PRACTICAL FILE

OF
“EDC”

SUBMITTED BY: SUBMITTED TO:

NAVEEN SONI MR. KRISHAN SAINI
ROLL NO.:60 (LECT. OF EDC)
CLASS : ECE-A

INSTITUTE OF TECHNOLOGY
& SCIENCES
 EXPERIMENT :- 1
AIM :-
INTRODUCTION ABOUT TO USE CIRCUIT CREATION &
SIMULATION SOFTWARE ORCAD.

APPARATUS :- Orcad pspice software.

THEORY :-

Capture CIS
OrCAD Capture CIS is a software tool used for circuit schematic capture. It
is part of the OrCAD circuit design suite.
It is used primarily for electronic design automation. The software is used
mainly to create electronic prints for manufacturing of printed circuit boards,
by electronic design engineers and electronic technicians to manufacture
electronic schematics.
The name OrCAD is a portmanteau, reflecting the software's
origins: Oregon + CAD

 SPICE (Simulation Program for Integrated Circuits Emphasis) is

an analog & digital circuit simulator.
 SPICE takes a circuit netlist and performs mathematical
simulation of the circuit's behavior.

 A netlist describes the components in the circuit and how they

are connected.

HOW TO OPEN ORCAD PSPICE :-

1) Click on Start Button.
2) Go to All programs=>ORCAD Release 9.1=>Capture CIS
3) Capture CIS will open in new window.

SIMULATION:-

 When you have finished the design, you can start to use PSpice to
simulate your design.
 Press “Pspice” in the menu bar and choose “New Simulation Profile”.
 A new windowpage will pop up, type the filename as you like and
then click “Create”.
 When you are done, “Simulation Settings” window is shown as
follow:
 Run to time
 Maximum step size
 Provide their values & press ok.
 Now click on the “Run Pspice” to see the output.

RESULT:- We are successful to introduced about to use Circuit Creation

& Simulation of Orcad software.
 EXPERIMENT : 2
AIM :-
TO STUDY THE DESIGN & SIMULATE HALF WAVE.

APPARATUS:-
Voltage Source, Diodes D1N4007,Resistors-1k,connecting wires, Orcad
pspice software etc.

THEORY:-

Half-wave rectifier
In half wave rectifier, either the positive or negative half of the AC wave is
passed, while the other half is blocked. Because only one half of the input
waveform reaches the output, it is very inefficient if used for power transfer.
Half-wave rectification can be achieved with a single diode in a one-phase
supply, or with three diodes in a three-phase supply.

CIRCUIT DIAGRAM :-

HALF WAVE REACTIFIER

OUTPUT:-

SIMULATION HALF WAVE REACTIFIER

RESULT :-
We have successful designed & Simulated the Half Wave .
 EXPERIMENT : 3
AIM :-
TO STDUY THE DESIGN & SIMULATE THE OP-AMP AS AN
INTEGRATOR.

APPARATUS:-
Voltage Source, Op-amp LM741,15v dc
Battery,Resistors-1k,Capacitor 2.5uf,connecting wires, Orcad
pspice software etc.

THEORY:-

Integrator:-
A Integrator is a circuit that is designed such
that the output of the circuit is proportional to
the integration of the input.

Vout= -1/RC(integration of Vin)

Where C is the capacitance of the capacitor, R is

the resistance of the resistor, Vout is the voltage across
the resistor R2 and Vin is the input voltage.
CIRCUIT DIAGRAM :-

OUTPUT:-

RESULT :-
We have successful to designed & Simulated the op-amp as
an Integrator.
 EXPERIMENT :- 4

AIM :-
TO STUDY THE DESIGN & SIMULATE THE OP-AMP AS A
DIFFERENTIATOR.

APPARATUS:-
Voltage Source, Op-amp LM741,15v dc
Battery,Resistors-1k&2k,Capacitor 2.2uf,connecting wires,
Orcad pspice software etc.

THEORY:-
Differentiator:-
A Differentiator is a circuit that is
designed such that the output of the
circuit is proportional to the
time derivative of the input.

Vout= -RC(diff. of Vin)

Where C is the capacitance of the

capacitor, R is the resistance of the resistor,
Vout is the voltage across the resistor R2
and Vin is the input voltage.
CIRCUIT DIAGRAM :-

OUTPUT:-

SIMULATION DIFFERENTIATOR

RESULT :- We have successful to designed & Simulated the op-amp as

a Differentiator
 EXPERIMENT :- 5

AIM :-
TO DESIGN & SIMULATE THE INVERTING AMPLIFIER.

APPARATUS:-
Voltage Source, Op-amp LM741,15v dc Battery,Resistors-1k
& 0.2k,connecting wires, Orcad pspice software etc.

THEORY:-
Inverting amplifier:-
A Inverting Amplifier is a circuit that is
designed to invert the input of the circuit.
An inverting amplifier uses negative
feedback to invert and amplify a voltage.

Where A is gain of inverting amplifier, Rf is the resistance of the feedback

resistor.
CIRCUIT DIAGRAM :-

INVERTING AMPLIFIER

OUTPUT:-

SIMULATION INVERTING AMPLIFIER

RESULT :- We have successful to designed & Simulated the Inverting

Amplifier.
 EXPERIMENT : 6
AIM :- TO STUDY THE DESIGN & SIMULATE FULL WAVE
REACTIFIER.

APPARATUS:- Voltage Source, Diodes D1N4007,Resistors-

1k,connecting wires, Orcad pspice software etc.

THEORY:-

A full-wave rectifier converts the whole of the input waveform to one of

constant polarity (positive or negative) at its output. Full-wave rectification
converts both polarities of the input waveform to DC (direct current), and is
more efficient. However, in a circuit with a non-center tapped transformer,
four diodes are required instead of the one needed for half-wave
rectification. Four diodes arranged this way are called a diode bridge or
bridge rectifier.
CIRCUIT DIAGRAM :-

FULL WAVE REACTIFIER

OUTPUT:-

SIMULATION FULL WAVE REACTIFIER

RESULT :- We have successful designed & Simulated the full Wave .

EXPERIMENT :- 7
AIM :-
TO DESIGN & SIMULATE THE INVERTING & NON-
INVERTING AMPLIFIER.

APPARATUS:-
Voltage Source, Op-amp LM741,15v dc
Battery,Resistors-1k & 0.2k,connecting wires, Orcad pspice
software etc.

THEORY:-

Non Inverting amplifier:-

In A Non-Inverting Amplifier the output voltage
changes in the same direction as the input voltage.

Where A is gain of non-inverting amplifier, Rf is the resistance of the

feedback resistor.

CIRCUIT DIAGRAM :-
 NON-INVERTING AMPLIFIER

SIMULATION NON-INVERTING AMPLIFIER

RESULT :-
We have successful to designed & Simulated the Non-inverting
Amplifier

EXPERIMENT : 8
AIM :-
TO DESIGN & SIMULATE THE CIRCUIT OF DC POWER
SUPPLY.

APPARATUS:-
Voltage Source, Step-down transformer,
Diodes,Resistors-1k,100ohm,capacitor-500uf,connecting wires,
Orcad pspice software etc.

THEORY:-
In this a bridge rectifier is used. An ac signal is passed through a rectifier
which rectifies the ac signal and it passes through a capacitive filter. A zener
diode is used for voltage regulation. When the rectified signal is passed on
there is voltage drop across the zener diode and the remaining voltage can be
measured across it through a voltmeter.
On decreasing & increasing the value of capacitance there is a change output
signal.

CIRCUIT DIAGRAM :-
 V
R1 D1 D3
TX1
D 1N 4007 D 1N 4007 R3
100
V
C1
1k
V1
VO F F = 0 R2 50uf
VAMPL = 10 D2 D4
F R EQ = 50 1k
D 1N 4007 D 1N 4007
0
0

POWER SUPPLY
OUTPUT:-

SIMULATION POWER SUPPLY

RESULT :- We have successful to designed & Simulated the dc power

supply.
EXPERIMENT : 9
AIM :-
TO DESIGN & SIMULATE THE RLC RESONANCE CIRCUIT.

APPARATUS:-
Vpluse Source,Resistor-1k,,capacitor-1uf,inductor-
10mh,connecting wires, Orcad pspice software etc.

THEORY:-
Resonance in AC circuits implies a special frequency determined by the
values of the resistance , capacitance , and inductance . For series
resonance the condition of resonance is straightforward and it is
characterized by minimum impedance and zero phase. Parallel resonance ,
which is more common in electronic practice, requires a more careful
definition.
The resonance of a series RLC circuit occurs when
the inductive and capacitivereactances are equal in magnitude but cancel
each other because they are 180 degrees apart in phase. The sharp minimum
in impedance which occurs is useful in tuning applications. The sharpness of
the minimum depends on the value of R and is characterized by the "Q" of
the circuit.

CIRCUIT DIAGRAM :-
 RLC SERIES RESONANCE

OUTPUT:-

SIMULATION RLC SERIES RESONANCE

RESULT :- We have designed & Simulated the RLC resonance circuit.

 EXPERIMENT : 10
AIM :-
TO STUDY ABOUT PCB DESIGNING.

APPARATUS:-
Copper clad board, transparency sheet, permanent
marker, photo film ,Ammonium sulphate etc.

THEORY:-

PCB are stands for printed circuit board which are used for wiring up of the
component of circuit. PCB are made of paper phenolic FR2 (low cost ,low
frequency and low power ckt assembly ) and a glass epoxy FR4 grade
for( high frequency and high power ckt . copper clad laminates ( available in
1.6mm ,2.4mm and 3.6mm thickness)single side PCB have copper foil on
one side while the double sided PCB have a copper foil on both side of
laminate. Thickness of copper foil is 35 micrometer minimum on cheaper
PCB and 70 micrometer on costly a PCB. Tracks are made by masking the
track part of copper with each resist enamel paint and later dipping the
laminate in ferric chloride solution to dissolve all the copper except under the
mask part. Holes in PCB are drilled after etching is over. The tracks on two
side of PCB are joined using printed through whole technique. On cheaper
PCB PTH are not provided, only pads i.e. Circular copper land with the
centre hole are provided and you have to join the track on both side by
soldering a copper wire to the pads with a copper wire . In a single sided PCB
components are mounted on the side which has no track. In double sided
PCB the component side is defined or it will show its component outline.

PROCEDURE :-
The most important task in making any project is to design its PCB. PCB is
an abbreviation of Printed circuit board. Printed circuit board is a copper
glad board on which tracks are designed through which the current flows
according to the circuit diagram.

Steps of PCB designing:-

1. Take a copper clad board of appropriate size according to the circuit

layout.
2. Draw the PCB layout on the transparency sheet with the help of
permanent marker.
3. Take a photo film of appropriate sizes according to the PCB layout
4. Put the photo film and transparency sheet in the proto contact
machine.
5. After one or two minutes take out the photo film from the machine
and rinse into the solution of Ammonium sulphate until we see a
complete layout.
6. After that the wash the photo film in water and Ag fix solution and
finally negative is prepared.
7. Now put the copper clad board into the Dip coat machine for two
three times for coating a smooth layer of gum.
8. After that put the copper clad board into the dryer machine for 5 to 7
minutes.
9. Suitably placed the copper clad board and negative in the Ultraviolet
Exposure machine for two minutes.
10.After that put the copper clad board into the Developer machine for 5
to 7 minutes.
11.Now put the copper clad board into the dye machine, so that the PCB
layout is printed on the copper clad board and dry it.
12.Design the tracks with the help of a permanent marker on the copper
glad board.
13.After finishing track designing once, do at least 3 coats of permanent
marker on the copper glad board to make the tracks darker so that the
copper beneath the permanent marker coating may not be removed
during the etching process which is explained in the next point.
PRECAUTIONS :-
1. The dark side of photographic film is kept on front side.
2. Do the procedure carefully.

RESULT:-
We have studied about the PCB designing.

EXPERIMENT : 11

AIM :-
TO STUDY ABOUT ETCHING OF PCB.

APPARATUS:-
Etching machine,permanent marker, Ferrous Chloride
(FeCl3) etc.

THEORY:-

Etching is where the excess copper is removed to leave the individual tracks
or traces as they are sometimes called. Buckets, bubble tanks, and spray
machines lots of different ways to etch, but most firms currently use high
pressure conveyerised spray equipment. Spray etching is fast, ammoniacal
etching solutions when sprayed can etch 55 microns of copper a minute.
Less than 40 seconds to etch a standard 1 oz, 35 micron circuit board.
Many different chemical solutions can be used to etch circuit boards.
Ranging from slow controlled speed etches used for surface preparation to
the faster etches used for etching the tracks.

PROCEDURE :-
1. Design the tracks with the help of a permanent marker on the copper glad
board.
2. After finishing track designing once, do at least 3 coats of permanent
marker on the copper glad board to make the tracks darker so that the
copper beneath the permanent marker coating may not be removed
during the etching process which is explained in the next point.
3. Now our PCB is ready to be etched. In this step we pour our PCB in an
etching solution. Etching solution is nothing but a chemical solution of
Ferrous Chloride (FeCl3). This solution reacts with the copper of copper
glad board and except the copper beneath the permanent marker coating.
Rest of the copper is washed away from the copper glad board. This
process takes 5 minutes approximately.
4. Wash the PCB with clean water and dry it.
5. Once the whole PCB is etched, the permanent marker coating has to be
removed from the board. For this the PCB is rugged by an iron scrubber.
PRECAUTIONS:-

1. Wear safety equipment during the whole process - gloves, protection

glasses, and an apron
2. Work near an emergency eyewash station, a first aid box and a phone
3. Familiarize yourself with the proper use of all equipment and tools in
the lab - if you are unsure of anything, ask a member of the lab staff.

RESULT:-
We have studied about the Etching of PCB.
 EXPERIMENT : 12

AIM :-
TO STUDY ABOUT DRILLING & PLACING OF
COMPONENTS ON PCB.

APPARATUS:-
Drilling machine, 1mm drill bit, cutter etc.

THEORY:-

DRILLING:-

Holes through a PCB are typically drilled with small-diameter drill bits
made of solid coated tungsten carbide. Drill bits must also remain sharp to
not mar or tear the traces. Drilling with high-speed-steel is simply not
feasible since the drill bits will dull quickly and thus tear the copper and ruin
the boards. The drilling is performed by automated drilling machines with
placement controlled by a drill tape or drill file. These computer-generated
files are also called numerically controlled drill.
When very small vias are required, drilling with mechanical bits is costly
because of high rates of wear and breakage. In this case, the vias may be
evaporated by lasers. Laser-drilled vias typically have an inferior surface
finish inside the hole. These holes are called micro vias.
PLACING :-

Placing means to place the components on pcb. All components should be

placed with an appropriate functional group and their tracks routed within
their designated PCB area. Place ground plane(s) under all components and
all their associated tracks.
Good component placement will make your layout job easier and give the
best electrical performance. Bad component placement can turn your routing
job into a nightmare and give poor electrical performance. It may even make
your board unmanufacturable. So there is a lot to think about when placing
components.

PROCEDURE :-

1. Take a Etched pcb.

2. Mark the positions where you want to place the components.
3. Now the time is to mount the components into the PCB. But for this
we have to make holes where we want to mount our components.
4. The holes are to be drilled with the help of drilling machine using a
1mm drill bit. The holes have to be drilled exactly at the place as
shown in the PCB layout.
 5. Now place the components into the holes.
6. Cut the extra wire with the help of cutter.
7. And finally solder them.
PRECAUTIONS:-
1. Check out for bubbling of needle while drilling.
2. Use drilling machine carefully,do avoid the damage of needle.
3. You should avoid to put inductive and and sparking components .
.
RESULT:-We have studied about the drilling & placing of components on
pcb.

EXPERIMENT : 13

AIM :-
TO STUDY ABOUT SOLDERING & TESTING OF PCB.

APPARATUS:-
Solder,Soldering wire,multimeter,solder stand etc.

THEORY:-

SOLDERING:-
Solder is a metallic alloy used to join two metallic surfaces into one. Joining
metal parts together, by allowing a molten metal alloy to flow around them
is called soldering. When the solder cools and solidifies, it provides a good
electrical connection between the parts, along with a little mechanical
strength. It is a skill that should be honed by both professionals and
hobbyists alike, and is essential in building, repairing, and modifying
lectronic components.

TESTING:-
Every electronic device contains one or more printed circuit boards, or
PCBs. As technology is improving and component sizes are getting smaller,
the complexity of these PCBs is increasing. A typical commercial PCB
found in an electronic device has more than two layers, but only the top and
bottom layers are visible and accessible for testing. The traces flowing
through inside of the board can not be accessed for electrical testing. One
can test a PCB using a multimeter.

PROCEDURE :-

SOLDERING:-
1. Ensure that parts to be soldered and the pcb are clean and free from
dirt or grease.
2. Both soldering contacts must be tinned before you attempt to solder
them. This coats or fills the wires or connector contacts with solder so
that you can melt them together.you are now ready to heat the
components to be soldered.

3. Rest the iron tip on both the component lead and the circuit board. It
will only take a few seconds to heat the components up depending on
the surface area.

4. Once you have heated up the component and the circuit board, solder
will naturally flow towards the heat.

5. solder will flow freely around the component lead and the pad. Once
the surface of the pad has been completely coated, you must stop
adding solder and quickly remove the soldering iron. Do not move the
newly formed joint for a few seconds until the solder cools down and
becomes solid.

TESTING:-
 1. Turn the multimeter knob to the DC voltage test point. The point will
have a "V" mark with two straight parallel lines.
2. Find the voltage regulator on the board.

3. Connect the PCB to its power supply and turn it on.

4. Touch the red multimeter lead to the positive input terminal of the
regulator and black lead to any ground point on the board. The
multimeter should display the voltage going into the regulator.

5. Touch the red multimeter lead to the positive output terminal of the
regulator and the black lead to any ground point on the PCB. The
multimeter display should show the regulator output.

PRECAUTIONS:-
1. Ensure that parts to be soldered and the pcb are clean and free from
dirt or grease
2. Use isopropyl alcohol with the help of non static Bristol brush for
cleaning.

3. Never touch the element or tip of the soldering iron.

4. Always return the soldering iron to its stand when not in use.

5. Wash your hands after using solder.

6. Carefully test the pcb by multimeter.

RESULT:-
We have studied about the Soldering & testing of PCB.