LP 1606
LP 1606
Product Guide
The Lenovo ThinkSystem SR860 V3 is a 4-socket server that features a 4U rack design with support for
high-performance GPUs. The server offers technology advances, including fourth-generation Intel Xeon
Scalable processors, and scale-up capacity of up to 16TB of system memory, up to 18x PCIe slots, and up
to 48x 2.5-inch drive bays.
Suggested uses: Mission critical workloads such as SAP HANA in-memory computing, transactional
databases, deep learning, analytics, big data, and virtual machine density.
Memory DDR4 memory operating DDR5 memory operating Increased memory capacity
up to 3200 MHz up to 4800 MHz New DDR5 memory offers
6 channels per CPU 8 channels per CPU significant performance
24 DIMMs (12 per 32 DIMMs (16 per improvements over DDR4
processor), 2 DIMMs per processor), 2 DIMMs per More memory channels means
channel channel greater memory bandwidth
Supports RDIMMs and Supports RDIMMs, 3DS Support for lower-cost 9x4
3DS RDIMMs RDIMMs and 9x4 DIMMs
Up to 12TB of system RDIMMs
memory Up to 16TB of system
Intel Optane Persistent memory
Memory 200 Series No support for persistent
memory
Networking 1x OCP 3.0 slot with 2x OCP 3.0 slots with Improved performance with
PCIe Gen 3 x16 interface PCIe Gen 5 x16 PCIe Gen 5
Additional PCIe adapters interfaces Support for two OCP adapters
supported Additional PCIe adapters in dedicated slots
1GbE dedicated supported
Management port 1GbE dedicated
Management port
PCIe Supports PCIe 3.0 Supports PCIe 5.0 PCIe Gen 5 allows for greater
Up to 14x slots (all Gen3) Up to 18x slots (all Gen4) I/O performance
3 onboard slots; others Up to 16x slots (mix of Additional 4x PCIe slots
via riser cards Gen4 & Gen5) Additional OCP slot
1x OCP slot (PCIe Gen3) Entry configuration of 4x
Gen4 slots
All slots via riser cards
2x OCP slots (PCIe
Gen5)
Standard specifications
The following table lists the standard specifications.
Optional two 7mm hot-swap SSD drive bays at the rear of the server, either SATA or NVMe, for OS
boot or storage
Storage Up to 24x Onboard PCIe Gen 5 or Gen 4 NVMe ports (RAID functions provided using Intel
controller VROC)
12 Gb SAS/SATA RAID adapters
12 Gb SAS/SATA HBA (non-RAID)
Rear: Three USB 3.1 G1 (5 Gbp/s) ports, one VGA video port, one DB-9 serial port, and one RJ-45
XClarity Controller (XCC) systems management port. The serial port can be shared with the XCC
for serial redirection functions.
Internal: Optional M.2 adapter in dedicated slot supporting one or two M.2 drives (for OS boot
support, including hypervisor support).
Cooling 12x N+1 redundant hot-swap 60 mm fans (all 12 standard). One additional fan integrated in each of
the four power supplies.
Models of the SR860 V3 are defined based on whether the server will support GPUs or not. For GPU
support (or any other full-length adapters), the server uses special low-profile winged heatsinks on the rear
processors. Feature codes for these chassis bases are as listed in the following table.
GPU support: For GPU support (single-wide or double-wide) or full-length adapter support, you must
select base BT2K. The standard base (BT2J) does not support these adapters and cannot be upgraded
in the field to support full-length adapters or GPUs.
Processors
The SR860 V3 supports Gold and Platinum level processors in the 4th Gen Intel Xeon Scalable Processor
family. The server supports two or four processors.
Support for three processors : For configurations with 3 processors, submit a CORE/special bid
request.
Heatsinks
Heatsinks for the processors are auto-derived based on the Base feature code selected. As listed in the
Models section, there are two base feature codes related to heatsinks, one for double-wide (DW) GPU
support and one that does not support DW GPUs. The DW GPU base derives two standard heatsinks for
the front processors and two low-profile winged heatsinks for the rear processors. The standard base
derives four standard heatsinks.
Processor options
All supported processors have the following characteristics:
8 DDR5 memory channels at 2 DIMMs per channel
Up to 3 UPI links between processors at 16 GT/s
80 PCIe 5.0 I/O lanes
The following table lists the processors that are currently supported by the SR860 V3.
Configuration notes:
Processor options include a heatsink but do not include a system fan
Processor features
The 4th Gen Intel Xeon Scalable processors introduce new embedded accelerators to add even more
processing capability:
QuickAssist Technology (Intel QAT)
Help reduce system resource consumption by providing accelerated cryptography, key protection,
and data compression with Intel QuickAssist Technology (Intel QAT). By offloading encryption and
decryption, this built-in accelerator helps free up processor cores and helps systems serve a larger
number of clients.
Intel Dynamic Load Balancer (Intel DLB)
Improve the system performance related to handling network data on multi-core Intel Xeon Scalable
processors. Intel Dynamic Load Balancer (Intel DLB) enables the efficient distribution of network
processing across multiple CPU cores/threads and dynamically distributes network data across
multiple CPU cores for processing as the system load varies. Intel DLB also restores the order of
networking data packets processed simultaneously on CPU cores.
Intel Data Streaming Accelerator (Intel DSA)
Drive high performance for storage, networking, and data-intensive workloads by improving
streaming data movement and transformation operations. Intel Data Streaming Accelerator (Intel
DSA) is designed to offload the most common data movement tasks that cause overhead in data
center-scale deployments. Intel DSA helps speed up data movement across the CPU, memory, and
caches, as well as all attached memory, storage, and network devices.
Two-processor configurations
The SR860 V3 can be used with only two processors installed. Most core functions of the server (including
the XClarity Controller) are connected to processors 1 and 2 as shown in the System architecture section.
With only two processors, the server has the following capabilities:
32 memory DIMMs for an 8TB maximum
11 slots are available - see I/O expansion options for details
Riser 1: slots 3, 6, 8
Riser 2: slots 11, 14
Riser 3: slots 15, 18, 20
Support for only 2x DW GPUs or 4x SW GPUs
Up to 8x NVMe drives
Memory options
The SR860 V3 uses Lenovo TruDDR5 memory operating at up to 4800 MHz. The server supports up to 64
DIMMs with 4 processors. The processors have 8 memory channels and support 2 DIMMs per channel
(DPC). The server supports up to 16TB of memory using 64x 256GB 3DS RDIMMs and four processors.
DIMMs operate at 4800 MHz at 1 DPC and 4400 MHz at 2 DPC.
The following table lists the memory options that are available for the server.
Lenovo TruDDR5 memory uses the highest quality components that are sourced from Tier 1 DRAM
suppliers and only memory that meets the strict requirements of Lenovo is selected. It is compatibility tested
and tuned to maximize performance and reliability. From a service and support standpoint, Lenovo
TruDDR5 memory automatically assumes the system warranty, and Lenovo provides service and support
worldwide.
9x4 RDIMMs (also known as Optimized or EC4 RDIMMs) are a new lower-cost DDR5 memory option
supported in ThinkSystem V3 servers. 9x4 DIMMs offer the same performance as standard RDIMMs
(known as 10x4 or EC8 modules), however they support lower fault-tolerance characteristics. Standard
RDIMMs and 3DS RDIMMs support two 40-bit subchannels (that is, a total of 80 bits), whereas 9x4
RDIMMs support two 36-bit subchannels (a total of 72 bits). The extra bits in the subchannels allow
standard RDIMMs and 3DS RDIMMs to support Single Device Data Correction (SDDC), however 9x4
RDIMMs do not support SDDC. Note, however, that all DDR5 DIMMs, including 9x4 RDIMMs, support
Bounded Fault correction, which enables the server to correct most common types of DRAM failures.
For more information on DDR5 memory, see the Lenovo Press paper, Introduction to DDR5 Memory,
available from https://lenovopress.com/lp1618.
The following rules apply when selecting the memory configuration:
The SR860 V3 only supports quantities of 1, 2, 4, 6, 8, 12, or 16 DIMMs per processor; other
quantities not supported
DIMMs operate at up to 4800 MHz at 1 DIMM per channel and up to 4400 MHz at 2 DIMMs per
channel
The server supports three types of DIMMs: 9x4 RDIMMs, RDIMMs, and 3DS RDIMMs; UDIMMs and
LRDIMMs are not supported
Mixing of DIMM types is not supported (9x4 DIMMs with 10x4 RDIMMs, 9x4 DIMMs with 3DS
RDIMMs, 10x4 RDIMMs with 3DS RDIMMs)
The mixing of 128GB 3DS RDIMMs and 256GB 3DS RDIMMs is supported, however all DIMM slots
must be populated evenly: 8x 128GB DIMMs and 8x 256GB DIMMs per processor
Mixing x4 and x8 DIMMs is not supported
Mixing of DIMM rank counts is supported. Follow the required installation order installing the DIMMs
with the higher rank counts first.
Mixing of DIMM capacities is supported, however only two different capacities are supported across
all channels of the processor. Follow the required installation order installing the larger DIMMs first.
For best performance, consider the following:
Ensure the memory installed is at least the same speed as the memory bus of the selected
processor.
Populate all 8 memory channels.
Internal storage
The SR860 V3 supports up to 48x 2.5-inch SAS/SATA drive bays, up to 24 of which can be AnyBay drive
bays instead. All 48x drive bays are hot-swap and all front-accessible. The server also supports internal M.2
drives (one or two, installed in an adapter), or rear-accessible hot-swap 7mm SSDs (installed in a PCIe
slot).
Note: M.2 and 7mm drive support is mutually exclusive, as they both use the same connectors.
In this section:
NVMe drive support
Front drive bays
Supported drive bay combinations
M.2 drives
7mm drives
SED encryption key management with ISKLM
Field upgrades
For field upgrades, the backplane part numbers include the necessary cables for onboard NVMe
connections as well as connections for both X350 and X40 RAID adapters/HBAs.
M.2 drives
The SR860 V3 supports one or two M.2 form-factor SATA or NVMe drives for use as an operating system
boot solution or as additional storage. The M.2 drives install into an M.2 module which is mounted on the air
baffle as shown in the Components and connectors section.
The supported M.2 modules are listed in the following table. For field upgrades see the M.2 field upgrades
section below.
Configuration notes:
M.2 and 7mm are mutually exclusive: they are not supported together in the same configuration
RAID support is implemented as follows:
ThinkSystem M.2 SATA/NVMe 2-Bay Enablement Kit (4Y37A09738): VROC (SATA or
NVMe); No additional adapter is required nor supported
ThinkSystem M.2 SATA/x4 NVMe 2-Bay Enablement Kit (4Y37A79663): VROC (SATA or
NVMe); No additional adapter is required nor supported
ThinkSystem M.2 NVMe 2-Bay RAID Enablement Kit (4Y37A09750): RAID implemented
using Marvell 88NR2241 NVMe RAID Controller (NVMe only)
The ThinkSystem M.2 SATA/NVMe 2-Bay Enablement Kit has the following features:
Supports one or two M.2 drives, either SATA or NVMe
When two drives installed, they must be either both SATA or both NVMe
Support 42mm, 60mm, 80mm and 110mm drive form factors (2242, 2260, 2280 and 22110)
On the SR860 V3, RAID support is implemented using VROC SATA or VROC NVMe
Either 6Gbps SATA or PCIe 3.0 x1 interface to the drives depending on the drives installed
Supports monitoring and reporting of events and temperature through I2C
Firmware update via Lenovo firmware update tools
The ThinkSystem M.2 SATA/x4 NVMe 2-Bay Enablement Kit has the following features:
Supports one or two M.2 drives, either SATA or NVMe
When two drives installed, they must be either both SATA or both NVMe
Support 42mm, 60mm, 80mm and 110mm drive form factors (2242, 2260, 2280 and 22110)
On the SR860 V3, RAID support is implemented using VROC SATA or VROC NVMe
Either 6Gbps SATA or PCIe 4.0 x4 interface to the drives depending on the drives installed
Supports monitoring and reporting of events and temperature through I2C
Firmware update via Lenovo firmware update tools
The ThinkSystem M.2 NVMe 2-Bay RAID Enablement Kit (4Y37A09750) has the following features:
Supports one or two NVMe M.2 drives
Support 42mm, 60mm, 80mm and 110mm drive form factors (2242, 2260, 2280 and 22110)
RAID support via an onboard Marvell 88NR2241 NVMe RAID Controller
With 1 drive, supports single-drive RAID-0
With 2 drives, supports 2-drive RAID-0, 2-drive RAID-1, or two single-drive RAID-0 arrays
PCIe 3.0 x2 host interface; PCIe 3.0 x1 connection to each drive
Management and configuration support via UEFI and OS-based tools
Supports monitoring and reporting of events and temperature through I2C
Firmware update via Lenovo firmware update tools
M.2 field upgrades
For field upgrades, the SR860 V3 also requires an additional M.2 cable kit.
M.2 and 7mm drive support: The 7mm drives connect to the same ports on the system board as the
M.2 module. As a result, 7mm and M.2 are mutually exclusive.
The IBM Security Key Lifecycle Manager software is available from Lenovo using the ordering information
listed in the following table.
Legacy Option ROM support: The server does not support legacy option boot ROM on PCIe adapters
connected to CPU 3 or 4. See the I/O expansion section for details on which slots connect to each CPU.
For option ROM support, install the adapters in slots connected to CPU 1 or 2, or use UEFI boot mode
on those adapters instead.
Configuration notes:
Supercap support limits the number of RAID adapters installable : RAID 9350 and RAID 940
adapters include and require a power module (supercap) to power the flash memory. The SR860 V3
supports up to 4 supercaps, installed in dedicated holders on the air baffle as shown in the
Components and connectors section. The number of supercaps supported also determines the
maximum number of internal + external RAID 9xx adapters that can be installed in the server.
Field upgrades: The RAID 9xx adapter part numbers include both the supercap and the supercap
cable.
E810 Ethernet and X350 RAID/HBAs : The use of both an Intel E810 network adapter and an X350
HBA/RAID adapter (9350, 5350 and 4350) is currently not supported in ThinkSystem servers. For
details see Support Tip HT513226. Planned support for this combination of adapters is 4Q/2023 (SI
23-2).
The SR860 V3 supports the VROC NVMe RAID offerings listed in the following table. The VROC Standard
offering supports RAID 0, 1, and 10, however RAID 5 is not supported.
Tip: These feature codes and part numbers are only for VROC RAID using NVMe drives, not SATA
drives
The part number(s) listed in the table enables field upgrades. These are fulfilled as a Feature on Demand
(FoD) license and is activated via the XCC management processor user interface.
For specifications about the RAID adapters and HBAs supported by the SR860 V3, see the ThinkSystem
RAID Adapter and HBA Comparison, available from:
https://lenovopress.com/lp1288-lenovo-thinksystem-raid-adapter-and-hba-reference#sr860-v3-
support=SR860%2520V3
For details about these adapters, see the relevant product guide:
SAS HBAs: https://lenovopress.com/servers/options/hba
RAID adapters: https://lenovopress.com/servers/options/raid
M.2 drive support: The use of M.2 drives requires an additional adapter as described in the M.2 drives
subsection.
SED support: The tables include a column to indicate which drives support SED encryption. The
encryption functionality can be disabled if needed. Note: Not all SED-enabled drives have "SED" in the
description.
Note: NVMe PCIe SSDs support surprise hot removal and hot insertion, provided the operating system
supports PCIe SSD hot-swap.
Optical drives
The server does not support an internal optical drive.
An external USB optical drive is available, listed in the following table.
I/O expansion
The SR860 V3 supports up to 20 PCIe slots: 18x regular PCIe slots – either Gen4 or Gen5 – plus two OCP
3.0 slots with Gen5 interfaces.
Full length adapter support: For full-length adapter support, you must select base BT2K. This Base
selection derives the lower winged heatsinks for the rear processors to enable full-length adapter
support. The standard base (BT2J) only supports half-length and low-profile adapters and cannot be
upgraded in the field to support full-length adapters. See the Models section for more information about
base feature codes.
Figure 10. Slot configuration with 12x Gen5 slots + 4x Gen4 slots
4x Gen4 + 2x OCP Gen5 slots
For applications that don't require many slots, the SR860 V3 also supports a configuration with 4x Gen4
slots plus 2x OCP slots. The configuration optionally supports 7mm hot-swap drive bays installed in riser 3.
OCP slots:
Slot 1: Gen5 x16 OCP 3.0 slot (CPU 1, Note: OCP 3.0 is support PCIe Gen4)
Slot 2: Gen5 x16 OCP 3.0 slot (CPU 2, Note: OCP 3.0 is support PCIe Gen4)
Riser 1:
Slot 3 ~ Slot 6: Empty
Slot 7: Gen4 x8 FHHL (CPU 1)
Slot 8: Gen4 x8 FHHL (CPU 1)
Riser 2: Empty
Slot 9 ~ Slot 14: Empty
Riser 3:
Slot 15 ~ Slot 18: Empty
Slot 19: Gen4 x8 FHHL (CPU 2)
Slot 20: Gen4 x8 FHHL (CPU 2)
The 4-slot configuration is shown in the following figure. Blue slots are Gen4 and green slots are Gen5. The
processor that each slot is connected to is also shown in the figure.
Risers with 7mm drive cages : As listed in the table, some risers include support for two 7mm hot-swap
drive bays installed in Riser 3. The part numbers and feature codes include the cages and cables
needed for the 7mm drive bays, however the 7mm drive bays themselves (backplanes) will need to be
ordered as well. See the 7mm drives section for details.
Field upgrades: It is supported to add riser cards using option part numbers as long as the target
configuration is listed as supported in the table. Part numbers are listed in the Riser ordering information
section.
Physically x16 slots : All of the x8 slots have a physical x16 connector. This means that the slot
mechanically accepts an adapter that has the longer x16 edge connector. However since the slot is
electrically x8, it only has eight PCIe lanes for data transfer and only has the performance of a x8 slot.
Network adapters
The SR860 V3 has two dedicated OCP 3.0 SFF slots with PCIe 5.0 x16 host interfaces. See Figure 3 for
the location of the OCP slots.
The following table lists the supported OCP adapters. One port of each adapter can optionally be shared
with the XCC management processor for Wake-on-LAN and NC-SI support.
The following table lists additional supported network adapters that can be installed in the regular PCIe
slots.
Legacy Option ROM support: The server does not support legacy option boot ROM on PCIe adapters
connected to CPU 3 or 4. See the I/O expansion section for details on which slots connect to each CPU.
For option ROM support, install the adapters in slots connected to CPU 1 or 2, or use UEFI boot mode
on those adapters instead.
Intel E810 adapter support: The Intel E810 PCIe adapters are currently limited to quantity 1 in the
SR860 V3. Support for larger quantities is planned for 4Q/2023.
Legacy Option ROM support: The server does not support legacy option boot ROM on PCIe adapters
connected to CPU 3 or 4. See the I/O expansion section for details on which slots connect to each CPU.
For option ROM support, install the adapters in slots connected to CPU 1 or 2, or use UEFI boot mode
on those adapters instead.
For more information, see the list of Lenovo Press Product Guides in the Host bus adapters category:
https://lenovopress.com/servers/options/hba
Legacy Option ROM support: The server does not support legacy option boot ROM on PCIe adapters
connected to CPU 3 or 4. See the I/O expansion section for details on which slots connect to each CPU.
For option ROM support, install the adapters in slots connected to CPU 1 or 2, or use UEFI boot mode
on those adapters instead.
For a comparison of the functions of the supported storage adapters, see the ThinkSystem RAID Adapter
and HBA Reference:
https://lenovopress.lenovo.com/lp1288#sr860-v3-support=SR860%2520V3&internal-or-external-
ports=External
The RAID 940-8e adapter uses a flash power module (supercap) and the server supports up to four
supercaps. The number of 940-8e RAID adapters supported is based on how many supercaps can be
installed in the server. For example, if your configuration uses two RAID 940/9350 adapters for internal
storage, then you can only install two RAID 940-8e adapters, since there is only space for four supercaps
total.
For details about these adapters, see the relevant product guide:
SAS HBAs: https://lenovopress.com/servers/options/hba
RAID adapters: https://lenovopress.com/servers/options/raid
GPU adapters
The SR860 V3 supports the graphics processing units (GPUs) listed in the following table:
GPU support: For GPU support with CTO orders, you will need to select base BT2K. See the Models
section for details. When adding GPUs to an existing server, the server must already be configured in
the factory with full-length slots and low-profile heatsinks on the rear processors. Field upgrades of the
heatsinks and slots are not available.
Note: The auxiliary power cable is not required for the NVIDIA A2 GPU
Cooling
Lenovo ThinkSystem SR860 V3 Server 50
Cooling
The server has 12 60mm hot-swap dual-rotor variable-speed fans at the front of the server and all 12 fans
are standard in all models. The server offers N+1 redundancy, meaning that one fan can fail and the server
still operates normally.
Each power supply also includes an integrated fan.
The 12 front fans are installed in a 4U-high unit as shown in the following figure. The 12 fans are installed in
six modules in vertical bays, each of which comprise of 2 fans.
Power supplies
The server supports up to four redundant hot-swap power supplies. Redundancy can be configured as N+1
or N+N.
Tip: Use Lenovo Capacity Planner to determine exactly what power your server needs:
https://datacentersupport.lenovo.com/us/en/products/solutions-and-software/software/lenovo-capacity-
planner/solutions/ht504651
The 1100W Platinum power supply is auto-sensing and supports both 110V AC (100-127V 50/60 Hz) and
220V AC (200-240V 50/60 Hz) power. All other power supplies only supports 220V AC power. For China
customers, all power supplies support 240V DC.
Configuration notes:
Installed power supplies must be identical wattage. For CRPS power supplies, part numbers cannot
be mixed.
Power supply options do not include a line cord. For server configurations, the inclusion of a power
cord is model dependent. Configure-to-order models can be configured without a power cord if
desired.
Power cords
Line cords and rack power cables with C13 connectors can be ordered as listed in the following table.
110V customers: If you plan to use the 1100W power supply with a 110V power source, select a power
cable that is rated above 10A. Power cables that are rated at 10A or below are not supported with 110V
power.
Systems management
The SR860 V3 contains an integrated service processor, XClarity Controller 2 (XCC), which provides
advanced control, monitoring, and alerting functions. The XCC2 is based on the AST2600 baseboard
management controller (BMC) using a dual-core ARM Cortex A7 32-bit RISC service processor running at
1.2 GHz.
Topics in this section:
System I/O Board
Local management
System status with XClarity Mobile
Remote management
XCC2 Platinum
Lenovo XClarity Provisioning Manager
Lenovo XClarity Administrator
Lenovo XClarity Integrators
Local management
The server offers a front operator panel with key LED status indicators, as shown in the following figure.
Tip: The Network LED only shows network activity of an installed OCP network adapter. The LED shows
activity from both OCP adapters if two are installed.
Information tab
The front of the server also houses an information pull-out tab (also known as the network access tag). See
Figure 2 for the location. A label on the tab shows the network information (MAC address and other data) to
remotely access XClarity Controller.
The use of this adapter allows concurrent remote access using both the connection on the adapter and the
onboard RJ45 remote management port provided by the server. The adapter and onboard port have
separate IP addresses.
Configuration rules:
In the SR860 V3, the ThinkSystem V3 Management NIC Adapter Kit is only supported in OCP slot 1
IPMI via the Ethernet port (IPMI over LAN) is supported, however it is disabled by default. For CTO orders
you can specify whether you want to the feature enabled or disabled in the factory, using the feature codes
listed in the following table.
XCC2 Platinum
In the SR860 V3, XCC2 has the Platinum level of features built into the server. Compared to the XCC
functions of ThinkSystem V2 and earlier systems, Platinum offers the same features as Enterprise and
Advanced levels in ThinkSystem V2, plus additional features.
DCSC tip: Even though XCC2 Platinum is a standard feature of the SR860 V3, it does not appear in the
list of feature codes for the configuration in DCSC.
Security
Topics in this section:
Security features
Security features
The SR860 V3 server offers the following electronic security features:
Secure Boot function of the Intel Xeon processor
Support for Platform Firmware Resiliency (PFR) hardware Root of Trust (RoT) - see the Platform
Firmware Resiliency section
Firmware signature processes compliant with FIPS and NIST requirements
System Guard (part of XCC2 Platinum ) - Proactive monitoring of hardware inventory for unexpected
component changes
Administrator and power-on password
Integrated Trusted Platform Module (TPM) supporting TPM 2.0
Self-encrypting drives (SEDs) with support for enterprise key managers - see the SED encryption
key management section
The server is NIST SP 800-147B compliant.
The SR860 V3 server also offers the following physical security features:
Chassis intrusion switch (standard on some models, otherwise available as a field upgrade)
Lockable top cover to help prevent access to internal components
The following table lists the security options for the server.
For SED drives and IBM Security Key Lifecycle Manager support see the SED encryption key management
with ISKLM section.
For more information on this offering, see the paper Introduction to Intel Transparent Supply Chain on
Lenovo ThinkSystem Servers, available from https://lenovopress.com/lp1434-introduction-to-intel-
transparent-supply-chain-on-thinksystem-servers.
Security standards
The SR860 V3 supports the following security standards and capabilities:
Industry Standard Security Capabilities
Intel CPU Enablement
AES-NI (Advanced Encryption Standard New Instructions)
CBnT (Converged Boot Guard and Trusted Execution Technology)
CET (Control flow Enforcement Technology)
Hardware-based side channel attack resilience enhancements
MKTME/TME (Multi-Key Total Memory Encryption)
SGX (Software Guard eXtensions)
SGX-TEM (Trusted Environment Mode)
Rack installation
Lenovo ThinkSystem SR860 V3 Server 67
Rack installation
The following table lists the rack installation options that are available for the server.
The following table summarizes the rail kit features and specifications.
You can download supported VMware vSphere hypervisor images from the following web page and load it
on the M.2 drives or 7mm drives using the instructions provided:
https://vmware.lenovo.com/content/custom_iso/
Operating environment
The SR860 V3 server complies with ASHRAE Class A2 specifications with most configurations, and
depending on the hardware configuration, also complies with ASHRAE Class A3 and Class A4
specifications.
Depending on the hardware configuration, the SR860 V3 server also complies with ASHRAE Class H1
specification. System performance may be impacted when operating temperature is outside ASHRAE H1
specification.
Topics in this section:
Particulate contamination
Airborne particulates (including metal flakes or particles) and reactive gases acting alone or in combination
with other environmental factors such as humidity or temperature might damage the system that might
cause the system to malfunction or stop working altogether.
The following specifications indicate the limits of particulates that the system can tolerate:
Reactive gases:
The reactivity rate of copper coupons shall be less than 200 Angstroms per month (Å/month)
The reactivity rate of silver coupons shall be less than 200 Å/month
Airborne particulates:
The room air should be continuously filtered with MERV 8 filters.
Air entering a data center should be filtered with MERV 11 or preferably MERV 13 filters.
The deliquescent relative humidity of the particulate contamination should be more than 60%
RH
Data centers must be free of zinc whiskers
For additional information, see the Specifications section of the Setup Guide for the server, available from
the Lenovo Documents site, https://pubs.lenovo.com/
Services
Lenovo Services is a dedicated partner to your success. Our goal is to reduce your capital outlays, mitigate
your IT risks, and accelerate your time to productivity.
Note: Some service options may not be available in all markets or regions. For more information, go to
https://www.lenovo.com/services. For information about Lenovo service upgrade offerings that are
available in your region, contact your local Lenovo sales representative or business partner.
Regulatory compliance
The SR860 V3 conforms to the following standards:
ANSI/UL 62368-1
IEC 62368-1 (CB Certificate and CB Test Report)
FCC - Verified to comply with Part 15 of the FCC Rules, Class A
CSA C22.2 No. 62368-1
CISPR 32, Class A, CISPR 35
Argentina IEC 60950-1
Japan VCCI, Class A
Taiwan BSMI CNS15936, Class A; CNS15598-1; Section 5 of CNS15663
CE, UKCA Mark (EN55032 Class A, EN62368-1, EN55024, EN55035, EN61000-3-2, EN61000-3-3,
(EU) 2019/424, and EN IEC 63000 (RoHS))
Korea KN32, Class A, KN35
Russia, Belorussia and Kazakhstan, TP EAC 037/2016 (for RoHS)
Russia, Belorussia and Kazakhstan, EAC: TP TC 004/2011 (for Safety); TP TC 020/2011 (for EMC)
Australia/New Zealand AS/NZS CISPR 32, Class A; AS/NZS 62368.1
Energy Star 3.0
China CELP certificate, HJ 2507-2011
Japanese Energy-Saving Act
Mexico NOM-019
TUV-GS (EN62368-1, and EK1-ITB2000)
India BIS 13252 (Part 1)
EU2019/424 Energy Related Product (ErP Lot9)
For details about supported drives, adapters, and cables, see the following Lenovo Press Product Guides:
Lenovo Storage D1212 and D1224
http://lenovopress.lenovo.com/lp0512
Lenovo Storage D3284
http://lenovopress.lenovo.com/lp0513
Lenovo ThinkSystem D4390
https://lenovopress.lenovo.com/lp1681
For more information, see the list of Product Guides in the Backup units category:
https://lenovopress.com/servers/options/backup
ASEAN
JAPAN
RUCIS
Brazil
INDIA
MEA
Part Feature
PRC
ANZ
HTK
EET
WE
NA
LA
number code Description
0U Basic PDUs
00YJ776 ATZY 0U 36 C13/6 C19 24A 1 Phase PDU N Y Y N N N N N N Y Y Y N
00YJ777 ATZZ 0U 36 C13/6 C19 32A 1 Phase PDU Y Y N Y Y Y Y Y Y N N Y Y
00YJ778 AU00 0U 21 C13/12 C19 32A 3 Phase PDU Y Y N Y Y Y Y Y Y N N Y Y
0U Switched and Monitored PDUs
00YJ783 AU04 0U 12 C13/12 C19 Switched and Monitored N N Y N N N Y N N Y Y Y N
48A 3 Phase PDU
00YJ781 AU03 0U 20 C13/4 C19 Switched and Monitored N N Y N Y N Y N N Y Y Y N
24A 1 Phase PDU
00YJ782 AU02 0U 18 C13/6 C19 Switched and Monitored Y Y Y Y Y Y Y Y Y N Y N Y
32A 3 Phase PDU
00YJ780 AU01 0U 20 C13/4 C19 Switched and Monitored Y Y Y Y Y Y Y Y Y N Y N Y
32A 1 Phase PDU
1U Switched and Monitored PDUs
4PU7A81117 BNDV 1U 18 C19/C13 switched and monitored 48A N N N N N N N N N N N Y N
3P WYE PDU - ETL
4PU7A77467 BLC4 1U 18 C19/C13 Switched and Monitored 80A N N N N N N N N N Y N Y N
3P Delta PDU
4PU7A77469 BLC6 1U 12 C19/C13 switched and monitored 60A N N N N N N N N N N N Y N
3P Delta PDU
4PU7A77468 BLC5 1U 12 C19/C13 switched and monitored 32A Y Y Y Y Y Y Y Y Y N Y Y Y
3P WYE PDU
4PU7A81118 BNDW 1U 18 C19/C13 switched and monitored 48A Y Y Y Y Y Y Y Y Y N Y N Y
3P WYE PDU - CE
1U Ultra Density Enterprise PDUs (9x IEC 320 C13 + 3x IEC 320 C19 outlets)
71763NU 6051 Ultra Density Enterprise C19/C13 PDU N N Y N N N N N N Y Y Y N
60A/208V/3PH
71762NX 6091 Ultra Density Enterprise C19/C13 PDU Y Y Y Y Y Y Y Y Y Y Y Y Y
Module
1U C13 Enterprise PDUs (12x IEC 320 C13 outlets)
39M2816 6030 DPI C13 Enterprise PDU Plus Module (WW) Y Y Y Y Y Y Y Y Y Y Y Y Y
39Y8941 6010 DPI C13 Enterprise PDU Module (WW) Y Y Y Y Y Y Y Y Y Y Y Y Y
1U C19 Enterprise PDUs (6x IEC 320 C19 outlets)
39Y8948 6060 DPI C19 Enterprise PDU Module (WW) Y Y Y Y Y Y Y Y Y Y Y Y Y
1U Front-end PDUs (3x IEC 320 C19 outlets)
39Y8938 6002 DPI Single-phase 30A/120V Front-end PDU Y Y Y Y Y Y Y Y Y Y Y Y Y
(US)
JAPAN
RUCIS
Brazil
INDIA
MEA
Part Feature
PRC
ANZ
HTK
EET
WE
NA
LA
number code Description
39Y8939 6003 DPI Single-phase 30A/208V Front-end PDU Y Y Y Y Y Y Y Y Y Y Y Y Y
(US)
39Y8934 6005 DPI Single-phase 32A/230V Front-end PDU Y Y Y Y Y Y Y Y Y Y Y Y Y
(International)
39Y8940 6004 DPI Single-phase 60A/208V Front-end PDU Y N Y Y Y Y Y N N Y Y Y N
(US)
39Y8935 6006 DPI Single-phase 63A/230V Front-end PDU Y Y Y Y Y Y Y Y Y Y Y Y Y
(International)
1U NEMA PDUs (6x NEMA 5-15R outlets)
39Y8905 5900 DPI 100-127V NEMA PDU Y Y Y Y Y Y Y Y Y Y Y Y Y
Line cords for 1U PDUs that ship without a line cord
40K9611 6504 4.3m, 32A/380-415V, EPDU/IEC 309 Y Y Y Y Y Y Y Y Y Y Y Y Y
3P+N+G 3ph wye (non-US) Line Cord
40K9612 6502 4.3m, 32A/230V, EPDU to IEC 309 P+N+G Y Y Y Y Y Y Y Y Y Y Y Y Y
(non-US) Line Cord
40K9613 6503 4.3m, 63A/230V, EPDU to IEC 309 P+N+G Y Y Y Y Y Y Y Y Y Y Y Y Y
(non-US) Line Cord
40K9614 6500 4.3m, 30A/208V, EPDU to NEMA L6-30P Y Y Y Y Y Y Y Y Y Y Y Y Y
(US) Line Cord
40K9615 6501 4.3m, 60A/208V, EPDU to IEC 309 2P+G N N Y N N N Y N N Y Y Y N
(US) Line Cord
40K9617 6505 4.3m, 32A/230V, Souriau UTG Female to Y Y Y Y Y Y Y Y Y Y Y Y Y
AS/NZ 3112 (Aus/NZ) Line Cord
40K9618 6506 4.3m, 32A/250V, Souriau UTG Female to Y Y Y Y Y Y Y Y Y Y Y Y Y
KSC 8305 (S. Korea) Line Cord
For more information, see the Lenovo Press documents in the PDU category:
https://lenovopress.com/servers/options/pdu
Rack cabinets
Lenovo ThinkSystem SR860 V3 Server 83
Rack cabinets
The following table lists the supported rack cabinets.
For specifications about these racks, see the Lenovo Rack Cabinet Reference, available from:
https://lenovopress.com/lp1287-lenovo-rack-cabinet-reference
For more information, see the list of Product Guides in the Rack cabinets category:
https://lenovopress.com/servers/options/racks
Installation restriction - 1100mm racks and the use of the CMA : The SR860 V3 with the cable
management arm (CMA) attached is supported in 1100mm rack cabinets, however there is insufficient
clearance to route any cables between the CMA and the rear door. As a result, if you require cable
access through the lower cable access panel of the rack and you have an SR860 V3 installed at the
bottom position of the rack, then it is not supported to use a CMA with that server. Similarly, if you
require cable access through the upper cable access panel of the rack and you have an SR860 V3
installed at the top position of the rack, then it is not supported to use a CMA with that server. This
limitation does not exist with rack cabinets with 1200mm depth.
The following table lists the available KVM switches and the options that are supported with them.
For more information, see the list of Product Guides in the KVM Switches and Consoles category:
http://lenovopress.com/servers/options/kvm
LENOVO PROVIDES THIS PUBLICATION ”AS IS” WITHOUT WARRANTY OF ANY KIND, EITHER EXPRESS OR
IMPLIED, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF NON-INFRINGEMENT,
MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE. Some jurisdictions do not allow disclaimer of
express or implied warranties in certain transactions, therefore, this statement may not apply to you.
This information could include technical inaccuracies or typographical errors. Changes are periodically made to the
information herein; these changes will be incorporated in new editions of the publication. Lenovo may make
improvements and/or changes in the product(s) and/or the program(s) described in this publication at any time
without notice.
The products described in this document are not intended for use in implantation or other life support applications
where malfunction may result in injury or death to persons. The information contained in this document does not
affect or change Lenovo product specifications or warranties. Nothing in this document shall operate as an express
or implied license or indemnity under the intellectual property rights of Lenovo or third parties. All information
contained in this document was obtained in specific environments and is presented as an illustration. The result
obtained in other operating environments may vary. Lenovo may use or distribute any of the information you supply
in any way it believes appropriate without incurring any obligation to you.
Any references in this publication to non-Lenovo Web sites are provided for convenience only and do not in any
manner serve as an endorsement of those Web sites. The materials at those Web sites are not part of the materials
for this Lenovo product, and use of those Web sites is at your own risk. Any performance data contained herein was
determined in a controlled environment. Therefore, the result obtained in other operating environments may vary
significantly. Some measurements may have been made on development-level systems and there is no guarantee
that these measurements will be the same on generally available systems. Furthermore, some measurements may
have been estimated through extrapolation. Actual results may vary. Users of this document should verify the
applicable data for their specific environment.