Scribd
Upload
538 views6 pages

Semiconductor Wafer Fab QC & Package Assy QC Standard Process

The document outlines the quality assurance and manufacturing flow process for molded components. It includes numerous quality control gates at each stage of production from raw material receipt through final testing, packaging, and shipping. Key stages involve wafer fabrication with statistical process control, electrical testing of dies, optical inspection after sawing and lead bonding, molding, plating, marking, and final product testing before shipment.

Uploaded by

2malaysia
Copyright
© Attribution Non-Commercial (BY-NC)
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PDF, TXT or read online on Scribd
538 views6 pages

Semiconductor Wafer Fab QC & Package Assy QC Standard Process

The document outlines the quality assurance and manufacturing flow process for molded components. It includes numerous quality control gates at each stage of production from raw material receipt through final testing, packaging, and shipping. Key stages involve wafer fabrication with statistical process control, electrical testing of dies, optical inspection after sawing and lead bonding, molding, plating, marking, and final product testing before shipment.

Uploaded by

2malaysia
Copyright
© Attribution Non-Commercial (BY-NC)
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PDF, TXT or read online on Scribd
You are on page 1/ 6

QUALITY ASSURANCE & MANUFACTURING FLOW STANDARD MOLDED PROCESS

PRODUCTION CONTROL MATERIAL RECEIPT


Critical raw materials received.

QUALITY CONTROL GATE INCOMING INSPECTION


Raw materials inspected against DS-IMP procurement specifications.

WAFER FABRICATION
Raw wafers are processed through diffusion, photolithography, implant, thin films, and etch. All areas use SPC to control the process.

QUALITY CONTROL DURING WAFER FABRICATION


A) Critical Dimensions B) Oxide Thickness C) Thin Film Thickness D) Sheet Resistivity E) Reflectivity F) CV Drift G) Mask Alignment H) Particles I) Etch Completion J) Visual Defects

QUALITY CONTROL GATE WAFER ACCEPTANCE


A) Visual Each wafer is visually inspected under a microscope for defects, mask alignment, and mask sequence. B) Parametric Test Five specially designed test sites on each wafer are tested for process and product parameters to verify processing integrity.

100% DIE ELECTRICAL TEST


All die are either 100% or sampled at electrical sort and tested for functionality and parameter conformance to wafer sort limits. Yields used for process, design, and test analysis.

Page

QUALITY ASSURANCE & MANUFACTURING FLOW STANDARD MOLDED PROCESS


QUALITY CONTROL MONITOR DIE ELECTRICAL TEST
Visual Inspection for: A) Process Defects B) Probe Scratches or Other Damage C) Electrical Test Anomalies D) Correct Probe Marks

SHIP WAFERS TO ASSEMBLY


100% WAFER SAW
100% Saw through and clean.

QUALITY CONTROL MONITOR SAW


A) RI Wafer Resistivity B) Kerf Width C) Chips and Cracks Criteria: A) Misscribed Die B) Scratches C) Smooth Cut

QUALITY CONTROL GATE OPTICAL INSPECTION


Per MIL-STD 883C Method 2010.8 Condition B LTPD = 5%

DIE MOUNT QUALITY CONTROL MONITOR DIE MOUNT INSPECTION


Die adhesion test by subcontracted assembler. Visual inspection (4 dice 1X/ Machine/ Shift, 20 units, Acc = 0, Rej = 1) Criteria: A) Scratches, Cracks on Die B) Die Placement,Orientation C) Stray Epoxy

Page

QUALITY ASSURANCE & MANUFACTURING FLOW STANDARD MOLDED PROCESS


DIE MOUNT CURE
175 6C /1Hr.

LEAD BONDING QUALITY CONTROL GATE LEAD BONDING


LTPD = 5%

QUALITY CONTROL GATE LEAD BOND INSPECTION


Bond Strength tested once per shift. Minimum grams for 1.3 mil. = 3 grams.

QUALITY CONTROL GATE 3RD OPTICAL INSPECTION


Per MIL-STD 883C Method 2010.8 Condition B LTPD = 5% Criteria: A) Missing Die B) Missing Wires C) Poor Lead Dress D) Conductive Contamination

MOLD
Post Mold Cure 175 5C/ 6 Hr.

QUALITY CONTROL MONITOR MOLD


(4X/Shift, 20 units, Acc = 0, Rej = 1) Criteria: A) Deflash B) Package Voids C) Bubbles, Blisters

TRIM & FORM LEADS

Page

QUALITY ASSURANCE & MANUFACTURING FLOW STANDARD MOLDED PROCESS


QUALITY CONTROL MONITOR TRIM & FORM
(4X/Shift, 20 units, Acc = 0, Rej = 1) Criteria: A) Lead Defects B) Burrs or Incomplete Trim C) Mold Flash

PURE TIN PLATING QUALITY CONTROL GATE ELECTROPLATE


LTPD = 5% Criteria: A) Missing Plating B) Extraneous Solder C) Flaking, Peeling

QUALITY CONTROL GATE SOLDER THICKNESS


X-ray fluroderm on 12points/package/machine/shift, from 2 strips The pure tin thickness=400 microinch minimum

QUALITY CONTROL MONITOR SOLDERABILTY


Per MIL-STD 883C Method 2003 - 6 units Criteria: A) 100% Coverage on Functional Area of Lead B) Solder Bridging, Lump, Ball C) Contamination

MARK QUALITY CONTROL MONITOR MARK


(4X/Shift, 20 units, Acc = 0, Rej = 1)

Page

QUALITY ASSURANCE & MANUFACTURING FLOW STANDARD MOLDED PROCESS


Criteria: A) Illegible Marking B) Incomplete Marking C) Marking Placement

MARK CURE
160 5C/ 1Hr.

QUALITY CONTROL MONITOR MARK PERMANENCY


Per MIL-STD 883C Method 2015 (2X/Shift, 22 units, Acc = 0, Rej = 1)

PRODUCTION FINAL TEST (25C)


Every unit tested for conformance to all guaranteed datasheet parameters.

QUALITY CONTROL GATE ELECTRICAL TEST (25C)


A sample is pulled per MIL-STD 105D to guarantee an outgoing electrical AQL of 0.1% for guaranteed electrical parameters.

PRODUCTION FINAL VISUAL INSPECTION


Every unit checked for correct marking, orientation, and any package defects obtained during assembly, test, or production conditioning.

QUALITY CONTROL GATE FV INSPECTION


A sample is pulled per MIL-STD 105D to guarantee an AQL of 0.1% for visually rejectable defects.

PRODUCTION PRODUCT LABELING & PACKAGING

SHIP TO DS-IMP

QUALITY CONTROL MONITOR INCOMING INSPECTION

Page

QUALITY ASSURANCE & MANUFACTURING FLOW STANDARD MOLDED PROCESS


Criteria: A) Labeling and Device Marking Correct B) Packaging C) Quantities Correct

QUALITY CONTROL GATE LOT ACCEPTANCE INTO FINISHED GOOD STORES


Each sublot examined by QA to verify conformance to standards.

FINISHED GOOD STORES


Product stored with finished goods disposition form attached detailing the products store classification.

SHIPPING PREPARATION
Product packaged using approved anti-static and Faraday shielding materials.

QUALITY CONTROL GATE SHIPPING


Criteria: A) Labeling Correct B) Packaging and Preparation for Shipment Correct C) Quantities Correct

SHIPMENT

Page

You might also like