h110m Pro-Vh Plus
h110m Pro-Vh Plus
ELF
3/24
1. BLOCK DIAGRAM
www.vinafix.vn
2. POWER FLOW
3. POWER ON SEQUENCE
4. Timing Diagram for G3 to S5
Timing Diagram for S5 to S0/M0
5. Frequency Flow
6. Socket reflow profile
7. Lead-Free Rework Thermo profile Graphic for BGA & Chipset
Except for body temp, all temperatures are measured with thermo couples inside solder
joints, for better accuracy
Primary Factors for Successful Rework:
•Flux formulation and solder paste formulation and volume
•A capable thermal reflow profile
•Proper PCB pad solder preparation/wicking (clean-up of the residual solder
from the PCB pads)
Caution: Always remove batteries and thermal solutions following the system
design disassembly process steps prior to BGA rework to avoid damaging the BGA.
View this Intel®BGA / Socket Rework Video (10 minutes in length):
http://link.brightcove.com/services/player/bcpid1409165005001?bckey=AQ~~,AAA
AqwZd9wk~,X1Exj3sUi-03b71FGkEmVWbi4T4yGcor&bctid=1519232885001
8. MB Baking Time: 120〬C, 8 hours
BGA Baking Time:
9. Voltage Measure Point
Voltage Measure Point
Station Net Name Diode resistance
PU702 +3VSB_ATX 312
PQ605 +5VSB 503
PL201 VCCGT 494
ATX12V +12V_CPU 771
OQ760 +3VSB 312
PC550 VTT_DDR 421
EATXPWR +5VSB_ATX 613
PQ611 +5VSB_DUAL 545
EATXPWR +12V 605
EATXPWR +5V 446
O1RN1 +3V 49
10.Signal Measure Point
Signal Measure Point
Station Sequence Net Name Diode resistance
SR120 S_RTCRST# 782
1
SR121 S_SRTCRST# 782
NA 2 AC Power Switch ON NA
PQ605 +5VSB 503
3
OQ760 +3VSB 312
ESDC12 3.1 S_DPWROK 8
SR80 4 O_RSMRST# 8
O1R14 5 PWRBTN# 860
O1R68 6 O_IOPWRBTN# 536
O1R11 7/4.2 S_SLP_S3# 519
NA 7 S_SLP_A# NA
NA 7.1 S_SLP_LAN# NA
O1R10 8/4.1 S_SLP_S4# 520
EATXPWR 9 ATX_PSON#_R 582
EATXPWR 12V 605
EATXPWR 10 5V 446
O1RN1 3V 49
NA 11 P_PWROK_PS NA
O1R12 12 O_PWROK 26
SR75 13 H_CPUPWRGD 385
HR210 H_SVID_DATA 512
14
PR109 H_SVID_CLK 515
PC168 15 VCORE 448
SQ6 16 P_VR_READY_10 425
TPM 17 S_PLTRST# 496
ESDC3 18 H_CPURST# 372
XC74 O_X1_RST# 595
19
XC71 O_X16_RST# 590