Dry-Film Developments for LDI - Technology
Russell Crockett Circuit Packaging Materials. DuPont Electronic Technologies
Advanced Manufacturing Techniques.
Rotherham 4 August. 2009
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Laser Direct Imaging for Printed Circuit Manufacture. Why Use LDI to expose a dry film resist?
Is it an Enabling Technology?
Improve production capabilities
Does it Improve Yields?
Reduce costs
9/3/2009 DUPONT CONFIDENTIAL
Laser Direct Imaging for Printed Circuit Manufacture. The 5 Steps to Create the Image.
Surface Preparation. Resist Lamination.
Resist Exposure.LDI step. p p
Resist Development. Circuit Creation.
Etching. Plating.
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Laser Direct Imaging for Printed Circuit Manufacture. The main Users of LDI Equipment. Prototype Market - Enabling Technology.
Speed to production. No phototool preparation. Flexability. Single board production.
HDI Market Yield Improvement.
Side to side, layer to layer registration. Large panel registration to micro vias. Reduced repeat fault ( dirt ) imaging for fine line. Better quality and lower total cost.
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LDI History
Polyscan PDI-2000 Nikon Pentax DI-2000
Orbotech DP-100
Dai-Nihon Screen
1990
1995
2000
UV Laser out put
360nm 405nm
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* 350 - 365nm * 400 - 415nm
LDI Technology 355nm vs. 405nm
Polygon Mirror System DMD (Digital Micro Mirror Devise) System
Laser
Wave Length355nm DMD
Scan direction Feed direction
Laser
Wave Length405nm
Polygon Mirror
Panel
Feed direction
Panel
Polygon Mirror 305nm
Orbotech
DMD. Digital Micro-mirror Devise 405nm
Fuji Pentax (ORC) Hitachi
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Polygon Optical System
source: ORBOTECH
AOM UV Laser Beam Splitter S litt Polygon Lens System
Stage movement during imaging Panel
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DMD 405nm LDI system
Optical system Exposure
Light Lens
DMD
CAD data
Focus Lens
ON OFF
Optical head
Imaging
Direct imaging Panel feed direction
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DMD Digital Micro mirror Device
Laser technology and Resist evolution.
Polygon Plotters ( DP 100 )
Low energy Productivity gated by photospeed, ~ 10mJ
Dry film resists( LDI 300, 500 Series )
V Very hi h photospeed, high h t d 8 - 10mJ 30micron resist 15 18mJ 50micron resist
Trade off
Unstable to heat and yellow light. Poor processing productivity, development, stripping. Brittle, poor tenting. Conventional resist 60 75mJ
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LDI History
Orbotech DP-100
Dai-Nihon Screen
Polyscan PDI-2000
Nikon
Pentax DI-2000
1990
1995
LDI 200
2000
LDI 300
LDI 500
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LDI 500 series dry-film 405nm + 355nm
LDI540 @ 405nm LDI540 @ 355nm
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LDI 500 series dry-film 405nm + 355nm
LDI540 @ 405nm 25 28 mJ/cm2 LDI540 @ 355nm 14 16 mJ/cm2
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LDI Dry-Film Developments
Orbotech DP-100
Dai-Nihon Screen LI-7000
Polyscan PDI-2000
Nikon
Pentax DI-2000
1990
1995
LDI 200 LDI 300
2000
LDI 500
LDI 800
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Laser technology and Resist evolution.
Digital Micro Mirror Device, LDI plotter
High resolution Smaller panel format Used U d mainly i A i i l in Asia. Needed specific photo-initiator at 405nm. Not compatible with other dry film photo-initiators. Not compatible with other exposure equipment. Riston* LDI 800 developed specifically for 405nm wave length.
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Laser technology and Resist evolution.
Polygon Plotters ( Paragon 8000 )
Higher energy Productivity gated by photospeed, ~ 18mJ
Dry film resists( LDI 7000 and 7200 Series )
Hi h photospeed, High h t d
Benifits
More stable to heat and yellow light. Improved resolution. Improved resist flow and adhesion. Improved processing productivity, development, stripping. Higher yields.
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LDI Dry-Film continued developments
Orbotech DP-100
Dai-Nihon Screen
Polyscan PDI-2000
Nikon
Pentax DI-2000
1990
1995 199
LDI 200
2000
LDI 300 LDI 500 LDI 800 LDI 7000
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Laser Direct Imaging for Printed Circuit Manufacture. Why Use LDI to expose a dry film resist?
Is it an Enabling Technology?
Improve production capabilities
Does it Improve Yields?
Reduce costs
9/3/2009 DUPONT CONFIDENTIAL
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Why Use LDI to expose a dry film resist?
Yield Imaging Defects, none LDI exposure
100 90 80 70 60 Yield % 50 opens/nicks 40 30 20 10 0 75 50 Feature size ym
without Repeats with Repeats
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Why Use LDI to expose a dry film resist?
Yield Imaging Defects, 50ym
100 90 80 70 Yield % 60 Imaging 50 Defects 40 30 20 10 0 1 LDI Exposure 2
( non-repeating )
without Cleaning with Cleaning
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Why Use LDI to expose a dry film resist? Yield Mis-registration Defects (610 x 510mm)
100 90 80 70 60 Yield % 50 Misregistration 40 30 20 10 0 Feature size 50ym
Film exposure LDI exposure
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Riston* LDI 7040
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LDI Dry Film Resist Requirements All Applications
Adhesion to many surface finishes Productivity, all processes. Flow at lamination. Resolution, Resolution ~ 50ym Etching, Acid and Alkaline Plate Cu, Sn, PB,Ni, Au. Tenting, T&E and Plating. Stability, Transport, yellow light. Can be exposed on conventional printers. Highest possible yields.
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LDI Dry Film Resist Requirements Best in class dry film, plus LDI exposure
Riston* LDI 7000 and 7200 series.
Good Adhesion on all surfaces Good Flow - Characteristics High Resolution Good Tenting ( 8mm through 65m Cu acid etch ) High Productivity - fast development - fast and easy stripping Acid and Alkaline etch. Plating, Cu, Sn, Pb, Ni, Au.
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LDI 7000,7200, Dry Film Resists
Riston* LDI 7000 and 7200 series.
Thicker resists 7250,7262,7275 and 7299
Optimized for through polymerization.
Cover sheet clarity and quality. High resolution capability, sub 50ym. ( resist thickness ) Compatibility with standard exposure equipment. Production proven high yield performance.
Etching innerlayers. Tent and etch. Cu & Sn and Ni & Au plating.
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Riston* LDI 7000 / 7200 Series LDI 7030 16 mJ/cm2 LDI 7040 20 mJ/cm2 LDI 7250 30 mJ/cm2 Paragon 8000, gate energy 18mJ.
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LDI 7040 - 37 micron L/S
14 mJ/cm2
20 mJ/cm2
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LDI 7030
LDI 7250
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Riston* LDI 7040
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Riston* LDI 7250
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Riston* LDI 7250
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LDI Productivity? Paragon + DuPont WBR 2100
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