THE INSTITUTE FOR

INTERCONNECTING IPC-HDBK-001
AND PACKAGING

ELECTRONIC CIRCUITS

Handbook and Guide to the

Requirements for Soldered
Electrical and Electronic
Assemblies to Supplement
ANSI/J-STD-001B

IPC-HDBK-001
March 1998 A standard developed by the Institute for Interconnecting
and Packaging Electronic Circuits

2215 Sanders Road Tel 847 509.9700

Northbrook, Illinois Fax 847 509.9798
60062-6135 URL: http://www.ipc.org
March 1998 IPC-HDBK-001

Table of Contents
3.7 Facilities ............................................................... 8
PREAMBLE/FOREWORD ............................................. 1
3.7.1 Environmental Controls....................................... 8
FORMAT ........................................................................ 1 3.7.2 Temperature and Humidity.................................. 8
1.0 Scope...................................................................... 1 3.7.3 Lighting ................................................................ 8
1.1 Purpose................................................................. 1 3.7.4 Field Assembly Operations.................................. 8
1.2 Classification ........................................................ 1 3.8 Soldering Tools and Equipment .......................... 8
1.3 Measurement Units and Applications ................. 2 3.8.1 Soldering Tools and Equipment .......................... 8
1.3.1 Verification of Dimensions .................................. 2 3.8.2 Thermal Profile of the Hand Soldering
Process.................................................................. 8
1.4 Definition of Requirements ................................. 2
3.8.3 Constant Output Soldering Irons......................... 9
1.4.1 Hardware Defects and Process Indicators .......... 3
3.8.4 Temperature Controlled Soldering Irons............. 9
1.4.2 Material and Process Nonconformances ............. 3
3.8.5 Selection of Hand Soldering Tools ..................... 9
1.5 Process Control Requirements ............................ 3
3.8.6 Soldering Iron Tip Selection ............................. 10
2.0 APPLICABLE DOCUMENTS ................................... 4
4.0 MATERIALS............................................................ 11
2.1 IPC ...................................................................... 4
4.1 Solder ................................................................. 11
2.2 EIA ...................................................................... 5
4.1.1 Solder Alloys...................................................... 12
2.3 Joint Industry Standards ...................................... 5
4.1.2 Low Temperature Solders.................................. 14
2.4 Documents Referenced in IPC-HDBK-001 ........ 5
4.1.3 High Temperature Solders ................................. 17
2.4.1 IPC........................................................................ 5
4.1.4 No-Lead Solders ................................................ 17
2.4.2 Department of Defense........................................ 5
4.1.5 Standard Solder Nomenclatures ........................ 17
2.4.3 Alpha Metals, Inc. ............................................... 5
4.1.6 Properties of Solder ........................................... 19
2.4.4 ASTM................................................................... 6
4.1.7 Material and Process Interactions ..................... 21
2.4.5 Sandia National Laboratories .............................. 6
4.1.8 Selecting Materials for Fatigue
2.4.6 AIA....................................................................... 6 Environments ..................................................... 23
2.4.7 UL ........................................................................ 6 4.2 Flux .................................................................... 23
2.4.8 ACGIH ................................................................. 6 4.2.1 Other Flux Considerations................................. 25
2.4.9 EMPF ................................................................... 6 4.2.2 Types of Fluxes.................................................. 27
3.0 GENERAL REQUIREMENTS................................... 6 4.3 Solder Paste........................................................ 31
3.0.1 PWBs.................................................................... 6 4.3.1 Solder Powder.................................................... 31
3.1 Order of Precedence ............................................ 6 4.3.2 Particle Shape Effects ........................................ 31
3.1.1 Conflict................................................................. 6 4.3.3 Solder Particle Size Effects ............................... 31
3.1.2 Specialized Processes and Technologies ........... 6 4.3.4 Oxide Content in Solder Paste .......................... 32
3.2 Terms and Definitions.......................................... 6 4.3.5 Metals Content .................................................. 32
3.2.1 Manufacturer (Assembler) ................................... 6 4.3.6 Paste Viscosity ................................................... 32
3.2.2 Objective Evidence .............................................. 7 4.3.7 Determination of Correct Paste Volume ........... 32
3.2.3 Proficiency............................................................ 7 4.4 Solder Preforms ................................................. 33
3.2.4 Supplier ............................................................... 7 4.5 Cleaning Agents................................................. 33
3.2.5 User ...................................................................... 7 4.6 Polymeric Coatings............................................ 33
3.2.6 Process Indicator.................................................. 7 4.6.1 Temporary Maskants.......................................... 33
3.2.7 Disposition ........................................................... 7 4.6.2 Conformal Coating and Encapsulants............... 34
3.3 Requirements Flowdown ..................................... 7 4.6.3 Spacers (Permanent and Temporary) ................ 36
3.4 Material and Process Compatibility .................... 7 4.7 Adhesives ........................................................... 36
3.5 Personnel Proficiency .......................................... 8 4.8 Chemical Strippers............................................. 37
3.6 ESD ...................................................................... 8 4.9 Heat Shrinkable Soldering Devices .................. 37

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IPC-HDBK-001 March 1998

4.9.1 Encapsulated Soldering Devices ....................... 37 6.3 Mounting to Terminals ...................................... 51

4.9.2 Selection Criteria ............................................... 38 6.3.1 Bifurcated (Slotted) and Turret Terminals ........ 51
4.9.3 Installation Guidelines ....................................... 38 6.3.2 Hook Terminals.................................................. 53
4.9.4 Inspection Guidelines ........................................ 38 6.3.3 Pierced or Perforated Terminals ........................ 53
6.3.4 Cup and Hollow Cylindrical Terminal
5.0 COMPONENTS ..................................................... 40
Soldering ............................................................ 53
5.0.1 Plastic/Ceramic Components............................. 40
6.3.5 General Requirements for Mounting to
5.0.2 Sealed Switches/Relays ..................................... 40 Terminals............................................................ 54
5.0.3 Solvent Resistance ............................................. 40 6.4 Surface Mounting of Components .................... 56
5.0.4 Alternative PWB Surface Finishes.................... 40 6.4.1 Placement Guidelines (Formerly Appendix
5.0.5 Silver Coated Leads........................................... 40 B from the Standard)......................................... 56
5.0.6 Glass Shields in Diodes..................................... 41 6.4.2 Surface Mount Device Lead Forming .............. 57
5.0.7 Desiccants .......................................................... 41 6.4.3 Small Devices with Two Terminations ............. 59
5.0.8 Galvanic Compatibility Concerns for 6.4.4 Leaded Component Body Positioning .............. 59
Electronic Assemblies........................................ 41 6.5 Through-Hole Mounting.................................... 60
5.0.9 Storage................................................................ 41 6.5.1 Placement Accuracy (Formerly Appendix
5.1 Solder Terminals ................................................ 42 C from the Standard)......................................... 60
5.1.1 Slot to Wire Size................................................ 42 6.5.2 Lead Forming Requirements ............................. 62
5.1.2 Barrier Layers .................................................... 42 6.5.3 Lead Termination Requirements ....................... 63
5.2 Solderability ....................................................... 42 6.5.4 Meniscus Spacing and Trimming...................... 64
5.2.1 Solderability Testing of Ceramic Boards .......... 43 7.0 ASSEMBLY SOLDERING PROCESS ................... 64
5.3 Solder Purity Maintenance ................................ 43 7.1 General ............................................................... 64
5.3.1 Reasons for Testing .......................................... 43 7.1.1 Handling of Parts............................................... 64
5.3.2 Testing Frequency ............................................. 43 7.1.2 Preheating........................................................... 64
5.3.3 Contamination Sources ...................................... 43 7.1.3 Hold Down of Surface Mount Leads................ 64
5.3.4 Solder Pot Contamination.................................. 45 7.1.4 Cooling............................................................... 64
5.3.5 Effect of Contamination on Solder Process...... 45 7.1.5 Lead Trimming .................................................. 64
5.3.6 Resolving Contamination Problems .................. 45 7.2 Manual/Hand (Non-Reflow) Soldering ............. 65
5.3.7 Tin Depletion .................................................... 45 7.2.1 Flux Application ................................................ 65
5.4 Solderability Maintenance ................................. 45 7.2.2 Solder Application ............................................. 65
5.4.1 Gold Removal .................................................... 46 7.2.3 Heat Sinks ......................................................... 66
5.4.2 Rework of Non-Solderable Parts ...................... 46 7.2.4 Solder Wicking .................................................. 66
6.0 ASSEMBLY PROCESSES ..................................... 47 7.3 Machine (Immersion Non-Reflow)
6.1 General Part Mounting Requirements............... 47 Soldering ............................................................ 66

6.1.1 7.3.1 Machine Controls............................................... 66

Part Markings and Reference Designations...... 47
6.1.2 7.3.2 Drying/Degassing............................................... 66
Lead Forming..................................................... 47
6.1.3 7.3.3 Holding Fixtures and Materials......................... 67
Wire and Cable Preparation .............................. 48
6.1.4 7.3.4 Flux Application ................................................ 67
Hole Obstruction................................................ 49
6.1.5 7.3.5 Solder Bath ........................................................ 68
Metal-Cased Component Installation ................ 50
6.1.6 7.4 Reflow Soldering .............................................. 71
Adhesive Coverage Limits ................................ 50
6.2 7.4.0 Reflow Soldering Process.................................. 71
Bifurcated and Turret Terminal Installation...... 50
6.2.1 7.4.1 Reflow Controls ................................................. 79
Shank Discontinuities ........................................ 50
6.2.2 7.4.2 Flux Application ................................................ 79
Flange Discontinuities ....................................... 50
6.2.3 Flared Flange Angles......................................... 50 8.0 CLEANLINESS REQUIREMENTS ......................... 80
6.2.4 Terminal Mounting - Mechanical...................... 51 8.0.1 Historical Perspective on Cleaning ................... 81
6.2.5 Terminal Mounting - Electrical ......................... 51 8.1 Cleaning Process Requirements ........................ 81

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March 1998 IPC-HDBK-001

8.1.1 Cleaner Compatibility........................................ 81 10.1.4 Conformal Coating Inspection ........................ 100

8.1.2 Pre-Soldering Cleanliness Requirements .......... 81 10.2 Encapsulation ................................................... 100
8.1.3 Post-Soldering Cleaning .................................... 82 10.2.1 Application....................................................... 101
8.2 Cleanliness Verification ..................................... 82 10.2.2 Performance Requirements.............................. 101
8.2.1 Visual Inspection................................................ 82 10.2.3 Rework of Encapsulant Material..................... 101
8.2.2 Testing ................................................................ 83 10.2.4 Encapsulant Inspection .................................... 101
8.3 Post-Solder Cleanliness ..................................... 83
11.0 REWORK AND REPAIR ................................... 101
8.3.1 Particulate Matter............................................... 83
11.1 Rework of Unsatisfactory Solder
8.3.2 Flux Residues and Other Ionic or Organic Connections...................................................... 101
Contaminants...................................................... 83
11.2 Repair ............................................................... 102
8.3.3 Cleaning Option................................................. 84
8.3.4 Test for Cleanliness ........................................... 84 11.3 Post Rework/Repair Cleaning ......................... 102
8.3.5 Flux Residues..................................................... 85 12.0 PRODUCT ASSURANCE................................. 102
8.3.6 Ionic Residues - Instrument Method................. 85 12.1 Inspection Methodology .................................. 102
8.3.7 Ionic Residues (Manual Method)...................... 86 12.1.1 Process Verification Inspection........................ 103
8.3.8 SIR...................................................................... 87 12.1.2 Visual Inspection.............................................. 103
8.3.9 Other Contamination.......................................... 87
12.1.3 Sampling Inspection ........................................ 103
8.4 Other Analytical Tests ....................................... 87
12.2 Process Control ................................................ 103
8.4.1 IC Testing........................................................... 87
12.2.0 SPC................................................................... 103
8.4.2 HPLC Testing..................................................... 88
12.2.1 Defect Reduction ............................................. 107
8.4.3 Test for Polyglycols ........................................... 88
12.2.2 Variance Reduction .......................................... 107
8.4.4 GC-MS ............................................................... 88
8.4.5 IR or FT-IR Spectroscopy ................................. 88 13.0 MISCELLANEOUS REQUIREMENTS ............. 107
8.5 Other Guidance on Cleaning............................. 88 13.1 Health and Safety ............................................ 107
8.5.1 Why Clean?........................................................ 89 13.1.1 Government Safety and Health
8.5.2 Cleaning Agent Considerations ......................... 89 Regulations....................................................... 107
8.5.3 Cleaning Agent Delivery Considerations.......... 90 13.1.2 Material Safety Data Sheets ............................ 107
8.5.4 Forms of Cleaning ............................................. 92 13.1.3 Ventilation ........................................................ 107
9.0 ASSEMBLY REQUIREMENTS .............................. 93 13.1.4 Training ............................................................ 107
9.1 Acceptance Requirements.................................. 93 13.2 Special Manufacturing Requirements ............. 107
9.1.1 Corrective Action Limits ................................... 93 13.2.1 Manufacture of Devices Incorporating
9.1.2 Opportunities Determination ............................. 93 Magnetic Windings .......................................... 108
9.2 General Assembly Requirements ...................... 93 13.2.2 High Frequency Applications .......................... 108
9.2.1 PWA Damage..................................................... 93 13.2.3 High Voltage or High Power Applications ..... 108
9.2.2 Markings ............................................................ 93 13.3 Guidance on Requirement Flowdown............. 109
9.2.3 Bow and Twist (Warpage) ................................. 93 APPENDICES ............................................................ 110
9.2.4 Solder Connection.............................................. 93
Appendix A Guidelines for Soldering Tools and
9.2.5 Interfacial Connections (Vias) ........................... 94
Equipment .............................................. 110
9.2.6 Surface Soldering of Leads and
Terminations....................................................... 95 Appendix B Placement Guidelines for Surface
9.2.7 Terminal Soldering............................................. 96 Mount Devices ....................................... 110

10.0 COATING AND ENCAPSULATION ................... 96 Appendix C Placement Guidelines for Through-
Hole Mount Devices .............................. 110
10.1 Conformal Coating ............................................ 96
10.1.1 Application......................................................... 97 Appendix D Material and Process Compatibility
Testing .................................................... 110
10.1.2 Performance Requirements................................ 98
10.1.3 Rework of Conformal Coating.......................... 99 Appendix E Statistical Process Control ..................... 110

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IPC-HDBK-001 March 1998

Figures Figure 6-25 Side Mounting.................................................. 61

Figure 3-1 Thermal Profile of a Soldering Iron Tip ............. 9 Figure 6-26 Vertical Mounting of Freestanding................... 61

Figure 4-1 Phase Diagram for Eutectic Solder ................. 12 Figure 6-27 Typical Configuration of Components
with Dual Non-Axial Leads .............................. 61
Figure 4-2A Eutectic Solder Microstructure......................... 13
Figure 6-28 Mounting of Components with Dual
Figure 4-2B Eutectic Solder Microstructure......................... 13 Non-Axial Leads .............................................. 61
Figure 4-3 Property Changes as a Function of Figure 6-29 End Mounting................................................... 61
Temperature..................................................... 14
Figure 6-30 Mounting with Feet on Standoffs..................... 62
Figure 4-4 Stress Relaxation with Time and
Temperature..................................................... 15 Figure 6-31 Non-Resilient Footed Standoffs....................... 62

Figure 4-5 Cyclical Deformation Leading to Joint Figure 6-32 Acceptable Lead Configurations...................... 62
Failure .............................................................. 15 Figure 6-33 Configuration of Ribbon Leads for
Figure 4-6 Property Change with Strain Rate................... 15 Through-Hole Mounting ................................... 63

Figure 4-7 Properties vs. Thermal Cycle .......................... 16 Figure 6-34 Lead Bends...................................................... 63

Figure 4-8 Properties vs. Vibration.................................... 16 Figure 6-35 Through-Hole Mounting Methods .................... 64

Figure 4-9 Yield Strength Increases with Grain Size........ 16 Figure 7-1 Creating a Thermal Bridge in Hand
Soldering.......................................................... 65
Figure 4-10 Tensile Strength Increases with Grain Size .... 16
Figure 9-1 Solder Wetting and Contact Angles................. 94
Figure 4-11 Total Elongation Decreases as Grain Size
Increases ......................................................... 16 Figure 9-2 Acceptable Interfacial Hole Fill ........................ 95

Figure 4-12 Resistance to Fatigue Decreases as Figure 9-3 Minimum Acceptable Hole Fill ......................... 96
Strain Increases............................................... 16
Figure 4-13 Tin Lead Phase Diagram................................. 21
Figure 4-14 Young’s Equation for the Process of
Tables
Wetting ............................................................. 21
Figure 4-15 Force Wetting Curves ...................................... 27 Table 1-1 Metric Prefixes .................................................... 2
Figure 4-16 Resin Acid Combinations................................. 28 Table 1-2 Conversion Formulae.......................................... 2
Figure 6-1 Heat Sinking Device ........................................ 47 Table 1-3 Requirements by Product Class ......................... 3
Figure 6-2 Lead Forming Forces ...................................... 48 Table 4-1 Common Physical Property Values for
Eutectic or Near Eutectic Tin/Lead Solder........ 13
Figure 6-3 Hand Stripper................................................... 49
Table 4-2 Effect of Temperature on Lap
Figure 6-4 Hole Obstruction .............................................. 50 Shear Strength PSI (Pa) ................................... 14
Figure 6-5 Rolled Flange Discontinuities .......................... 50 Table 4-3 Properties of Some Common Tin-Lead-
Figure 6-6 Flare Angles..................................................... 51 Bismuth Alloys................................................... 17
Figure 6-7 Rolled Flange................................................... 51 Table 4-4 Composition, Alloy Name, and Melting
Figure 6-8 Terminal Mounting Techniques ........................ 52 Point of Indium Alloys ....................................... 18

Figure 6-9 Wire and Lead Wrap Around ........................... 52 Table 4-5 Properties of Some Common High
Temperature Alloys............................................ 18
Figure 6-10 Side Route Connections and Wrap
on Bifurcated Terminal ..................................... 52 Table 4-6 J-STD-006 Solder Forms .................................. 18

Figure 6-11 Top and Bottom Route Terminal Table 4-7 J-STD-006 Flux Types and Designating
Symbols ............................................................ 18
Connection....................................................... 53
Table 4-8 J-STD-006 Flux Percentage Classifications ..... 19
Figure 6-12 Continuous Run Wire Wraps ........................... 54
Table 4-9 Standard Solder Powders ................................. 19
Figure 6-13 Hook Terminal Connections............................. 54
Table 4-10 Description System for Solid Solder ................. 19
Figure 6-14 Pierced or Perforated Terminal Wire Wrap ..... 55
Table 4-11 Intermetallic Compounds and Diffusion
Figure 6-15 Insulation Clearance Measurement................. 55 Constants for Near-Eutectic SnPb Solders ...... 22
Figure 6-16 Service Loop for Lead Wiring.......................... 55 Table 4-12 Temperature Constants ai of Coefficient of
Figure 6-17 Stress Relief Examples ................................... 56 Thermal Expansion (ppm/3C)
of Some Electronic Packaging Materials .......... 24
Figure 6-18 Wire Wrap ........................................................ 56
Table 4-13a Flux Classifications per J-STD-004,
Figure 6-19 Wire Wrap Around Terminal Post .................... 56
Amendment 1.................................................... 26
Figure 6-20 Wire Wrap Around Terminal Post .................... 56
Table 4-13b Guidelines for Cleaning by Flux Type............... 26
Figure 6-21 Surface Mount Device Lead Forming.............. 58
Table 4-14 Flux Nomenclature Cross Reference................ 27
Figure 6-22 Maximum Toe Curl........................................... 58
Table 4-15 Some Acids and Salts Used as Activators in
Figure 6-23 Surface Mounted and Butt Mounted DIPs ...... 59 Fluxes................................................................ 29
Figure 6-24 Component Bridging ........................................ 60 Table 4-16 Common Activators Used for WSF................... 30

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March 1998 IPC-HDBK-001

Table 4-17 Mesh Size vs. Particle size for Table 7-7 Advantages and Disadvantages of Vapor
Solder Powders Used in Solder Paste ............. 31 Phase Soldering................................................ 74
Table 4-18 Recommended Viscosities of Solder Pastes.... 32 Table 7-8 Thermal Data for Electronic Materials .............. 74
Table 4-19 Effects of Parameters on Viscosity ................... 32 Table 7-9 Problems and Solutions in Vapor Phase
Table 4-20 Coating Designators and Thickness Range ..... 34 Soldering ........................................................... 75

Table 4-21 Conformal Coating Characteristics ................... 35 Table 7-10 IR Radiation ...................................................... 75

Table 5-1 Levels of Allowable Solder Impurities for Table 7-11 Advantage and Disadvantages of IR
Sn60Pb40 and Sn63Pb37 Solders Soldering ........................................................... 75
(Weight %) ........................................................ 44 Table 7-12 Characteristics of Infrared Sources for SMT
Table 6-1 Lead Forming Troubleshooting Chart ............... 48 Soldering ........................................................... 76

Table 6-2 Damaged Strand Limits .................................... 48 Table 7-13 Comparison of Laser Soldering Systems ......... 78

Table 7-1 Baking Times and Temperatures ...................... 66 Table 9-1 PTHs with Component Leads Minimum
Acceptable Conditions ...................................... 96
Table 7-2 Maximum Storage Times After Bakeout ........... 67
Table 9-2 Terminal Soldering Requirements..................... 96
Table 7-3 Common Screen Parameters ........................... 72
Table 10-1 Preferred Conformal Coating Removal
Table 7-4 Common Screening Problems and Methods .......................................................... 100
Solutions ........................................................... 73
Table 12-1 d2 Values......................................................... 104
Table 7-5 Needle Sizes ..................................................... 73
Table 12-2 A2, D3, D4 Values............................................ 105
Table 7-6 Physical Properties of Vapor Phase Reflow
Fluids................................................................. 74

vii
March 1998 IPC-HDBK-001

Handbook and Guide to the Requirements

for Soldered Electrical and Electronic Assemblies
to Supplement ANSI/J-STD-001B

PREAMBLE/FOREWORD throughout the handbook and are defined in the Acronym

This handbook is a companion reference to J-STD-001B. Index at the end of the handbook.
With the present transition from prescriptive ‘‘how to’’
specifications to performance-based standards, much of the 1.0 SCOPE
tutorial information that was provided in J-STD-001A was The Standard sets forth practices and requirements for the
removed. The intent of this handbook is to capture this assembly, soldering processes, soldered connections, clean-
‘‘how to’’ information and give more background for the ing, coating/encapsulation, rework, and verification of sol-
specification limits and how they were derived. In addition, dered electrical and electronic assemblies. Practices are
other supporting information is provided to give a broader accepted industry methods and are provided in the Stan-
understanding of the process considerations needed for the
dard for guidance only; they are not mandatory. Require-
production of acceptable hardware. The target reader of
ments are mandatory conditions essential for producing
this handbook is a process or manufacturing engineer.
acceptable products in accordance with the Standard. The
Standard does not apply to non-electrical soldering.
FORMAT
The section and paragraph numbers in this handbook refer 1.1 Purpose The Standard describes materials, methods,
and correspond to the section and paragraph numbers in and verification criteria that, when applied as recom-
J-STD-001B, although subparagraph numbers may not cor- mended or required, will produce quality soldered electri-
respond exactly. There are no appendices in this handbook. cal and electronic assemblies. The intent of the Standard is
Information concerning the appendices in J-STD-001B is to implement control over processes rather than depending
either addressed in the body of this handbook or, in the
on end-item inspection to determine product quality. The
case of Appendix D, covered more thoroughly in another
Standard does not exclude any acceptable process used to
document. An appendices guide is included at the end of
make the electrical connections, as long as the methods
13.0, which links the topics discussed in the appendices of
used will produce completed solder joints conforming to
J-STD-001B to the appropriate supplemental information.
the acceptability requirements of the Standard.
Where used verbatim, J-STD-001B specification text is
identified by small case capital letters, with must and shall 1.2 Classification J-STD-001B RECOGNIZES THAT ELEC-
annotated in bold. For the purposes of the handbook, a TRICAL AND ELECTRONIC ASSEMBLIES ARE SUBJECT TO CLAS-
capitalized ‘‘Standard’’ in the handbook text refers to SIFICATIONS BY INTENDED END-ITEM USE. THREE GENERAL
J-STD-001B. It should also be noted that any references in END-PRODUCT CLASSES HAVE BEEN ESTABLISHED TO REFLECT
the handbook text (not text taken from the Standard) refer DIFFERENCES IN PRODUCIBILITY, COMPLEXITY, FUNCTIONAL
to sections, tables, and figures in the handbook (see PERFORMANCE REQUIREMENTS, AND VERIFICATION
Example 1). References in the handbook text to sections, (INSPECTION/TEST) FREQUENCY. IT SHOULD BE RECOGNIZED
tables, and figures in the Standard will be followed by ‘‘of THAT THERE MAY BE OVERLAPS OF EQUIPMENT BETWEEN
the Standard’’ (see Example 2). References in the text CLASSES.
taken verbatim from the Standard reference sections,
tables, and figures in the Standard, unless otherwise noted. THE USER (the individual, organization, company, or agency
responsible for the procurement of electrical/electronic
Example 1: hardware, having the authority to define the class of equip-
For more information on lead trimming, see 5.2.0.5. ment and any variation or restrictions to the requirements
Example 2: of this Standard) AND MANUFACTURER (the individual, orga-
nization, or company responsible for the procurement of
For more information on defects, see Table 11-1 of
material and components, as well as all assembly processes
the Standard.
and verification operations necessary to ensure full compli-
Endnotes are included at the end of some sections to list ance of assemblies to the Standard) MUST AGREE ON THE
references included in that section. Acronyms are used CLASS TO WHICH THE PRODUCT BELONGS.