NPN Silicon: Semiconductor Technical Data
NPN Silicon: Semiconductor Technical Data
2
BASE
1
EMITTER
1
MAXIMUM RATINGS 2
3
Rating Symbol Value Unit
Collector – Emitter Voltage VCEO 400 Vdc CASE 29–04, STYLE 1
TO–92 (TO–226AA)
Collector – Base Voltage VCBO 500 Vdc
Emitter – Base Voltage VEBO 6.0 Vdc
Collector Current — Continuous IC 300 mAdc
Total Device Dissipation @ TA = 25°C PD 625 mW
Derate above 25°C 5.0 mW/°C
Total Device Dissipation @ TC = 25°C PD 1.5 Watts
Derate above 25°C 12 mW/°C
Operating and Storage Junction TJ, Tstg – 55 to +150 °C
Temperature Range
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Thermal Resistance, Junction to Ambient RqJA 200 °C/W
Thermal Resistance, Junction to Case RqJC 83.3 °C/W
OFF CHARACTERISTICS
Collector – Emitter Breakdown Voltage(1) V(BR)CEO 400 — Vdc
(IC = 1.0 mAdc, IB = 0)
Collector – Emitter Breakdown Voltage V(BR)CES 500 — Vdc
(IC = 100 µAdc, VBE = 0)
Collector – Base Breakdown Voltage V(BR)CBO 500 — Vdc
(IC = 100 mAdc, IE = 0)
Emitter – Base Breakdown Voltage V(BR)EBO 6.0 — Vdc
(IE = 10 mAdc, IC = 0)
Collector Cutoff Current ICBO — 0.1 µAdc
(VCB = 400 Vdc, IE = 0)
Collector Cutoff Current ICES — 500 nAdc
(VCE = 400 Vdc, VBE = 0)
Emitter Cutoff Current IEBO — 0.1 µAdc
(VEB = 4.0 Vdc, IC = 0)
140 TA = 125°C
0.4 IC = 1.0 mA IC = 10 mA IC = 50 mA
hFE, DC CURRENT GAIN
120 VCE = 10 V
100 0.3
TA = 25°C
25°C
80 0.2
60
0.1
40
–55°C
20 0
1.0 2.0 5.0 10 20 50 100 200 300 10 30 100 300 1.0 k 3.0 k 10 k 50 k
IC, COLLECTOR CURRENT (mA) IB, BASE CURRENT (µA)
1.0 1000
TA = 25°C 1.0 ms 100 µs
TA = 25°C
100
0.6 VBE(on) @ VCE = 10 V
20
0.4
10 CURRENT LIMIT
THERMAL LIMIT
0.2 VCE(sat) @ IC/IB = 10 SECOND BREAKDOWN LIMIT
2.0 VALID FOR DUTY CYCLE ≤ 10% MPSA44
0 1.0
0.1 0.3 1.0 3.0 10 30 100 300 1.0 2.0 5.0 10 20 50 100 200 500
IC, COLLECTOR CURRENT (mA) VCE, COLLECTOR VOLTAGE (VOLTS)
100 10
Cib
|h fe |, SMALL–SIGNAL CURRENT GAIN
50
C, CAPACITANCE (pF)
20
10 VCE = 10 V
Cob
f = 10 MHz
3.0 TA = 25°C
5.0
2.0
1.0 0
0.5 –4.0 V
VCC = 150 V
IC/IB = 10 VCC
0.2 TA = 25°C tr
RL
VBE(off) = 4.0 Vdc td
0.1 Vout
1.0 3.0 10 30 50 100
RB
IC, COLLECTOR CURRENT (mA) Vin
CS ≤ 4.0 pF*
10
Vin
5.0 +10.7 V
ts
2.0 PW = 50 µS
DUTY CYCLE = 2.0%
t, TIME ( µs)
1.0
0.5 tf
VCC = 150 V –11.4 V
IC/IB = 10 VCC
0.2 TA = 25°C
RL
0.1
1.0 3.0 10 30 50 100 Vout
IC, COLLECTOR CURRENT (mA) RB
Vin
CS ≤ 4.0 pF*
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
A B
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. CONTOUR OF PACKAGE BEYOND DIMENSION R
IS UNCONTROLLED.
R 4. DIMENSION F APPLIES BETWEEN P AND L.
DIMENSION D AND J APPLY BETWEEN L AND K
P MINIMUM. LEAD DIMENSION IS UNCONTROLLED
IN P AND BEYOND DIMENSION K MINIMUM.
L
SEATING F
PLANE K INCHES MILLIMETERS
DIM MIN MAX MIN MAX
A 0.175 0.205 4.45 5.20
D B 0.170 0.210 4.32 5.33
C 0.125 0.165 3.18 4.19
J D 0.016 0.022 0.41 0.55
X X F 0.016 0.019 0.41 0.48
G G 0.045 0.055 1.15 1.39
H H 0.095 0.105 2.42 2.66
SECTION X–X J 0.015 0.020 0.39 0.50
V C K 0.500 ––– 12.70 –––
L 0.250 ––– 6.35 –––
N 0.080 0.105 2.04 2.66
1 N P ––– 0.100 ––– 2.54
R 0.115 ––– 2.93 –––
N V 0.135 ––– 3.43 –––
STYLE 1:
CASE 029–04 PIN 1. EMITTER
2. BASE
(TO–226AA) 3. COLLECTOR
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*MPSA44/D*
6 ◊ MPSA44/D
Motorola Small–Signal Transistors, FETs and Diodes Device Data