0% found this document useful (0 votes)
50 views

Module 4 Mem

This document discusses scaling laws that are applicable to the design of microsystems as their size decreases. It covers how geometry, rigid body dynamics, electrostatic forces, and fluid mechanics are affected by scaling down. Some key points: 1) As size decreases, volume decreases faster than surface area due to their different scaling laws. This impacts properties like heat transfer and surface forces. 2) Rigid body dynamics scaling shows that acceleration, time, and power density needed for motion all increase as size decreases. Electrostatic forces also decrease significantly with size. 3) Examples demonstrate how scaling laws can be used to estimate changes in properties like torque required or breakdown voltage when dimensions are reduced.

Uploaded by

Harshitha C
Copyright
© © All Rights Reserved
Available Formats
Download as PDF, TXT or read online on Scribd
0% found this document useful (0 votes)
50 views

Module 4 Mem

This document discusses scaling laws that are applicable to the design of microsystems as their size decreases. It covers how geometry, rigid body dynamics, electrostatic forces, and fluid mechanics are affected by scaling down. Some key points: 1) As size decreases, volume decreases faster than surface area due to their different scaling laws. This impacts properties like heat transfer and surface forces. 2) Rigid body dynamics scaling shows that acceleration, time, and power density needed for motion all increase as size decreases. Electrostatic forces also decrease significantly with size. 3) Examples demonstrate how scaling laws can be used to estimate changes in properties like torque required or breakdown voltage when dimensions are reduced.

Uploaded by

Harshitha C
Copyright
© © All Rights Reserved
Available Formats
Download as PDF, TXT or read online on Scribd
You are on page 1/ 18

MODULE 4 MEMS (15EC831)

MODULE 4

SCALING LAWS IN MINIATURIZATION

Syllabus

Scaling Laws in Miniaturization


4.1 Introduction
4.2 Scaling in Geometry
4.3 Scaling in Rigid-Body Dynamics
4.4 Scaling in Electrostatic Forces
4.5 Scaling in Fluid Mechanics
4.6 Scaling in Heat Transfer

48
Dept of ECE,VVIET
MODULE 4 MEMS (15EC831)

4.1 Introduction to Scaling

• A successful industrial product requires meeting consumer expectations to be intelligent and


multifunctional.
• Sensors, actuators, and microprocessors have to be systematically integrated and packaged in
these products.
• The constraints on the size and geometry of the products require miniaturization of these
components to improve on physical appearance, volume, weight and economy.
• There are two types of scaling laws applicable to design of microsystems.
• The first type of scaling law is dependent on the size of objects- such as geometry.
• Here the behavior of the objects is governed by the law of physics
• Ex. Scaling law include the scaling of rigid-body dynamics and electrostatic and
electromagnetic forces.
• The second type of scaling law involves the scaling of phenomenological behavior of
microsystems.
• Here both the size and material properties of the system are involved.
• Ex this is used in thermos fluids in microsystems

4.2 Scaling in Geometry

• Volume and surface are two physical quantities that are frequently involved in micro device
design.
• Volume relates to the mass and weight of device components.
• Ex. thermal inertia is related to the heat capacity of the solid which is a measure of how fast we
can heat or cool a solid. This is used to design a thermally actuated device.
• Surface properties are related to pressure and the buoyant forces in fluid mechanics and heat
absorption or dissipation by a solid in convective heat transfer.
• To minimize a physical quantity, one must weigh the magnitudes of the possible consequences
of the reduction on both the volume and surface of the particular device.
• Equal reduction of volume and surface of an object is not normally achievable in a scale down
process.
• Consider the example of a solid of rectangular geometry having 3 sides a>b>c.

49
Dept of ECE,VVIET
MODULE 4 MEMS (15EC831)

• Volume V= abc and the Surface area S= length X breadth.


• If l represents the linear dimension of the solid, then Volume α l3 and the surface Sα l2.
• Thus S/V = l-1
• Consider an example in figure 6.2.

• Elephant has and S/V ratio of 10-4 /mm and dragonfly has10-1 /mm
• Hence dragon fly requires less energy and power and so low consumption of food and water,
while elephant needs more food to generate more energy.
• From the scaling formula, a reduction in size by 10 times(l=0.1) means 103 =1000 times
reduction in volume , but 102 =100 times reduction in surface area.
• A reduction of volume by 1000 means 1000 times reduction in weight.
• Micro mirrors are essential parts of micro switches used in fiber optic networks in
telecommunication.
• These mirrors rotate to a tightly controlled range at high rates.
• Angular momentum is an important factor in both rotation control and rate of rotation.

• Ex. Estimate the reduction of torque required in turning a micro mirror with a reduction of 50
percent in the dimensions.

50
Dept of ECE,VVIET
MODULE 4 MEMS (15EC831)

Solution: the torque required to turn the mirror about the y-y axis is related to mass moment of inertia
of the mirror Iyy, expressed as

Where M= mass of the mirror and C= width of the mirror


Since the mass of the mirror is M = ρV = ρ(bct),
Where ρ= mass density of the mirror material, the mass moment of inertial of the mirror is

The mass moment of inertial of the mirror with a 50 % reduction of the size becomes

A reduction of a factor of 32 is achieved in mass moment of inertia, giving 50% reduction of dimension.

4.3 Scaling in Rigid-Body Dynamics


• Forces are required to make parts move, and power is the source for the generation of forces.

51
Dept of ECE,VVIET
MODULE 4 MEMS (15EC831)

• Inertia decides the amount of force required to move a part and how fast movements can be
achieved and stopped.
• The inertia of a solid is related to its mass and the acceleration required to initiate or stop the
motion of a component.
• When minimized, the effect of reduction in the size on the power P, force F and pressure p and
the time t required to deliver the motion has to be seen

4.3.1 Scaling in Dynamic Forces

• If a solid moves from one position to another, the distance that the solid travels, S, is
S α l, where l stands for the linear scale.
The velocity v =s/t
• From particle kinematics, wkt

4.3.2 the Trimmer Force Scaling Vector


• Trimmer proposed a Force scaling vector F which is a unique matrix related to parameters
of acceleration a, time t and power density P/V0 required for scaling of systems in motion

52
Dept of ECE,VVIET
MODULE 4 MEMS (15EC831)

Accleration a:
• Consider F=Ma in which a = F/M
• Scaling is obtained as

Time t:
• Consider


• The transient time is expressed as

Power Density P/V0 :


• No solid or fluid can move without a power supply.
• Power is very important parameter in the design of microsystems.
• Insufficient power supply to a microsystem results in the inactivity of the system.
• System may suffer structural damage such as over heating with excessive power supply.
• Excessive power requirements increases the operational cost, reduce the lives of biomedical
devices implanted in human bodies.
• Wkt, Work done is equal to force times distance travelled W=F X s.
• Power is defined as work done per unit time P = W/t.
• Power density is expressed as


• Power density is related to force scaling vector as

53
Dept of ECE,VVIET
MODULE 4 MEMS (15EC831)


• Using this the scaling laws for rigid body dynamics is established


• This table is useful in scaling down devices in a design process
Ex.

54
Dept of ECE,VVIET
MODULE 4 MEMS (15EC831)

4.3 SCALING IN ELECTROSTATIC FORCES

• Consider the configuration of a parallel plate capacitor.


• The electric potential energy induced in the parallel plates is


• The above breakdown voltage V varies with the gap between the two plates as per paschen
effect.
• Fig 6.5 shows that the breakdown voltage V drops drastically with increase in d for d<5µm.
• It decreases after the gap widens from d>5µm.
• Voltage variation reverses at d ͌ 10µm.
• The breakdown voltage increases linearly as gap increases.
• We can say that applied voltage Vαd or in scaling Vαl1 for the working range of d˃ 10 µm
• The scaling of is neutral, so α
• The electrostatic potential is expressed


55
Dept of ECE,VVIET
MODULE 4 MEMS (15EC831)


• A factor of 10 decrease in linear dimensions(W,L,d) will decrease the potential energy by
a factor of 103 =1000
• Wkt, the electrostatic forces can be produced in 3 dimensions in parallel plate arrangements
as

• The three force components .


• The electrostatic forces are of the order 2.
Ex.

56
Dept of ECE,VVIET
MODULE 4 MEMS (15EC831)

• Here the gap d is constant and


• Fd α l2 for the normal force component
• Fw α l2 for the force component along the width
• FL α l2 for the normal force component along the length
• So, a reduction by a factor of 10 reduces the electrostatic forces by 100

Basics of fluid mechanics


• Many of the MEMS devices involve moving fluids in both liquid and gaseous forms.
• Mechanical designs of these systems requires the application of principles of fluid dynamics
and heat transfer.
• Fluids in motion are called fluid dynamics and at rest is called fluid statics.
• There are two types of fluids namely non-compressible fluids ex. Liquids and compressible
fluids ex. Gases.
• Fluids are aggregation of molecules.
• These molecules are closely spaced in solids, widely spaced in liquids and in gases they are
loosely spaced.
• These molecules are feely moving in liquids unlike solids. So liquids have volume and no shape.
• Solids can resist any shear force or shear stress without moving.
• Fluids have viscosity that causes friction when they are set in motion.
• Viscosity is a measure of fluid’s resistance to shear when the fluid is in motion.
• Hence a driving force if needed to make a fluid flow in channels
• A continuum fluid is a fluid with its properties continuously varying in space
• Fluids can be put into motion even by a slight shear force.
• The induced shear strain is expresses as angle θ

57
Dept of ECE,VVIET
MODULE 4 MEMS (15EC831)

• This shear deformation is considered possible by a relative motion of a pair of plates placed at
the top and bottom of the bulk fluid

ER

• The relative motion of the plates represents a shear force which causes the fluid flow.
• The associate shear stress τ is considered proportional to the rate of change of induced shear
strain θ given by

• The proportional constant µ is called the dynamic viscosity of the fluid


• Fluids that exhibit such linear relationship are called Newtonian fluids.

6.5 SCALING IN FLUID MECHANICS



• Fluids flow under the influence of shear forces or shear stresses and the continuum fluid
mechanics equations breaks down at submicrometer and nanoscales
• The breakdown is due to the capillary effect
• Consider the figure 6.7

58
Dept of ECE,VVIET
MODULE 4 MEMS (15EC831)

• The volume of the fluid V can be expressed as the area(A) X height(h).


• The fluid in originally in rectangular shape between two imaginary parallel plates
• Moving the top plate in the x direction to the right induces the motion of the fluid.
• The fluid shape now changes to parallelogram
• The shear stress applied is τ results in a velocity profile which is maximum at the top wall and
zero at the bottom wall.
• The viscosity of the fluid, causes the variation of the velocities in the moving fluid..
• Expressing viscosity as


• Figure 6.8 shows a fluid flow through a small circular conduit of length L and radius a.

59
Dept of ECE,VVIET
MODULE 4 MEMS (15EC831)

• The pressure drop over the length L is computed using Hagen-Poiseuille law as

• The rate of volumetric flow of the fluid Q is expressed as



• The pressure drop for a section of a capillary tube of length L is computed as


• The scaling laws for fluid flows in capillary tubes are derived as for volumetric flow and
for pressure drop per unit length, whre a is the radius of the tube.

60
Dept of ECE,VVIET
MODULE 4 MEMS (15EC831)

Ex.

Soln: wkt volumetric flow where a is the radius of the tube.


So volumetric flow reduces by 104 = 10000 times

Also pressure drop per unit length is so this increases by 102 = 100 times.

• When the radius of the conduit s very small, capillary effect appears.
• This is due to surface tension of the fluids.
• The pressure required to overcome the surface tension is
• So, the pressure drop per unit length of a liquid is


Ex. What will happen to the pressure drop in the fluid in above ex. If the tube radius is microscale?

Soln: the pressure drop per unit length of the tube, from the scaling law in equation increases
1000 times with a 10 times reduction of the tube radius.
The situation is one order of magnitude more severe than the case in meso or macroscale.

• Due to adverse effect in scaling down, special pumping techniques such as piezoelectric,
electro-osmotic, electrohydrodynamic pumping are used
• These are based on surface pumping forces. Ex. Piezoelectric pump.
• Here the forces generated on tube wall is used to drive the fluid flow is used.
• The surface force F, proportional to the surface area of the inner wall of the tube scales
favorably.
• This surface area of the inner wall of the tube is S= 2πaL and the volume of the fluid is V= πa2L
• The surface area to volume ration S/V = 2/a.
• Scaling down the tube radius will result in the increase of the surface force available for
pumping the unit volume of the fluid

6.6 SCALING IN HEAT TRANSFER


• In microsystems, heat transfer is an essential part of the design.
• Heat transfer is done by conduction, convection and by radiation in laser treatments.

61
Dept of ECE,VVIET
MODULE 4 MEMS (15EC831)

• Scaling laws are done in two scales, one being the meso and microscale and the other in sub
micrometer scale(<1µm).
• With this sub micrometer designs thermos physical properties vary with the size of MEMS.
6.6.1 Scaling in Heat Conduction
Basics
Heat conduction in a solid slab:

• In the figure, a solid slab with the temperature at the left side wall maintained a Ta and
the right side wall maintained at Tb with Ta > Tb
• The temperature difference causes the heat to flow from left side to right side of the slab.
• The total amount of heat flow through the slab, Q, is proportional to the cross-sectional
area A, the temp difference between the two faces, the time t allowed for the heat to
flow.
• The heat flow is inversely proportional to the distance that the heat has to travel, i.e.,
thickness d of the slab

K is the proportionality constant which is the thermal conductivity of the solid


6.6.1.1 Scaling in Heat Flux
• Heat flux q is defined as the heat flow per unit area and time.
• It is a vector quantity and is expressed as

62
Dept of ECE,VVIET
MODULE 4 MEMS (15EC831)

• This heat conduction in solids is governed by the Fourier Law


• For one dimensional heat conduction along the x co-ordinate, we have


• Where qx is the heat flux along x coordinate, k is the thermal conductivity of the solid
and T(x,y,z,t)is the temperature field in the solid in a Cartesian coordinate system at
time t.
• The heat conduction in a solid is


• From the above equation, the scaling law for heat conduction for solids in meso and
microscales is Qα l1 (A is replaced by α)
• So the reduction in size leads to the decrease of total heat flow in a solid
6.6.1.2 Scaling in Termal Conductivity in Submicrometer Regime
• Thermal conductivity k in solids is estimated by

• Here λ α 1/ρ, where ρ is the mass density of the solid with an order similar to volume
i.e., l3
• The scaling of heat flow in a solid in the sub micrometer regime is obtained by
combining the above two equations.


• So, a reduction in size of 10 would lead to a reduction of total heat flow by 100
6.6.1.3 Scaling in Effect of Heat Conduction in Solids of Meso and Micro scales
• F0 is the Fourier number with has no dimension
• It is used to determine the time increments in a transient heat conduction analysis

63
Dept of ECE,VVIET
MODULE 4 MEMS (15EC831)


• Here α is the thermal diffusivity of the material
• t is the time for heat to flow across the characteristic length L
• Fourier number is the ratio of the rate of heat transfer by conduction to the rate of energy
storage in the system.
• From the above equation, the scaling in time for heat conduction in a solid is


• Where both F0 and α are constants

Ex. Estimate the variation of the heat flow and the time required to transmit heat in a solid with a
reduction of size by a factor of 10
Soln: from the equations

and
the total heat flow and the time required for heat transmission are both reduced by 102 =100 times with
a reduction of size by a factor of 10

6.6.2 Scaling in Heat Convection

• There exists the boundary layers at the interfaces of solids and fluids.
• Heat transfer in fluids is in the mode of convection governed by Newton’s cooling law
expressed as


• Heat transfer h depends on the velocity of the fluid
• This does not play a significant role in scaling the heat flow.
• The total heat therefore depends on the cross-sectional area A, of the order of l2
• Therefore the scaling of heat transfer in convection is for fluids in meso and micro
regimes.
• Consider only the convective heat transfer of gases in the regime

64
Dept of ECE,VVIET
MODULE 4 MEMS (15EC831)

• When the gases pass in narrow channels at sub micrometer scale, the heat transfer break down.
• The convective heat transfer has become conduction of heat among the gas molecules due to
boundary layer effect
• Consider the figure given

• The passage is represented by a gap H <7λ, where λ is the mean free path of the gas
• The transfer of heat between the two plates is predominantly by conduction through the gas
between the plates rather than convection.
• The mean free path is proportional to the reciprocal of mass density of gas as

• The thermal conductivity of the gas is given by

• C is the specific heat of the gas at constant volume and the mean velocity V is obtained from


• Here T is the mean temperature of the gas and m is the molecular weight of the gas

65
Dept of ECE,VVIET

You might also like