Taiwan Semiconductor Manufacturing Company Limited

1Q94 2Q94 3Q94 4Q94 1Q95 2Q95 3Q95 4Q95 1Q96 2Q96 3Q96 4Q96 1Q97 2Q97 3Q97 4Q97
Historical Operating Data

Annual Capacity (1) 228 293 392 524

(Thousand 12" equivalent wafers)

Quarterly Wafer Shipments (2) - - - - - - - - - - - - 93 117 140 160

(Thousand 12" equivalent wafers)

Breakdown of Revenue (%) (2)

Wafer Revenue by Technology (4) (6)
5nm - - - - - - - - - - - - - - - -
7nm - - - - - - - - - - - - - - - -
10nm - - - - - - - - - - - - - - - -
16nm - - - - - - - - - - - - - - - -
20nm - - - - - - - - - - - - - - - -
28nm - - - - - - - - - - - - - - - -
40/45nm - - - - - - - - - - - - - - - -
65nm - - - - - - - - - - - - - - - -
90nm - - - - - - - - - - - - - - - -
0.11/0.13um - - - - - - - - - - - - - - - -
0.15um - - - - - - - - - - - - - - - -
0.18um - - - - - - - - - - - - - - - -
0.25um+ - - - - - - - - - - - - 100% 100% 100% 100%

Net Revenue by Application (3) (4) (6)

Computer - - - - - - - - - - - - - - - -
Communication - - - - - - - - - - - - - - - -
Consumer - - - - - - - - - - - - - - - -
Industrial/Standard - - - - - - - - - - - - - - - -

Net Revenue by Platform (7)

High Performance Computing
Smartphone
Internet of Things
Automotive
Digital Consumer Electronics
Others

Net Revenue by Geography (5) (6)

North America - - - - - - - - - - - - - - - -
Asia Pacific - - - - - - - - - - - - - - - -
China
EMEA - - - - - - - - - - - - - - - -
Japan - - - - - - - - - - - - - - - -

Note:
(1) Commencing from 2003, capacity did not include wafers committed by Vanguard. Commencing from 2013, TSMC no longer includes SSMC's capacity. Meanwhile, TSMC still has the access to SSMC's capacity.
(2) Commencing from 1Q06, wafer shipment and revenue breakdown were on consolidated basis.
(3) Prior to 1Q01, breakdown by application and technology were based on wafer shipment. Starting from 1Q01, breakdown by application and technology were based on revenue.
 Taiwan Semiconductor Manufacturing Company Limited

1Q98 2Q98 3Q98 4Q98 1Q99 2Q99 3Q99 4Q99 1Q00 2Q00 3Q00 4Q00 1Q01 2Q01 3Q01 4Q01
Historical Operating Data

Annual Capacity (1) 719 842 1,516 1,946

(Thousand 12" equivalent wafers)

Quarterly Wafer Shipments (2) 156 123 117 127 142 188 207 245 285 366 419 445 312 200 199 248
(Thousand 12" equivalent wafers)

Breakdown of Revenue (%) (2)

Wafer Revenue by Technology (4) (6)
5nm - - - - - - - - - - - - - - - -
7nm - - - - - - - - - - - - - - - -
10nm - - - - - - - - - - - - - - - -
16nm - - - - - - - - - - - - - - - -
20nm - - - - - - - - - - - - - - - -
28nm - - - - - - - - - - - - - - - -
40/45nm - - - - - - - - - - - - - - - -
65nm - - - - - - - - - - - - - - - -
90nm - - - - - - - - - - - - - - - -
0.11/0.13um - - - - - - - - - - - - - - - -
0.15um - - - - - - - - - - - - 1% 4% 15% 21%
0.18um - - - - - - - - 1% 3% 5% 7% 17% 22% 24% 24%
0.25um+ 100% 100% 100% 100% 100% 100% 100% 100% 99% 97% 95% 93% 82% 74% 61% 55%

Net Revenue by Application (3) (4) (6)

Computer 37% 36% 31% 29% 44% 40% 41% 40% 36% 36% 35% 29% 32% 41% 49% 57%
Communication 17% 13% 16% 24% 27% 25% 33% 33% 38% 39% 33% 33% 31% 24% 16% 20%
Consumer 15% 24% 31% 29% 18% 15% 12% 16% 15% 12% 17% 20% 16% 17% 25% 19%
Industrial/Standard 31% 27% 22% 18% 12% 20% 14% 11% 11% 13% 15% 18% 21% 18% 10% 5%

Net Revenue by Platform (7)

High Performance Computing
Smartphone
Internet of Things
Automotive
Digital Consumer Electronics
Others

Net Revenue by Geography (5) (6)

North America 52% 53% 60% 64% 48% 53% 65% 67% 67% 69% 63% 67% 59% 63% 69% 80%
Asia Pacific 30% 26% 27% 24% 37% 36% 18% 20% 22% 21% 21% 12% 18% 18% 16% 13%
China
EMEA 10% 16% 11% 9% 12% 7% 9% 8% 7% 6% 7% 8% 10% 7% 3% 3%
Japan 8% 5% 3% 3% 3% 4% 8% 5% 4% 4% 9% 13% 13% 12% 12% 5%

Note:
apacity. Meanwhile, (1)
TSMCCommencing
still has the
from
access
2003,
tocapacity
SSMC's did
capacity.
not include wafers committed by Vanguard. Commencing from 2013, TSMC no longer includes SSMC's capacity. Meanwhile, TSMC still has the access to SSMC's capacity.
(2) Commencing from 1Q06, wafer shipment and revenue breakdown were on consolidated basis.
(3) Prior to 1Q01, breakdown by application and technology were based on wafer shipment. Starting from 1Q01, breakdown by application and technology were based on revenue.
 Taiwan Semiconductor Manufacturing Company Limited

1Q02 2Q02 3Q02 4Q02 1Q03 2Q03 3Q03 4Q03 1Q04 2Q04 3Q04 4Q04 1Q05 2Q05 3Q05 4Q05
Historical Operating Data

Annual Capacity (1) 1,729 1,784 2,128 2,646

(Thousand 12" equivalent wafers)

Quarterly Wafer Shipments (2) 266 320 301 303 308 394 441 501 521 570 592 542 495 567 679 759
(Thousand 12" equivalent wafers)

Breakdown of Revenue (%) (2)

Wafer Revenue by Technology (4) (6)
5nm - - - - - - - - - - - - - - - -
7nm - - - - - - - - - - - - - - - -
10nm - - - - - - - - - - - - - - - -
16nm - - - - - - - - - - - - - - - -
20nm - - - - - - - - - - - - - - - -
28nm - - - - - - - - - - - - - - - -
40/45nm - - - - - - - - - - - - - - - -
65nm - - - - - - - - - - - - - - - -
90nm - - - - - - - - - - - 1% 4% 2% 10% 17%
0.11/0.13um 1% 1% 5% 8% 11% 17% 19% 18% 20% 25% 30% 35% 41% 41% 33% 32%
0.15um 30% 29% 20% 24% 21% 21% 20% 17% 17% 13% 38% 34% 31% 34% 35% 32%
0.18um 22% 22% 23% 21% 21% 24% 27% 28% 27% 29% - - - - - -
0.25um+ 47% 48% 52% 47% 47% 38% 34% 37% 36% 33% 32% 30% 24% 23% 22% 19%

Net Revenue by Application (3) (4) (6)

Computer 56% 45% 36% 39% 41% 43% 36% 35% 32% 27% 31% 35% 34% 38% 30% 32%
Communication 18% 26% 34% 35% 38% 34% 36% 42% 45% 45% 42% 41% 41% 37% 41% 41%
Consumer 21% 23% 22% 18% 13% 16% 21% 17% 17% 22% 20% 16% 17% 18% 23% 21%
Industrial/Standard 5% 6% 8% 8% 8% 7% 7% 6% 6% 6% 7% 8% 8% 7% 6% 6%

Net Revenue by Platform (7)

High Performance Computing
Smartphone
Internet of Things
Automotive
Digital Consumer Electronics
Others

Net Revenue by Geography (5) (6)

North America 78% 79% 76% 76% 76% 77% 76% 75% 74% 73% 75% 75% 79% 77% 75% 77%
Asia Pacific 14% 12% 13% 14% 13% 12% 11% 12% 13% 12% 11% 10% 8% 9% 11% 11%
China
EMEA 3% 3% 5% 5% 5% 4% 5% 5% 7% 7% 7% 7% 6% 8% 9% 8%
Japan 5% 6% 6% 5% 6% 7% 8% 8% 6% 8% 7% 8% 7% 6% 5% 4%

Note:
(1) Commencing from 2003, capacity did not include wafers committed by Vanguard. Commencing from 2013, TSMC no longer includes SSMC's capacity. Meanwhile, TSMC still has the access to SSMC's capacity.
(2) Commencing from 1Q06, wafer shipment and revenue breakdown were on consolidated basis.
(3) Prior to 1Q01, breakdown by application and technology were based on wafer shipment. Starting from 1Q01, breakdown by application and technology were based on revenue.
 Taiwan Semiconductor Manufacturing Company Limited

1Q06 2Q06 3Q06 4Q06 1Q07 2Q07 3Q07 4Q07 1Q08 2Q08 3Q08 4Q08 1Q09 2Q09 3Q09 4Q09 1Q10
Historical Operating Data

Annual Capacity (1) 3,139 3,684 4,168 4,424

(Thousand 12" equivalent wafers)

Quarterly Wafer Shipments (2) 772 831 840 764 696 825 989 1,048 976 1,035 1,072 681 396 876 1,087 1,080 1,132
(Thousand 12" equivalent wafers)

Breakdown of Revenue (%) (2)

Wafer Revenue by Technology (4) (6)
5nm - - - - - - - - - - - - - - - - -
7nm - - - - - - - - - - - - - - - - -
10nm - - - - - - - - - - - - - - - - -
16nm - - - - - - - - - - - - - - - - -
20nm - - - - - - - - - - - - - - - - -
28nm - - - - - - - - - - - - - - - - -
40/45nm - - - - - - - - - - - - 1% 1% 4% 9% 14%
65nm - - - - 1% 3% 7% 10% 15% 18% 25% 27% 23% 28% 31% 30% 27%
90nm 20% 24% 24% 23% 22% 26% 27% 29% 28% 28% 26% 21% 25% 23% 18% 16% 17%
0.11/0.13um 29% 25% 25% 25% 26% 24% 22% 20% 20% 17% 15% 17% 16% 13% 14% 15% 13%
0.15um 32% 32% 33% 33% 30% 30% 28% 27% 23% 23% 22% 22% 21% 23% 21% 18% 18%
0.18um - - - - - - - - - - - - - - - - -
0.25um+ 19% 19% 18% 19% 21% 17% 16% 14% 14% 14% 12% 13% 14% 12% 12% 12% 11%

Net Revenue by Application (3) (4) (6)

Computer 37% 30% 28% 32% 30% 29% 32% 35% 32% 30% 30% 30% 23% 26% 28% 33% 32%
Communication 39% 44% 45% 42% 42% 44% 42% 42% 39% 38% 38% 39% 41% 42% 42% 39% 39%
Consumer 18% 20% 20% 16% 17% 18% 17% 15% 15% 18% 18% 16% 19% 18% 16% 13% 14%
Industrial/Standard 6% 6% 7% 10% 11% 9% 9% 8% 14% 14% 14% 15% 17% 14% 14% 15% 15%

Net Revenue by Platform (7)

High Performance Computing
Smartphone
Internet of Things
Automotive
Digital Consumer Electronics
Others

Net Revenue by Geography (5) (6)

North America 78% 77% 78% 78% 77% 74% 74% 79% 76% 73% 74% 73% 68% 65% 70% 71% 68%
Asia Pacific 11% 10% 10% 11% 11% 13% 13% 11% 12% 13% 13% 13% 14% 18% 13% 13% 15%
China 3% 3% 3% 3% 2%
EMEA 7% 9% 8% 7% 7% 9% 10% 8% 9% 11% 10% 11% 12% 11% 11% 10% 11%
Japan 4% 4% 4% 4% 5% 4% 3% 2% 3% 3% 3% 3% 3% 3% 3% 3% 4%

Note:
(1) Commencing from 2003, capacity did not include wafers committed by Vanguard. Commencing from 2013, TSMC no longer includes SSMC's capacity. Meanwhile, TSMC still has the access to SSMC's capacity.
(2) Commencing from 1Q06, wafer shipment and revenue breakdown were on consolidated basis.
(3) Prior to 1Q01, breakdown by application and technology were based on wafer shipment. Starting from 1Q01, breakdown by application and technology were based on revenue.
 Taiwan Semiconductor Manufacturing Company Limited

2Q10 3Q10 4Q10 1Q11 2Q11 3Q11 4Q11 1Q12 2Q12 3Q12 4Q12 1Q13 2Q13 3Q13 4Q13 1Q14
Historical Operating Data

Annual Capacity (1) 5,035 5,876 6,707 7,310

(Thousand 12" equivalent wafers)

Quarterly Wafer Shipments (2) 1,301 1,418 1,420 1,405 1,463 1,413 1,296 1,297 1,645 1,716 1,584 1,587 1,793 1,864 1,719 1,718
(Thousand 12" equivalent wafers)

Breakdown of Revenue (%) (2)

Wafer Revenue by Technology (4) (6)
5nm - - - - - - - - - - - - - - - -
7nm - - - - - - - - - - - - - - - -
10nm - - - - - - - - - - - - - - - -
16nm - - - - - - - - - - - - - - - -
20nm - - - - - - - - - - - - - - - -
28nm - - - - - - 2% 5% 7% 13% 22% 24% 29% 32% 34% 34%
40/45nm 16% 17% 21% 22% 26% 27% 27% 32% 28% 27% 22% 23% 21% 20% 17% 21%
65nm 27% 29% 31% 32% 29% 27% 30% 26% 26% 22% 19% 17% 18% 15% 16% 16%
90nm 16% 14% 11% 10% 9% 9% 8% 8% 10% 9% 8% 8% 8% 8% 7% 7%
0.11/0.13um 13% 12% 10% 9% 8% 9% 7% 7% 6% 6% 4% 4% 4% 4% 4% 3%
0.15um 17% 17% 17% 17% 18% 18% 17% 14% 15% 14% 17% 17% 15% 15% 16% 14%
0.18um - - - - - - - - - - - - - - - -
0.25um+ 11% 11% 10% 10% 10% 10% 9% 8% 8% 9% 8% 7% 5% 6% 6% 5%

Net Revenue by Application (3) (4) (6)

Computer 29% 25% 24% 23% 25% 21% 20% 22% 21% 19% 16% 16% 16% 13% 13% 13%
Communication 41% 44% 47% 48% 45% 48% 53% 48% 48% 49% 54% 55% 57% 53% 51% 54%
Consumer 15% 14% 11% 11% 11% 10% 9% 10% 9% 8% 7% 7% 7% 14% 13% 11%
Industrial/Standard 15% 17% 18% 18% 19% 21% 18% 20% 22% 24% 23% 22% 20% 20% 23% 22%

Net Revenue by Platform (7)

High Performance Computing
Smartphone
Internet of Things
Automotive
Digital Consumer Electronics
Others

Net Revenue by Geography (5) (6)

North America 66% 67% 70% 69% 70% 70% 70% 70% 68% 67% 69% 69% 70% 70% 73% 66%
Asia Pacific 15% 15% 13% 14% 14% 14% 13% 14% 15% 14% 15% 14% 13% 15% 12% 16%
China 3% 3% 3% 3% 4% 3% 4% 4% 5% 5% 5% 6% 8% 5% 5% 8%
EMEA 11% 11% 10% 10% 8% 9% 9% 9% 9% 10% 8% 8% 6% 7% 7% 6%
Japan 5% 4% 4% 4% 4% 4% 4% 3% 3% 4% 3% 3% 3% 3% 3% 4%

Note:
(1) Commencing from 2003, capacity did not include wafers committed by Vanguard. Commencing from 2013, TSMC no longer includes SSMC's capacity. Meanwhile, TSMC still has the access to SSMC's capacity.
(2) Commencing from 1Q06, wafer shipment and revenue breakdown were on consolidated basis.
(3) Prior to 1Q01, breakdown by application and technology were based on wafer shipment. Starting from 1Q01, breakdown by application and technology were based on revenue.
 Taiwan Semiconductor Manufacturing Company Limited

2Q14 3Q14 4Q14 1Q15 2Q15 3Q15 4Q15 1Q16 2Q16 3Q16 4Q16 1Q17 2Q17 3Q17 4Q17 1Q18
Historical Operating Data

Annual Capacity (1) 8,176 > 9,000 > 10,000 > 11,000
(Thousand 12" equivalent wafers)

Quarterly Wafer Shipments (2) 2,053 2,267 2,225 2,287 2,240 2,216 2,020 2,056 2,297 2,638 2,614 2,473 2,533 2,744 2,699 2,680
(Thousand 12" equivalent wafers)

Breakdown of Revenue (%) (2)

Wafer Revenue by Technology (4) (6)
5nm - - - - - - - - - - - - - - - -
7nm - - - - - - - - - - - - - - - -
10nm - - - - - - - - - - - - 1% 10% 25% 19%
16nm - 18%
9% 21% 16% 20% 21% 24% 23% 23% 31% 33% 31% 26% 24% 20%
20nm - 4%
28nm 37% 34% 30% 30% 27% 27% 25% 30% 28% 24% 24% 25% 27% 23% 18% 20%
40/45nm 19% 17% 13% 15% 14% 14% 14% 14% 15% 13% 12% 13% 13% 12% 10% 11%
65nm 15% 13% 11% 12% 11% 11% 11% 10% 12% 11% 11% 11% 10% 10% 9% 9%
90nm 7% 6% 6% 7% 7% 8% 7% 6% 5% 5% 5% 4% 5% 5% 4% 5%
0.11/0.13um 3% 3% 2% 2% 3% 2% 3% 2% 2% 3% 2% 2% 3% 3% 2% 2%
0.15um 14% 13% 12% 13% 13% 12% 11% 11% 11% 9% 10% 11% 11% 10% 9% 9%
0.18um - - - - - - - - - - - - - - - -
0.25um+ 5% 5% 5% 5% 5% 5% 5% 4% 4% 4% 3% 3% 4% 3% 3% 3%

Net Revenue by Application (3) (4) (6)

Computer 11% 9% 9% 8% 7% 8% 9% 8% 8% 7% 7% 9% 8% 10% 10% 14%
Communication 54% 59% 65% 60% 62% 59% 62% 63% 58% 60% 66% 60% 56% 55% 62% 56%
Consumer 12% 10% 7% 10% 8% 8% 6% 8% 12% 12% 7% 10% 11% 10% 6% 7%
Industrial/Standard 23% 22% 19% 22% 23% 25% 23% 21% 22% 21% 20% 21% 25% 25% 22% 23%

Net Revenue by Platform (7)

High Performance Computing 32%
Smartphone 46%
Internet of Things 6%
Automotive 5%
Digital Consumer Electronics 6%
Others 5%

Net Revenue by Geography (5) (6)

North America 67% 69% 74% 69% 66% 69% 69% 62% 62% 69% 71% 65% 61% 65% 69% 60%
Asia Pacific 14% 13% 9% 12% 13% 12% 10% 15% 17% 15% 10% 12% 13% 10% 6% 9%
China 8% 6% 6% 8% 8% 6% 9% 12% 10% 6% 8% 11% 11% 10% 13% 18%
EMEA 6% 6% 6% 6% 7% 7% 6% 6% 6% 6% 6% 6% 8% 8% 7% 7%
Japan 5% 6% 5% 5% 6% 6% 6% 5% 5% 4% 5% 6% 7% 7% 5% 6%

Note:
(1) Commencing from 2003, capacity did not include wafers committed by Vanguard. Commencing from 2013, TSMC no longer includes SSMC's capacity. Meanwhile, TSMC still has the access to SSMC's capacity.
(2) Commencing from 1Q06, wafer shipment and revenue breakdown were on consolidated basis.
(3) Prior to 1Q01, breakdown by application and technology were based on wafer shipment. Starting from 1Q01, breakdown by application and technology were based on revenue.
 Taiwan Semiconductor Manufacturing Company Limited

2Q18 3Q18 4Q18 1Q19 2Q19 3Q19 4Q19 1Q20 2Q20 3Q20 4Q20 1Q21 2Q21 3Q21 4Q21 1Q22
Historical Operating Data

Annual Capacity (1) >12,000 >12,000 >12,000 >13,000

(Thousand 12" equivalent wafers)

Quarterly Wafer Shipments (2) 2,674 2,712 2,686 2,205 2,308 2,733 2,823 2,925 2,985 3,240 3,246 3,359 3,449 3,646 3,725 3,778
(Thousand 12" equivalent wafers)

Breakdown of Revenue (%) (2)

Wafer Revenue by Technology (4) (6)
5nm - - - - - - - - - 8% 20% 14% 18% 18% 23% 20%
7nm - 11% 23% 22% 21% 27% 35% 35% 36% 35% 29% 35% 31% 34% 27% 30%
10nm 13% 6% 6% 4% 3% 2% 1% 0.5% 0% 0% 0% 0% 0% 0% 0% 0%
16nm 21% 23% 20% 16% 23% 22% 20% 19% 18% 18% 13% 14% 14% 13% 13% 14%
20nm 4% 2% 1% 1% 1% 1% 1% 1% 1% 1% 1% 0% 0% 0% 0% 0%
28nm 23% 19% 17% 20% 18% 16% 13% 14% 14% 12% 11% 11% 11% 10% 11% 11%
40/45nm 11% 12% 10% 12% 11% 10% 8% 10% 9% 8% 8% 7% 7% 8% 8% 8%
65nm 9% 8% 8% 8% 8% 7% 7% 6% 6% 5% 5% 5% 5% 4% 5% 5%
90nm 5% 4% 3% 3% 3% 2% 3% 3% 3% 2% 2% 3% 3% 2% 2% 2%
0.11/0.13um 2% 3% 2% 3% 2% 2% 3% 2% 3% 2% 3% 3% 3% 3% 3% 3%
0.15um 9% 9% 8% 8% 8% 9% 8% 8% 8% 7% 7% 6% 6% 6% 6% 6%
0.18um - - - - - - - - - - - - - - - -
0.25um+ 3% 3% 2% 3% 2% 2% 1% 2% 2% 2% 1% 2% 2% 2% 2% 1%

Net Revenue by Application (3) (4) (6)

Computer 20% 12% 11% 10%
Communication 47% 56% 64% 62%
Consumer 9% 8% 5% 5%
Industrial/Standard 24% 24% 20% 23%
0%
Net Revenue by Platform (7)
High Performance Computing 40% 33% 29% 29% 32% 29% 29% 30% 33% 37% 31% 35% 39% 37% 37% 41%
Smartphone 35% 45% 53% 47% 45% 49% 53% 49% 47% 46% 51% 45% 42% 44% 44% 40%
Internet of Things 7% 6% 6% 7% 8% 9% 8% 9% 8% 9% 7% 9% 8% 9% 9% 8%
Automotive 6% 5% 4% 5% 5% 4% 4% 4% 4% 2% 3% 4% 4% 4% 4% 5%
Digital Consumer Electronics 7% 6% 4% 7% 6% 5% 3% 5% 5% 3% 4% 4% 4% 3% 3% 3%
Others 5% 5% 4% 5% 4% 4% 3% 3% 3% 3% 4% 3% 3% 3% 3% 3%
0%
Net Revenue by Geography (5) (6)
North America 54% 62% 69% 60% 61% 60% 59% 56% 58% 59% 73% 67% 64% 65% 66% 64%
Asia Pacific 9% 10% 7% 9% 10% 9% 8% 11% 10% 10% 12% 17% 15% 13% 12% 15%
China 23% 15% 13% 18% 17% 20% 22% 22% 21% 22% 6% 6% 11% 11% 12% 11%
EMEA 8% 7% 6% 7% 6% 6% 6% 6% 6% 5% 5% 6% 6% 6% 5% 5%
Japan 6% 6% 5% 6% 6% 5% 5% 5% 5% 4% 4% 4% 4% 5% 5% 5%

Note:
(1) Commencing from 2003, capacity did not include wafers committed by Vanguard. Commencing from 2013, TSMC no longer includes SSMC's capacity. Meanwhile, TSMC still has the access to SSMC's capacity.
(2) Commencing from 1Q06, wafer shipment and revenue breakdown were on consolidated basis.
(3) Prior to 1Q01, breakdown by application and technology were based on wafer shipment. Starting from 1Q01, breakdown by application and technology were based on revenue.
 Taiwan Semiconductor Manufacturing Company Limited

2Q22 3Q22 4Q22 1Q23 2Q23

Historical Operating Data

Annual Capacity (1) >15,000

(Thousand 12" equivalent wafers)

Quarterly Wafer Shipments (2) 3,799 3,974 3,702 3,227 2,916

(Thousand 12" equivalent wafers)

Breakdown of Revenue (%) (2)

Wafer Revenue by Technology (4) (6)
5nm 21% 28% 32% 31% 30%
7nm 30% 26% 22% 20% 23%
10nm 0% 0% 0% 0% 0%
16nm 14% 12% 12% 13% 11%
20nm 0% 0% 0% 1% 1%
28nm 10% 10% 11% 12% 11%
40/45nm 8% 7% 7% 7% 7%
65nm 5% 5% 5% 6% 7%
90nm 2% 2% 2% 2% 2%
0.11/0.13um 3% 3% 3% 2% 2%
0.15um 6% 6% 5% 5% 5%
0.18um - - - - -
0.25um+ 1% 1% 1% 1% 1%

Net Revenue by Application (3) (4) (6)

Computer
Communication
Consumer
Industrial/Standard

Net Revenue by Platform (7)

High Performance Computing 43% 39% 42% 44% 44%
Smartphone 38% 41% 38% 34% 33%
Internet of Things 8% 10% 8% 9% 8%
Automotive 5% 5% 6% 7% 8%
Digital Consumer Electronics 3% 2% 2% 2% 3%
Others 3% 3% 4% 4% 4%

Net Revenue by Geography (5) (6)

North America 64% 72% 69% 63% 66%
Asia Pacific 12% 10% 7% 8% 8%
China 13% 8% 12% 15% 12%
EMEA 6% 5% 6% 7% 7%
Japan 5% 5% 6% 7% 7%

Note:
(1) Commencing from 2003, capacity did not include wafers committed by Vanguard. Commencing from 2013, TSMC no longer includes SSMC's capacity. Meanwhile, TSMC still h
(2) Commencing from 1Q06, wafer shipment and revenue breakdown were on consolidated basis.
(3) Prior to 1Q01, breakdown by application and technology were based on wafer shipment. Starting from 1Q01, breakdown by application and technology were based on revenue
 Taiwan Semiconductor Manufacturing Company Limited

(4) Market segmentation has been updated in 1Q10, and previous classifications have been revised accordingly starting from 1Q08.
(5) Prior to 1Q13,4Q18,
(6) Commencing breakdown is based
revenue on wafer
breakdown revenue. Commencing
by application from 1Q13,
and by geography breakdown
is based is based
on net revenue on net revenue.
including both waferNet
andrevenue by geography
non-wafer is categorized
revenue, while mainly based
revenue breakdown on the country
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is based the customer
on wafer revenue,issame
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as before. O

(7) Starting 1Q19, the Company will report its net revenue breakdown by platform, and will no longer provide net revenue breakdow by application.
 Taiwan Semiconductor Manufacturing Company Limited

(4) Market segmentation has been updated in 1Q10, and previous classifications have been revised accordingly starting from 1Q08.
ywhile
is categorized mainly
(5)
revenue breakdownPrior
based
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(6) Commencingthe country
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headquarterd.
by application
same Commencing
as before.
and byOn from 1Q13,
geography
a comparable breakdown
is based
basis,
on net is based
previous
revenue on net revenue.
classifications
including both
have Net
wafer
been revenue
and
revised by geography
non-wafer
accordingly
revenue, is categorized
starting
while from
revenue
1Q16. mainly based
breakdown on the country
by technology in which
is based the customer
on wafer revenue,issame
headquarterd.
as before. O

(7) Starting 1Q19, the Company will report its net revenue breakdown by platform, and will no longer provide net revenue breakdow by application.