ESP32­WROVER

Datasheet

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Version 2.7
Espressif Systems
Copyright © 2023

www.espressif.com
About This Document
This document provides the specifications for the ESP32-WROVER module.

Document Updates
Please always refer to the latest version on https://www.espressif.com/en/support/download/documents.

Revision History
For revision history of this document, please refer to the last page.

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Certification
Download certificates for Espressif products from www.espressif.com/en/certificates.

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Contents

1 Overview 6

2 Pin Definitions 8
2.1 Pin Layout 8
2.2 Pin Description 9
2.3 Strapping Pins 10

3 Functional Description 12
3.1 CPU and Internal Memory 12
3.2 External Flash and SRAM 12
3.3 Crystal Oscillators 12
3.4 RTC and Low-Power Management 12

4 Peripherals and Sensors 14

5 Electrical Characteristics 15
5.1 Absolute Maximum Ratings 15
5.2 Recommended Operating Conditions 15
5.3 DC Characteristics (3.3 V, 25 °C) 15
5.4 Wi-Fi Radio 16
5.5 Bluetooth LE Radio 17
5.5.1 Receiver 17
5.5.2 Transmitter 17

6 Schematics 18

7 Peripheral Schematics 19

8 Physical Dimensions 20

9 Recommended PCB Land Pattern 21

10 Dimensions of External Antenna Connector 22

11 Product Handling 23
11.1 Storage Conditions 23
11.2 Electrostatic Discharge (ESD) 23
11.3 Reflow Profile 23
11.4 Ultrasonic Vibration 24

12 Related Documentation and Resources 25

Revision History 26

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List of Tables
1 ESP32-WROVER Ordering Information 6
2 ESP32-WROVER Specifications 7
3 Pin Definitions 9
4 Strapping Pins 10
5 Parameter Descriptions of Setup and Hold Times for the Strapping Pins 11
6 Absolute Maximum Ratings 15
7 Recommended Operating Conditions 15
8 DC Characteristics (3.3 V, 25 °C) 15
9 Wi-Fi Radio Characteristics 16
10 Receiver Characteristics – Bluetooth LE 17
11 Transmitter Characteristics – Bluetooth LE 17

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List of Figures
1 Pin Layout of ESP32-WROVER (Top View) 8
2 Setup and Hold Times for the Strapping Pins 11
3 Schematics of ESP32-WROVER 18
4 Peripheral Schematics of ESP32-WROVER 19
5 Physical Dimensions of ESP32-WROVER 20
6 Recommended PCB Land Pattern of ESP32-WROVER 21
7 Dimensions of External Antenna Connector 22
8 Reflow Profile 23

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1 Overview

1 Overview
ESP32-WROVER is a powerful, generic Wi-Fi + Bluetooth + Bluetooth LE MCU module that targets a wide
variety of applications, ranging from low-power sensor networks to the most demanding tasks, such as voice
encoding, music streaming and MP3 decoding.

This module is provided in two versions: one with a PCB antenna, the other with an external antenna connector.
ESP32-WROVER features a 4 MB external SPI flash and an additional 8 MB SPI Pseudo static RAM
(PSRAM).

The ordering information on the two variants of ESP32-WROVER is listed as follows:

Table 1: ESP32­WROVER Ordering Information

Module Chip embedded Flash PSRAM Dimensions (mm)

ESP32-WROVER (PCB antenna)
ESP32-D0WDQ6 4 MB 8 MB 18.0 × 31.4 × 3.3
ESP32-WROVER (External antenna connector)

For detailed ordering information, please see ESP Product Selector. For dimensions of the external antenna
connector, please see Chapter 10. The information in this datasheet is applicable to both modules.

At the core of this module is the ESP32-D0WDQ6 chip*. The chip embedded is designed to be scalable and
adaptive. There are two CPU cores that can be individually controlled, and the CPU clock frequency is adjustable
from 80 MHz to 240 MHz. The chip also has a low-power coprocessor that can be used instead of the CPU to
save power while performing tasks that do not require much computing power, such as monitoring of
peripherals. ESP32 integrates a rich set of peripherals, ranging from capacitive touch sensors, SD card interface,
Ethernet, high-speed SPI, UART, I2S, and I2C.

Note:
* For details on the part numbers of the ESP32 family of chips, please refer to the document ESP32 Datasheet.

The integration of Bluetooth® , Bluetooth LE and Wi-Fi ensures that a wide range of applications can be targeted,
and that the module is all-around: using Wi-Fi allows a large physical range and direct connection to the Internet
through a Wi-Fi router, while using Bluetooth allows the user to conveniently connect to the phone or broadcast
low energy beacons for its detection. The sleep current of the ESP32 chip is less than 5 µA, making it suitable for
battery powered and wearable electronics applications. The module supports a data rate of up to 150 Mbps,
and 20 dBm output power at the antenna to ensure the widest physical range. As such the module does offer
industry-leading specifications and the best performance for electronic integration, range, power consumption,
and connectivity.

The operating system chosen for ESP32 is freeRTOS with LwIP; TLS 1.2 with hardware acceleration is built in as
well. Secure (encrypted) over the air (OTA) upgrade is also supported, so that users can upgrade their products
even after their release, at minimum cost and effort.

Table 2 provides the specifications of ESP32-WROVER.

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1 Overview

Table 2: ESP32­WROVER Specifications

Categories Items Specifications

Certification RF certification See certificates for ESP32-WROVER
Wi-Fi certification Wi-Fi Alliance
Bluetooth certification BQB
Green certification RoHS/REACH
Test Reliablity HTOL/HTSL/uHAST/TCT/ESD
802.11 b/g/n (802.11n up to 150 Mbps)
Wi-Fi Protocols A-MPDU and A-MSDU aggregation and 0.4 µs guard in-
terval support
Center frequency range of oper-
2412 ~ 2484 MHz
ating channel
Protocols Bluetooth v4.2 BR/EDR and Bluetooth LE specification
NZIF receiver with –97 dBm sensitivity
Bluetooth Radio Class-1, class-2 and class-3 transmitter
AFH
Audio CVSD and SBC
SD card, UART, SPI, SDIO, I2C, LED PWM, Motor PWM,
I2S, IR, pulse counter, GPIO, capacitive touch sensor,
Module interfaces
ADC, DAC, TWAI® (compatible with ISO 11898-1, i.e.
CAN Specification 2.0)
Integrated crystal 40 MHz crystal
Integrated SPI flash 4 MB
Integrated PSRAM 8 MB
Hardware
Operating voltage/Power supply 2.3 V ~ 3.6 V
Operating current Average: 80 mA
Minimum current delivered by
500 mA
power supply
Recommended operating ambi-
–40 °C ~ 85 °C
ent temperature
Package size (18.00±0.10) mm × (31.40±0.10) mm × (3.30±0.10) mm
Moisture sensitivity level (MSL) Level 3

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2 Pin Definitions

2 Pin Definitions

2.1 Pin Layout

Keepout Zone

1 GND GND 38

2 VDD33 IO23 37

3 EN IO22 36

4 SENSOR_VP TXD0 35

5 SENSOR_VN RXD0 34

6 IO34 IO21 33

7 IO35 NC 32
39 GND
8 IO32 IO19 31

9 IO33 IO18 30

10 IO25 IO5 29

11 IO26 NC 28

12 IO27 NC 27

13 IO14 IO4 26

14 IO12 IO0 25

15 GND IO2 24

16 IO13 IO15 23

17 SD2 SD1 22

18 SD3 SD0 21

19 CMD CLK 20

Figure 1: Pin Layout of ESP32­WROVER (Top View)

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2 Pin Definitions

2.2 Pin Description

ESP32-WROVER has 38 pins. See pin definitions in Table 3.

Table 3: Pin Definitions

Name No. Type Function

GND 1 P Ground
3V3 2 P Power supply
EN 3 I Module-enable signal. Active high.
SENSOR_VP 4 I GPIO36, ADC1_CH0, RTC_GPIO0
SENSOR_VN 5 I GPIO39, ADC1_CH3, RTC_GPIO3
IO34 6 I GPIO34, ADC1_CH6, RTC_GPIO4
IO35 7 I GPIO35, ADC1_CH7, RTC_GPIO5
GPIO32, XTAL_32K_P (32.768 kHz crystal oscillator input), ADC1_CH4,
IO32 8 I/O
TOUCH9, RTC_GPIO9
GPIO33, XTAL_32K_N (32.768 kHz crystal oscillator output),
IO33 9 I/O
ADC1_CH5, TOUCH8, RTC_GPIO8
IO25 10 I/O GPIO25, DAC_1, ADC2_CH8, RTC_GPIO6, EMAC_RXD0
IO26 11 I/O GPIO26, DAC_2, ADC2_CH9, RTC_GPIO7, EMAC_RXD1
IO27 12 I/O GPIO27, ADC2_CH7, TOUCH7, RTC_GPIO17, EMAC_RX_DV
GPIO14, ADC2_CH6, TOUCH6, RTC_GPIO16, MTMS, HSPICLK,
IO14 13 I/O
HS2_CLK, SD_CLK, EMAC_TXD2
GPIO12, ADC2_CH5, TOUCH5, RTC_GPIO15, MTDI, HSPIQ,
IO12 1 14 I/O
HS2_DATA2, SD_DATA2, EMAC_TXD3
GND 15 P Ground
GPIO13, ADC2_CH4, TOUCH4, RTC_GPIO14, MTCK, HSPID,
IO13 16 I/O
HS2_DATA3, SD_DATA3, EMAC_RX_ER
2
SHD/SD2 17 I/O GPIO9, SD_DATA2, SPIHD, HS1_DATA2, U1RXD
2
SWP/SD3 18 I/O GPIO10, SD_DATA3, SPIWP, HS1_DATA3, U1TXD
2
SCS/CMD 19 I/O GPIO11, SD_CMD, SPICS0, HS1_CMD, U1RTS
2
SCK/CLK 20 I/O GPIO6, SD_CLK, SPICLK, HS1_CLK, U1CTS
2
SDO/SD0 21 I/O GPIO7, SD_DATA0, SPIQ, HS1_DATA0, U2RTS
2
SDI/SD1 22 I/O GPIO8, SD_DATA1, SPID, HS1_DATA1, U2CTS
GPIO15, ADC2_CH3, TOUCH3, MTDO, HSPICS0, RTC_GPIO13,
IO15 23 I/O
HS2_CMD, SD_CMD, EMAC_RXD3
GPIO2, ADC2_CH2, TOUCH2, RTC_GPIO12, HSPIWP, HS2_DATA0,
IO2 24 I/O
SD_DATA0
GPIO0, ADC2_CH1, TOUCH1, RTC_GPIO11, CLK_OUT1,
IO0 25 I/O
EMAC_TX_CLK
GPIO4, ADC2_CH0, TOUCH0, RTC_GPIO10, HSPIHD, HS2_DATA1,
IO4 26 I/O
SD_DATA1, EMAC_TX_ER
NC1 27 - -
NC2 28 - -
IO5 29 I/O GPIO5, VSPICS0, HS1_DATA6, EMAC_RX_CLK
IO18 30 I/O GPIO18, VSPICLK, HS1_DATA7

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2 Pin Definitions

Name No. Type Function

IO19 31 I/O GPIO19, VSPIQ, U0CTS, EMAC_TXD0
NC 32 - -
IO21 33 I/O GPIO21, VSPIHD, EMAC_TX_EN
RXD0 34 I/O GPIO3, U0RXD, CLK_OUT2
TXD0 35 I/O GPIO1, U0TXD, CLK_OUT3, EMAC_RXD2
IO22 36 I/O GPIO22, VSPIWP, U0RTS, EMAC_TXD1
IO23 37 I/O GPIO23, VSPID, HS1_STROBE
GND 38 P Ground

Notice:

1. GPIO12 is internally pulled high in the module and is not recommended for use as a touch pin.

2. Pins SCK/CLK, SDO/SD0, SDI/SD1, SHD/SD2, SWP/SD3 and SCS/CMD, namely, GPIO6 to GPIO11 are con-
nected to the SPI flash integrated on the module and are not recommended for other uses.

2.3 Strapping Pins

ESP32 has five strapping pins, which can be seen in Chapter 6 Schematics:

• MTDI

• GPIO0

• GPIO2

• MTDO

• GPIO5

Software can read the values of these five bits from register “GPIO_STRAPPING”.

During the chip’s system reset release (power-on-reset, RTC watchdog reset and brownout reset), the latches of
the strapping pins sample the voltage level as strapping bits of “0” or “1”, and hold these bits until the chip is
powered down or shut down. The strapping bits configure the device’s boot mode, the operating voltage of
VDD_SDIO and other initial system settings.

Each strapping pin is connected to its internal pull-up/pull-down during the chip reset. Consequently, if a
strapping pin is unconnected or the connected external circuit is high-impedance, the internal weak
pull-up/pull-down will determine the default input level of the strapping pins.

To change the strapping bit values, users can apply the external pull-down/pull-up resistances, or use the host
MCU’s GPIOs to control the voltage level of these pins when powering on ESP32.

After reset release, the strapping pins work as normal-function pins.

Refer to Table 4 for a detailed boot-mode configuration by strapping pins.

Table 4: Strapping Pins

Voltage of Internal LDO (VDD_SDIO)

Pin Default 3.3 V 1.8 V

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2 Pin Definitions

MTDI Pull-down 0 1
Booting Mode
Pin Default SPI Boot Download Boot
GPIO0 Pull-up 1 0
GPIO2 Pull-down Don’t-care 0
Enabling/Disabling Debugging Log Print over U0TXD During Booting
Pin Default U0TXD Active U0TXD Silent
MTDO Pull-up 1 0
Timing of SDIO Slave
FE Sampling FE Sampling RE Sampling RE Sampling
Pin Default FE Output RE Output FE Output RE Output
MTDO Pull-up 0 0 1 1
GPIO5 Pull-up 0 1 0 1

Note:
• Firmware can configure register bits to change the settings of ”Voltage of Internal LDO (VDD_SDIO)” and ”Timing
of SDIO Slave” after booting.

• The MTDI is internally pulled high in the module, as the flash and SRAM in ESP32-WROVER only support a power
voltage of 1.8 V (output by VDD_SDIO).

The illustration below shows the setup and hold times for the strapping pins before and after the CHIP_PU signal
goes high. Details about the parameters are listed in Table 5.

t0 t1

VIL_nRST
CHIP_PU

VIH

Strapping pin

Figure 2: Setup and Hold Times for the Strapping Pins

Table 5: Parameter Descriptions of Setup and Hold Times for the Strapping Pins

Parameters Description Min. Unit

t0 Setup time before CHIP_PU goes from low to high 0 ms
t1 Hold time after CHIP_PU goes high 1 ms

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3 Functional Description

3 Functional Description
This chapter describes the modules and functions integrated in ESP32-WROVER.

3.1 CPU and Internal Memory

ESP32-D0WDQ6 contains two low-power Xtensa® 32-bit LX6 microprocessors. The internal memory
includes:

• 448 KB of ROM for booting and core functions.

• 520 KB of on-chip SRAM for data and instructions.

• 8 KB of SRAM in RTC, which is called RTC FAST Memory and can be used for data storage; it is accessed
by the main CPU during RTC Boot from the Deep-sleep mode.

• 8 KB of SRAM in RTC, which is called RTC SLOW Memory and can be accessed by the co-processor
during the Deep-sleep mode.

• 1 Kbit of eFuse: 256 bits are used for the system (MAC address and chip configuration) and the remaining
768 bits are reserved for customer applications, including flash-encryption and chip-ID.

3.2 External Flash and SRAM

ESP32 supports multiple external QSPI flash and SRAM chips. More details can be found in Chapter SPI in the
ESP32 Technical Reference Manual. ESP32 also supports hardware encryption/decryption based on AES to
protect developers’ programs and data in flash.

ESP32 can access the external QSPI flash and SRAM through high-speed caches.

• The external flash can be mapped into CPU instruction memory space and read-only memory space
simultaneously.

– When external flash is mapped into CPU instruction memory space, up to 11 MB + 248 KB can be
mapped at a time. Note that if more than 3 MB + 248 KB are mapped, cache performance will be
reduced due to speculative reads by the CPU.

– When external flash is mapped into read-only data memory space, up to 4 MB can be mapped at a
time. 8-bit, 16-bit and 32-bit reads are supported.

• External SRAM can be mapped into CPU data memory space. Up to 4 MB can be mapped at a time.
8-bit, 16-bit and 32-bit reads and writes are supported.

ESP32-WROVER integrates a 4 MB of external SPI flash and an 8 MB PSRAM for more memory space.

3.3 Crystal Oscillators

The module uses a 40-MHz crystal oscillator.

3.4 RTC and Low­Power Management

With the use of advanced power-management technologies, ESP32 can switch between different power
modes.

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3 Functional Description

For details on ESP32’s power consumption in different power modes, please refer to section ”RTC and
Low-Power Management” in ESP32 Datasheet.

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4 Peripherals and Sensors

4 Peripherals and Sensors

Please refer to Section Peripherals and Sensors in ESP32 Datasheet.

Note:

1. GPIO12 is internally pulled high in the module and is not recommended for use as a touch pin.

2. External connections can be made to any GPIO except for GPIOs in the range 6-11, 16, or 17. GPIOs 6-11 are
connected to the module’s integrated SPI flash and PSRAM. GPIOs 16 and 17 are connected to the module’s
integrated PSRAM. For details, please see Chapter 6 Schematics.

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5 Electrical Characteristics

5 Electrical Characteristics

5.1 Absolute Maximum Ratings

Stresses beyond the absolute maximum ratings listed in the table below may cause permanent damage to the
device. These are stress ratings only, and do not refer to the functional operation of the device that should follow
the recommended operating conditions.

Table 6: Absolute Maximum Ratings

Symbol Parameter Min Max Unit

VDD33 Power supply voltage –0.3 3.6 V
1
Ioutput Cumulative IO output current - 1,100 mA
Tstore Storage temperature –40 105 °C

1. The module worked properly after a 24-hour test in ambient temperature at 25 °C, and the IOs in three domains
(VDD3P3_RTC, VDD3P3_CPU, VDD_SDIO) output high logic level to ground. Please note that pins occupied by flash
and/or PSRAM in the VDD_SDIO power domain were excluded from the test.
2. Please see Appendix IO_MUX of ESP32 Datasheet for IO’s power domain.

5.2 Recommended Operating Conditions

Table 7: Recommended Operating Conditions

Symbol Parameter Min Typical Max Unit

VDD33 - 2.3 3.3 3.6 V
IV DD Current delivered by external power supply 0.5 - - A
T Operating ambient temperature –40 - 85 °C

5.3 DC Characteristics (3.3 V, 25 °C)

Table 8: DC Characteristics (3.3 V, 25 °C)

Symbol Parameter Min Typ Max Unit

CIN Pin capacitance - 2 - pF
1 1
VIH High-level input voltage 0.75×VDD - VDD +0.3 V
1
VIL Low-level input voltage –0.3 - 0.25×VDD V
IIH High-level input current - - 50 nA
IIL Low-level input current - - 50 nA
VOH High-level output voltage 0.8×VDD1 - - V
VOL Low-level output voltage - - 0.1×VDD1 V
High-level source current VDD3P3_CPU power domain 1, 2 - 40 - mA
1 1, 2
(VDD = 3.3 V, VOH >= 2.64 V, VDD3P3_RTC power domain - 40 - mA
IOH
output drive strength set to the
VDD_SDIO power domain 1, 3
- 20 - mA
maximum)

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5 Electrical Characteristics

Symbol Parameter Min Typ Max Unit

Low-level sink current
IOL (VDD1 = 3.3 V, VOL = 0.495 V, - 28 - mA
output drive strength set to the maximum)
RP U Resistance of internal pull-up resistor - 45 - kΩ
RP D Resistance of internal pull-down resistor - 45 - kΩ
VIL_nRST Low-level input voltage of CHIP_PU to shut down the chip - - 0.6 V

Notes:

1. Please see Appendix IO_MUX of ESP32 Datasheet for IO’s power domain. VDD is the I/O voltage for a particular power
domain of pins.
2. For VDD3P3_CPU and VDD3P3_RTC power domain, per-pin current sourced in the same domain is gradually reduced
from around 40 mA to around 29 mA, VOH >=2.64 V, as the number of current-source pins increases.
3. Pins occupied by flash and/or PSRAM in the VDD_SDIO power domain were excluded from the test.

5.4 Wi­Fi Radio

Table 9: Wi­Fi Radio Characteristics

Parameter Condition Min Typical Max Unit

Center frequency range of oper- - 2412 - 2484 MHz
note1
ating channel
Output impedance note2 - - See note 2 - Ω
note3
TX power 11n, MCS7 12 13 14 dBm
11b mode 17.5 18.5 20 dBm
Sensitivity 11b, 1 Mbps - –98 - dBm
11b, 11 Mbps - –89 - dBm
11g, 6 Mbps - –92 - dBm
11g, 54 Mbps - –74 - dBm
11n, HT20, MCS0 - –91 - dBm
11n, HT20, MCS7 - –71 - dBm
11n, HT40, MCS0 - –89 - dBm
11n, HT40, MCS7 - –69 - dBm
Adjacent channel rejection 11g, 6 Mbps - 31 - dB
11g, 54 Mbps - 14 - dB
11n, HT20, MCS0 - 31 - dB
11n, HT20, MCS7 - 13 - dB
1. Device should operate in the center frequency range allocated by regional regulatory authorities. Target center
frequency range is configurable by software.
2. For the modules that use external antennas, the output impedance is 50 Ω. For other modules without external
antennas, users do not need to concern about the output impedance.
3. Target TX power is configurable based on device or certification requirements.

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5 Electrical Characteristics

5.5 Bluetooth LE Radio

5.5.1 Receiver

Table 10: Receiver Characteristics – Bluetooth LE

Parameter Conditions Min Typ Max Unit

Sensitivity @30.8% PER - - –97 - dBm
Maximum received signal @30.8% PER - 0 - - dBm
Co-channel C/I - - +10 - dB
F = F0 + 1 MHz - –5 - dB
F = F0 – 1 MHz - –5 - dB
F = F0 + 2 MHz - –25 - dB
Adjacent channel selectivity C/I
F = F0 – 2 MHz - –35 - dB
F = F0 + 3 MHz - –25 - dB
F = F0 – 3 MHz - –45 - dB
30 MHz ~ 2000 MHz –10 - - dBm
2000 MHz ~ 2400 MHz –27 - - dBm
Out-of-band blocking performance
2500 MHz ~ 3000 MHz –27 - - dBm
3000 MHz ~ 12.5 GHz –10 - - dBm
Intermodulation - –36 - - dBm

5.5.2 Transmitter

Table 11: Transmitter Characteristics – Bluetooth LE

Parameter Conditions Min Typ Max Unit

RF transmit power - - 0 - dBm
Gain control step - - 3 - dBm
RF power control range - –12 - +9 dBm
F = F0 ± 2 MHz - –52 - dBm
Adjacent channel transmit power F = F0 ± 3 MHz - –58 - dBm
F = F0 ± > 3 MHz - –60 - dBm
∆ f 1avg - - - 265 kHz
∆ f 2max - 247 - - kHz
∆ f 2avg /∆ f 1avg - - –0.92 - -
ICFT - - –10 - kHz
Drift rate - - 0.7 - kHz/50 µs
Drift - - 2 - kHz

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 Espressif Systems 5 4 3 2 1

6 Schematics
6 Schematics
D D

ESP32 Module:
with 1.8V Flash & SRAM Pin.1
GND
Pin.15
GND
Pin.38
GND
GND
The BLUE netname means 1.8V. GND

D1 GND GND
GND GND Pin.2 Pin.16 Pin.37
ESD3.3V88D-LCDN

3
U1 VDD33 IO13 IO23
The values of C1 and C2 vary with VDD33

GND

GND XOUT
GPIO13 GPIO23
the selection of a crystal.
C1 C2

XIN
22pF/6.3V(10%) 22pF/6.3V(10%)
Pin.3 Pin.17 Pin.36
VDD33 CHIP_PU/EN SD2 IO22

2
CHIP_PU SHD/SD2 GPIO22
C3
GND
100pF/6.3V(10%) GND
R1 20K(5%) 40MHz+/-10ppm
VDD33 Pin.4 Pin.18 Pin.35
GND GPIO21
C6 C5 U0TXD
SENSOR_VP SD3 TXD0
U0RXD SENSOR_VP SWP/SD3 U0TXD
C9
10nF/6.3V(10%) 3.3nF/6.3V(10%) GPIO22
0.1uF/6.3V(10%) GPIO19
VDD33 GND
GND C4 Pin.5 Pin.19 Pin.34

49

48
47
46
45
44
43
42
41
40
39
38
37
VDD33 SENSOR_VN CMD RXD0
IPEX
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R14 0R(5%)/NC C13 C12 C11 C10 0.1uF/6.3V(10%) SENSOR_VN SCS/CMD U0RXD
C 1 C

GND

CAP1
CAP2
VDDA
XTAL_P
XTAL_N
VDDA
GPIO21
U0TXD
U0RXD
GPIO22
GPIO19
VDD3P3_CPU
10uF/6.3V(10%) 10uF/6.3V(10%) 1uF/10V(20%) 0.1uF/6.3V(10%)
J39 GND
2

GND GND GND GND Pin.6 Pin.20 Pin.33

GND
ANT1 1 36 GPIO23 IO34 CLK IO21
1 R15 0R(5%) C14 TBD 2 VDDA GPIO23 35 GPIO18 GPIO34 FLASH_CLK GPIO21
2 3 LNA_IN GPIO18 34 GPIO5
4 VDD3P3 GPIO5 33 SDI/SD1
C15 L4 C16
PCB ANT SENSOR_VP 5 VDD3P3 SD_DATA_1 32 SDO/SD0
TBD TBD 270pF/6.3V(10%) 6 SENSOR_VP SD_DATA_0 31 SCK/CLK
SENSOR_CAPP SD_CLK Pin.7 Pin.21 Pin.32
7 30 SCS/CMD
C17 SENSOR_VN8 SENSOR_CAPN SD_CMD 29 SWP/SD3 IO35 SD0 NC
CHIP_PU 9 SENSOR_VN SD_DATA_3 28 SHD/SD2 GPIO35 SDO/SD0
270pF/6.3V(10%) GPIO34 10 CHIP_PU SD_DATA_2 27 GPIO17
GND GND GND VDET_1 GPIO17
GPIO35 11 26
18

GPIO32 12 VDET_2 VDD_SDIO 25 GPIO16

32K_XP GPIO16
The values of C14, L4 and C15 vary with VDD_SDIO Pin.8 Pin.22 Pin.31

VDD3P3_RTC
the actual selection of a PCB board. IO32 SD1 IO19

32K_XN
GPIO32 SDI/SD1 GPIO19

GPIO25
GPIO26
GPIO27

GPIO2
GPIO0
GPIO4
MTMS

MTDO
MTCK
C18 C24

MTDI
4.7uF/16V(10%) 2K(5%)
U2 ESP32-D0WDQ6 Pin.9 Pin.23 Pin.30
13
14
15
16
17
18
19
20
21
22
23
24
GND GND VDD33 IO33 IO15 IO18
SCK/CLK R12 0R(5%) FLASH_CLK GPIO33 GPIO15 GPIO18
C19
GPIO33
GPIO25
GPIO26
GPIO27
GPIO14
GPIO12

GPIO13
GPIO15
Not Recommended For New Designs (NRND)

R11

GPIO2
GPIO0
GPIO4
0.1uF/6.3V(10%)
0R(5%)(NC) Pin.10 Pin.24 Pin.29
GND IO25 IO2 IO5
GPIO17 R13 0R(5%) SRAM_CLK GPIO25 GPIO2 GPIO5

B Pin.11 Pin.28 B
IO26 NC
GPIO26

VDD_SDIO VDD_SDIO VDD_SDIO

Pin.12 Pin.27
IO27 NC
R10
GPIO27
8

U3 10K(5%)
SCS/CMD 1 5 SDI/SD1 U4
VCC

/CS DI GPIO16 1 8
FLASH_CLK 6 2 SDO/SD0 SDO/SD0 2 CS# VDD 7 SHD/SD2
CLK DO SO/SIO1 SIO3 Pin.13 Pin.26
SWP/SD3 3 6 SRAM_CLK
GND

IO14 IO4
ESP32-WROVER Datasheet v2.7

SHD/SD2 7 3 SWP/SD3 4 SIO2 SCLK 5 SDI/SD1 VDD33

/HOLD /WP VSS SI/SIO0 GPIO14 GPIO4
FLASH PSRAM
4

R9
Pin.14 10K(5%)
Pin.39 Pin.25
GND GND IO12 GND IO0
GPIO12 GND GPIO0

Figure 3: Schematics of ESP32­WROVER

A A

Title
ESP32-WROVER-V4
Size Document Number Rev
C <Doc>
Date: Wednesday, November 14, 2018 Sheet 1 of 1
5 4 3 2 1

Espressif Systems
7 Peripheral Schematics

7 Peripheral Schematics

VDD33 U1
39 VDD33
GND 1 P_GND 38 GND
2 GND1 GND3 37 GPIO23 JP1
EN 3 3V3 IO23 36 GPIO22 1
GPI36 SENSOR_VP 4 EN IO22 35 TXD0 2 1
R1 GPI39 SENSOR_VN 5 SENSOR_VP TXD0 34 RXD0 3 2
GPI34 6 SENSOR_VN RXD0 33 GPIO21 4 3
C1 C2 TBD GPI35 7 IO34 IO21 32 4
GPIO32 8 IO35 NC 31 GPIO19 UART
IO32 IO19
22uF/25V(10%)

0.1uF/50V(10%)

GPIO33 9 30 GPIO18
GPIO25 10 IO33 IO18 29 GPIO5 GND
C3 GPIO26 11 IO25 IO5 28
GPIO27 12 IO26 NC2 27
TBD GPIO14 13 IO27 NC1 26 GPIO4
GPIO12 14 IO14 IO4 25 GPIO0
GND 15 IO12 IO0 24 GPIO2
GPIO13 16 GND2 IO2 23 GPIO15
SD2 17 IO13 IO15 22 SDI GND
SD2 SD1

1
2
GND GND SD3 18 21 SDO
CMD 19 SD3 SD0 20 SCK

1
2
CMD CLK

JP2
Boot Option

SW1
R2 0R(5%) EN JP3
1 GPIO14 MTMS
1 2 GPIO12 MTDI
2 3 GPIO13 MTCK
C4 0.1uF/50V(10%) 3 4 GPIO15 MTDO
4
JTAG
GND

Figure 4: Peripheral Schematics of ESP32­WROVER

Note:

• Soldering Pad 39 to the Ground of the base board is not necessary for a satisfactory thermal performance. If users
do want to solder it, they need to ensure that the correct quantity of soldering paste is applied.

• To ensure the power supply to the ESP32 chip during power-up, it is advised to add an RC delay circuit at the EN pin.
The recommended setting for the RC delay circuit is usually R = 10 kΩ and C = 1 µF. However, specific parameters
should be adjusted based on the power-up timing of the module and the power-up and reset sequence timing
of the chip. For ESP32’s power-up and reset sequence timing diagram, please refer to Section Power Scheme in
ESP32 Datasheet.

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Espressif Systems 19
4 Submit Documentation Feedback 3ESP32-WROVER Datasheet v2.7
8 Physical Dimensions

8 Physical Dimensions

Unit: mm

18.00±0.15
3.30±0.15

0.80
5.90

5.90
0.90

2.12
0.85

0.45 4.10
10.45

0.1
3.72
31.40±0.15

4.10
24.09

23.06

16.17
15.84
1.27

10.38
1.10

0.57

Top View Side View Bottom View

Figure 5: Physical Dimensions of ESP32­WROVER

Note:
For information about tape, reel, and product marking, please refer to Espressif Module Package Information.

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9 Recommended PCB Land Pattern

9 Recommended PCB Land Pattern

This section provides the following resources for your reference:

• Figures for recommended PCB land patterns with all the dimensions needed for PCB design. See Figure 6
Recommended PCB Land Pattern of ESP32-WROVER.

• Source files of recommended PCB land patterns to measure dimensions not covered in Figure 6. You can
view the source files for ESP32-WROVER with Autodesk Viewer.

Unit: mm
Via for thermal pad
Copper

18.00

6.31
Antenna Area
38x1.50
1 4.10 38
1.05
38x0.90

0.475
31.40

22.86

7.62
0.475

4.10
1.05
16.17
1.27
1.10

19 20

0.50

Figure 6: Recommended PCB Land Pattern of ESP32­WROVER

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10 Dimensions of External Antenna Connector

10 Dimensions of External Antenna Connector

Unit: mm

Figure 7: Dimensions of External Antenna Connector

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11 Product Handling

11 Product Handling

11.1 Storage Conditions

The products sealed in moisture barrier bags (MBB) should be stored in a non-condensing atmospheric
environment of < 40 °C and 90%RH. The module is rated at the moisture sensitivity level (MSL) of 3.

After unpacking, the module must be soldered within 168 hours with the factory conditions 25 ± 5 °C and 60
%RH. If the above conditions are not met, the module needs to be baked.

11.2 Electrostatic Discharge (ESD)

• Human body model (HBM): ±2000 V
• Charged-device model (CDM): ±500 V

11.3 Reflow Profile

Solder the module in a single reflow.
Temperature (℃)

Peak Temp.
235 ~ 250 ℃
250
Preheating zone Reflow zone Cooling zone
150 ~ 200 ℃ 60 ~ 120 s 217 ℃ 60 ~ 90 s –1 ~ –5 ℃/s
217
200
Soldering time
> 30 s

Ramp-up zone
1 ~ 3 ℃/s
100

50

25
Time (sec.)
0
0 50 100 150 200 250

Ramp-up zone — Temp.: 25 ~ 150 ℃ Time: 60 ~ 90 s Ramp-up rate: 1 ~ 3 ℃/s

Preheating zone — Temp.: 150 ~ 200 ℃ Time: 60 ~ 120 s
Reflow zone — Temp.: >217 ℃ 60 ~ 90 s; Peak Temp.: 235 ~ 250 ℃ Time: 30 ~ 70 s
Cooling zone — Peak Temp. ~ 180 ℃ Ramp-down rate: –1 ~ –5 ℃/s
Solder — Sn-Ag-Cu (SAC305) lead-free solder alloy

Figure 8: Reflow Profile

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Espressif Systems 23 ESP32-WROVER Datasheet v2.7
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11 Product Handling

11.4 Ultrasonic Vibration

Avoid exposing Espressif modules to vibration from ultrasonic equipment, such as ultrasonic welders or
ultrasonic cleaners. This vibration may induce resonance in the in-module crystal and lead to its malfunction or
even failure. As a consequence, the module may stop working or its performance may deteriorate.

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Espressif Systems 24 ESP32-WROVER Datasheet v2.7
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12 Related Documentation and Resources

12 Related Documentation and Resources

Related Documentation
• ESP32 Series Datasheet – Specifications of the ESP32 hardware.
• ESP32 Technical Reference Manual – Detailed information on how to use the ESP32 memory and peripherals.
• ESP32 Hardware Design Guidelines – Guidelines on how to integrate the ESP32 into your hardware product.
• ESP32 ECO and Workarounds for Bugs – Correction of ESP32 design errors.
• Certificates
https://espressif.com/en/support/documents/certificates
• ESP32 Product/Process Change Notifications (PCN)
https://espressif.com/en/support/documents/pcns
• ESP32 Advisories – Information on security, bugs, compatibility, component reliability.
https://espressif.com/en/support/documents/advisories
• Documentation Updates and Update Notification Subscription
https://espressif.com/en/support/download/documents

Developer Zone
• ESP-IDF Programming Guide for ESP32 – Extensive documentation for the ESP-IDF development framework.
• ESP-IDF and other development frameworks on GitHub.
https://github.com/espressif
• ESP32 BBS Forum – Engineer-to-Engineer (E2E) Community for Espressif products where you can post questions,
share knowledge, explore ideas, and help solve problems with fellow engineers.
https://esp32.com/
• The ESP Journal – Best Practices, Articles, and Notes from Espressif folks.
https://blog.espressif.com/
• See the tabs SDKs and Demos, Apps, Tools, AT Firmware.
https://espressif.com/en/support/download/sdks-demos

Products
• ESP32 Series SoCs – Browse through all ESP32 SoCs.
https://espressif.com/en/products/socs?id=ESP32
• ESP32 Series Modules – Browse through all ESP32-based modules.
https://espressif.com/en/products/modules?id=ESP32
• ESP32 Series DevKits – Browse through all ESP32-based devkits.
https://espressif.com/en/products/devkits?id=ESP32
• ESP Product Selector – Find an Espressif hardware product suitable for your needs by comparing or applying filters.
https://products.espressif.com/#/product-selector?language=en

Contact Us
• See the tabs Sales Questions, Technical Enquiries, Circuit Schematic & PCB Design Review, Get Samples
(Online stores), Become Our Supplier, Comments & Suggestions.
https://espressif.com/en/contact-us/sales-questions

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Espressif Systems 25 ESP32-WROVER Datasheet v2.7
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Revision History

Revision History

Date Version Release notes

Major updates:
• Removed contents about hall sensor according to PCN20221202
Other updates:
• Added information about the setup and hold times for the strapping pins in
2023-02-09 v2.7
Section 2.3
• Added source files of PCB land patterns and 3D models of the modules (if
available) in Section 9: Recommended PCB Land Pattern
• Added Chapter 11

Added a link to RF certificates in Table 2

2022.04 v2.6 Updated Table 6
Added a note below Figure 5
Replaced Espressif Product Ordering Information with ESP Product Selector
2021.08 v2.5 Updated the description of TWAI in Table 2
Labeled this document as (Not Recommended For New Designs)
Updated Figure 5: Physical Dimensions of ESP32-WROVER and Figure 6: Recom-
mended PCB Land Pattern of ESP32-WROVER.
2021.02 V2.4
Modified the note below Figure Reflow Profile.
Updated the trade mark from TWAI™ to TWAI® .
Added TWAITM in Table 2;
Added a note to Figure Reflow Profile;
2020.11 V2.3
Added documentation feedback link;
Updated the C value in RC circuit from 0.1 µF to 1 µF.
• Added Moisture sensitivity level (MSL) 3 in Table 2 ESP32-WROVER Specifica-
tions;
• Added notes about ”Operating frequency range” and ”TX power” under Table
2019.09 V2.2 9 Wi-Fi Radio Characteristics;
• Updated Section 7 Peripheral Schematics and added a note about RC delay
circuit under it;
• Updated Figure 9 Recommended PCB Land Pattern.
Added a note on the use of GPIO12 under Table 3, as well as in Section 4;
2019.01 V2.1
Changed the RF power control range in Table 11 from –12 ~ +12 to –12 ~ +9 dBm.
Updated the recommended operating temperature from –40 °C ~ 65 °C to –40 °C
~ 85 °C.
2018.11 V2.0
Updated Chapter 6: Schematics, where C18 is changed from a 1 µF capacitor to a
4.7 µF capacitor.
Added ”Cumulative IO output current” entry to Table 6: Absolute Maximum Ratings;
2018.10 V1.9
Added more parameters to Table 8: DC Characteristics.

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Espressif Systems 26 ESP32-WROVER Datasheet v2.7
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Revision History

Date Version Release notes

• Added certifications and reliability test items the module has passed in Table 2:
ESP32-WROVER Specifications, and removed software-specific information;
• Updated Section 3.4: RTC and Low-Power Management;
• Changed the module’s dimensions from (18±0.15) mm x (31.4 ±0.2) mm x
(3.5±0.15) mm to (18.00±0.10) mm x (31.40±0.10) mm x (3.30±0.10) mm;
• Updated Figure 8: Physical Dimensions;
2018.08 V1.8
• Updated Chapter 6: Schematics;
• Changed the recommended operating temperature from –40°C ~ 85°C to –
40°C ~ 65°C and added a note to custom order of ESP32-WROVER with high
temperature range;
• Corrected a typo in Electrical Characteristics section;
• Updated Table 9: Wi-Fi Radio.
• Updated the capacity of PSRAM from 32 Mbit to 64 Mbit;
• Deleted Temperature Sensor in Table 2: ESP32-WROVER Specifications;
• Updated Chapter 3: Functional Description;
• Updated Chapter 6: Schematics;
• Added Chapter 9: Recommended PCB Land Pattern;
2018.06 V1.7 Changes to electrical characteristics:
• Updated Table 6: Absolute Maximum Ratings;
• Added Table 7: Recommended Operating Conditions;
• Added Table 8: DC Characteristics;
• Updated the values of ”Gain control step”, ”Adjacent channel transmit power”
in Table 11: Transmitter Characteristics - BLE.
2018.03 V1.6 Corrected typos in Table 3 Pin Definitions.
2018.03 V1.5 Updated Table 2 in Chapter 1.
Updated Chapter 6 Schematics;
2018.03 V1.4
Updated Chapter 8 Dimensions.
Updated section 3.4 RTC and Low-Power Management;
2018.01 V1.3 Deleted information on LNA pre-amplifier;
Updated section 3.4 RTC and Low-Power Management;
Updated the ESP32-WROVER schematics in Chapter 6;
Added a note in Chapter 7;
Added the U.FL dimensions (Figure 10).
Updated the description of the chip’s system reset in Section 2.3 Strapping Pins;
Deleted ”Association sleep pattern” in Table ”Power Consumption by Power Modes”
2017.10 V1.2 and added notes to Active-sleep and Modem-sleep;
Added a note to Output Impedance in Table 9;
Updated the notes to Figure 4 Peripheral Schematics.
Updated Section 2.1 Pin Layout;
2017.09 V1.1 Updated the ESP32-WROVER Schematics and dded a note in Chapter 7;
Added Chapter 8 Dimensions.
2017.08 V1.0 First release.

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Espressif Systems 27 ESP32-WROVER Datasheet v2.7
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 Disclaimer and Copyright Notice
Information in this document, including URL references, is subject to change without notice.
ALL THIRD PARTY’S INFORMATION IN THIS DOCUMENT IS PROVIDED AS IS WITH NO
WARRANTIES TO ITS AUTHENTICITY AND ACCURACY.
NO WARRANTY IS PROVIDED TO THIS DOCUMENT FOR ITS MERCHANTABILITY, NON-
INFRINGEMENT, FITNESS FOR ANY PARTICULAR PURPOSE, NOR DOES ANY WARRANTY
OTHERWISE ARISING OUT OF ANY PROPOSAL, SPECIFICATION OR SAMPLE.
All liability, including liability for infringement of any proprietary rights, relating to use of information
in this document is disclaimed. No licenses express or implied, by estoppel or otherwise, to any
intellectual property rights are granted herein.
The Wi-Fi Alliance Member logo is a trademark of the Wi-Fi Alliance. The Bluetooth logo is a
registered trademark of Bluetooth SIG.
All trade names, trademarks and registered trademarks mentioned in this document are property
www.espressif.com of their respective owners, and are hereby acknowledged.
Copyright © 2023 Espressif Systems (Shanghai) Co., Ltd. All rights reserved.

Not Recommended For New Designs (NRND)