Cabaluna Analogy between Dislocation Motion and

Caterpillar Locomotion

1. Caterpillar Locomotion - hump formed

Dislocations and Strengthening Mechanisms
and propelled by lifting and shifting of
- are processes that occur in materials leg pairs.
when they are subjected to stress.
2. Dislocation Motion - the movement of
an extra half-plane of atoms by breaking
Dislocations and reforming interatomic bonds.
- is a term used in material science to
describe a defect or irregularity in a
crystal lattice. TYPES OF DISLOCATIONS

1. Edge Dislocation
Strengthening Mechanisms - this type of dislocation occurs when an
extra half-plane of atoms is introduced in the
- refer to a variety of techniques use to crystal lattice.
increase the strength of a material. - direction of edge dislocation line (⊥)
motion- in direction of applied shear stress
(τ).
Dislocations

- a line defect is also called dislocation 2. Screw Dislocation

- is a Crystallographic defect or - this type of dislocation occurs when an
irregularity within a crystal structure extra half-plane of atoms is introduced
- the presence of dislocations strongly crystal lattice and is rotated by some
influences many of the properties of angle from its original position.
materials - direction of edge dislocation line (↻)
motion- perpendicular to direction of
applied shear stress.
Plastic Deformation by Dislocation Motion
3. Mixed Dislocation
1. Plastic Deformation occurs by motion of - dislocations with mixed edge and screw
dislocations (edge, screw, mixed) - character.
process called slip.

Burgers Vector
2. Applied shear stress can cause extra half
plane of atom [ edge dislocation line ()] - the magnitude and the direction of the
to move as follows; slip is represented by a vector b called
the burgers vector.
- the displacement vector that closes the
3. Atomic bonds broken and reformed loop when traversing an equal number
along plane as dislocation (extra half of lattice steps around the defect.
plane) moves.
Burgers Vector in Edge Dislocation Interaction between Dislocations

- lies perpendicular to the line of ▪ Same signs moving on the same slip plane-
dislocation. repel

Burgers Vector in Screw Dislocation

▪ Same signs moving on the different slip
- parallel to the dislocation line. plane – attract

▪ Opposite signs moving on the same slip

DISLOCATION CHARACTERISTICS: METALS plane- attract (annihilate)

Examples: ▪ Opposite signs moving on the different slip

• Copper plane - repel
• Aluminum
• Iron
Slip Systems
Dislocation Motion - relatively easy - combination of slip plane and slip
Metallic Bonding - non-directional direction.
Close-packed planes and directions for
slip Slip Plain

- crystallographic plane on which slip

occurs most easily
DISLOCATIONS CHARACTERISTICS: CERAMIC - plane with high planar density
Ceramics - Covalently Bonded Slip Direction
Examples: - crystallographic direction along which
• Silicon slip occurs most easily
• Diamond - direction with high linear density

Dislocation Motion - relatively difficult

Covalent Bonding - directional For FCC crystal structure - slip systems is {111} <
110 >

▪ Dislocation motion on {111} planes

Ceramics - Ionically Bonded
▪ Dislocation motion in < 110 > directions
Examples: ▪ A total of 12 independent slip systems
• NaCl for FCC
• MgO

Dislocation Motion - relatively difficult

Few slips systems - motion of nearby
ions of like charge (+ & -) restricted by
electrostatic repulsive forces.
Slip systems for Face- Centered Cubic, Body- Resolved Shear Stress
Centered Cubic and Hexagonal Close-Packed
- it is not the entirety of the applied force
Metals
that causes the slip or dislocation, but
just a component of it.

Polycrystalline Materials

- are solids composed of numerous small

crystals (the "grains").

Grain Boundaries

- separate the grains, which have random

crystallographic orientations.
Cabrillos

Slip (Dislocation Motion)

Hall-Petch Equation
- the process by which plastic
deformation is produced by the - is an empirical relationship that explains
dislocation motion the relationship between the grain size
and yield strength of a polycrystalline
Slip Plane material.
- is the crystallographic plane along which
the dislocation line moves.
Deformation by Twinning
Slip Direction
Twinning
- is the direction of the dislocation line
movement - shear force produces atoms moving to
the mirror image position of atoms on
the other side.
Single Crystals Twin Boundary
- is formed when the periodic and - special type of grain boundary that
repeated arrangement of atoms is preserve mirror symmetry on both sides
perfect or extends throughout the entire of it.
specimen without interruption.
Twinned Region

- is a distinct region in a material where

Slip on Single Crystals (Crystal Slip) twinning has occurred.
- is the occurrence of two planes of atoms
sliding
over one another.
- the sliding follows a specific slip system
(slip plane and slip direction)
Cadungog Clar

Grain Size Reduction ▪ Plastically deforming a polycrystalline

metal specimen at temperature that are
▪ grain boundaries act as barriers to
low relative to its absolute melting
dislocation motion
temperature produces microstructural
▪ at Boundary
and property changes that includes:
• slip planes changes direction
• discontinuity of slip planes 1. Change in grain shape,
▪ reduce grain size 2. Increase in dislocation density
• increase grain boundary are 3. Strain hardening
• more barriers to dislocation motion
• increase yield strength, tensile
strength, hardness ▪ These properties and structure may
revert back to the pre-cold worked
states by having appropriate heat
Solid Solution Strengthening treatment
- impurity atoms distort the lattice &
generate lattice strains.
- this strain can act as barriers to ▪ Such restoration result from different
dislocation motion. processes that occur at an elevated
- remember, “like” strain repel one temperature:
another. ✓ Recovery
✓ recrystallization
✓ grain growth
Strengthening
Recovery
- small substitutional impurities tend to
concentrate at dislocation (regions of - takes place at low temperatures of
compressive strains) annealing
- large substitutional impurities tend to - there is no change in microstructure
concentrate at dislocations (region - excess point defects created during cold
tensile strains) work are absorbed at surface or grain
boundaries.
- random dislocation of opposite sign
Strain or Work Hardening come together and annihilate each
- deformation at room temperature (for other, this phenomenon is called
most metals) to make them harder or polygonization
stronger
- phenomenon called “Strain Hardening
or (cold working)” Recrystallization
- deformation often reduction in cross-
- is the formation of a new set of strain-
sectional area.
free and equiaxed grains (i.e., having
approximately equal dimensions in all
direction) that have low dislocation
 densities and are characteristics of the
pre-cold worked condition. c. Grain size: Finer the original grain size
- the new grains forms and grow until they lower is the recrystallization
completely consume the parent temperature.
material.
- process of recrystallization increases
with time and certain temperature. d. Purity of metal: presence of impurities
- the small speckled grains are those that increases recrystallization temperature.
have recrystallized. Thus,
recrystallization of CW metal may be e. Heating time: Longer the heating time,
used to refine the grain structure. lower is the recrystallization
temperature.

Stages of the Recrystallization of Brass

a. Cold-worked (33%CW) grain structure

b. Initial stage of recrystallization after
heating for 3 sec at 580 °C; the very small
grain is those that have recrystallized.
c. Partial replacement of cold-worked
grains by recrystallized ones (4 sec at 580
°
d. Complete recrystallization (8sec at 580
°C).

Grain Growth
Recrystallization
- Grain growth by the migration of grain
- recrystallization temperature (𝑇_𝑅𝑇) is boundaries. Obviously, not all grain can
typically between 1/3 and 1/2 of the enlarge, but large ones grow at the
absolute 𝑇_𝑚𝑒𝑙𝑡 of a metal or alloy expense of small ones that shrink. Thus,
- hot working helps keep material soft and the average grain size increases with
ductile allowing a huge degree of time, and at any particular instant there
deformation exist a range of grain sizes.

Factors affecting recrystallization e. Grain growth after 15 min at 580 °C.

a. Melting point: Higher the melting point g. Grain growth after 10 min at 700°C.
of the metal, higher is the
recrystallization temperature.

b. Degree of cold work: Higher the degree

of cold work, lower is the
recrystallization temperature