Document Datasheet
Type Multilayer Chip Antenna
AMOTECH Co., Ltd. Application 2.4GHz
Part No. ALA321C3
Revision 7.0
DATASHEET
Application
Bluetooth
Zigbee
WLAN (IEEE 802.11 b/g)
ISM 2.4GHz Wireless Devices
Features
Helical Structure
Small Size (3.2*1.6*1.2mm3)
Easy Optimizing
with external lumped matching components
SMT Available under Pb-free Condition
RoHS Compliant
AMOTECH
Notes
The contents of this datasheet are subject to change without notice. Please confirm the specifications and delivery
conditions when placing your order.
Datasheet / Multilayer Chip Antenna / 2.4GHz
ALA321C3 (Rev 7.0)
Revision History
Rev. No Date Title Contents Page
7 ’09.04.07 Format Changed document format
Table of Content
1. Specifications 3
1.1 Electrical Specifications 3
1.2 Mechanical Specifications 3
1.3 Appearance and Material 3
2. PCB Design for Test 4
2.1 Evaluation Board Dimension 4
2.2 PCB Design Guide 4
3. Measurement Result 5
3.1 Typical Measurement Result (VSWR/RL, Smithchart) 5
3.2 Typical Measurement Result (Gain, Radiation Pattern) 6
4. Reliability 7
5. Soldering Reflow Profile 7
6. Packaging 8
6.1 Carrier Tape Dimension 8
6.2 Packaging Quantity 8
6.3 Packaging Label 8
2
Datasheet / Multilayer Chip Antenna / 2.4GHz
ALA321C3 (Rev 7.0)
1. Specifications
1.1 Electrical Specifications
No Item Spec. Remark
1 Frequency Range [GHz] 2.4 ~2.485
2 VSWR Max 3.0:1
3 Peak Gain [dBi] typ. 2.3
4 Total Avg. Gain [dBi] typ. -0.6
5 Efficiency [%] typ. 84
6 Polarization Linear
7 Impedance [Ω] Nominal 50
The results are measured on the 10x43mm2 evaluation board(EVB).
See Page 6. for more detail gain parameter
1.2 Mechanical Specifications
No Item Spec. Remark
1 Dimensions (LxWxH) 3.2x1.6x1.2 mm3
2 Unit Weight typ. 20 mg
3 Operating Temperature -35 ~ +85 ℃
1.3 Appearance & Material
No Item Function Material
① External Electrode Soldering, Input Port Ag/Ni/Sn
② Direction index Indication of Ceramic
③ Ceramic Body - Ceramic
④ Model No. index - Ceramic
⑤ External Electrode Soldering Ag/Ni/Sn
③
① ② 3.2±0.3
④
⑤ 1.6±0.2
A3
Side
0.4±0.2
1.2±0.2
(unit : mm)
3
Datasheet / Multilayer Chip Antenna / 2.4GHz
ALA321C3 (Rev 7.0)
2. PCB Design for Test
2.1 Evaluation Board Dimension
Chip Antenna
Matching Stage
SMA Connector
GND
[Unit : mm]
Evaluation board size ~ 10x43
Fill Cut Area (GND Clearance) ~ 10x13
2.2 PCB Design Guide
50 Ohm Feeding Line 0.8
① ② 1.8
2.4
4.0
[PCB Solder Land]
No Pin Assignment
① Feeding
② N.C
[unit : mm]
Matching Component
4
Datasheet / Multilayer Chip Antenna / 2.4GHz
ALA321C3 (Rev 7.0)
3. Measurement Result
3.1 Typical Measurement Result (VSWR/RL, Smithchart)
③
②
No Matching Value
① N.C
② 5.6 nH
③ 1.8 nH
The results are measured on the 10x43mm2 evaluation board(EVB).
5
Datasheet / Multilayer Chip Antenna / 2.4GHz
ALA321C3 (Rev 7.0)
3.2 Typical Measurement Result (Gain, Radiation Pattern) z
E2
Peak Gain Avg. Gain Total Avg. Gain Efficiency
(dBi) (dBi) (dBi) (%)
E1
Azimuth 2.0 -0.2
Elevation 1 2.3 -1.8 -0.6 84 -y y
Elevation 2 0.9 -2.7
x Azimuth
[Azimuth plane @2.45GHz ] [Elevation1 plane @2.45GHz ]
[Elevation2 plane @2.45GHz ] [3D Radiation Pattern]
6
Datasheet / Multilayer Chip Antenna / 2.4GHz
ALA321C3 (Rev 7.0)
4. Reliability
No Item Test Condition Test Requirements
1. Applied force on SMT chip till
detached point from PCB.
1. No mechanical damage by
Adhesive Strength
1 applied force
of Termination F
2. Strength (F) > 3 kgf
PCB SMD PAD
1. Step 1 : -40 ± 3℃, 30 min
Thermal Shock 1. No visual damage
2 Step 2 : +125 ± 3℃, 30 min
(Cycle) 2. Within electric spec (VSWR)
2. Number of cycle : 30
High Temperature 1. Temperature : +125 ± 5℃ 1. No visual damage
3
Resistance 2. Time : 1000 ± 24 hrs 2. Within electric spec (VSWR)
Low Temperature 1. Temperature : -40 ± 5℃ 1. No visual damage
4
Resistance 2. Time : 1000 ± 24 hrs 2. Within electric spec (VSWR)
1. Humidity : 85 % RH
1. No visual damage
5 Humidity Temperature : +85 ± 3℃
2. Within electric spec (VSWR)
2. Time : 1000 ± 24 hrs
5. Soldering Reflow Profile
7
Datasheet / Multilayer Chip Antenna / 2.4GHz
ALA321C3 (Rev 7.0)
6. Packaging
6.1 Carrier Tape Dimension
Item Spec. Item Spec. Item Spec.
A0 1.90±0.10 P0 4.00 ±0.10 E 1.75±0.10
B0 3.50±0.10 P1 4.00 ±0.10 F 7.50±0.10
K0 1.50±0.10 P2 2.00 ±0.10 W 16.00±0.30
D0 1.55±0.05 - - t 0.30±0.05
6.2 Packaging Quantity
Item Quantity Dimension
Reel 2,000ea Φ7” * 12mm
Inner Box 6,000ea (3 reel) 185 * 185 * 68 (mm3)
Outer Box1 30,000ea (5 Inner Box) 375 * 200 * 205 (mm3)
Outer Box2 60,000ea (10 Inner Box) 390 * 375 * 205 (mm3)
6.3 Packaging Label
AMOTECH Co., Ltd.
5BL-1Lot, 617, Namchon-Dong, Namdong-Gu, Incheon, Korea
Multilayer Chip Antenna
P/N : ALA321C3
Lot No :
Quantity : 2,000 pcs Date : 2010/01/19
