MIC5209

500 mA Low-Noise LDO Regulator

Features General Description

• Output Voltage Range: 1.8V to 15V The MIC5209 is an efficient linear voltage regulator
• Meets Intel® Slot 1 and Slot 2 Requirements with very low dropout voltage, typically 10 mV at light
• Guaranteed 500 mA Output Over the Full loads and less than 500 mV at full load, with better than
Operating Temperature Range 1% output voltage accuracy.
• Low 500 mV Maximum Dropout Voltage at Full Designed especially for hand-held, battery-powered
Load devices, the MIC5209 features low ground current to
• Extremely Tight Load and Line Regulation help prolong battery life. An enable/shutdown pin on
the SOIC-8 and DDPAK versions can further improve
• Thermally Efficient Surface-Mount Package
battery life with near-zero shutdown current.
• Low Temperature Coefficient
Key features include reversed-battery protection,
• Current and Thermal Limiting
current limiting, overtemperature shutdown,
• Reversed-Battery Protection ultra-low-noise capability (SOIC-8 and DDPAK
• No-Load Stability versions), and is available in thermally efficient
• 1% Output Accuracy packaging. The MIC5209 is available in adjustable or
• Ultra-Low-Noise Capability in SOIC-8 and DDPAK fixed output voltages.
• Ultra-Small 3 mm × 3 mm VDFN Package

Applications
• Pentium II Slot 1 and Slot 2 Support Circuits
• Laptop, Notebook, and Palmtop Computers
• Cellular Telephones
• Consumer and Personal Electronics
• SMPS Post-Regulator and DC/DC Modules
• High-Efficiency Linear Power Supplies

Typical Application Circuits

3.3V NOMINAL INPUT SLOT 1 ULTRA-LOW NOISE

POWER SUPPLY 5V REGULATOR

MIC5209-2.5YS ENABLE MIC5209-5.0YM

SHUTDOWN 1 8
VIN 2 7
6.0V
VOUT 3 6
1 2 3 5.0V 4 5
VIN VOUT
22μF
• 3.0V 2.5V ±1% 470pF
TANTALUM
0.1μF (OPTIONAL)
22μF
TANTALUM

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MIC5209
Package Types

MIC5209-X.XYS MIC5209YML
SOT-223 (S) 8-PIN 3X3 VDFN (ML)
FIXED VOLTAGES (TOP VIEW) ADJUSTABLE VOLTAGES (TOP VIEW)

GND
TAB
IN 1 8 EN

IN 2 7 GND
OUT 3 6 ADJ
OUT 4 5 NC
1 2 3 EP
IN GND OUT

MIC5209-X.XYM MIC5209-X.XYU
SOIC-8 (M) DDPAK (U)
FIXED VOLTAGES (TOP VIEW) FIXED VOLTAGES (TOP VIEW)

5 BYP
EN 1 8 GND
GND 4 OUT
IN 2 7 GND TAB 3 GND
2 IN
OUT 3 6 GND 1 EN
BYP 4 5 GND

MIC5209YM MIC5209YU
SOIC-8 (M) DDPAK (U)
ADJUSTABLE VOLTAGES (TOP VIEW) ADJUSTABLE VOLTAGES (TOP VIEW)

5 ADJ
EN 1 8 GND 4 OUT
GND
AB

3 GND
TA

IN
N 2 7 GND
2 IN
OUT
OUT 3 6 GND 1 EN
ADJ
J 4 5 GND

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 MIC5209
Functional Diagrams

LOW-NOISE
FIXED REGULATOR
(SOT-223 VERSION ONLY)
IN OUT
VIN VOUT

COUT

~2.0V – 2.1V
EN –40ºC
BANDGAP
REFERENCE

CURRENT-LIMIT
THERMAL SHUTDOWN

MIC5209-x.xYS

GND

ULTRA-LOW-NOISE
FIXED REGULATOR

IN OUT
VIN VOUT

COUT
BYP

CBYP
(OPTIONAL)

BANDGAP
REFERENCE

EN

CURRENT-LIMIT
THERMAL SHUTDOWN

MIC5209-x.xYM/U
GND

ULTRA-LOW-NOISE
ADJUSTABLE REGULATOR

IN OUT
VIN VOUT

R1 COUT
ADJ

R2 CBYP
BANDGAP (OPTIONAL)
REFERENCE

EN

CURRENT-LIMIT
THERMAL SHUTDOWN

MIC5209YM/U (ADJUSTABLE)

GND

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MIC5209
1.0 ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings †
Supply Voltage (VIN).................................................................................................................................... –20V to +20V
Power Dissipation (PD) (Note 1).............................................................................................................Internally Limited
ESD Rating (SOT-223)..................................................................................................................... 2 kV HBM/300V MM
ESD Rating (VDFN, SOIC-8) ........................................................................................................... 5 kV HBM/100V MM

Operating Ratings ‡
Supply Voltage (VIN)................................................................................................................................... +2.5V to +16V
Adjustable Output Voltage Range (VOUT) .................................................................................................. +1.8V to +15V

† Notice: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device.
This is a stress rating only and functional operation of the device at those or any other conditions above those indicated
in the operational sections of this specification is not intended. Exposure to maximum rating conditions for extended
periods may affect device reliability.
‡ Notice: The device is not guaranteed to function outside its operating ratings.
Note 1: The maximum allowable power dissipation at any TA (ambient temperature) is PD(max) = (TJ(max) – TA) x θJA.
Exceeding the maximum allowable power dissipation will cause excessive die temperature, and the regula-
tor will go into thermal shutdown. See Table 4-1 and the Thermal Considerations sub-section in Applications
Information for details.

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 MIC5209
ELECTRICAL CHARACTERISTICS
Electrical Characteristics: VIN = VOUT + 1V; IL = 100 μA; TJ = +25°C, bold values indicate –40°C ≤ TJ ≤ +125°C
except 0°C ≤ TJ ≤ +125°C for 1.8V ≤ VOUT ≤ 2.5V, unless noted. Note 1
Parameter Symbol Min. Typ. Max. Units Conditions
–1 — 1
Output Voltage Accuracy VOUT % Variation from nominal VOUT
–2 — 2
Output Voltage ΔVOUT/
— 40 — ppm/°C Note 2
Temperature Coefficient ΔT
ΔVOUT/ — 0.009 0.05
Line Regulation % VIN = VOUT + 1V to 16V
VOUT — — 0.10
ΔVOUT/ — 0.05 0.5
Load Regulation % IL = 100 µA to 500 mA, Note 3
VOUT — — 0.7
— 10 60
IL = 100 µA
— — 80
— 115 175
IL = 50 mA
VIN – — — 250
Dropout Voltage, (Note 4) mV
VOUT — 165 300
IL = 150 mA
— — 400
— 350 500
IL = 500 mA
— — 600
— 80 130
VEN ≥ 3.0V, IOUT = 100 µA
— — 170
µA
— 350 650
VEN ≥ 3.0V, IOUT = 50 mA
Ground Pin Current — — 900
IGND
(Note 5, Note 6) — 1.8 2.5
VEN ≥ 3.0V, IOUT = 150 mA
— — 3.0
mA
— 8 20
VEN ≥ 3.0V, IOUT = 500 mA
— — 25
Ground Pin Quiescent — 0.05 3 VEN ≤ 0.4V (shutdown)
IGND µA
Current, (Note 6) — 0.10 8 VEN ≤ 0.18V (shutdown)
Ripple Rejection PSRR — 75 — dB f = 120 Hz
— 700 900
Current Limit ILIMIT mA VOUT = 0V
— — 1000
ΔVOUT/
Thermal Regulation — 0.05 — %/W Note 7
ΔPD
VOUT = 2.5V, IOUT = 50 mA
— 500 —
COUT = 2.2 µF, CBYP = 0
Output Noise, (Note 8) en nV √Hz
IOUT = 50 mA, COUT = 2.2 µF
— 300 —
CBYP = 470 pF

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MIC5209
ELECTRICAL CHARACTERISTICS (CONTINUED)
Electrical Characteristics: VIN = VOUT + 1V; IL = 100 μA; TJ = +25°C, bold values indicate –40°C ≤ TJ ≤ +125°C
except 0°C ≤ TJ ≤ +125°C for 1.8V ≤ VOUT ≤ 2.5V, unless noted. Note 1
Parameter Symbol Min. Typ. Max. Units Conditions
Enable Input
— — 0.4
Enable Input Logic-Low V VEN = Logic-low (Regulator shutdown)
VENL — — 0.18
Voltage
2.0 — — V VEN = Logic-high (Regulator enabled)
— 0.01 –1 VENL ≤ 0.4V
Enable Input Current IENL µA
— 0.01 –2 VENL ≤ 0.18V
— 5 20
VENH = 2.0V
— — 25
— IENH µA
— — 30
VENH = 16V
— — 50
Note 1: Specification for packaged product only.
2: Output voltage temperature coefficient is defined as the worst-case voltage change divided by the total
temperature range.
3: Regulation is measured at constant junction temperature using low duty cycle pulse testing. Parts are
tested for load regulation in the load range from 100 µA to 500 mA. Changes in output voltage due to heat-
ing effects are covered by the thermal regulation specification.
4: Dropout Voltage is defined as the input to output differential at which the output voltage drops 2% below its
nominal value measured at 1V differential.
5: Ground pin current is the regulator quiescent current plus pass transistor base current. The total current
drawn from the supply is the sum of the load current plus the ground pin current.
6: VEN is the voltage externally applied to devices with the EN (enable) input pin. SOIC-8 (M) and DDPAK (U)
packages only.
7: Thermal regulation is the change in output voltage at a time “t” after a change in power dissipation is
applied, excluding load or line regulation effects. Specifications are for a 500 mA load pulse at VIN = 16V
for t = 10 ms.
8: CBYP is an optional, external bypass capacitor connected to devices with a BYP (bypass) or ADJ (adjust)
pin. SOIC-8 (M) and DDPAK (U) packages only.

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 MIC5209
TEMPERATURE SPECIFICATIONS (Note 1)
Parameters Sym. Min. Typ. Max. Units Conditions
Temperature Ranges
Storage Temperature Range TS –65 — +150 °C —
Lead Temperature — — — +260 °C Soldering, 5 sec.
Junction Temperature TJ –40 — +125 °C 2.5V ≤ VOUT ≤ 15V
Junction Temperature TJ 0 — +125 °C 1.8V ≤ VOUT < 2.5V
Package Thermal Resistance
θJA — 62 — °C/W EIA/JEDEC
Thermal Resistance SOT-223 JES51-751-7,
θJC — 15 — °C/W 4 Layer Board
θJA — 50 — °C/W See Thermal
Thermal Resistance SOIC-8 Considerations for more
θJC — 25 — °C/W information.
θJA — 31.4 — °C/W EIA/JEDEC
Thermal Resistance DDPAK JES51-751-7,
θJC — 3 — °C/W 4 Layer Board
θJA — 64 — °C/W EIA/JEDEC
Thermal Resistance 3 mm x 3 mm
JES51-751-7,
VDFN θJC — 12 — °C/W 4 Layer Board
Note 1: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable
junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the
maximum allowable power dissipation will cause the device operating junction temperature to exceed the
maximum +125°C rating. Sustained junction temperatures above +125°C can impact the device reliability.

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MIC5209
2.0 TYPICAL PERFORMANCE CURVES
Note: The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.

FIGURE 2-1: Power Supply Rejection FIGURE 2-4: Power Supply Rejection
Ratio. Ratio.

FIGURE 2-2: Power Supply Rejection FIGURE 2-5: Power Supply Rejection
Ratio. Ratio.

FIGURE 2-3: Power Supply Rejection FIGURE 2-6: Power Supply Rejection
Ratio. Ratio.

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 MIC5209

FIGURE 2-7: Power Supply Ripple FIGURE 2-10: Noise Performance.

Rejection vs. Voltage Drop.

FIGURE 2-8: Power Supply Ripple FIGURE 2-11: Noise Performance.

Rejection vs. Voltage Drop.

FIGURE 2-9: Noise Performance. FIGURE 2-12: Dropout Voltage vs. Output
Current.

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MIC5209

FIGURE 2-13: Ground Current vs. Output

Current.

FIGURE 2-14: Ground Current vs. Supply

Voltage.

FIGURE 2-15: Ground Current vs. Supply

Voltage.

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 MIC5209
3.0 PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 3-1.

TABLE 3-1: PIN FUNCTION TABLE

Pin Number Pin Number Pin Number Pin Number
Pin Name Description
8-Pin VDFN SOT-223 SOIC-8 DDPAK
1, 2 1 2 2 IN Supply Input.
7 2, TAB 5, 6, 7, 8 3, TAB GND Ground: SOT-223 Pin 2 and TAB are
internally connected. SOIC-8 Pins 5
through 8 are internally connected.
3, 4 3 3 4 OUT Regulator Output: Pins 3 and 4 must
be tied together.
5 — — — NC Not Connected.
8 — 1 1 EN Enable (Input): CMOS-compatible
control input. Logic-High = Enable;
Logic-Low = Shutdown.
— — 4 (Fixed) 5 (Fixed) BYP Reference Bypass: Connect external
470 pF capacitor to GND to reduce
output noise. Can be left open. For
1.8V or 2.5V operation, see Application
Information.
6 — 4 (Adjustable) 5 (Adjustable) ADJ Adjust (Input): Feedback input.
Connect to resistive voltage-divider
network.
EP — — — ePad Exposed Thermal Pad: Connect to
GND for best thermal performance.

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MIC5209
4.0 APPLICATIONS INFORMATION CBYP reduces the phase margin, the output capacitor
should be increased to at least 2.2 µF to maintain
stability.
4.1 Enable/Shutdown
The start-up speed of the MIC5209 is inversely
Enable is not available on devices in the SOT-223 (S) proportional to the size of the reference bypass
package. capacitor. Applications requiring a slow ramp-up of
Forcing EN (enable/shutdown) high (> 2V) enables the output voltage should consider larger values of CBYP.
regulator. EN is compatible with CMOS logic. If the Likewise, if rapid turn-on is necessary, consider
enable/shutdown feature is not required, connect EN to omitting CBYP.
IN (supply input). If output noise is not a major concern, omit CBYP and
leave BYP open.
4.2 Input Capacitor
A 1 µF capacitor should be placed from IN to GND if 4.6 Thermal Considerations
there is more than 10 inches of wire between the input The SOT-223 has a ground tab that allows it to
and the AC filter capacitor or if a battery is used as the dissipate more power than the SOIC-8 (refer to the
input. Slot-1 Power Supply sub-section for details). At +25°C
ambient, it will operate reliably at 1.6W dissipation with
4.3 Output Capacitor “worst-case” mounting (no ground plane, minimum
trace widths, and FR4 printed circuit board).
An output capacitor is required between OUT and GND
to prevent oscillation. The minimum size of the output Thermal resistance values for the SOIC-8 represent
capacitor is dependent upon whether a reference typical mounting on a 1”-square, copper-clad, FR4
bypass capacitor is used. 1 µF minimum is circuit board. For greater power dissipation, SOIC-8
recommended when CBYP is not used (see Figure 4-1). versions of the MIC5209 feature a fused internal lead
2.2 µF minimum is recommended when CBYP is 470 pF frame and die bonding arrangement that reduces
(see Figure 4-2). Larger values improve the regulator’s thermal resistance when compared to standard SOIC-8
transient response. packages.
The output capacitor should have an ESR (equivalent TABLE 4-1: MIC5209 THERMAL
series resistance) of about 1Ω and a resonant RESISTANCE
frequency above 1 MHz. Ultra-low-ESR and ceramic
capacitors can cause a low amplitude oscillation on the Package θJA θJC
output and/or underdamped transient response. Most SOT-223 (S) 62°C/W 15°C/W
tantalum or aluminum electrolytic capacitors are
SOIC-8 (M) 50°C/W 25°C/W
adequate; film types will work, but are more expensive.
Since many aluminum electrolytics have electrolytes DDPAK (U) 31.4°C/W 3°C/W
that freeze at about –30°C, solid tantalums are 3x3 VDFN (ML) 64°C/W 12°C/W
recommended for operation below –25°C. Multilayer boards with a ground plane, wide traces near
At lower values of output current, less output the pads, and large supply-bus lines will have better
capacitance is needed for output stability. The thermal conductivity and will also allow additional
capacitor can be reduced to 0.47 µF for current below power dissipation.
10 mA or 0.33 µF for currents below 1 mA. For additional heat sink characteristics, refer to
Application Hint 17. For a full discussion of heat sinking
4.4 No-Load Stability and thermal effects on voltage regulators, refer to the
“Regulator Thermals” section of the Designing with
The MIC5209 will remain stable and in regulation with Low-Dropout Voltage Regulators handbook.
no load (other than the internal voltage divider) unlike
many other voltage regulators. This is especially
important in CMOSRAM keep-alive applications.
4.7 Low-Voltage Operation
The MIC5209-1.8 and MIC5209-2.5 require special
4.5 Reference Bypass Capacitor consideration when used in voltage-sensitive systems.
They may momentarily overshoot their nominal output
Reference bypass (BYP) is available only on devices in voltages unless appropriate output and bypass
SOIC-8 and DDPAK packages. capacitor values are chosen.
BYP is connected to the internal voltage reference. A During regulator power up, the pass transistor is fully
470 pF capacitor (CBYP) connected from BYP to GND saturated for a short time, while the error amplifier and
quiets this reference, providing a significant reduction voltage reference are being powered up more slowly
in output noise (ultra-low-noise performance). Because from the output (see Functional Diagrams). Selecting

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 MIC5209
larger output and bypass capacitors allows additional 4.9 Adjustable Regulator Applications
time for the error amplifier and reference to turn on and
prevent overshoot. The MIC5209YM, MIC5209YU, and MIC5209YML can
be adjusted to a specific output voltage by using two
To ensure that no overshoot is present when starting up external resistors (Figure 4-3). The resistors set the
into a light load (100 µA), use a 4.7 µF output output voltage based on the equation:
capacitance and 470 pF bypass capacitance. This
slows the turn-on enough to allow the regulator to react
EQUATION 4-1:
and keep the output voltage from exceeding its nominal
value. At heavier loads, use a 10 µF output
capacitance and 470 pF bypass capacitance. Lower
values of output and bypass capacitance can be used, V OUT = 1.242V   1 + R2
-------
 R1
depending on the sensitivity of the system.
Applications that can withstand some overshoot on the
output of the regulator can reduce the output capacitor
and/or reduce or eliminate the bypass capacitor. This equation is correct due to the configuration of the
Applications that are not sensitive to overshoot due to bandgap reference. The bandgap voltage is relative to
power-on reset delays can use normal output and the output, as seen in the Functional Diagrams.
bypass capacitor configurations. Traditional regulators normally have the reference
Please note the junction temperature range of the voltage relative to ground; therefore, their equations
regulator with an output less than 2.5V (fixed and are different from the equation for the MIC5209Y.
adjustable) is 0°C to +125°C. Although ADJ is a high-impedance input and, for best
performance, R2 should not exceed 470 kΩ.
4.8 Fixed Regulator Applications
Figure 4-1 shows a basic MIC5209-x.xYM (SOIC-8) MIC5209YM
2 3
fixed-voltage regulator circuit. See Figure 5 for a similar VIN IN OUT VOUT
configuration using the more thermally-efficient 1 4 R1
MIC5209-x.xYS (SOT-223). A 1 µF minimum output EN ADJ

capacitor is required for basic fixed-voltage GND

1μF

applications. 5-8
R2

MIC5209-x.xYM
2 3
VIN IN OUT VOUT FIGURE 4-3: Low-Noise
1 4 Adjustable-Voltage Application.
EN BYP
1μF Figure 4-4 includes the optional 470 pF bypass
GND capacitor from ADJ to GND to reduce output noise.
5-8

MIC5209YM
VIN 2 3 VOUT
FIGURE 4-1: Low-Noise Fixed-Voltage IN OUT

Application. 1
EN ADJ
4 R1

Figure 4-2 includes the optional 470 pF noise bypass GND

2.2μF
capacitor between BYP and GND to reduce output 5-8
noise. Note that the minimum value of COUT must be R2
470pF
increased when the bypass capacitor is used.

MIC5209-x.xYM
2 3
FIGURE 4-4: Ultra-Low-Noise Adjustable
VIN VOUT
IN OUT Application.
1 4
EN BYP
2.2μF 4.10 Slot-1 Power Supply
GND
5-8 Intel’s Pentium II processors have a requirement for a
470pF
2.5V ±5% power supply for a clock synthesizer and its
associated loads. The current requirement for the 2.5V
FIGURE 4-2: Ultra-Low-Noise supply is dependent upon the clock synthesizer used,
Fixed-Voltage Application.

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MIC5209
the number of clock outputs, and the type of level So:
shifter (from core logic levels to 2.5V levels). Intel
estimates a “worst-case” load of 320 mA. EQUATION 4-3:
The MIC5209 was designed to provide the 2.5V power
requirement for Slot-1 applications. Its guaranteed
performance of 2.5V ±3% at 500 mA allows adequate   3.6V – 2.375V   320mA  +  3.6V  4mA 
margin for all systems, and the dropout voltage of
500 mV means that it operates from a “worst-case”
3.3V supply where the voltage can be as low as 3.0V.

Resulting in:
MIC5209-x.xYS
1 3
VIN IN OUT VOUT EQUATION 4-4:

CIN COUT
0.1μF
GND
22μF P D = 407mW
2, TAB

FIGURE 4-5: Slot-1 Power Supply. Using the maximum junction temperature of +125°C
and a θJC of 15°C/W for the SOT-223, 25°C/W for the
A Slot-1 power supply (Figure 4-5) is easy to SOIC-8, or 3°C/W for the DDPAK package, the
implement. Only two capacitors are necessary, and following worst-case heat-sink thermal resistance (θSA)
their values are not critical. CIN bypasses the internal requirements are:
circuitry and should be at least 0.1 µF. COUT provides
output filtering, improves transient response, and
EQUATION 4-5:
compensates the internal regulator control loop. Its
value should be at least 22 µF. CIN and COUT can be
increased as much as desired.
T J  MAX  – T A
 JA = -------------------------------
-
4.10.1 SLOT-1 POWER SUPPLY POWER PD
DISSIPATION Where: θSA = θJA - θJC
Powered from a 3.3V supply, the Slot-1 power supply
illustrated in Figure 4-5 has a nominal efficiency of
Table 4-2 and Figure 4-6 show that the Slot-1 power
75%. At the maximum anticipated Slot-1 load
supply application can be implemented with a minimum
(320 mA), the nominal power dissipation is only
footprint layout.
256 mW.
The SOT-223 package has sufficient thermal TABLE 4-2: MAXIMUM ALLOWABLE
characteristics for wide design margins when mounted THERMAL RESISTANCE
on a single-layer copper-clad printed circuit board. The
TA +40°C +50°C +60°C +70°C
power dissipation of the MIC5209 is calculated using
the voltage drop across the device output current plus θJA Limit 209°C/W 184°C/W 160°C/W 135°C/W
supply voltage ground current. θSA 194°C/W 169°C/W 145°C/W 120°C/W
Considering “worst-case” tolerances, the power SOT-223
dissipation could be as high as: θSA 184°C/W 159°C/W 135°C/W 110°C/W
SOIC-8
EQUATION 4-2: θSA 206°C/W 181°C/W 157°C/W 132°C/W
DDPAK
Figure 4-6 shows the necessary copper pad area to
 V IN  MAX  – V OUT  MAX    I OUT + V IN  MAX   I GND obtain specific heatsink thermal resistance (θSA)
values. The θSA values highlighted in Table 4-2 require
much less than 500 mm2 of copper and, per Figure 4-6,
can be easily accomplished with the minimum footprint.

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 MIC5209

70

THERMAL RESISTANCE (ºC/W)

60

50

40

30

20

10

0
0 2000 4000 6000

COPPER HEAT SINK AREA (mm2)

FIGURE 4-6: PCB Heatsink Thermal

Resistance.

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MIC5209
5.0 PACKAGING INFORMATION
5.1 Package Marking Information

8-Pin VDFN* Example

5-Pin SOT-223* Example

XXXX 5209 Y Y
XXXXNNNP 25YS722P XXXX 5209
NNN 916

SOIC-8 (Fixed)* Example 5-Pin DDPAK (Fixed)* Example

XXXX 5209 XXXX 5209

-X.XXX -3.3YM -X.XXX -3.3YU
WNNN 9651 WNNNP 5492P

SOIC-8 (Adj.)* Example 5-Pin DDPAK (Adj)* Example

XXX MIC XXX MIC

XXXXXX 5209YM XXXXXX 5209YU
WNNN 1312 WNNNP 1975P

Legend: XX...X Product code or customer-specific information

Y Year code (last digit of calendar year)
YY Year code (last 2 digits of calendar year)
WW Week code (week of January 1 is week ‘01’)
NNN Alphanumeric traceability code
e3 Pb-free JEDEC® designator for Matte Tin (Sn)
* This package is Pb-free. The Pb-free JEDEC designator ( e3 )
can be found on the outer packaging for this package.
●, ▲, ▼ Pin one index is identified by a dot, delta up, or delta down (triangle
mark).

Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information. Package may or may not include
the corporate logo.
Underbar (_) and/or Overbar (‾) symbol may not be to scale.

Note: If the full seven-character YYWWNNN code cannot fit on the package, the following truncated codes are
used based on the available marking space:
6 Characters = YWWNNN; 5 Characters = WWNNN; 4 Characters = WNNN; 3 Characters = NNN;
2 Characters = NN; 1 Character = N

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 MIC5209
3-Lead SOT-223 Package Outline and Recommended Land Pattern

Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging.

 2017 - 2022 Microchip Technology Inc. and its subsidiaries DS20005720B-page 17

MIC5209
5-Lead DDPAK Package Outline and Recommended Land Pattern

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DS20005720B-page 18  2017 - 2022 Microchip Technology Inc. and its subsidiaries

 MIC5209

Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging

 2017 - 2022 Microchip Technology Inc. and its subsidiaries DS20005720B-page 19

MIC5209
8-Lead 3 mm x 3 mm VDFN Package Outline and Recommended Land Pattern

8-Lead Very Thin Plastic Dual Flat, No Lead Package (JMA) - 3x3x0.9 mm Body [VDFN]
Micrel Legacy Package DFN33-8LD-PL-1
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging

D A B
N

(DATUM A)

(DATUM B)
E
NOTE 1

2X
0.05 C
1 2
2X
0.05 C TOP VIEW

0.10 C

C A
SEATING A1
PLANE
8X
0.08 C
(A3) SIDE VIEW
0.10 C A B
D2
1 2

0.10 C A B

E2

K
L

N
8X b
e 0.10 C A B
0.05 C
BOTTOM VIEW

Microchip Technology Drawing C04-1021 A Sheet 1 of 2

DS20005720B-page 20  2017 - 2022 Microchip Technology Inc. and its subsidiaries

 MIC5209

8-Lead Very Thin Plastic Dual Flat, No Lead Package (JMA) - 3x3x0.9 mm Body [VDFN]
Micrel Legacy Package DFN33-8LD-PL-1
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging

Units MILLIMETERS
Dimension Limits MIN NOM MAX
Number of Terminals N 8
Pitch e 0.65 BSC
Overall Height A 0.80 0.85 0.90
Standoff A1 0.00 0.02 0.05
Terminal Thickness A3 0.203 REF
Overall Length D 3.00 BSC
Exposed Pad Length D2 2.25 2.30 2.35
Overall Width E 3.00 BSC
Exposed Pad Width E2 1.50 1.55 1.60
Terminal Width b 0.20 0.25 0.30
Terminal Length L 0.35 0.40 0.45
Terminal-to-Exposed-Pad K 0.20 - -
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package is saw singulated
3. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.

Microchip Technology Drawing C04-1021 A Sheet 1 of 2

 2017 - 2022 Microchip Technology Inc. and its subsidiaries DS20005720B-page 21

MIC5209

8-Lead Very Thin Plastic Dual Flat, No Lead Package (JMA) - 3x3x0.9 mm Body [VDFN]
Micrel Legacy Package DFN33-8LD-PL-1
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging

X2
EV
8

ØV
Y2
EV
C G1

Y1

1 2

SILK SCREEN X1
G2
E

RECOMMENDED LAND PATTERN

Units MILLIMETERS
Dimension Limits MIN NOM MAX
Contact Pitch E 0.65 BSC
Optional Center Pad Width X2 2.35
Optional Center Pad Length Y2 1.60
Contact Pad Spacing C 2.90
Contact Pad Width (X8) X1 0.30
Contact Pad Length (X8) Y1 0.85
Contact Pad to Center Pad (X8) G1 0.23
Contact Pad to Contact Pad (X6) G2 0.35
Thermal Via Diameter V 0.30
Thermal Via Pitch EV 1.00
Notes:
1. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
2. For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during
reflow process

Microchip Technology Drawing C04-3021 Rev A

DS20005720B-page 22  2017 - 2022 Microchip Technology Inc. and its subsidiaries

 MIC5209
8-Lead SOIC Package Outline and Recommended Land Pattern

Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging.

 2017 - 2022 Microchip Technology Inc. and its subsidiaries DS20005720B-page 23

MIC5209
NOTES:

DS20005720B-page 24  2017 - 2022 Microchip Technology Inc. and its subsidiaries

 MIC5209
APPENDIX A: REVISION HISTORY

Revision A (February 2017)

• Converted Micrel document MIC5209 to Micro-
chip data sheet DS20005720A.
• Minor text changes throughout.
• Updated TO-263-5 packaging spec to DDPAK.
• Updated Thermal Resistance values to be current
with Microchip packaging.

Revision B (January 2022)

• Updated Package Marking Information drawing.
• Updated 8-Lead 3 mm x 3 mm VDFN Package
Outline and Recommended Land Pattern draw-
ing.
• Updated all instances of DFN in text/graphics to
VDFN.

 2017 - 2022 Microchip Technology Inc. and its subsidiaries DS20005720B-page 25

MIC5209
NOTES:

DS20005720B-page 26  2017 - 2022 Microchip Technology Inc. and its subsidiaries

 MIC5209
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, contact your local Microchip representative or sales office.
Examples:
PART NO. – X.X X X – XX
a) MIC5209-1.8YM-TR: 500 mA Low-Noise LDO
Device Voltage Temperature Package Media Type Regulator, 1.8V Voltage,
–40°C to +125°C Temp. Range,
8-Lead SOIC, 2,500/Reel
Device: MIC5209: 500 mA Low Noise LDO Regulator b) MIC5209-1.8YM: 500 mA Low-Noise LDO
Regulator, 1.8V Voltage,
–40°C to +125°C Temp. Range,
Voltage: (blank) = Adjustable
1.8 = 1.8V 8-Lead SOIC, 95/Tube
2.5 = 2.5V c) MIC5209-2.5YU-TR: 500 mA Low-Noise LDO
3.0 = 3.0V Regulator, 2.5V Voltage,
3.3 = 3.3V
–40°C to +125°C Temp. Range,
3.6 = 3.6V
4.2 = 4.2V 5-Lead DDPAK, 750/Reel
5.0 = 5.0V d) MIC5209-2.5YU: 500 mA Low-Noise LDO
Regulator, 2.5V Voltage,
Temperature: Y = –40°C to +125°C –40°C to +125°C Temp. Range,
5-Lead DDPAK, 50/Tube
e) MIC5209-3.0YS-TR: 500 mA Low-Noise LDO
Package: M = 8-Lead SOIC
ML = 8-Lead VDFN Regulator, 3.0V Voltage,
S = 3-Lead SOT-223 –40°C to +125°C Temp. Range,
U = 5-Lead DDPAK 3-Lead SOT-223, 2,500/Reel
f) MIC5209-3.0YS: 500 mA Low-Noise LDO
Media Type: TR = 2,500/Reel (SOIC, SOT-223) Regulator, 3.0V Voltage,
TR = 750/Reel (DDPAK) –40°C to +125°C Temp. Range,
TR = 5,000/Reel (VDFN)
T5 = 500/Reel (VDFN) 3-Lead SOT-223, 78/Tube
(blank)= 50/Tube (DDPAK) g) MIC5209YML-TR: 500 mA Low-Noise LDO
(blank)= 78/Tube (SOT-223) Regulator, Adj. Voltage,
(blank)= 95/Tube (SOIC) –40°C to +125°C Temp. Range,
8-Lead VDFN, 5,000/Reel
h) MIC5209YML-T5: 500 mA Low-Noise LDO
Regulator, Adj. Voltage,
–40°C to +125°C Temp. Range,
8-Lead VDFN, 500/Reel

Note 1: Tape and Reel identifier only appears in the

catalog part number description. This identifier is
used for ordering purposes and is not printed on
the device package. Check with your Microchip
Sales Office for package availability with the
Tape and Reel option.

 2017 - 2022 Microchip Technology Inc. and its subsidiaries DS20005720B-page 27

MIC5209
NOTES:

DS20005720B-page 28  2017 - 2022 Microchip Technology Inc. and its subsidiaries

Note the following details of the code protection feature on Microchip products:
• Microchip products meet the specifications contained in their particular Microchip Data Sheet.

• Microchip believes that its family of products is secure when used in the intended manner, within operating specifications, and
under normal conditions.

• Microchip values and aggressively protects its intellectual property rights. Attempts to breach the code protection features of
Microchip product is strictly prohibited and may violate the Digital Millennium Copyright Act.

• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of its code. Code protection does not
mean that we are guaranteeing the product is “unbreakable”. Code protection is constantly evolving. Microchip is committed to
continuously improving the code protection features of our products.

This publication and the information herein may be used only Trademarks
with Microchip products, including to design, test, and integrate The Microchip name and logo, the Microchip logo, Adaptec,
Microchip products with your application. Use of this informa- AnyRate, AVR, AVR logo, AVR Freaks, BesTime, BitCloud,
tion in any other manner violates these terms. Information CryptoMemory, CryptoRF, dsPIC, flexPWR, HELDO, IGLOO,
JukeBlox, KeeLoq, Kleer, LANCheck, LinkMD, maXStylus,
regarding device applications is provided only for your conve-
maXTouch, MediaLB, megaAVR, Microsemi, Microsemi logo,
nience and may be superseded by updates. It is your responsi- MOST, MOST logo, MPLAB, OptoLyzer, PIC, picoPower,
bility to ensure that your application meets with your PICSTART, PIC32 logo, PolarFire, Prochip Designer, QTouch,
specifications. Contact your local Microchip sales office for SAM-BA, SenGenuity, SpyNIC, SST, SST Logo, SuperFlash,
additional support or, obtain additional support at https:// Symmetricom, SyncServer, Tachyon, TimeSource, tinyAVR, UNI/O,
Vectron, and XMEGA are registered trademarks of Microchip
www.microchip.com/en-us/support/design-help/client-support- Technology Incorporated in the U.S.A. and other countries.
services.
AgileSwitch, APT, ClockWorks, The Embedded Control Solutions
THIS INFORMATION IS PROVIDED BY MICROCHIP "AS IS". Company, EtherSynch, Flashtec, Hyper Speed Control, HyperLight
MICROCHIP MAKES NO REPRESENTATIONS OR WAR- Load, IntelliMOS, Libero, motorBench, mTouch, Powermite 3,
RANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, Precision Edge, ProASIC, ProASIC Plus, ProASIC Plus logo, Quiet-
WRITTEN OR ORAL, STATUTORY OR OTHERWISE, Wire, SmartFusion, SyncWorld, Temux, TimeCesium, TimeHub,
TimePictra, TimeProvider, TrueTime, WinPath, and ZL are
RELATED TO THE INFORMATION INCLUDING BUT NOT registered trademarks of Microchip Technology Incorporated in the
LIMITED TO ANY IMPLIED WARRANTIES OF NON- U.S.A.
INFRINGEMENT, MERCHANTABILITY, AND FITNESS FOR A
PARTICULAR PURPOSE, OR WARRANTIES RELATED TO Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any
ITS CONDITION, QUALITY, OR PERFORMANCE. Capacitor, AnyIn, AnyOut, Augmented Switching, BlueSky,
BodyCom, CodeGuard, CryptoAuthentication, CryptoAutomotive,
IN NO EVENT WILL MICROCHIP BE LIABLE FOR ANY INDI- CryptoCompanion, CryptoController, dsPICDEM, dsPICDEM.net,
Dynamic Average Matching, DAM, ECAN, Espresso T1S,
RECT, SPECIAL, PUNITIVE, INCIDENTAL, OR CONSE- EtherGREEN, GridTime, IdealBridge, In-Circuit Serial
QUENTIAL LOSS, DAMAGE, COST, OR EXPENSE OF ANY Programming, ICSP, INICnet, Intelligent Paralleling, Inter-Chip
KIND WHATSOEVER RELATED TO THE INFORMATION OR Connectivity, JitterBlocker, Knob-on-Display, maxCrypto, maxView,
ITS USE, HOWEVER CAUSED, EVEN IF MICROCHIP HAS memBrain, Mindi, MiWi, MPASM, MPF, MPLAB Certified logo,
BEEN ADVISED OF THE POSSIBILITY OR THE DAMAGES MPLIB, MPLINK, MultiTRAK, NetDetach, NVM Express, NVMe,
Omniscient Code Generation, PICDEM, PICDEM.net, PICkit,
ARE FORESEEABLE. TO THE FULLEST EXTENT PICtail, PowerSmart, PureSilicon, QMatrix, REAL ICE, Ripple
ALLOWED BY LAW, MICROCHIP'S TOTAL LIABILITY ON Blocker, RTAX, RTG4, SAM-ICE, Serial Quad I/O, simpleMAP,
ALL CLAIMS IN ANY WAY RELATED TO THE INFORMATION SimpliPHY, SmartBuffer, SmartHLS, SMART-I.S., storClad, SQI,
OR ITS USE WILL NOT EXCEED THE AMOUNT OF FEES, IF SuperSwitcher, SuperSwitcher II, Switchtec, SynchroPHY, Total
ANY, THAT YOU HAVE PAID DIRECTLY TO MICROCHIP Endurance, TSHARC, USBCheck, VariSense, VectorBlox, VeriPHY,
ViewSpan, WiperLock, XpressConnect, and ZENA are trademarks
FOR THE INFORMATION. of Microchip Technology Incorporated in the U.S.A. and other
countries.
Use of Microchip devices in life support and/or safety applica-
tions is entirely at the buyer's risk, and the buyer agrees to SQTP is a service mark of Microchip Technology Incorporated in
defend, indemnify and hold harmless Microchip from any and the U.S.A.
all damages, claims, suits, or expenses resulting from such
use. No licenses are conveyed, implicitly or otherwise, under The Adaptec logo, Frequency on Demand, Silicon Storage
Technology, Symmcom, and Trusted Time are registered
any Microchip intellectual property rights unless otherwise trademarks of Microchip Technology Inc. in other countries.
stated.
GestIC is a registered trademark of Microchip Technology Germany
II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in
other countries.

All other trademarks mentioned herein are property of their

respective companies.

© 2017 - 2022, Microchip Technology Incorporated and its subsidiar-

ies.

All Rights Reserved.

For information regarding Microchip’s Quality Management Systems,
ISBN: 978-1-5224-9710-3
please visit www.microchip.com/quality.

 2017 - 2022 Microchip Technology Inc. and its subsidiaries DS20005720B-page 29

 Worldwide Sales and Service
AMERICAS ASIA/PACIFIC ASIA/PACIFIC EUROPE
Corporate Office Australia - Sydney India - Bangalore Austria - Wels
2355 West Chandler Blvd. Tel: 61-2-9868-6733 Tel: 91-80-3090-4444 Tel: 43-7242-2244-39
Chandler, AZ 85224-6199 China - Beijing India - New Delhi Fax: 43-7242-2244-393
Tel: 480-792-7200 Tel: 86-10-8569-7000 Tel: 91-11-4160-8631 Denmark - Copenhagen
Fax: 480-792-7277 Tel: 45-4485-5910
China - Chengdu India - Pune
Technical Support: Fax: 45-4485-2829
Tel: 86-28-8665-5511 Tel: 91-20-4121-0141
http://www.microchip.com/
China - Chongqing Japan - Osaka Finland - Espoo
support
Tel: 86-23-8980-9588 Tel: 81-6-6152-7160 Tel: 358-9-4520-820
Web Address:
www.microchip.com China - Dongguan Japan - Tokyo France - Paris
Tel: 86-769-8702-9880 Tel: 81-3-6880- 3770 Tel: 33-1-69-53-63-20
Atlanta Fax: 33-1-69-30-90-79
Duluth, GA China - Guangzhou Korea - Daegu
Tel: 678-957-9614 Tel: 86-20-8755-8029 Tel: 82-53-744-4301 Germany - Garching
Tel: 49-8931-9700
Fax: 678-957-1455 China - Hangzhou Korea - Seoul
Tel: 86-571-8792-8115 Tel: 82-2-554-7200 Germany - Haan
Austin, TX
Tel: 49-2129-3766400
Tel: 512-257-3370 China - Hong Kong SAR Malaysia - Kuala Lumpur
Tel: 852-2943-5100 Tel: 60-3-7651-7906 Germany - Heilbronn
Boston
Tel: 49-7131-72400
Westborough, MA China - Nanjing Malaysia - Penang
Tel: 774-760-0087 Tel: 86-25-8473-2460 Tel: 60-4-227-8870 Germany - Karlsruhe
Fax: 774-760-0088 Tel: 49-721-625370
China - Qingdao Philippines - Manila
Chicago Tel: 86-532-8502-7355 Tel: 63-2-634-9065 Germany - Munich
Itasca, IL Tel: 49-89-627-144-0
China - Shanghai Singapore
Tel: 630-285-0071 Fax: 49-89-627-144-44
Tel: 86-21-3326-8000 Tel: 65-6334-8870
Fax: 630-285-0075 Germany - Rosenheim
China - Shenyang Taiwan - Hsin Chu
Dallas Tel: 49-8031-354-560
Tel: 86-24-2334-2829 Tel: 886-3-577-8366
Addison, TX Israel - Ra’anana
China - Shenzhen Taiwan - Kaohsiung
Tel: 972-818-7423 Tel: 972-9-744-7705
Tel: 86-755-8864-2200 Tel: 886-7-213-7830
Fax: 972-818-2924 Italy - Milan
China - Suzhou Taiwan - Taipei
Detroit Tel: 39-0331-742611
Tel: 86-186-6233-1526 Tel: 886-2-2508-8600
Novi, MI Fax: 39-0331-466781
Tel: 248-848-4000 China - Wuhan Thailand - Bangkok
Tel: 86-27-5980-5300 Tel: 66-2-694-1351 Italy - Padova
Houston, TX Tel: 39-049-7625286
Tel: 281-894-5983 China - Xian Vietnam - Ho Chi Minh
Tel: 86-29-8833-7252 Tel: 84-28-5448-2100 Netherlands - Drunen
Indianapolis Tel: 31-416-690399
Noblesville, IN China - Xiamen Fax: 31-416-690340
Tel: 86-592-2388138
Tel: 317-773-8323 Norway - Trondheim
Fax: 317-773-5453 China - Zhuhai Tel: 47-7288-4388
Tel: 317-536-2380 Tel: 86-756-3210040
Poland - Warsaw
Los Angeles Tel: 48-22-3325737
Mission Viejo, CA
Romania - Bucharest
Tel: 949-462-9523 Tel: 40-21-407-87-50
Fax: 949-462-9608
Tel: 951-273-7800 Spain - Madrid
Tel: 34-91-708-08-90
Raleigh, NC Fax: 34-91-708-08-91
Tel: 919-844-7510
Sweden - Gothenberg
New York, NY Tel: 46-31-704-60-40
Tel: 631-435-6000
Sweden - Stockholm
San Jose, CA Tel: 46-8-5090-4654
Tel: 408-735-9110
Tel: 408-436-4270 UK - Wokingham
Tel: 44-118-921-5800
Canada - Toronto Fax: 44-118-921-5820
Tel: 905-695-1980
Fax: 905-695-2078

DS20005720B-page 30  2017 - 2022 Microchip Technology Inc. and its subsidiaries

09/14/21
Mouser Electronics

Authorized Distributor

Click to View Pricing, Inventory, Delivery & Lifecycle Information:

Microchip:
MIC5209-3.3YM MIC5209-4.2YS MIC5209-3.3YU MIC5209YM MIC5209YU MIC5209-5.0YS MIC5209-5.0YM
MIC5209-3.3YS TR MIC5209-2.5YS MIC5209-5.0YU MIC5209-5.0YM TR MIC5209-3.3YS MIC5209-1.8YM
MIC5209-2.5YM MIC5209-3.0YS MIC5209-3.6YS MIC5209YM TR MIC5209-3.6YM MIC5209YU TR MIC5209-
1.8YU MIC5209-2.5YU MIC5209-3.0YM MIC5209-5.0YS TR MIC5209-2.5YM TR MIC5209-5.0YU TR MIC5209-
3.0YU TR MIC5209-3.6YS TR MIC5209-1.8YM TR MIC5209-2.5YU TR MIC5209-3.0YM TR MIC5209YML TR
MIC5209-3.0YU MIC5209-3.3YM TR MIC5209-3.6YU MIC5209-1.8YU TR MIC5209-2.5YS TR MIC5209-3.6YU TR
MIC5209-4.2YS TR MIC5209-3.0YS TR MIC5209-3.3YU TR MIC5209-3.6YM TR MIC5209-5.0YU-TR MIC5209-
2.5YU-TR MIC5209YM-TR MIC5209-3.3YS-TR MIC5209-3.3YM-TR MIC5209-3.3YU-TR MIC5209-5.0YS-TR
MIC5209-2.5YM-TR MIC5209-4.2YS-TR MIC5209-5.0YM-TR MIC5209-3.0YS-TR MIC5209-3.6YS-TR MIC5209-
3.6YM-TR MIC5209-3.0YU-TR MIC5209-1.8YU-TR MIC5209-1.8YM-TR MIC5209-3.0YM-TR MIC5209-3.6YU-TR
MIC5209YML-TR MIC5209YU-TR MIC5209-2.5YS-TR MIC5209YML-T5