Frequently Asked Questions

Storage and Handling Q: Should solder paste be used direct from refrigeration?

Q: Do paste containers require a certain orientation during A: No. Solder paste should be used at “room temperature.”
storage? This will assure intended viscosity and prevent potential
condensation. Recommended warm-up time is four hours.
A: Yes. Syringes and cartridges should be stored vertically with
tips facing down. Jars should be stored right side up. Q: Can solder paste be warmed up quicker than the
recommended 4 hours?
Q: Does solder paste require refrigeration?
A: We do not recommend it. However, if necessary, faster
A: Suggested storage temperature for paste is between 40°F warm-up may be achieved by placing the sealed container in a
and 70°F (4°C to 21°C). If ambient conditions are outside water bath or similar equipment at or near ambient temperature.
this temperature range, then refrigeration is required. Syringes require approximately fifteen minutes while jars and
cartridges can take up to 45 minutes. DO NOT heat paste with
Q: What is the shelf life of solder paste? an oven or other environment set above “room temperature.”
Dry all packing completely prior to use to prevent water coming
A: At a minimum, six months from date of shipment when in contact with the solder paste.
stored as recommended. Paste should not be frozen. Warmer
conditions will reduce shelf life and/or cause flux separation. Q: Should solder paste be re-refrigerated?
The end user needs to determine actual shelf life if stored outside
recommendations. In this case, the replacement guarantee is void. A: No. Solder paste should be used as needed. Material should
be left at room temperature once removed from refrigeration. In
Q: What happens to solder paste if it is frozen? the event that a container of solder paste would go unused after
removal from refrigeration, and ambient temperature exceeds
A: In many cases, nothing happens. However, some pastes are 75°F (25°C) for an extended time before use, it may be returned
susceptible to damage that impairs paste performance. As a to cool storage.
consequence, we recommend not freezing any of our solder
pastes and paste fluxes. If you do “freeze” some paste, test its Q: Can excess stenciling solder paste be re-used?
performance before use on live product.
A: In general, we do not recommend reuse of solder paste
Q: Will solder paste last beyond the stated six-month shelf life? remaining on the stencil. However, if paste is relatively fresh,
it can be put into a jar and stored for reuse. Never put used
A: EFD guarantees that properly stored solder paste will perform paste back into the same container as new paste. This will
properly for up to 6 months from date of shipment, or material contaminate the unused paste and degrade its performance.
will be replaced at no charge. Many of our solder pastes will
last well beyond the warranty period. Customers wishing to use Process and inspection
“expired” paste should re-qualify the material by running test
boards or parts through the entire production process to confirm Q: I’m getting solder balls on the sides of my chip
good soldering results. components. How do I make them go away?

Q: Are there telltale signs of improper storage and/or handling? A: Solder balls on the sides of chip components are typically
referred to as “solder beads” due to their large size. Two
A: Aside from poor performance, the other major sign of process changes may be possible to minimize or eliminate
mishandled solder paste is separation of the flux and alloy the problem.
particles. Solder paste should be uniform in color and consistency.

EFD, Inc. 14 Blackstone Valley Place, Lincoln RI 02865 USA www.efd-inc.com

North and South America: 401.333.3800 Fax: 401.333.4954 [email protected]
Europe: +44(0)1582 666334 Fax: +44(0)1582 664227 [email protected]
China: +(86)215854 2345,806 899 Fax: (86)215031 7583 [email protected]
The Wave Design is a trademark of Nordson Corporation ©2008 Nordson Corporation v010708
1) Aperture reductions designed to decrease the quantity of Q: What should my no-clean residue look and feel like?
paste trapped between the part and board solder mask. The
most effective shape is a triangular shape removed from the A: No-clean residues should be colorless or nearly so to
inside edge of each aperture. Two other options in use are a facilitate visual inspection. They should be tack free and fairly
home plate shape and simple aperture reduction on the inside brittle, allowing for easy penetration of test probes without
edges. Call Technical Service for specifics. clogging.

2) Component placement accuracy relative to paste is critical. Q: We want to switch to lead free solder. What do we have
Reductions all by themselves do not guarantee elimination of to worry about?
solder balls if pick & place accuracy is inadequate. Tune your
equipment to optimize vision recognition and placement A: The issue of greatest concern is component survivability
accuracy of your chip components. at the higher reflow temperatures required for lead free solder
alloys. Both circuit board materials and components have
Q: What are the effects of a Nitrogen atmosphere on solder been developed around lower temperature solders and can be
paste reflow? damaged when processed at lead free reflow temperatures.
Check your component specifications.
A: Four effects are more significant than others.
Q: Will our inspection criteria have to change?
1) Increased surface tension of molten solder alloy changes
fillet shapes, improves part centering, and may increase A: Yes. Only Sn63/Pb37 has the mirror smooth, bright
tombstoning. finish that inspectors are typically trained to look for. High
tin, lead free alloys will look light colored and dull or grainy
2) The low oxygen content retards oxidation, allowing for longer in comparison. This look is a function of the alloy crystal
and hotter profiles. structure. EFD strongly recommends retraining and
requalification of inspection and rework personnel when
3) Nitrogen transfers heat better than air so set points may switching from an Sn/Pb soldering process to a lead free
be lower. process.

4) Evaporation of many fluid flux constituents is increased,

thereby reducing the quantity of flux residue.

EFD, Inc. 14 Blackstone Valley Place, Lincoln RI 02865 USA www.efd-inc.com

North and South America: 401.333.3800 Fax: 401.333.4954 [email protected]
Europe: +44(0)1582 666334 Fax: +44(0)1582 664227 [email protected]
China: +(86)215854 2345,806 899 Fax: (86)215031 7583 [email protected]
The Wave Design is a trademark of Nordson Corporation ©2008 Nordson Corporation v010708