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SOT323 Standard

This document provides packaging information for the SOT323 (Standard) surface mount package, including: - Mechanical data such as package weight, soldering temperature limits, and case material. - Package outline dimensions, suggested pad layout, and minimum packing quantities for shipping reels. - Device tape orientation, embossed carrier tape specifications, and allowable component movement within tape pockets. It specifies the key physical characteristics of the SOT323 package to enable proper handling and placement on printed circuit boards.

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Vikas Attarde
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0% found this document useful (0 votes)
53 views5 pages

SOT323 Standard

This document provides packaging information for the SOT323 (Standard) surface mount package, including: - Mechanical data such as package weight, soldering temperature limits, and case material. - Package outline dimensions, suggested pad layout, and minimum packing quantities for shipping reels. - Device tape orientation, embossed carrier tape specifications, and allowable component movement within tape pockets. It specifies the key physical characteristics of the SOT323 package to enable proper handling and placement on printed circuit boards.

Uploaded by

Vikas Attarde
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PDF, TXT or read online on Scribd
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2 SOT323 (Standard)

PACKAGE INFORMATION

Mechanical Data Package View


 Surface Mount Package
 Weight: 0.006 grams (Approximate)
 Max Soldering Temperature +260°C for 30 secs as per JEDEC
J-STD-020
 Case Material: Molded Plastic, UL Flammability Rating 94V
 Terminals: Finish - Matte Tin Plated Leads, Solderable per Top View (Front) Top View (Back)
MIL-STD-202, Method 208 e3

Package Outline Dimensions

SOT323 (Standard)
D

A2
SOT323 (Standard)
Dim Min Max Typ
c a A1 0.00 0.10 0.05
A1 e L A2 0.80 1.00 0.90
b 0.20 0.40 0.30
b c 0.08 0.18 0.13
D 1.80 2.20 2.00
E 2.00 2.45 2.225
E1 1.15 1.35 1.25
e -- -- 0.65
e1 1.20 1.40 1.30
F 0.25 0.475 0.3625
E E1 L 0.25 0.46 0.355
a 0° 8° --
All Dimensions in mm

F e1

Suggested Pad Layout

SOT323 (Standard)
X

Value
Dimensions
(in mm)
Y1 G C 0.650
G 1.300
X 0.470
Y 0.600
Y1 2.500

C
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application.
These dimensions may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for
wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A,
Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Note: For high voltage applications, the appropriate industry sector guidelines should be considered with regards to creepage and clearance
distances between device Terminals and PCB tracking.

SOT323 (Standard) Package Information 1 of 5 February 2021


Rev. 2021-02-24 www.diodes.com © Diodes Incorporated
2 SOT323 (Standard)

Minimum Packing Quantity


Quantity Tape Width Part Number Suffix
7” Reel 3,000 8mm -7
13” Reel 10,000 8mm -13
Note: Package quantities given are for minimum packaging quantity only, not minimum order quantity. For minimum order quantity, please contact Sales
Department.
Note: No mixed date codes or partial quantity (less than minimum packaging quantity) per packaging is allowed.
Note: In no case shall there be two or more consecutive components missing from any reel for any reason.

Device Tape Orientation


Tape Width Part Number Suffix Tape Orientation

-7
8mm
-13

Direction of feed
Note: For part marking, refer to product datasheet.
Note: Tape and package drawings are not to scale and are shown for device tape orientation only.

Embossed Carrier Tape Specifications

Dimension Value (mm) Dimension Value (mm) Dimension Value (mm)


Tape Width (W)
B1 4.5 max. F 3.5±0.05 P2 2.0±0.05
D 1.5+0.10 -0.0 K 2.4 max. t 0.40 max.
D1 0.35 min. P 4.0±0.10 W 8±0.30
8mm
E 1.75±0.10 P0 4.0±0.10
Determined by component size. The clearance between the component and the cavity must comply
A0 B0 K0 to the rotational and lateral movement requirement provided in figures in the "Maximum Component
Movement in Tape Pocket” section.

SOT323 (Standard) Package Information 2 of 5 February 2021


Rev. 2021-02-24 www.diodes.com © Diodes Incorporated
2 SOT323 (Standard)

Embossed Carrier Tape Specifications (Continued)

SOT323 (Standard) Package Information 3 of 5 February 2021


Rev. 2021-02-24 www.diodes.com © Diodes Incorporated
2 SOT323 (Standard)

Maximum Component Movement in Tape Pocket

SOT323 (Standard) Package Information 4 of 5 February 2021


Rev. 2021-02-24 www.diodes.com © Diodes Incorporated
2 SOT323 (Standard)

Surface Mount Reel Specifications

B*

C
A D* N

Full Radius

G
[Measured at hub]
* Drive spokes optional. If used,
dimensions with asterisks apply.

A B Max C D Max N Min G T Max


Tape Width Reel Size
(mm) (mm) (mm) (mm) (mm) (mm) (mm)

7” 178 2 2.0 +0.5 -0 13 +0.5 -0.2 20.5 0.2 55 5 8.4 +1.5 -0.0 14.4
8mm
13” 330 2 2.0 +0.5 -0 13 +0.5 -0.2 20.5 0.2 100 2 8.4 +1.5 -0.0 14.4

Tape Leader and Trailer Specifications

User Direction of Feed

Min. 390mm
END

Top Cover
Tape START

Min. 160mm Min. 160mm Carrier Tape Sealed


with Cover Tape
Trailer Tape (No Components) Leader Tape (No Components)

Note: There shall be a leader of at least 230mm which may consist of carrier tape and/or cover tape or a start tape followed by at least 160mm of
empty carrier tape sealed with cover tape.

Note: There shall be a trailer of at least 160mm of empty carrier tape sealed with cover tape. The entire carrier tape must release from the reel
hub as the last portion of the tape unwinds from the reel without damage to the carrier tape and the remaining components in the cavities.

SOT323 (Standard) Package Information 5 of 5 February 2021


Rev. 2021-02-24 www.diodes.com © Diodes Incorporated

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