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CP 72 6

This document provides the specifications for a 72-lead lead frame chip scale package (LFCSP_VQ) that has a 10 x 10 mm body and is very thin. The summary includes dimensions in millimeters for the package body size and lead frame layout, including pin numbers and locations, minimum clearance distances, and other technical specifications. It also notes the package complies with JEDEC MO-220-VNND-4 standards.

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0% found this document useful (0 votes)
87 views1 page

CP 72 6

This document provides the specifications for a 72-lead lead frame chip scale package (LFCSP_VQ) that has a 10 x 10 mm body and is very thin. The summary includes dimensions in millimeters for the package body size and lead frame layout, including pin numbers and locations, minimum clearance distances, and other technical specifications. It also notes the package complies with JEDEC MO-220-VNND-4 standards.

Uploaded by

jose2
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
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72-Lead Lead Frame Chip Scale Package [LFCSP_VQ]

10 x 10 mm Body, Very Thin Quad


(CP-72-6)
Dimensions shown in millimeters

10.10 0.60 0.30


10.00 SQ 0.60 0.42 0.23
9.90 0.42 0.24 0.18
PIN 1
0.24 55 72
1 INDICATOR
54

PIN 1
INDICATOR
9.85 0.50
9.75 SQ BSC 5.45
9.65 EXPOSED 5.30 SQ
PAD
5.15

0.50
0.40 18
37
0.30 36 19

TOP VIEW BOTTOM VIEW 0.25 MIN


12° MAX 0.80 MAX 8.50 REF
1.00
0.65 TYP
0.85
0.05 MAX
0.80
0.02 NOM
COPLANARITY
SEATING 0.08
PLANE 0.20 REF

06-25-2012-C
COMPLIANT TO JEDEC STANDARDS MO-220-VNND-4

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