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Enclheatingselection

This document provides a step-by-step process for calculating the heating requirements of an enclosure to prevent moisture buildup. It explains that moisture can cause failures in electronic components and lists factors like temperature, humidity and air circulation that impact moisture. A 5-step calculation is given that determines the enclosure's surface area, heat transmission coefficient, temperature differential and required heating power based on these factors.

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Butscher
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0% found this document useful (0 votes)
31 views

Enclheatingselection

This document provides a step-by-step process for calculating the heating requirements of an enclosure to prevent moisture buildup. It explains that moisture can cause failures in electronic components and lists factors like temperature, humidity and air circulation that impact moisture. A 5-step calculation is given that determines the enclosure's surface area, heat transmission coefficient, temperature differential and required heating power based on these factors.

Uploaded by

Butscher
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PDF, TXT or read online on Scribd
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For the latest prices, please check AutomationDirect.com.

Enclosure Heating and Heater Selection


Why Heat an Enclosure? requirement, the heater should then be placed in a position
near the bottom of the enclosure. If a separate control device
Today’s miniaturization of enclosure components results in high is used, the heater should not be located directly beneath the
packing densities, which in turn results in higher temperatures controller to ensure that the controller is not influenced by direct
within the enclosure. These high temperatures are harmful heat from the heater.
to electronic components. In response, cooling systems have
become standard in many applications. However, just as critical
and widely underestimated, are failures caused by the formation
Heater Calculation
of moisture. Follow Steps 1-5 to determine the heating requirement of an
enclosure (US units - left column, metric - right)
Under certain climatic conditions, moisture can build up not
only in outdoor or poorly insulated enclosures, but also in highly STEP 1: Determine the Surface Area (A) of your enclosure
protected and well-sealed enclosures. which is exposed to open air.
Enclosure Dimensions:
Moisture and Failure height = ________feet ________meters
Moisture, especially when combined with aggressive gases width = ________feet ________meters
and dust, causes atmospheric corrosion and can result in the
failure of components such as circuit breakers, busbars, relays, depth = ________feet ________meters
integrated circuit boards and transformers. The greatest danger Choose Mounting Option from next page, and calculate the
lies in conditions where electronic equipment is exposed to surface area as indicated
relatively high air humidity or extreme variations in temperature, A = ________ ft2 or ________ m2
such as day-and-night operation or outdoor installation. Failure
of components in such cases is usually caused by changing
STEP 2: Choose the Heat Transmission Coefficient (k) for your
contact resistances, flashovers, creepage currents or reduced
enclosure’s material of construction.
insulation properties.
painted steel = 0.511 W/(ft2•K) 5.5 W/(m2•K)
Eliminate Moisture stainless steel = 0.344 W/(ft2•K) 3.7 W/(m2•K)
Moisture and corrosion will remain low if relative air humidity aluminum = 1.115 W/(ft2•K) 12 W/(m2•K)
stays below 60%. However, relative humidity above 65% plastic or insulated
will significantly increase moisture and corrosion problems. stainless = 0.325 W/(ft2•K) 3.5 W/(m2•K)
This can be prevented by keeping the environment inside an
k= ________W/(ft2•K) or ________ W/(m2•K)
enclosure at a temperature as little as 9°F (5°C) higher than
that of the ambient air. Constant temperatures are a necessity to
guarantee optimal operating conditions. Continuous STEP 3: Determine the Temperature Differential (ΔT).
temperature changes not only create condensation but A. Desired enclosure interior temp. = ____oF ____oC
they reduce the life expectancy of electronic components B. Lowest ambient (outside) temp. = ____oF ____oC
significantly. Electronic components can be protected by cooling
Subtract B from A = Temp. diff. (ΔT) = ____oF ____oC
during the day and heating at night.
For these calculations, ΔT must be in degrees Kelvin (K).
Thermal Management Therefore, divide ΔT (oF) by 1.8. ΔT = ________ K
Modern enclosure heaters are designed to protect against
condensation. They heat the air inside enclosures, preventing STEP 4: Determine Heating Power (PV), if any (generated from
water vapor from condensing on components while existing components, i.e. transformer).
providing the greatest possible air circulation and low energy PV = ________ W or ________ W
consumption.
Other heating element technology improvements include: STEP 5: Calculate the Required Heating Power (PH) for your
• L onger operating life enclosure based on the above values.
• Greater energy efficiencies If enclosure is located inside:
• Quick wiring options
PH = (A x k x ΔT) - PV = __________ W
• Easier mounting
• F an heaters should be considered for larger enclosures to ensure If enclosure is located outside:
that the entire enclosure is heated uniformly PH = 2 x (A x k x ΔT) - PV = __________ W

Heater Location
Ideally, most heaters will perform optimally when mounted near
the bottom of an enclosure and used in conjunction with a
control device, thermostat, and/or hygrostat. The control
device may be a separate device, or it may be integral to the
heater. With the controller located in an area of the cabinet
that is representative of the average temperature or humidity

tENC-434 Enclosures Thermal Management 1-800-633-0405


For the latest prices, please check AutomationDirect.com.

Enclosure Mounting Types and Surface


Area Calculations
1. Free-Standing
W

D
Area (A) = 1.8 (H x W) Area (A) = 1.8 (H x W) Area (A) = 1.8 (H x W)
+ 1.8 (H x D) + 1.8 (W x D) + 1.4 (H x D) + 1.8 (W x D) + (H x D) + 1.8 (W x D)

2. Wall-Mounted

Area (A) = 1.4 (H x W) Area (A) = 1.4 (H x W) Area (A) = 1.4 (H x W)


+ 1.8 (H x D) + 1.8 (W x D) + 1.4 (H x D) + 1.8 (W x D) + (H x D) + 1.8 (W x D)

3. Ground

Area (A) = 1.8 (H x W) Area (A) = 1.8 (H x W) Area (A) = 1.8 (H x W)


+ 1.8 (H x D) + 1.4 (W x D) + 1.4 (H x D) + 1.4 (W x D) + (H x D) + 1.4 (W x D)

4. Ground and Wall

Area (A) = 1.4 (H x W) Area (A) = 1.4 (H x W) Area (A) = 1.4 (H x W)


+ 1.8 (H x D) + 1.4 (W x D) + 1.4 (H x D) + 1.4 (W x D) + (H x D) + 1.4 (W x D)

tENC-435 Enclosures Thermal Management 1-800-633-0405

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