FCIA Training Material

02 FusionServer Technical Introduction

1
 Content
Part 1: Rack Server - 1288H V6/2288H V6/5288 V6/2488H V6
----------------------- Page 3-30
Part 2: Heterogeneous Server - G5500
----------------------- Page 31-36
Part 3: High-Density Server - X6000 V6
----------------------- Page 37-41

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Part 1

Rack Server V6 Technical Introduction

1288H V6/2288H V6/5288 V6/2488H V6

Page 3
FusionServer V6 Rack Server Panorama

High-Density Flexible Ultra-large High Computing

Deployment Configuration Storage Efficiency

1288H V6 2288H V6 5288 V6 2488H V6

2-socket (1U-4U) 4-socket (2U)

4
 FusionServer 1288H V6
• Virtualization
• Cloud computing
• Big data
• Distributed storage
• IT core business

High Reliability Superb Performance Flexible Expansion Unique Value

• Carrier-class component • 2 x 3rd Gen Intel® Xeon® • 2 x OCP3.0 NICs, hot- • FDM: The patented Fault Diagnosis &
specifications and 100% derating Scalable Processors, up to 80 swappable Management (FDM) technology
design cores and TDP 270 W per CPU • 6 x PCIe 4.0 expansion slots provides the fault locating accuracy
• Redundancy design: 2 PSU • 32 x DDR4 DIMMs, up to 3200 • 2 x M.2 SSDs, hot-swappable, up to 93%
modules in 1+1 mode, 7 hot- MT/s; Optane™ Persistent hardware RAID • Intelligent Fault Prediction: Drive
swap counter rotary fan modules Memory (PMem), up to 3200 • 7 x fan modules in N+1 mode fault prediction 7 to 30 days before it
in N+1 mode MT/s; total memory capacity up • 2 x PSUs in 1+1 mode occurs
to 12 TB on a single server • DEMT2.0: The patented Dynamic
• Supports up to 10 NVMe SSDs Energy Management Technology
(DEMT) reduces energy consumption
by 18% without compromising
services
• AI Memory Fault Management:
reduces downtime rate by 50%
• Five Major Intelligent Technologies:
improve O&M efficiency by 30%

5
 1288H V6 Product Architecture

32 x DDR4 DIMMs, 2-socket Scalable

3200 MT/s Processors, TDP 270 W

1 x PCIe 4.0 x16 Drive enclosure: 4 x 3.5'' SAS/SATA drives

half-height slot

2 x PCIe 4.0 x16 slots

(1 full-height slot, 1 Drive enclosure: 8 x 2.5'' SAS/SATA
half-height slot) drives

Drive enclosure: 10 x 2.5'' SAS/SATA

drives

management Drive enclosure: 10 x 2.5'' drives（2-4

network port, NVMe SSD drives and 6-8 SAS/SATA drives
serial port ）
Flex I/O card 1 Flex I/O card 2
(OCP3.0 NIC) (OCP3.0 NIC)
Drive enclosure: 10 x 2.5'' NVMe
Internal RAID 7 fan modules, N+1 drives
controller card redundancy
PSU,
1+1 redundancy

6
1288H V6 Product Specification

Item Details

Height 1 U （4.445 cm）

Two 3rd Gen Intel® Xeon® Scalable processors (Ice Lake) (8300/6300/5300/4300 series) with up to 270 W
CPU TDP per processor
® TM
Thirty-two 3200 MT/s DDR4 memory slots for flexible optional scenarios, hosting up to 16 Intel Optane
Memory
persistent memory 200 series.
• Up to 4x3.5" or 8 or 10x2.5" SAS/SATA drives
Local storage • 4 or 10 NVMe SSDs
• 2xM.2 SSD cards
RAID RAID 0/1/10/5/50/6/60
Six expansion slots, containing one dedicated slot for RAID control card, two Flex IO expansion slots for
PCIe expansion
OCP3.0 NICs, and three slots for standard PCIe 4.0 expansion cards
Multiple types of NICs
NIC Two optional hot-swappable OCP 3.0 network adapters in the two Flex IO expansion slots (determine
whether to configure OCP 3.0 network adapters on demand)
PSU 2 hot-swappable PSUs (900 W/1200 W/1500 W/2000 W) in 1+1 redundancy mode

Fan modules 7 hot-swappable counter-rotating fan modules in N+1 redundancy mode

Operating
5ºC to 45ºC (41ºF to 113ºF) (confirm to ASHRAE Class A1/A2/A3/A4)
temperature

7
FusionServer 2288H V6: High Performance and Flexible
Configuration, Adaptive to Various Workloads
• IT core business
• Cloud computing
• Virtualization
• Distributed storage
• Big data analytics
• AI inference

Ultra-large storage Supreme computing Flexible configurations Intelligent management

• 12-20 x 3.5'' or 8~31 x 2.5'' • 2 x 3rd Gen Intel® Xeon® • 32 x DIMM and 16 DIMM • FDM: The patented FDM technology
SAS/SATA drives, 4/8/16/24 x Scalable Processors (Ice models alternative, adaptive provides the fault locating accuracy
NVMe SSDs Lake), up to 80 cores and to various workloads up to 93%
• 45 x 2.5'' drives, or 34 x NVMe TDP 270 W per CPU • 2 x OCP 3.0 NICs, hot-swap • Intelligent Fault Prediction: Drive fault
SSDs for ultra-large storage • 4 x 300 W full-height full- • 14 x PCIe 4.0 expansion slots prediction 7 to 30 days before it occurs
• 32 x DDR4 DIMMs, up to 3200 length dual-width GPUs, 8 • 2 x M.2 SSDs, hot-swap, • DEMT2.0: The patented DEMT reduces
MT/s; Optane™ PMem, up to full-height full-length hardware RAID energy consumption by 18% without
3200 MT/s; total memory single-width GPUs, or 11 • 2 x 3000 W PSU modules in compromising services
capacity up to 12 TB on a single half-height half-length 1+1 mode • AI Memory Fault Management:
server GPUs, provide supreme • 4 x hot-swap fan modules in reduces downtime rate by 50%
heterogeneous computing N+1 mode • Five Major Intelligent Technologies:
power improve O&M efficiency by 30%

8
 2288H V6-16DIMM Architecture

Drive enclosure: 4 x 3.5"

SAS/SATA drives

16 x DDR4 DIMMs,
1 x PCIe 4.0 x16 or 3200 MT/s 2-socket scalable
2 x PCIe 4.0 x8 processors, TDP 270 W
Drive enclosure: 8 x 2.5'' SAS/SATA drives
half-height slots or
Drive: 2 x 2.5“ or 2 x 4* 2.5" SAS/SATA/
3.5“ SAS/SATA drives NVMe drives
1 x PCIe 3.0 x8 and
3 x PCIe 3.0 x16 Drive enclosure: 12 x 3.5" SAS/SATA drives
half-height slots

Drive enclosure: 12 x 3.5" drives (8 x SAS/SATA + 4 x

SAS/SATA/NVMe)

Management Drive enclosure: 25 x 2.5" SAS/SATA drives

network port,
serial port
Flex I/O card
(OCP3.0 NIC) Internal RAID controller card

1500 W PSUs, 1+1 redundancy 4 x fan modules, N+1

redundancy

9
 2288H V6-32DIMM Architecture
Drive enclosure: 8 x 2.5'' SAS/SATA drives
Drive enclosure: 4 x 3.5" or 10 x 2.5"
8 x PCIe 4.0 full-height slots SAS/SATA drives

（ 6 x PCIe 4.0 x8 slots, 2 x PCIe 4.0 x16 Drive enclosure: 12 x 3.5'' SAS/SATA drives
slots） 32 x DDR4 DIMMs, 2-socket scalable
3200 MT/s processors, TDP 270 W Drive enclosure: 12 x 3.5'' drives (8 x SAS/SATA + 4 x
SAS/SATA/NVMe)

Drive enclosure: 12 x 2.5'' drives (4 x SAS/SATA + 8 x NVMe）

Management
network port, Drive enclosure: 20 x 2.5'' drives (4 x SAS/SATA + 16 x NVMe）
serial port
Flex I/O card 1 Flex I/O card 2
(OCP3.0 NIC) (OCP3.0 NIC) Drive enclosure: 24 x 2.5'' NVMe drives

Rear panel configured with 4 x full-height Drive enclosure: 24 x 2.5" SAS/SATA drives
full-length dual-width GPU cards

Drive enclosure: 25 x 2.5" SAS/SATA drives

Internal RAID
controller card 4 x fan modules, N+1
3000 W PSUs, redundancy
1+1 redundancy
10
Highlights in 2288H V6 Product Specifications

Superior computing power

• 80-core generic computing power
• Four 300 W FHFL dual-width GPU
Larger storage
accelerator cards
• Up to 45 x 2.5" drives
• Eight FHFL single-width GPU
or 34 NVMe SSDs
accelerator cards
• Up to 12 TB memory
• 11 HHHL half-width GPU
capacity
accelerator cards

Flexible configuration
• Models with 32 DIMMs or 16 DIMMs
• Two OCP 3.0 hot-swappable NICs
• 14 PCIe 4.0 expansion slots for diverse
applications
• Patented design: • Two M.2 SSD cards, supporting hot
hot-swappable
drives swap and hardware RAID
• Two 3000 W PSUs in 1+1 redundancy

11 mode
2288H V6 Logical Topology

12
2288H V6 Product Specification
Item Details
Size 2U
Two 3rd Gen Intel® Xeon® Scalable processors (Ice Lake) (8300/6300/5300/4300 series), with
CPU up to 270 W TDP per processor
Memory Sixteen or thirty-two 3200 MT/s DDR4 memory slots for flexible optional scenarios, hosting up
® TM
to 16 Intel Optane persistent memory 200 series
• Twelve or twenty 3.5" or eight to thirty-one 2.5" SAS/SATA drives
• 4/8/16/24 NVMe SSDs
Local storage • Support up to 45 x 2.5" SAS/SATA drives or 34 NVMe SSDs
• Two M.2 SSDs
RAID RAID 0/1/10/1E/5/50/6/60.
Up to 14 PCIe 4.0 expansion slots, including one PCIe expansion slot for a RAID controller card,
PCIe expansion
two slots for OPC 3.0 Flex IO expansion cards, and 11 PCIe 4.0 expansion slots.
• Four 300 W FHFL dual-width GPU accelerator cards
Heterogenous accelerator • 11 HHHL GPU accelerator cards
card • Eight FHFL single-width GPU accelerator cards
Multiple types of NICs
NIC Two optional hot-swappable OCP 3.0 network adapters in the two Flex IO expansion slots
(determine whether to configure OCP 3.0 network adapters on demand)
PSU Two hot-swappable PSUs (900 W/1200 W/1500 W/2000 W/3000 W) in 1+1 redundancy mode

Fan module Four hot-swappable counter-rotating fan modules in N+1 redundancy mode

Operation temperature 5ºC to 45ºC (41ºF to 113ºF) (confirm to ASHRAE Class A1/A2/A3/A4)
13
Major Composition Modules
1 I/O module 1 2 I/O module 2

3 PSU 4 Chassis

5 I/O module 3 6 Supercapacitor holder

7 Air duct 8 Intrusion sensor

NOTE:
The air duct cannot be
installed on a server with
built-in drives.
9 Front-drive backplane 10 Left mounting ear plate

11 Fan module brackets 12 Fan module

13 Front drive 14 Right mounting ear plate

15 Processor heat sink 16 Processor

17 Cable organizer 18 Mainboard

19 BMC card 20 OCP 3.0 network adapter

21 Screw-in RAID controller 22 TPM/TCM

card
23 Memory - -

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Mainboard 20: mini-SAS HD connector C (MINIHD
PORTC/J4)
24: mini-SAS HD connector B (MINIHD
8080 fans use 33, 34, 35, 36, 38, 40, and
Fan module PORTB/J5)
41. Mini
connector 26: mini-SAS HD connector A uses 26 (MINIHD
8038 fans use 34, 36, 40, and 42. SAS/SATA
PORTA/J6)
27: SATA connector 1 (SATA1/J1)
28: SATA connector 2 (SATA2/J2)

31: LP Slimline 1 connector

(SLIMLINE1/J11)
8: Two USB 3.0 connector J88
32: LP Slimline 2 connector
9: Rear VGA port (VGA CONN/J60)
(SLIMLINE2/J84)
10: Serial port J6020
44: LP Slimline 4 connector
Slimline 11: BMC management network port (BMC_GE
(SLIMLINE4/J12)
/J6019)
45: LP Slimline 3 connector BMC
12: BMC management board
(SLIMLINE3/J85)
13: LCD connector (LCD CONN/J6025)
52: LP Slimline 5 connector
(SLIMLINE5/J30)

15: Rear-drive backplane power connector

2 (REAR BP PWR2/J21)
21: Drive backplane power connector 3
(HDD BP PWR3/J89)
25: Backplane 4PIN power connector1 J64)
29: Cell battery holder (U9) )
1: PCIe riser 2 slot (PCIE RISER2/J51)
46: Power connector for the built-in-drive
4: Screw-in RAID controller card connector
backplane (INNER HDD PWR/J22) Riser,
(RAID CARD/J86)
47: Drive backplane power connector 2 RAID, SD
7: Built-in storage expansion port (SD
PSU (HDD BP PWR2/J88) expansion
CARD/J87)
connector 48: BBU power connector (BBU connector,
18: PCIe riser 1 slot (PCIE RISER1/J50)
POWER/J13001) USB
22: Built-in USB 3.0 connector (INNER
49: Drive backplane power connector 1
USB3.0/J110)
(HDD BP PWR1/J26)
50: Backplane 6PIN power connector3 J20)
51: PSU 2 connector (PSU2/J56)
55: PSU 1 connector (PSU1/J28)

OCP 1: 2: Debugging pin (J103)

14: OCP 3.0 network adapter 1 connector 16: NC-SI connector (NCSI CONN/J114
(OCP1 CONN/J108) 19: TPM/TCM connector (J10)
17: LP slimline 6 connector for OCP 3.0 23: Right mounting ear connector (RCIA
network adapter 1 (SLIMLINE6/J13) BOARD/J113)
OCP 2: 30: VROC key connector (Soft RAID KEY/J3)
OCP
5: LP slimline 7 connector for OCP 3.0 Other 37: Intrusion sensor connector (INTRUDER
connector
network adapter 2 (SLIMLINE7/J31) CONN/S1)
6: OCP 3.0 network adapter 2 connector 43: Left mounting ear connector (LCIA
(OCP2 CONN/J109) BOARD/J106)
15
 2288H V6 Hardware Configuration Types (1/3)

Front Rear Built-in RAID Controller Card

PCH pass-through, one

1 screw-in RAID controller
card, or one PCIe RAID
8 x 2.5" SAS/SATA drives 4 x 2.5" NVMe drives controller card

PCH pass-through, one

screw-in RAID controller
2 card, or one PCIe RAID
12 x 2.5" drives controller card
(4 x SAS/SATA + 8 x NVMe)

One screw-in RAID

3 controller card or one
4 x 3.5"/2.5" SAS/SATA/drives PCIe RAID controller card
12 x 3.5" SAS/SATA drives
or (8 x SAS /SATA + 4 x NVMe) 4 x 2.5" NVMe drives

PCH pass-through
4
12 x 3.5" SATA drives
or (8 x SATA + 4 x SATA/NVMe) 4 x 2.5" NVMe drives

16
 2288H V6 Hardware Configuration Types (2/3)

Front Rear Built-in RAID card

5 One screw-in RAID

controller card or one
PCIe RAID controller
12 x 3.5" SAS/SATA drives 2 x 2.5" SAS/SATA drives card
4 x 2.5" NVMe drives

6 One screw-in RAID

controller card or one
PCIe RAID controller card
12 x 3.5" SAS/SATA drives 4 x 3.5"/2.5" SAS/SATA drives 4 x 3.5" SAS/SATA drives
4 x 2.5" SAS/SATA/NVMe drives

PCH pass-through, one

7 screw-in RAID controller
card, or one PCIe RAID
20 x 2.5" drives (4 x controller card
SAS/SATA + 16 x NVMe) 4 x 2.5" SAS/SATA drives

8 PCH pass-through or
one screw-in RAID
24 x 2.5" drives controller card
(4 x SAS/SATA/NVMe + 20 x NVMe) 4 x 2.5" SAS/SATA drives

17
 2288H V6 Hardware Configuration Types (3/3)

Front Rear Built-in RAID card

One screw-in RAID

9 controller card and two
24 x 2.5" SAS/SATA drives 4 x 2.5" NVMe drives PCIe RAID controller
cards

One RAID controller card

10 or one RAID controller
2 x 2.5" SAS/SATA/drives card
25 x 2.5" SAS/SATA drives 4 x 2.5" NVMe drives

One screw-in RAID

11 controller card and one
2 x 2.5" SAS/SATA/drives PCIe RAID controller card
25 x 2.5" SAS/SATA drives 4 x 2.5" NVMe drives

One RAID controller card

12 or one RAID controller
25 x 2.5" SAS/SATA drives 2 x 2.5" SAS/SATA/drives card
4 x 2.5" SAS/SATA/ NVMe drives
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IO Expansion — PCIe Riser Card
PCIe slots

•I/O module 1 provides slots 1, 2, and 3. If a two-slot PCIe riser module is used, slot 1 is unavailable. If a
module with 2 x 2.5" drives and one PCIe card is used, slots 1 and 2 are unavailable.
•I/O module 2 provides slots 4, 5, and 6. If a two-slot PCIe riser module is used, slot 4 is unavailable. If a
module with 2 x 2.5" drives and one PCIe card is used, slots 4 and 5 are unavailable.
•I/O module 3 provides slots 7 and 8. If a one-slot PCIe riser module is used, slot 7 is unavailable.

Observe the following rules when configuring GPU cards:

• When one to five x16 T4 GPU cards are configured:
• I/O module 1 supports two HHHL PCIe x16 GPU cards.
• I/O module 2 supports two HHHL PCIe x16 GPU cards.
• I/O module 3 supports one HHHL PCIe x16 GPU card (in slot 8).
• When six to eight T4 GPU cards (six x8 + two x16) are configured:
• I/O module 1 supports two HHHL PCIe x8 and one HHHL x16 GPU cards.
• I/O module 2 supports two HHHL PCIe x8 and one HHHL x16 GPU cards.
• I/O module 3 supports two HHHL PCIe x8 GPU cards.
19
 IO Expansion — PCIe Riser Card

• Provides PCIe slots 1, 2, and 3 when installed in I/O module 1. • Provides PCIe slots 2 and 3 when installed in I/O module 1.
• Provides PCIe slots 4, 5, and 6 when installed in I/O module 2. • Provides PCIe slots 5 and 6 when installed in I/O module 2.

20
IO Expansion — PCIe Riser Card
PCIe Riser Module

Provides PCIe slots 7 and 8 when being installed in I/O module 3.

•Provides PCIe slot 3 when installed in I/O module 1.

•Provides PCIe slot 6 when installed in I/O module 2.
Provides PCIe slot 8 when installed in I/O module 3.

21
Main Specification Differences Between Two Models
Specification 32-DIMM Model 16 DIMM Model
W i-Fi/BLUETOOTH+BTN+LED, VGA, two USB 3.0, one Type-
No right mounting ear
C (USB 2.0)+LED, PWRBTN+LED
Mounting ear
UIDBTN+LED, NICLED, fault diagnosis LED, temperature PWRBTN+LED, UIDBTN+LED, NIC LED, fault diagnosis LED,
sensor temperature sensor
1. 8/12/12EXP/25EXP
2. 12 (four NVMe)
3. Four SAS + eight NVMe 1. 8/12/12EXP/25EXP
Front hardware
4. 24 NVMe (four SAS) pass-through 2. 12 (four NVMe)
configuration
5. Up to thirty-seven 2.5“ (front twenty-five 2.5” SATA/SAS
+ rear ten 2.5“ SATA/SAS + rear two 2.5” SATA/SAS)—POC
6. 34 NVMe drives (24 + 1 U 10 NVMe)—POC
CPU ICELAKE CPU with up to 270 W, cloud customized CPU 320 W ICELAKE CPU, with up to energy consumption 270 W

Memory 32 DDR4 DIMMs, 2DPC 16 DDR4 DIMMs, 1DPC

Two OCP 3.0 network adapters, with reserved support for
Internet connection One OCP 3.0 card
multi-host and connection capacity of 200G
11 PCIe 4.0，with five FH slots plus six HH slots or eight
Five PCIe 3.0 HHHL cards
PCIe 4.0 FH slots
I/O slot Four rear panel slots (three PCIe 3.0 x16 + one PCIe 3.0 x8);
One PCIe 3.0 x8 for RAID card one PCIe 3.0 x8 for a RAID controller card, one built-in PCIe 3.0
x16
Built-in memory One USB 3.0 One USB 3.0
GPU Four 300 W GPU cards Four 75 W GPU cards
BMC Card LOM
BIOS insyde BYO

22
Back Window Difference
32 DIMM Model

16 DIMM Model

23
FusionServer 5288 V6: Supports for Warm and Cold Data Storage
and Video Analytics

• Tiered storage of warm and cold data

• Cloud computing
• Big data

Ultimate Video Analytics Flexible Configuration Intelligent management

Ultra-Large Local Storage
Storage
• Hybrid storage architecture and • 2 x 3rd Gen Intel® Xeon® • 2 x OCP 3.0 NICs, hot-swap • FDM: The patented FDM technology
tiered storage of warm and cold data Scalable Processors, up to 80 • 1 x 1 PCIe 4.0 expansion provides the fault locating accuracy up
• Up to 44 x 3.5-inch drives for cores and TDP 270 W per CPU slots to 93%
storage of warm and cold data, 4 • 8 x half-height half-length GPUs • 2 x M.2 SSDs, hot-swap, • Intelligent Fault Prediction: Drive fault
provide up to 640-channel FHD hardware RAID prediction 7 to 30 days before it occurs
x 2.5-inch NVMe SSDs support for
video analytics, and support 36 x • 2 x PSU modules (3000 W) in • MPC-PID: The patented energy loss
high-speed media storage
3.5-inch drives for video reduction technologies (MPC-PID)
• 32 x DDR4 DIMMs and Optane™ 1+1 mode
analytics and large data storage
PMem with total in-memory • 4 x fan modules in N+1 reduces energy consumption by 5%
capacity up to 12 TB on a single mode without compromising services
server ➢ Rack Server- 1288H • AI Memory Fault Management: reduces
downtime rate by 50%
V6/2288H V6/5288
• Five Major Intelligent Technologies:
V6/2488H V6 improve O&M efficiency by 30%
➢ GPU Server- G5500 V5
24
➢ High-density Server- X6000
5288 V6 Product Specification
Item Details
Size 4U
Two 3rd Gen Intel® Xeon® Scalable processors (Ice Lake) with up to 270 W TDP per processor
Processor (8300/6300/5300/4300 series)
® TM
Thirty-two 3200 MT/s DDR4 memory slots for flexible scenarios, hosting up to 16 Intel Optane
Memory
persistent memory modules.
• Thirty-six to forty-four 3.5" SAS/SATA drives, including four optional NVMe SSDs
Local storage • Two M.2 SSDs

RAID RAID 0/1/5/50/6/60.

Up to 11 PCIe 4.0 expansion slots, including one PCIe expansion slot for a RAID controller card, two
PCIe expansion
slots for OPC 3.0 Flex IO expansion cards, and eight PCIe 4.0 expansion slots.
Heterogenous
8 HHHL GPU accelerator cards
accelerator card
Multiple network expansion capabilities.
NIC Two optional hot-swappable OCP 3.0 NICs in the two Flex IO expansion slots (determine whether to
configure OCP 3.0 NICs on demand).
PSUs Two hot-swappable PSU (900 W/1500 W/2000 W) in 1+1 redundancy mode

Fan modules Four hot-swappable fan modules in N+1 redundancy mode

Operating
5ºC to 45ºC (41ºF to 113ºF) (confirm to ASHRAE Class A1/A2/A3/A4)
temperature

25
 5288 V6 Architecture

Drive enclosure: 4 x 3.5"

8 x PCIe 4.0 full-height slots SAS/STA drives
(6 x PCIe 4.0 x8 slots, 2 x PCIe 4.0 x16
slots) 32 x DDR4 DIMMs, 2-socket scalable
3200 MT/s processors, TDP 270 W

Drive enclosure:
24 x 3.5" SAS/SATA drives
management
Flex I/O card 1 network port, Flex I/O card 2
serial port
(OCP3.0 NIC) (OCP3.0 NIC)

Rear 4 x 2.5" NVMe SSD

PSU, 1+1 redundancy 4 x fan modules, N+1

redundancy
Rear drive: 12 x 3.5" SAS/SATA drives

26
 FusionServer 2488H V6: Mission Critical Server of High
Reliability
• Virtualization
• Cloud computing
• High-performance
computing (HPC)
• Database
• Entry-level in-memory
database (SAP HANA)
• AI inference or training

High reliability Superb performance Intelligent management Innovative design

• Carrier-class component • 4 x 3rd Gen Intel® Xeon® Scalable • FDM: The patented FDM • 2 x full-height full-length dual-
specifications and 100% derating Processors, up to 28 cores and technology provides the fault width GPU AI accelerator such as
design TDP 205 W per CPU locating accuracy up to 93% Tesla V100
• Redundancy design: PSU modules • 48 x DDR4 DIMMs, up to 3200 • Intelligent Fault Prediction: Drive • 4 x half-height half-length single-
in 1+1 mode, fan modules in N+1 MT/s; a maximum of 24 Optane™ fault prediction 7 to 30 days before width GPU AI accelerator such as
mode, and memory module PMem 200 Series, up to 2666 MT/s; it occurs Tesla T4
sparing/mirroring total memory capacity up to 18 TB • DEMT2.0: The patented DEMT • 11 x PCIe 3.0 slots, including 1 x
on a single server reduces energy consumption by hot-swappable OCP 3.0 standard
• 69 RAS features • 2 x 300 W high-performing dual- 18% without compromising NIC
• 99.999% availability width GPUs provides ultimate services • 25 x 2.5" SAS/SATA drives, up to
• 15% fewer failures than the computing power for AI inference and • AI Memory Fault Management: 16NVMe SSDs1
industry average training reduces downtime rate by 50% • Type-C access to iBMC facilitates
• BSST(Boot Speedup Storage • Five Major Intelligent O&M
Technology), 2xM.2 SSD install OS Technologies: improve O&M
27 efficiency by 30%
 2488H V6 Architecture

4 x 3rd Gen Intel® Xeon® scalable

processors, TDP 270 W per CPU Disk enclosure: 8 x 2.5" SAS/SATA drives
1 x PCIe 3.0 x8 slot,
2 x PCIe 3.0 x16
full-height slots
Disk enclosure: 4 x 2.5" SAS/SATA drives,
8 x 2.5" NVMe drives
3 x PCIe 3.0 x8
half-height slots

Disk enclosure: 4 x 2.5" SAS/SATA drives,

16 x 2.5" NVMe drives

Disk enclosure: 24 x 2.5" SAS/SATA drives or

serial port, management 24 x 2.5" NVMe drives
network port, VGA, 2 x USB3.0
1 x OCP3.0
standard NIC,
hot-swap
Disk enclosure: 25 x 2.5" SAS/SATA drives

2 x hot-swap PSUs, 1 x Internal PCIe 3.0 x8 6 x hot-swap fan modules,

1+1 redundancy half-height slot N+1 redundancy

48 x DDR4 DIMMs, 3200 MT/s; 24

Optane™ PMem 200 Series, total
memory capacity up to 18 TB on a
single server

28
2488H V6 Product Specification
Item Details
Size 2U

Processor Two or four 3rd Gen Intel® Xeon® scalable processors (5300/6300/8300 series), TDP up to 250 W

Memory 48 DDR4 DIMMss, up to 3,200 MT/s; 24 Optane™ PMem 200 series, up to 2,666 MT/s
Supports various drive configurations and hot swappable:
• 8 x 2.5-inch front SAS/SATA drives, 24 x 2.5-inch front SAS/SATA drives, 25 x 2.5-inch front SAS/SATA
Local storage drives, 4 x 2.5-inch front SAS/SATA drives and 8 x NVMe SSDs, 4 x 2.5-inch front SAS/SATA drives and
16 x NVMe SSDs
• Supports flash storage: Dual M.2 SSDs
RAID RAID 0/1/5/50/6/60.
Heterogenous
Supports two dual-slot FHFL GPUs or four single-slot HHHL GPU heterogeneous accelerator cards
accelerator card
(Optional) One OCP 3.0 NIC: supports two GE, two 10GE, two 25GE, or two 100GE ports; supports hot-
NIC swappable, NC-SI, WOL, and PXE

PSUs 2 hot-swappable PSUs in 1+1 redundancy mode.

Fan modules Six hot-swappable fan modules in N+1 redundancy mode

Operating
5°C to 45°C (41°F to 113°F) (ASHRAE Class A2/A3/A4 compliant)
temperature

29
Part 2

Heterogeneous Server Technical Introduction

G5500 V5

Page 30
 G5500 Data Center Heterogeneous Server Overview

Rich and flexible hardware configurations: 1 chassis, 2 node types, and 3 models

GP608 node • 8 x V100/P100/P40/T4 PCIe

G560 V5 full-width dual-socket

G5500 full-width model compute node

GP308 node • 4 x V100 or 8*V100（150 W）

/T4 PCIe

G530 half-width dual-socket GP316 node • 16 x T4 PCIe

G5500 half-width model compute node

31
G5500 Product Specifications
G5500
Node G560 V5 G530 V5
Application High-density AI inference deployment;
G560 V5 front view Large-scale AI training
Scenario HPC
Full-width heterogeneous
Type Half-width heterogeneous compute node
compute node
GPU module
2 half-width GPU boards
1 full-width GPU board
GPU Each board: 16 T4 or 4 P100/V100 (PCIe)
8 P40/P100/V100 (PCIe)
or 8 V100 (single PCIe slot)
CPU module
1 full-width 2S CPU compute
2 half-width 2S CPU compute modules
module
Server Each node: 2 Xeon® Skylake/Cascade
2 Xeon® Skylake/Cascade CPUs,
G530 V5 front view CPUs, 24 DIMMs
24 DIMMs
G5500

Each node: 2 x 2.5-inch SAS/SATA/NVMe

GPU module 2 x 2.5-inch SAS/SATA + 6 x 2.5-
drives
inch NVMe
Drive Or 4 M.2 SATA SSDs
PCIe model: scalable to 8 x 3.5-
Scalable to 4 x 3.5-inch SAS/SATA drives
CPU module inch SAS/SATA drives
(GP308)
RAID RAID 0, 1, 10, 5, 50, 6, or 60
G5500 rear view
IO 4 PCIe x16 LP + 2 x 10GE LOM Each node: 2 PCIe x16 LP + 2 x 10GE LOM

Power 4 hot-swappable 2200 W AC or 240 V HVDC PSUs, with support for the N+N
Supply Units working mode
Fan Modules 6 hot-swappable fan modules, with support for N+1 redundancy
Temperature 5°C to 35°C (41°F to 95°F)
Dimensions
32 175 mm x 447 mm x 790 mm (6.89 in. x 17.60 in. x 31.10 in.)
(H x W x D)
G5500 Front View — Various Local Storage Resources

1
1

2
2
3
3

1 8 x 3.5-inch SAS/SATA HDDs* 1 4 x 3.5-inch SAS/SATA HDDs*

2 6 x 2.5-inch NVMe SSDs or SAS/SATA HDDs 2 2 x 2.5-inch NVMe SSDs or SAS/SATA HDDs (OS
installation)

3 2 x 2.5-inch SAS/SATA HDDs (OS installation) 3 1 VGA + 2 USB ports

*Note: The G530 V5+GP316 model does not support 4 x

3.5-inch drives.

33
G5500 Rear View — Unified Management and Shared
Power and Fan Resources
1 1

2 2
4

3 3

1 Management modules 2 I/O modules 3 PSUs 4 Fan modules

⚫ 2 management modules ⚫ 2 I/O modules ⚫ 4 Platinum PSUs, N+N ⚫ 6 hot-swappable fan modules,
⚫ Each management module ⚫ Each I/O module supports 2 redundancy N+1 redundancy
supports 2 x 10GE optical PCIe x16 slots ⚫ Maximum output power of ⚫ Online maintenance without
ports ⚫ Supports half-height half- each PSU: 2200 W opening the chassis cover
⚫ GE management network length PCIe cards ⚫ Support for AC and 240 V
ports and serial ports HVDC

34
FusionServer G5500 Key Messages

Superior Heterogeneous Computing Performance

• Supports 8 FHFL or 32 HHHL AI training &
inference heterogeneous accelerator cards
• Supports GPUDirect RDMA/P2P

One-Click Switching of Heterogeneous Topologies

• AI and HPC topologies switched at one click
• Support diverse applications and reduce hardware
investment

Fully Modular Design

• Independent CPU module and heterogeneous
modules, supports long-term evolution
• Power supply, hard drive and fan use modular
Artificial Cloud GPU design, simplifying O&M
Intelligence HPC
Acceleration

35
Part 3

High-Density Server Technical Introduction

X6000 V6

Page 36
Efficient Heat Dissipation Unleashes the Ultimate Performance

Superior Performance

• 8 x 3rd Gen Intel® Xeon® Scalable processor, up to 25 TFLOPS

computing power per chassis
24-drive 8-drive • 8-channel DIMMs, 45% higher bandwidth
configuration configuration • 24 NVMe SSDs

Optimal Heat Dissipation

X6000 V6 high-density server • Drives do not have backplanes and the cabinet uses wing counter-
rotating fans, increasing the intake air volume by 35%.
• Drives do not have backplanes, increasing the porosity rate by 40%.
• The large vapor chamber (VC) conjoined heat sink is made of phase-
change materials, whose thermal conductivity is 15x that of pure copper.
• Built-in PSUs support 110 mm heat sinks.
• Liquid cooling door + Board-level full liquid cooling, 100% liquid cooling

XH321 V6 air-cooled XH321C V6 liquid-cooled

Ultimate Efficiency
node node
• 4 x 3000 W PSUs in 2+2 redundancy
High-performance Virtualization Web apps Cloud • The total output power doubles that of the industry.
computing (HPC) computing • Titanium PSUs with up to 96.5% conversion efficiency
• MPC-PID machine learning-based energy saving algorithm, 5% less energy
consumption

37
X6000 V6: High-Density Design, Meeting HPC Requirements

24-drive configuration for NVMe SSDs in HPC scenarios

PSU

Front view 2+4 balanced configuration, USB port + VGA port Rear view
eliminating I/O bottlenecks between
CPUs and drives

8-drive configuration for optimal heat dissipation in HPC scenarios

XH321 V6 1U half-width 2-socket server node

Hard drive: 2 x SAS/SATA/SSD

Hardware Specifications
Form 2U chassis, 4 x 1U half-width 2-socket server node
Drive 24 x 2.5" SAS/SATA/SSD/NVMe drives of any configuration
PSU 4 x hot-swappable PSUs in 1+1 or 2+2 redundancy: 68 mm x 138 mm, 1200 W/1500 W/2000 W/3000 W
Power supply 100 V to 240 V AC; 240 V DC
Fan module 4 x hot-swappable fan modules in N+1 redundancy
Operating temperature 5ºC to 35ºC (41°F to 95°F)
Dimensions (H x W x D) 447 mm x 899 mm x 86.1 mm
38
XH321 V6 Node: Industry's Most Powerful Computing Power

Internal view
Superior Computing Flexible
Performance Deployment
16 x DIMM slot 50 mm/68 mm built-in PSU
• 3rd Gen Intel® Xeon® Scalable processors, 40% • InfiniBand HDR 200G high-speed interconnection
higher performance network
• 8-channel DIMMs, 45% higher memory • NVMe SSDs storage
Rear drive bandwidth
backplane
Hardware Specifications
2 x 3rd Gen Intel® Xeon® Scalable processors (6300/8300 series), thermal
RAID 2 x M.2 110 mm VC Processor design power (TDP) up to 270 W, 6.3 TFLOPS/node
controller SSD slot conjoined
card heat sink DIMM slot 16 x DDR4 DIMM slot, up to 3200 MT/s (8-channel)
6 x 2.5" SAS/SATA/SSD/NVMe drives (NVMe SSDs support 2+4 balanced
Rear view Drives configuration.)
PCIe slot 1 PCIe slot 2 PSU RAID controller card RAID 0, 1, 5, 6, 10, 50, or 60; supercapacitor for power failure protection
2 x PCIe 4.0 x16 half-height half-length (HHHL) standard expansion slot, one of
PCIe expansion which can be configured to support multi-host

OCP expansion 1 x OCP x16 slot

OCP slot iBMC aggregated Onboard storage Up to two M.2 2280 or 2242 SATA SSDs, in RAID 0, 1, and 5
management
Operating temperature 5ºC to 35ºC (41°F to 95°F)
network port
Dimensions (H x W x D) 218.7 mm x 632 mm x 40.7 mm

39
 XH321C V6 Liquid-Cooled Node: 45ºC (113°F) Warm Water
Cooling Brings Down the TCO by 20%

Liquid cooling of processors and memory modules

High Energy Efficiency Cabinet-Level
(board-level liquid cooling solution) and Robust Reliability Deployment Solution
• The CPU/memory/VRD uses an optimized • Accommodated in a FusionServer liquid-
PUE ≤ 1.1
liquid cooling ratio: 80% water routing design for inter-DIMM cold cooled cabinet, which has manifolds inside
plates. The heat dissipation ratio of board- and can be connected to the main pipe
level liquid cooling reaches 80%. • Up to 72 liquid-cooled nodes in a liquid-
• 45ºC (113°F) warm water cooling, 20% less TCO cooled cabinet

Hardware Specifications
2 x 3rd Gen Intel® Xeon® Scalable processors (6300/8300 series),
Processor
TDP up to 270 W
Liquid cooling of processors and memory
DIMM slot 16 x DDR4 DIMM slot, up to 3200 MT/s (8-channel)
modules + Liquid cooling door
(full liquid cooling solution) 6 x 2.5" SAS/SATA/SSD/NVMe drives (NVMe SSDs support 2+4
Drives
balanced configuration.)
PUE ≤ 1.1
liquid cooling ratio: 80% RAID 0, 1, 5, 6, 10, 50, or 60; supercapacitor for power failure
RAID controller card

+
protection
One PCIe 4.0 x16 HHHL standard expansion slot, multi-host
PCIe expansion
supported
OCP expansion 1 x OCP x16 slot
Onboard storage Up to two M.2 2280 or 2242 SATA SSDs, in RAID 0, 1, and 5
Liquid cooling door
Operating temperature 5ºC to 35ºC (41°F to 95°F)
40 Dimensions (H x W x D) 218.7 mm x 632 mm x 40.7 mm
Thank you.

Fusion X, Digital Infinity

Copyright©2021 xFusion Digital Technologies Co., Ltd.

All Rights Reserved.

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the future financial and operating results, future product
portfolio, new technology, etc. There are a number of factors that
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from those expressed or implied in the predictive statements.
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