practical ways of printing a first off without solder paste touching the board
surface. Using a low tack clear film on the PCB surface allows successful printing to be confirmed
prior to starting production. Alternatively, an overhead acetate foil and some magic tape can be
used. The foil must be held on the PCB surface otherwise it sticks to the stencil. The ideal solution
is a test board for the design being printed. If it is a gold surface finish it is much easier to use for
multiple set ups, easy to clean and gives the best contrast between paste and pad

A sample board can be placed on the tacky surface of the film print face down. A knife is then used
to cut and remove the overhanging film. It is important to check the film is making good contact
with the board surface.

A small overhang of the film could be left in place provided it does not affect printing and automatic
transfer of the board in the printer. The overhanging film can make removal after testing and
inspection easier. The film should be flat on the surface of all pads with no evidence of the bubbles
as this will affect printing quality.

7
Solder Paste Print Inspection & Defect Guide

Here the paste deposit on these fine pitch pads

is consistent but the stencil and the board were
misaligned hence the paste is off the pad and
unacceptable for a set up print

The paste deposit on these through hole pads is

considered unacceptable. The print process has
caused the paste to be lifted from the aperture
producing inconsistent paste volume

When the printing test has been conducted and

the results assessed the film can be removed
from the surface of the PCB. With care test acetate
print sheets can be retained for inspection and
training and are very easy to photograph

8
 Bob Willis

Manual Solder Paste Inspection

Ideally when printing a first off test print production boards should not be used. If they are to be
used to print paste direct to the board a clear film should be placed on the board. This avoids the
difficulty of cleaning paste from small holes and apertures. Alternatively paste can be printed on a
dedicated print test board for this purpose. The test board can be used many times provided it is
cleaned properly after use or inspected as a first off. A gold/nickel surface finish gives good contrast
for any form of inspection and will last longer than other finishes.

After printing this simple criteria can be used, alternatively there is criteria in IPC and NASA inspection
documents.

Satisfactory Print
This is a satisfactory condition which should be achieved and used as the standard for manufacture.
The solder paste deposit should equal the dimensions of the stencil, X, Y & Z plus conform to the
shape of the stencil aperture design. The prints should be centrally positioned on the pad unless
specifically designed with offsets.

Acceptable Print
This condition represents the maximum acceptable departure from the “Satisfactory” condition.
Examples within this limit of deviation will NOT require rework or washoff. Individual clarification
accompanies each example illustration. Consideration should be given to modification/examination
and corrective action to the printing process prior to continuing further printing. This level should only
continue while investigations are in progress and not become the standard for manufacture.

Unacceptable Print
This applies to an unacceptable condition which should not be reprinted without the cause of the
fault being established. Reprinting of the board may be possible after assessment of the fault and
corrective action taken on the process. Any production board must be correctly cleaned prior to
reprinting and should be marked on the edge of the laminate to allow future identification if required.
The cleaning of any production boards should be noted on production batch documentation with the
number of boards affected.

Solder Paste Inspection Criteria

The paste deposit should be flat with no peaks and conform to the stencil aperture dimensions. It
should be positioned centrally on the pad and approximately equal to the thickness of the stencil
in the area of the aperture.

Chip Component Area Array Package QFN Package

9
Solder Paste Print Inspection & Defect Guide

The paste deposit may be misregistered up to 20% from the pad surface provided 80% of the paste
deposit is present on each pad.

Chip Component Area Array Package QFN Package

The deposit will not be acceptable if the print deposit is incomplete, or the print is mis-registered
by more than 20% from the pad or wet paste shorts are visible on the boar.

Chip Component Area Array Package QFN Package

The area array paste deposit should be flat with no peaks and conform to the stencil aperture
dimensions. It should be positioned centrally on the pad surface.

Automatic Solder Paste Inspection

There have been many techniques used over the years to measure paste deposits on the surface of
a circuit board. Methods have now evolved to allow extremely accurate non-contact and repeatable
size, volume and height measurement which is completely automatic and referred to as Solder
Paste Inspection (SPI). This has become the method of choice in the industry.

Graphs show the type of measurements taken

from a SPI system.

10
 Bob Willis

PPM Monitoring
Counting defects manually is very time consuming but has been used in the past to provide simple
comparisons based on the optical inspection guide outlined earlier. Normally speaking in PPM
monitoring you would review periodically the yields from placement, reflow and printing. The
following is the method used to calculate the defect level for printing, based on opportunities which
are the apertures printed. A note would also be taken on the complexity level of the board design
in terms of component size or pitch.

A minimum of five sample boards or panels would be taken for inspection. Any company can take
a much larger sample if they wished. A minimum number of 5000 opportunities would be taken
during sample inspection, this may require additional boards or panels to be inspected if the
minimum number of opportunities is not achieved. The opportunities for error to be determined
are based on the stencil apertures printed in the samples.

Printing Defects x 1,000 000 = PPM Level

Opportunities

Graph shows the results from one project using this manual method

11
OVERCOMING SOLDERING CHALLENGES
When looking for ways to improve production processes, solving soldering challenges can be the best
place to start. Roy Goshawk, Sales Manager and Electronics Specialist at Fraser Technologies, explains
how choosing the right soldering solutions for the job can have a significant impact.

Like most industrial sectors, our electronics

manufacturing clients are always looking for
more efficient production methods, and one
way we can help them is with their soldering
products.
Three of the most common issues related
to soldering are: poor wettability, high levels
of voiding and soldering iron tip erosion. Examples of superior wetting found by using Koki
M500C-7 solder paste
These challenges can lead to reduced
efficiency and higher costs, but there are S3X58-M500C-7 is designed to provide
products available that can solve all of these superior and consistent wetting to oxidised
problems without compromising on metal surfaces, removing the oxide film at the
performance.
At Fraser Technologies, we are proud to pre-heating stage, and forming a protective
have an exclusive UK partnership with Koki – film on the surface of the solder particles to
the leading global soldering solutions effectively prevent re-oxidation during the
provider. The team at Koki has been remaining heating process.
pioneering and manufacturing cutting-edge
soldering materials for over 50 years, and Solving tip erosion issues
Koki’s solder wires, pastes and other Many businesses are searching for more
supporting materials have proven to solve cost-effective solder wires. Typically, standard
these common issues, while also providing un-leaded higher tin containing solder alloys
superior results to comparable products. used for hand soldering are very aggressive
and increase the erosion of soldering iron tips.
Improving poor wettability As components get smaller due to design and
If wettability is an issue, the 72M series space limitations, soldering iron tips have
solder wire and S3X58-M500C-7 solder pastes become more sophisticated and much more
have a market leading powerful wetting expensive.
performance. The 72M series has a new Koki is at the forefront of R&D and technical
activator and a resin composition allowing innovation in this field and the special
better flux coverage, which can more than un-leaded alloys from Koki’s 72M series of
double soldering speed to save time and solder wires are designed to extend the life of
improve efficiency compared to competitors’ soldering iron tips by up to four times! During
products. the soldering process, the alloy forms a
The improved wettability works well with protective barrier to deter erosion. This,
copper, as well as nickel and brass, the latter combined with a powerful wetting flux core,
of which are generally difficult to wet. The wire allows the operator to run the iron tip at lower
is so powerful it also prevents bridging in temperatures, further improving the tip life,
defect-prone conditions, such as low iron tip and leading to a significantly more economical
temperatures or fast sliding speed. manufacturing process.
 low voiding, regardless of the metallisation
condition of the component or PC board; the
type or shape of the components; or the
reflow profiles. It also provides consistent,
continual printability with fine pitch
component board pad patterns. And, in terms
of electronic compatibility, a heat-resistant flux
Example of how Koki’s 72M solder wire creates a activator system enables good solder
protective barrier on the solder iron tip, extending its coalescence with micro-components, even
life for much longer under harsh reflow profiles.

Minimising voiding in solder joints Why choose Koki products?

The formation of voids in solder joints also
Koki offers the full range of printed circuit
pose a significant challenge. Due to an
board assembly materials, leaded and
increasing use of power transistor/bottom
unleaded solder pastes, solder wires, liquid
termination components in surface mount
fluxes for both wave and selective soldering,
electronics, the reflow discharge of generated
tack fluxes for repair and rework and SMT
gas, and the subsequent voiding, is becoming
adhesives. One of the capabilities that sets
a more critical issue with these types of
Koki apart from other suppliers is that it
components.
manufactures its own solder powder, which
Koki’s S3X58-G803, lead-free, ultra-low
ensures quality and consistency across
voiding solder paste is engineered so the
products and technologies.
oxide reduction reaction occurs before the
A simple switch can improve performance,
solder melts or during the pre-heating stage. A
save time, and save money, all while delivering
very fast solder wetting action discharges flux
the high quality results the electronics industry
gas as the solder melts, meaning almost no
demands.
non-wet locations are left, no flux remains in
98% of Fraser Technologies’ customers
the joint and there is no continuous outgassing,
have seen the benefits and switched to the
significantly reducing trapped flux and
72M series, and have seen impressive results
therefore voiding.
from all of Koki’s product range – are you
This formula ensures stable and consistently
ready to make the change too? To find out
more about these products please visit our
website www.frasertech.co.uk.

Tel: 01506 443058

Email: [email protected]

G803 voiding results within a solder joint

Solder Paste Print Inspection & Defect Guide

Weight Gain

Adding solder paste to the PCB does add weight and measuring the board before and after printing
does show a change. The digital scales used must be accurate to three decimal places to allow
comparison. It is, however, more accurate to use some acetate sheets which are much lighter than
a board so that the paste weight increase is more significant.

Printing to acetate sheets also allowed direct measurement on large deposits. In the early days
when paste tended to dry quickly it was possible to measure the paste height with a micrometre
or vernier gauge. This method is an average and does not provide the data to easily solve
process problems.

Solder Paste Gauge

Early methods also included contact height measurement with a Solder Paste Gauge (SPG). This
was a thin metal gauge with teeth set at different heights. These were used on test prints on the
solder mask of waste sections on cut-outs of sections of boards in panels. This method is still used
to measure the wet thickness of conformal coatings (The author had these etched by a stencil
supplier and provided full instruction on how to measure paste).

Solder Paste Printing Defects

Our photographic guide provides examples of common and not
so common paste and printing defects. These are not necessarily
all related to the printing process, or the solder paste being used.
There are many reasons why we get defects during assembly and
hopefully this guide will highlight some of the causes allowing
further investigations to take place to find the exact cause.

Printing and inspection have become very sophisticated today with

automated Solder Paste Inspection (SPI) able to inspect area of
paste coverage, height and volume on every pad on every board. Simple method of solder paste
Previously inspection on a printer was confined to area of coverage. height comparison used in the
However, there is still a benefit and much to be learned at looking early days of SMT
at pasted boards manually when trying to find the root cause of
defects. Let the SPI machines do the hard work but please take a look at your printing closely as
there is still much to learn. A past online survey by the author provided some insight to the type and
possible reasons for defects. The results of future online surveys on paste and printing defects will be
available online with the upcoming webinars associated with this defect guide.

14
 Bob Willis

Solder Splats in Used Paste

Close up of solder paste metal particles after a small sample

of paste has been placed in IPA then allowed to evaporate on
blotting paper. The example is very bad and the result of paste
being abused with no care taken during recovery from a stencil. It
is common practice to remove paste from one stencil to another
or used paste container provided the paste is still printing well.
When particles are compressed and deformed they can block
apertures. This type of deformed particles can be caused by
excess print pressure from the squeegee blade. Most suppliers
will give recommendation on the tools to use during stirring and
adding paste to a stencil.

Solder Splats in New paste

Today’s solder paste products are very consistent with good
control of particle size, shape and distribution. Normally we would
not sample paste to look at existing products unless poor printing
was observed. However, when looking at new products or new
alloys there is a value to use existing test methods defined in IPC
or practical examination. The sample images show alloy particles
from low temperate solder paste Tin/Bismuth/Silver (SnBiAg) with
variation between size and a mixture of shapes. There are also
some examples of compressed and deformed particles which
may impact the printing process by blocking apertures. The paste
sample was separated in IPA then allowed to evaporate on blotting paper before inspection and
measurement of the solder powder.

Solder Balling

During production testing of solder paste samples it is fairly uncommon today to see solder balling
on new or correctly handled products. Great care is taken by suppliers to maintain products during
shipment and detailed advice is available from producers on their website. When testing solder
paste in line with IPC or in-house developed tests paste should not show evidence of slump or
solder balling. Please remember there are other reasons for balling not just the quality of the paste.

15
Solder Paste Print Inspection & Defect Guide

Example images show paste solder balling on the surface of a ceramic tile. The clean
ceramic surface is used during the printing and reflow test. Many years ago one supplier
provided customers test kits in lovely wooden boxes with full instructions like the one
shown and loaned to the author.
Watch
Bob’s
video

Solder Balling

Solder balling that is paste related can be seen where paste is a poor quality, incorrectly stored
or slumps badly during initial preheat and reflow. All of the paste particles cannot coalesce back
to a single ball which is what is expected during testing a paste on a known non-wettable ceramic
surface. The images above are taken from a solder paste test where balling has not occurred, the
first three images show the printed deposit, preheated and then reflowed. The last image shows
the type of balling that can be experienced.

Solder Balling on Solder Mask

Solder paste should not ideally be printed on to solder mask, also referred to as solder resist,
unless by process design. Solder mask can vary from supplier to supplier. Any company
purchasing boards or any design department specifying printed boards should always specify the
solder mask by type and product name. They should not just quote a generic type or specification
like IPC SM840

Solder mask was not originally designed to have paste reflowed on its surface. If the process
requires, as we often do in through hole or intrusive reflow, then it is important to test and
evaluate both paste and solder mask compatibility to coalesce across the surface without
separating into random solder balls

16
 Bob Willis

Engineers often change stencil aperture sizes on one or more pads to increase solder volume on
selected joints. This is also done where there is a known coplanarity issue with corner pins on a
device, connectors or area array package that warp during soldering. The increased volume of
solder helps make the joints possible. A special modification and a new stencil is often a small
price to pay and avoid rework.

Solder Paste Smudging

Smudging solder paste on the surface of the board is most likely
to occur when handling boards or leaning over the board on a
conveyor to inspect. Remember the wrist strap, cuffs on a work
coat or better still the visitor/security pass on a lanyard can make
a mess. This can be very embarrassing but please own up.

Solder Paste Shorts

A wet short or wet paste short are just terms used by the author to
describe solder paste bridging the gap between two paste deposits.
These may or may not lead to a solder short after reflow but the
cause needs to be understood. In the example, which is severe,
they are more likely to cause shorts, particularly after the fine pitch
Quad Flat Pack (QFP) has been placed then reflowed.

Paste shorts like this are likely to occur when people conduct a
double print operation due to the stencil lifting between cycles.
It can occur when the stencil is not in contact with the board for the full print, letting the paste
squeeze between stencil and substrate.

Solder Paste Wet Shorts

Solder paste wet shorts can become a solder short after reflow. Using
X-ray to look at paste deposits after component placement with
area array packages can be helpful. This allows any displacement
and squashing of deposits to be seen. This is particularly useful
when setting up new processes and a technique often used by the
author on Package on Package, QFN and intrusive reflow assembly.

Paste Misalignment
Paste misalignment on boards is not uncommon. Provided the printing process is set up correctly
on smaller individual boards this should not be an issue. However with larger boards and multiple
panels print misalignment between boards can be a problem, in this case we are often forced to find
the best fit rather than perfect prints on each board. If the error is known and the direction of the

17
Solder Paste Print Inspection & Defect Guide

error the stencil suppliers can help with modifications.

Consider checking the boards to the design information and the

stencil. Check the position of the boards in the panels for any
change in dimensions Your PCB and stencil supplier have the
equipment to help with this process. Changes in board dimensions
can occur due to first reflow, change in laminate type, break out
techniques and poor etching.

Paste Scooping
As the size of a stencil aperture increases and the pressure
applied during printing increases it is possible to see solder
paste being scooped off the pad. Reducing the size of the print
or decreasing the pressure can overcome the issue. Where it is
difficult to reduce the aperture then it should be broken up into
multiple smaller apertures. This is very commonly seen on Quad
Flat No Lead (QFN) and large power diodes.

Incomplete Paste Deposit

The most common reasons for incomplete paste deposits is the printing process. Incorrect amount
of solder paste added to the surface of the stencil prevents the apertures filling. Too little paste
on the surface of the stencil will in turn stop the paste rolling in front of the squeegee blade. It is a
less common fault today but if the stencil surface does not promote the rolling action of the paste,
allowing it to slide across the metal, the result will be poor aperture fill.

Incomplete Paste Fill

18
 Bob Willis

Solder paste can be printed on to the surface of Plated Through Holes (PTH) and into the barrel of a
hole for a process called Pin In Hole Intrusive Reflow (PIHIR). This allows through hole components
to reflow with other surface mount parts rather than using hand, wave or selective soldering.

The key feature of this process is to get consistent prints on the surface of the board and hole fill.
This will provide a through hole joint to meet IPC standards and be as reliable as standard processes
like wave and selective soldering. The example shows inconsistent hole fill which may result in
variation in the through hole solder joints. If you have X-ray it makes through hole inspection easy
for paste fill, some engineers may wonder what you are doing using X-ray for paste quality, but it
can work well. If you are interested in PIHIR assembly the authors FREE book on the technology is
available to download.

Incomplete & Missing Paste Deposit

This is a great example of missing and incomplete paste deposit
from a production line the author was running at an exhibition for
three days. The printing problem was seen on different pastes,
different stencils with manual optical inspection and highlighted
by automatic SPI. There is of course a little misalignment on this
example but the reflow soldering results were perfect with the
exception of the missing deposits.

The simple answer was engineering error and not checking

the stencil supplier’s check plots. This stencil was replaced with larger area array apertures with
overprinting of the pads which provided superior paste release on all pastes and stencil types. The
author had a more relaxed exhibition with less process defects with a new stencil.

Solder Paste Particle Contamination

The most common reason for this problem is poor board washoff. A board has been printed with
paste and due to some errors an attempt has been made to manually clean the board. Paste is
forced into plated and non-plated holes and solder mask apertures around pads. You can normally
always spot a board washoff when investigating soldering problems. However, all boards and
panels and boards that do go through washoff should be marked for future reference. If you do
allow washoffs please make sure you have a procedure and train staff.

19
INDIUM CORPORATION:
PROVEN MATERIALS ARE THE FOUNDATION
OF PCBA RELIABILITY
At Indium Corporation, we help ensure reliability in printed circuit board assembly (PCBA) and,
ultimately, consumer products. And while many factors contribute to reliability, the importance of using
quality materials cannot be overlooked.

So, how do we deliver reliability? printing parameters for consistent,

high-quality solder deposits.
• We start with quality materials and a
global supply chain Many common defects which appear after
reflow can still be addressed by optimizing the
• We have storage and handling solder paste and/or solder printing process.
guidance for every step of the soldering
process based on testing and a long • Solder beading is a common defect in
history with SMT products which a small volume of solder material
does not coalesce into the solder joint.
• We provide training and technical This is commonly seen on passive
support for key process steps including: components with excessive solder paste
• Printing deposition. This defect can often be
• Dispensing avoided by improving stencil-to-board
• Stencil design gasketing or aperture design during the
• Reflow settings printing process.

Preventing soldering defects is fundamental • Graping - when solder particles oxidize

to our commitment to lifetime reliability. In rather than coalesce into a joint - is
fact, our team of engineers is available to not more common when using finer powder
only help select the best material for a sizes and can sometimes be fixed by
product, but also to provide technical support choosing the correct flux. Graping can
during the process. also be caused by solder insufficients or
overly long reflow profiles.
One of the first key defects to avoid is
detectable - and preventable - prior to reflow: • A common cause of Tombstoning -
Solder Paste Insufficients. To avoid this when a passive component has one end
issue, we recommend first using a high-quality lifted off the board - is variation in solder
solder paste such as Indium8.9HF. volume. With a controlled and consistent
printing process, we can reduce uneven
Indium8.9HF delivers versatility and stability surface tensions between solder joints
to the printing process, offering enhanced during the reflow process.
electrical reliability to ensure product life
reliability and excellent response-to-pause • HIP and NWO are defects on BGA
performance and long stencil life. components in which the solder doesn’t
fully connect the component to the
These factors help prevent variability so we board on some joints. Since this defect is
can help our customers and partners set up often caused by warpage of the
 DEFECTS
ELIMINATED
RELIABILITY
DELIVERED

component combined with oxidation

during reflow, the recommended
solution is switching to a solder paste AVOID:
such as Indium10.8HF, which is VOIDING
specially engineered to address
NWOs, rather than making
modifications to the printing process.
AVOID:
• Although not all voids are defects,
DENDRITIC GROWTH
excessive Voiding certainly is. We have
worked with many customers to Avoid
the Void® with our proven portfolio of AVOID:
low-voiding solder pastes, carefully SOLDER BEADING
selected reflow profile modifications,
and aperture designs.

At Indium Corporation, we believe in

AVOID:
HEAD-IN-PILLOW
collaborating with our partners to inspire
innovation and advance the industry - From
One Engineer to Another®. Contact our
experts at [email protected]. AVOID:
NON-WET OPENS

AVOID:
INSUFFICIENT
SOLDER DEPOSITS

Learn more:
www.indium.com/PIDG

We Believe that
MATERIALS
SCIENCE
Changes the World
Connect with us

©2021 Indium Corporation

Solder Paste Print Inspection & Defect Guide

Open QFP Joint

This is a clear example of an open joint but is it a solderability problem with the pad or a printing
problem on the first image. Close examination shows all of the other joints are fine with paste
reflowed. If there were a random issue with the gold surface paste would still reflow and the pin
surface would show a buildup of solder around the pin wicking away from the pad. This is shown
on the second image also with some flux residue visible. In this case it is a print aperture issue as
there is no evidence of solder on the pin plating or flux on the pad.

Open Chip Capacitor Joint

There is no evidence of solder on the pad or on the 0402 capacitor termination after reflow. If the
solder paste deposit was printed successfully there should be evidence of the solder and some
evidence of flux residues on or around the pad. Solder paste inspection would have captured this
defect and as this is a fairly large aperture to print there should be other evidence of inconsistent
printing when examining this type of error.

Paste Over Printing Compromises

It is common practice to overprint solder paste on plated through holes to increase the volume
of solder and create perfect joints in a PIHIR process. The images show the paste deposits and
the stencil used to form them. Increasing paste coverage reduces the requirement to change the

22
 Bob Willis

printing process to maximise paste filling the plated through hole and, in some cases, compromising
the print process.

Paste is missing from one hole, but in this example is being used as local fiducial for automatic
through hole insertion. The split reduced area paste deposit on the larger hole avoids contact with
the body of the connector and reduces potential paste loss during preheat and final reflow.

Poor Stencil Design

In through hole printing checking the connector design is essential; do not just accept the supplier’s
pdf design file please measure real parts, its good engineering. Always check any new or alternative
parts for correct paste location between standoff points on the connector to avoid problems after
printing. If your stencil supplier asks to see a new part please help him as he is trying to give you
the best stencil design for your process.

Poor Stencil Design

Solder ball visible on the surface of solder mask
adjacent to pads is not usual but unlikely to be
as large as this or be a solder paste or printing
problem. In this case the paste was printed correctly
and reflow then formed a joint at one end of the
capacitor but with the part flipped. It is believed
that the solderability of the pad may have been an
issue or component misplaced or flipped during
reflow also displacing the paste deposit.

23
kolb CLEANING TECHNOLOGY
Solder Defects Technologies
Optimal cleaning of stencils is a Must in electronics Manual cleaning
production to assure reproducible quality and low Manual cleaning of stencils is still used by process
reject numbers. Residues from SMD-adhesives technicians. However, the inherent limitations and
and -paste particularly in the apertures of stencils / hazards far outweigh possible benefits.
screens lead to printing mistakes in PCB assembly
manufacturing and subsequently to malfunctions of • Time consuming cleaning and drying – means
the final product. Ongoing miniaturization requires low efficiency and high labor cost
ever smaller designs with ultra-fine pitch soldering • Cleanliness is highly depending on human factor
and, as a consequence, ever finer stencil apertures. and often not safely reproducible
Micro-residues of paste and dirt in those tiny • Spreading of solder balls and sticky residues
openings make error-free printing impossible. caused by (compressed air) drying
• Cleaning operators may not be around to attend
The printer-internal stencil cleaning removes paste to printer problems. A printer stand-still costs
or adhesive residues by underside wiping, using more than savings due to manual cleaning gain
wet or dry-cleaning tissues. They primarily clean • High alcohol content means high evaporation
the surface but not necessarily the apertures. To and quick drying hence a higher amount is
achieve here the best cleaning results only special, needed to achieve good results - means
preferably aqueous detergents should be used, higher costs
which do not affect the viscosity of the solder paste. • High evaporation bears health and safety risks
for the operator
Nonetheless, to assure high and constant reliability
it is required that the stencils are regularly 4 Water based detergents gain momentum
completely washed - if possible in an automatic
• Low VOC content and longer impact time on the
stencil cleaning system.
contamination surely is an advantage
• No considerable evaporation
Decisive questions when designing a cleaning
• Lower consumption per cleaning
process:
• Slower drying
• Can the process clean thoroughly and material
conserving fine- and ultrafine-pitch apertures?
• What exact contaminations need to be
Machine supported cleaning
cleaned now and in a foreseeable future?
• Can the process clean fresh as well as dry /
The industry standard IPC recommends the use of a
older contaminations?
cleaning system instead of manual cleaning.
• Is the whole process environmentally safe
and compliant?
• The most popular technologies used are spray
• What is the total cost of ownership (investment,
in air, air-in-immersion and ultrasonic technologies
operating cost, maintenance time)?
• Each technology has different characteristics,
The governing parameters choosing a cleaning but all machine supported cleaning is more
system should be reliability, reproducibility and reliable and repeatable short- and long-term
total cost of ownership. • Even small apertures are cleaned thoroughly
• Most stencil cleaners operate with a single
chamber utilized for both washing and
rinsing operations
• Spray or ultrasonic systems mostly offer PLC
controlled, programmable process

Even if the initial investment in a machine cleaning

system is higher, the total cost of ownership will be
lower in the long run.
Solder Paste Print Inspection & Defect Guide

Print Thickness Variation

The solder paste deposit on the pads has been
scooped, the squeegee blade has lifted the paste
leaving minimum paste on the pads. This may
have been exaggerated by the solder coating on
the PCB. In cases where the stencil apertures are
1 – 1 with the pad dimensions the combination of
solder height and blade pressure can exaggerate
this issue. It is also possible that excessive copper
etching and a large stencil aperture could allow the
pad to sit in the aperture and reduce the thickness
of the stencil for printing.

Dirty Paste Stencil

This is not the worst cleaning problem we see during
factory visits but it is not ideal. Contamination
of any level can lead to printing issues. Manual
cleaning can achieve a higher level of cleanliness
if the correct procedures are followed along with
occasional process audits. Ultrasonic hand cleaning
equipment is very effective with fine pitch stencils if
handled correctly. Automated cleaning can achieve
a high level of consistency without handling any
cleaning solutions.

Stencils must be kept clean with the apertures completely clear of dried paste as this will prevent full
transfer of the desired volume of paste. The stencil should also be clean and tack free to avoid hairs
or other particles sticking. Fibreglass from the PCB can contaminate the paste deposit or again block
apertures. Using a light box is a simple way of inspecting stencils when received or after cleaning. The
process of cleaning and inspection should be fully documented and the staff trained.

Solder Paste Bleed

During printing it is possible for solder paste to
pass between the bottom of the stencil and the
PCB. This is one of the reasons we have periodic
under stencil cleaning. Paste on the bottom of
the stencil must be avoided as it can cause shorts
through paste transfer to random locations on
each board.

The image shows paste printed on to glass and is

useful for engineers to understand the process
and why certain defects occur. It is also possible
to have a solder mask printed and developed on
glass to make it more realistic. Bottom and side

26
 Bob Willis

view macro video cameras have been used for many years to understand paste transfer and the
impact of stencil separation after printing.

From experience we have seen the PCB surface impact the quality and consistency of printing.
Variations in solder mask and legend height will lift the stencil. Reworked solder mask and
identification labels will cause uneven prints as will plating or copper weight variations across the
board surface.

Slow printing, much slower than recommended by the paste supplier, can cause the paste vehicle
to capillary between stencil and surface.

Solvent Bleed Under Stencil

Solder pastes from different suppliers can perform in different ways. In the example paste is
being printed onto glass but it is clear that this product is more prone to solvent bleeding between
apertures. This can lead to solder particles also flowing out from the print area. This in turn can
contaminate the underside of the stencil leading to more frequent stencil wipes.

Solder Paste Slump

Ideally when you print solder paste through a
stencil the resulting print will closely match the
stencil aperture dimensions X, Y and Z height.
When a solder paste is heated to simulate the
reflow soldering conditions there should be a
minimum of paste slump, much less than illustrated
in the photograph where the paste has slumped
excessively, the product would not be ideal for use.
Paste slump testing is documented by suppliers and
featured in IPC Standards and in their Test Methods
Manual. It is common practice to use this as one of
the more simpler tests to compare paste products
from different vendors.

27
Solder Paste Print Inspection & Defect Guide

PCB Fibre Contamination

Contamination does occur from PCB glass fibres and due to airborne particles which can be trapped
by the tacky nature of solder paste. The example shows a fibre on the surface of the paste after
placement. The resulting solder joint was not affected by the fibre, but all contamination should be
avoided wherever possible. It is one of the reasons that the automotive industry have been very
keen on preprint board cleaning as this type of contamination would not be acceptable.

Poor Cleaning of Apertures

If the stencil is not cleaned correctly paste will remain in the apertures and dry in place. When the
stencil is used again then it will be very difficult to obtain successful prints. Having dried paste on
the same pad as a limited deposit of fresh paste is also less likely to provide a perfect joint. It will
be very difficult, if not impossible, to fault find after reflow.

Any stencil must be cleaned after use and inspected before returning to the stencil library. A stencil
should always be checked before mounting on to a printer. A lot of time can be wasted if the printer
is set up then has to be broken down again due to dirty stencils.

30
 Bob Willis

Component Lift
In most cases component lifting during reflow
would be blamed on the reflow process. However,
in this case a combination of stencil and pad
design have caused the component to lift on the
solder as it reflows forming a bump. The pad width
is wider than the gap in the plastic standoff body
of the component. The incorrect pad design has
been used on this part, leading to a wider stencil
aperture. To be fair there may have been a change
in the component supplier but if that is the case the
new part should have been checked with the board
design before accepting new stock. Alternatively
the engineer should have reduced the stencil width
and increased its length to maintain paste volume for the joint but not lifted the part.

Stencil Manufacturing Quality

There are many very good stencil producers in our industry offering etched, laser-cut and electro
formed stencils. Each supplier may also offer other proprietary processes and treatments which
may enhance paste printing and release from each aperture. It is up to the customer to work with
and evaluate sample stencils. Very few companies have the resources to evaluate a stencil in detail.
A side by side comparison on a demanding board is the simplest way. Then compare the ongoing
performance of the supplier based on yield, delivery, support and finally cost.

The image shows a stencil aperture which is etched but has a very uneven wall surface, there is also
some evidence of the paste still present in the opening. The second SEM image is also etched but
with a superior surface and provided a good performance.

31
Fast, Accurate 3D Solder Paste Inspection for
Multiple Applications | Case Study

Benefit Summary
Flexibility tops the list of benefits as the SQ3000™ proves to be
the most accurate and reliable solution for both AOI and SPI
applications.

Challenge
Our customers were in search of a single solution that could
handle both Automated Optical Inspection (AOI) and Solder
Paste Inspection (SPI). A flexible and robust system, would
allow them to accurately and repeatedly measure both small, short components (~50µm)
and large, tall components (<25 mm). The ability to manage both inspection cycles with one
system would greatly reduce cost, training and operator time, and minimize the required
footprint.

Solution
CyberOptics’ SQ3000 is the ideal inspection solution for these customers. This Multi-Function
system has the flexibility required for a variety of applications, including AOI, SPI and CMM.
The sensor, software and system all work together to completely automate the full-line
inspection process. With high precision, customers are able to utilize this solution without
changing process and production based on layout for features like plot line design. The
SQ3000 offers repeatability of 6 micrometers in 3 sigma for X, Y, Z measurement.

The Multi-Reflection Suppression™ (MRS™) sensor technology delivers unmatched accuracy

by identifying and rejecting reflection based distortions caused by shiny components and
surfaces. With multiple MRS sensors available, with various speeds and resolutions, our
customers are able to find defects sooner and mitigate any measurement inaccuracies for a
variety of AOI and SPI applications, helping reduce cost and operator time. Additional
advantages of the SQ3000 include ease of use and reduced training time.

This proprietary system is a best-in-class solution that significantly improves yields and
processes, and continues to create operational efficiencies for our customers.

For more information about CyberOptics, visit our website at www.CyberOptics.com

Copyright © 2021. CyberOptics Corporation. All Rights Reserved.

 A Leap Forward in Solder Paste Inspection
Ultimate Combination of High Speed, Accuracy, and Resolution

Maximize yields and improve processes with inspection and measurement

systems powered by Multi-Reflection Suppression™ (MRS™) Technology.

The SQ3000™ Multi-Function system for AOI, SPI and CMM incorporates the
multi-award winning MRS technology with multiple sensor options for the best
accuracy, repeatability and reproducibility - even on the smallest paste deposits.
The Ultra-High Resolution MRS Sensor enhances the SQ3000 platform, delivering
superior inspection performance, ideally suited for the 0201 metric process and
microelectronic applications. CyberOptics also offers large board and dual-lane
systems, as well as the SE3000™ 3D SPI system for dedicated solder paste
inspection and metrology.

www.CyberOptics.com
Copyright © 2021. CyberOptics Corporation. All Rights Reserved.
Solder Paste Print Inspection & Defect Guide

Poor Stencil Cleaning

Cleaning stencils can be conducted manually or
automatically to a very high standard. The first
thing that needs to be established is the cleaning
material to be used is compatible with the solder
paste being cleaned. The cleaner must be able
to dissolve the residues, the flux/vehicle must be
soluble in the cleaner and the cleaning process
must be able to clean and then rinse the stencil
before drying. The surface of all apertures must
be clean with no residue or solder particles left
behind. The complete surface of the stencil must
be tack free. The image shows a dirty stencil with
streaks and residues and it was tacky to the touch
making it difficult to remove from its shop floor protective packaging.

Incomplete Print
There are a number of reasons for incomplete
and smeared prints. This example was caused
by movement of the board during separation of
the stencil. The board was not being help by the
clamping system. The board could be seen to
move as the pressure of the squeegee blade was
released. This was also indicated by the lifting of
the stencil.

Solder Paste Bleed

This is a less common problem today but paste
is contaminating the board surface away from
the pad being printed. Where there are through
holes and vacuum tooling used to hold boards in
position problems can be experienced. Literally
the paste is being sucked off the pad surface. This
was also a problem with hybrid circuits before
surface mount technology.

34
 Bob Willis

Wet Paste Deposit

When looking at solder paste deposits they often look dry on the surface of the pad after
application. This example looks different. Well it is different and it has not been printed; it has
been jetted on to the surface of the pad. The main reason for the difference in appearance is the
paste. When products are designed for dispensing or jetting they generally have a lower metal
content and different viscosity. There is nothing wrong with either of the examples above it is just
they are different, and both helped formulations from suppliers to create perfect solder joints. The
dispensing and jetting paste grades still must perform correctly when soldered. It is just another
challenge for the paste developers.

Solder Paste Alignment

Printing ultra-fine pitch and small passive components 01005 and below is a challenge and it
is all about fighting tolerances. Circuit boards expand and contract during soldering. There are
differences in the relative position of the boards in multi panels and stencils.

35
Solder Paste Print Inspection & Defect Guide

Solder Paste Stencil Damage

Solder paste stencils are a precision tool that must be handled, used, cleaned and stored correctly
following supplier recommendations. If the stencil becomes damaged the print quality will suffer.
We are very fortunate today that stencils are more economically priced and quick to turn around
replacement stencils. Back in the day a laser cut stencil could cost over £1000.

The examples above all show damage to the foils which will cause print errors and should be
replaced. With decreasing stencil thickness from 0.006” – 0.003” (150 - 75um) damage can occur.
Most stencil supplier offer fast turnround times, you pay a little more but if you have to spend
more then hopefully more care will be taken with these tools in the future. Many years ago it was
common to have back up stencils and this is still possible as stencil foils take up so little room in
high volume. However, fast manufacture and delivery is readily available so the need for back up
stencils are not necessary.

Solder Paste Deposit

Just to round off the defect section here is a perfect
example of paste deposits on a QFN footprint.
The side termination pads have consistent paste
coverage and volume. The centre pad has nine split
aperture designs to avoid excess paste, voiding and
paste displacement during component placement.

38
 Bob Willis

Solder Paste Washoffs

Although every effort is made to eliminate printing problems, they do occur. Some boards do
require cleaning if the required standard of paste printing is not achieved. If this is the case a
method needs to be defined on the shop floor and monitored for its effectiveness unless you want
to have boards like the examples shown below?

The most common process is to wipe the paste off the board with a cloth or rubber blade which
removes the paste from the surface of the pads but deposits it everywhere else. Wiping paste manually
places paste in the resist windows, via holes, tooling holes and plated through holes and may not be
removed with subsequent cleaning operations. Process problems may be experienced during through
hole component insertion as the paste will reflow partially filling the holes. As the fluxing agent in the
paste has been removed during cleaning the solder particles normally just bind together in the holes
like frogspawn. If the paste is left on the surface of the board the cleaning system will have to handle
more paste removal; both situations can be evaluated during testing.

Although the cleanliness of the printed board after cleaning is very important, testing for ionic residues
is only one issue to consider. The impact on solderability of the surface finish and the solder particles
on the surface of the board, and in the through hole, is also very important to monitor. The time
taken to clean the boards manually or semi automatically is very important to the solderability of the
boards. How easy is it to put boards into a cleaning tank and totally forget they were there, we have
all done it??

Final inspection will undoubtedly detect solder balls on the surface of the board after final assembly.
On many occasions the solder paste is blamed for poor reflow and a debate ensues. A simple trick for
any boards that are washed off by whatever means is to mark the edge of the card with a wide felt
tip pen.

39
Solder Paste Print Inspection & Defect Guide

In the case of a multi panel each board, there is no point in marking the scrap breakout sections
for investigation. Marking the edge makes it quite clear that the board has gone through a different
process and may be considered during defect investigation. Of course we assume that washoffs are
also recorded in the batch documentation.

The practice of washing off boards should be defined and a process available to conduct the operation
with suitable training for staff. The number of washed off boards should also be monitored as part
of a process control strategy to provide an indication when a process is drifting. Cleaning and drying
boards prior to re-printing is important to consider. If the cleaning material is not fully evaporated
from the surface of the board or solder mask it will affect satisfactory reflow of the solder paste. Often
this looks like incompletely reflowed paste. The author has been in some factories where the pile of
boards for washoff was nearly as high as the printer. This was of course quite a few years back, the
goal is never to create defects and have to wash boards with paste.

Sponsored by

40
 Bob Willis

International Standards & Reference Guides

Stencil Design Guidelines - IPC-7525A

Stencil & Misprinted Board Cleaning Handbook - IPC-7526
Requirements for Solder Paste Printing - IPC-7527
General Requirements & Test Methods for Soldering Paste - J-STD-005
NASA Workmanship Standards - Solder Paste Printing
Bob Willis Solder Paste Printing & Inspection Posters
Bob Willis Solder Paste, Printing, Inspection & Defect Photo Library

Technical Books on Solder Paste & Printing

Reflow Soldering & Process Troubleshooting

Dr Ning-Cheng Lee

Solder Paste in Electronics Packaging: Technology and Applications in Surface Mount

by Jennie S. Hwang

Solder Paste Technology Principals & Applications

by Colin Johnson

Guide to PIHR Technology – Design, Assembly, Inspection & Defects

by Bob Willis

41
Solder Paste Print Inspection & Defect Guide

Authors Profile

Bob Willis currently operates a training and consultancy business based

in United Kingdom and has created one of the largest collections of
interactive training material in the industry. He is a member of the SMTA
Europe Technical Committee. Over the years Bob has been Chairman and
Technical Director of the SMART Group and held the title of Honorary Life
Vice President for his contributions to the Group since its inception. With
his online training webinars Bob Willis provides a cost-effective solution
to training worldwide and regularly runs training for SMTA, IPC and in the
past ICT & EIPC. Although a specialist for companies implementing lead-
free manufacture Bob has provided worldwide consultancy in most areas
of electronic manufacture over the last 35 years. This earned him the
SOLDERTEC/Tin Technology Global Lead-Free Award for his contribution
to the industry. Bob has travelled in the United States, Japan, China, New
Zealand, Australia, South Africa and the Far East consulting and lecturing on electronic assembly.

Bob was presented with the “Paul Eisler award by the IMF (Institute of Metal Finishing)” for the best
technical paper during their technical programmes. He has conducted SMT Training programs for
Texas Instruments and ran Wave & Reflow Soldering Workshops in Europe for one of the largest
suppliers of capital equipment Electrovert/Speedline. This is based on many years of practical
experience working in telecommunications, military OEM, contract assembly, printed board
manufacture, environmental test and quality control laboratories. He has also been presented
with the SMTA International Leadership Award and IPC Committee Award for contribution to their
standards activity.

He has also run training workshops with research groups like ITTF, SINTEF, NPL & IVF in Europe.
Bob has organised and run lead-free production lines at international exhibitions Productronica,
Hanover Fair in Germany. Nepcon Electronics in England plus IPC APEX and SMTA International in
USA providing an insight to the practical use of lead-free soldering, high temperature electronics,
cleaning, conformal coating on Ball Grid Array (BGA), Chip Scale Package (CSP), 0210 - 01005 chips
and through hole intrusive reflow assemblies. Bob has also been presented with a Best Speaker
at SMTA International Conference in Chicago. In his early career he worked with the GEC Technical
Directorate as Surface Mount Co-Ordinator for both the Marconi and GEC group of companies and
prior to that he was Senior Process Control Engineer with Marconi Communication Systems.

42
 Bob Willis

Bob Willis Solder Paste Defect Videos

Here are some of our video clips showing common and less common problems with the use of
solder paste. We have created and used these types of clips for many years to help engineers
understand what can happen and to investigate problems for customers.

Poor Paste Volume and Rolling Action

Excessive Under Stencil Cleaning

Poor Paste Seperation

Solder Balling & Solder Paste Fines

Solder Beading & Poor Design Rules for Pads

Solder Beading Due to Solder Paste Slump

Solder Paste Stencil Contamination

Solder Balls & Solder Fines

Excess Stencil Solvent Cleaning

Voiding in Pin In Paste Reflow

Solder Paste Spitting & Condensation

These can all be found on Bob Willis’ Youtube Channel:

https://www.youtube.com/user/MrBobwillis/

43