曜凌光電股份有限公司

Raystar Optronics, Inc.

T: +886-4-2565-0761 | F: +886-4-2565-0760
[email protected] | www.raystar-optronics.com

SPECIFICATION
Model No:

REX012832GYAP3N00000

CUSTOMER:

APPROVED BY

PCB VERSION

DATE

FOR CUSTOMER USE ONLY

SALES BY APPROVED BY CHECKED BY PREPARED BY

Release DATE:

□APPROVAL FOR SPECIFICATIONS ONLY

■APPROVAL FOR SPECIFICATIONS AND SAMPLE

Revision History
VERSION DATE REVISED PAGE NO. Note

0 2018/08/14 First release

A 2018/11/15 Sample spec
B 2018/11/27 Modify Static
electricity test
Content of Test
C 2019/09/02 Modify Precautions in
use of OLED
Modules
D 2019/12/18 Modify Reliability Test
measurement
conditions &
Inspection
specification:
" Accept no dense"
modify to "ignore"&
Precautions
&Interface Pin
Function
E 2020/08/27 Modify Inspection
specification
F 2020/11/18 Modify Storage
Precautions

Page 3 , Total 28 Pages

Contents
1.General Specification

2.Module Classification Information

3.Interface Pin Function

4.Contour Drawing & Block Diagram

5.Absolute Maximum Ratings

6.Electrical Characteristics

7.Optical Characteristics

8.OLED Lifetime

9.Reliability

10.Inspection specification

11.Precautions in use of OLED Modules

Page 4 , Total 28 Pages

1.General Specification
The Features is described as follow:
◼ Module dimension: 50.50 x 15.75 x 2.01 mm
◼ Active area: 42.22 x 10.54 mm
◼ Dot Matrix: 128 x 32
◼ Pixel size: 0.308 x 0.308 mm
◼ Pixel pitch: 0.33 x 0.33 mm
◼ Display Mode: Passive Matrix
◼ Duty: 1/32 Duty
◼ Display Color: Yellow
◼ IC: SSD1307ZD
◼ Interface: SPI,I2C
◼ Size: 1.71 inch

Page 5 , Total 28 Pages

2.Module Classification information
1 2 3 4 5 6 7 8 9 10 11 12 13 14
R E X 012832 G Y A P 3 N 0 0 0 00

1 Brand：Raystar Optronics Inc.

2 E：OLED
C：COB Character G：COB Graphic
X：COG H：COG + FR
3 Display Type
P：COG + FR + PCB T：TAB
A：COG + PCB
4 Dot Matrix： 128*32
5 Series
A：Amber R：Red C：Full Color
B：Blue W：White
6 Emitting Color
G：Green Y：Yellow
S：Sky Blue X：Dual Color
P：With Polarizer; N: Without Polarizer
7 Polarizer
A：Anti-glare Polarizer
8 Display Mode P：Passive Matrix ; N：Active Matrix
9 Driver Voltage 3：3.0~3.3V ; 5：5.0V
10 Touch Panel N：Without touch panel; T: With touch panel
0：Standard
1：Daylight Readable
Product type
11 2：Transparent OLED (TOLED)
3：Flexible OLED (FOLED)
4：OLED Lighting
0：Standard
2：B grade
12 Inspection Grade
C：Automotive grade
Y：Consumer grade
13 Option 0：Default ; F：ZIF FPC ; H：Hot bar FPC; D：Demo Kit
14 Serial No. Serial number(00~ZZ)

Page 6 , Total 28 Pages

3.Interface Pin Function
No. Symbol Function
N.C. Dummy Pin
1
(GND) This is dummy pin. Do not group or short NC pins together.
Power supply for panel driving voltage. This is also the most positive power
2 VCC
voltage supply pin.

3 VLSS This is an analog ground pin. It should be connected to VSS externally

4 VSS This is a ground pin.

5 VDD Power Supply for Logic

6 CS# The chip select input. (active LOW)

7 RES# Power Reset for Controller and Driver

This is Data/Command control pin.

When it is pulled HIGH (i.e. connect to VDD), the data at D[7:0] is treated as
data. When it is pulled LOW, the data at D[7:0] will be transferred to the
8 D/C#
command register.
In I2C mode, this pin acts as SA0 for slave address selection.
When 3-wire serial interface is selected, this pin must be connected to VSS.
Host Data Input / Output Bus
When serial interface mode is selected, D0 will be the serial clock input:
9~11 D0~D2 SCLK; D1 will be the serial data input: SDIN and D2 should be kept NC.
When I2C mode is selected, D2, D1 should be tied together and serve as
SDAout, SDAin in application and D0 is the serial clock input, SCL.
This is segment output current reference pin.
12 IREF A resistor should be connected between this pin and VSS to maintain the
IREF current at 10uA.

The pin is for COM signal deselected voltage level.

13 VCOMH
A capacitor should be connected between this pin and VSS.

Power supply for panel driving voltage. This is also the most positive power
14 VCC
voltage supply pin.

Page 7 , Total 28 Pages

 Communicating Protocol Select
These pins are MCU interface selection input. See the following table:
BS0 BS1
BS0 I2C 0 1
15,16 3-wire SPI 1 0
BS1
4-wire SPI 0 0
Note
(1) 0 is connected to VSS
(2) 1 is connected to VDD

17 VLSS This is an analog ground pin. It should be connected to VSS externally.

N.C. Dummy Pin

18
(GND) This is dummy pin. Do not group or short NC pins together.

Page 8 , Total 28 Pages

4. Contour Drawing & Block Diagram
PIN NO. SYMBOL
50.5±0.2 1 GND
47±0.2 2 VCC
0.5±0.5 46(Polarizer) 3 VLSS
1.25 44.22(VA) 4 VSS

P0.5*(18-1)=8.5
2.25 42.22(AA) 5 VDD
0.5±0.5

50.42±0.5 6 CS#
Pull tape
2.61
1.61

7 RES#
2-
0. 8 D/C#
80
9 D0

18
14.75(Polarizer)
15.75±0.2

10 D1
10.54(AA)
12.54(VA)

7.4±0.1

9.5±0.1
0.3
128*32 Dots 11 D2

0.5
12 IREF
13 VCOMH

1
14 VCC

1.05
3±0.3
15 BS0

3.13
7
16 BS1
2.01±0.2

17 VLSS

0.3±0.05
Polarizer Protective tape
18 GND
0.7

2.0 Max. Contact Side

1.1

Non-Bendong area

Glue
Stiffener 5±0.3
Seg126 Seg 0 0.33
0.308
Com0
0.33
0.308

Com31
Seg127 Seg 1 DOTS SIZE The non-specified tolerance of dimension is ±0.3 mm .
Scale 10/1

Page 9 , Total 28 Pages

4.1 Application recommendations

Recommended components：
C2, C3：2.2uF
C1：1.0uF

Bus Interface selection: (Must be set the BS[1:0], refer to chapter 3)

3 or 4-wire SPI, and I2C

Voltage at IREF = VCC – 3V. For VCC = 12V, IREF = 10uA:

R1 = (Voltage at IREF - VSS) / IREF
= (12-3) / 10u
= 900K ohm

*For more information, please refer to Application Note provided by Raystar Optronics.

Page 10 , Total 28 Pages

5.Absolute Maximum Ratings
Parameter Symbol Min Max Unit Notes

Supply Voltage for Logic VDD -0.3 4.0 V 1,2

Supply Voltage for Display VCC 0 16.0 V 1,2

Operating Temperature TOP -40 +80 °C —

Storage Temperature TSTG -40 +85 °C —

Note 1: All the above voltages are on the basis of “VSS = 0V”.
Note 2: When this module is used beyond the above absolute maximum ratings, permanent
breakage of the module may occur. Also, for normal operations, it is desirable to use this
module under the conditions according to Section 6.“Optics & Electrical Characteristics”. If
this module is used beyond these conditions, malfunctioning of the module can occur and the
reliability of the module may deteriorate.

Page 11 , Total 28 Pages

 6.Electrical Characteristics

6.1 DC Electrical Characteristics

Item Symbol Condition Min Typ Max Unit

Supply Voltage for Logic VDD － 2.8 3.0 3.3 V

Supply Voltage for Display VCC － 11.5 12.0 12.5 V

High Level Input VIH － 0.8×VDD － － V

Low Level Input VIL － 0 － 0.2×VDD V

High Level Output VOH － 0.9×VDD － － V

Low Level Output VOL － － － 0.1×VDD V

Operating Current for VCC
ICC VCC=12.0V － 11 16.5 mA
(Full ON)

Page 12 , Total 28 Pages

6.2 Initial code
void Initial_SSD1307ZD(void){

Write_command(0xAE); // Display Off

Write_command(0xD5); //SET DISPLAY CLOCK

Write_command(0x80); //

Write_command(0xA8); // Select Multiplex Ratio

Write_command(0x1F); // Default => 0x3F (1/64 Duty) 0x1F(1/32 Duty)

Write_command(0xD3); //Setting Display Offset

Write_command(0x00); //00H Reset

Write_command(0x40); //Set Display Start Line

Write_command(0xA1); //Set Segment Re-Map Default

//0xA0 (0x00) => column Address 0 mapped to 127
//0xA1 (0x01) => Column Address 127 mapped to 0

Write_command(0xC0); //Set COM Output Scan Direction

Write_command(0xDA); //Set COM Hardware Configuration

Write_command(0x12); //Alternative COM Pin---See IC Spec page 34

Write_command(0x81); //Set Contrast Control

Write_command(0x48);

Write_command(0xD9); //Set Pre-Charge period

Write_command(0xA1);

Write_command(0xDB); //Set Deselect Vcomh level

Write_command(0x00);

Write_command(0xA4); //Entire Display ON

Write_command(0xA6); //Set Normal Display

Write_command(0xAF); // Display ON

Page 13 , Total 28 Pages

7.Optical Characteristics

Item Symbol Condition Min Typ Max Unit

(V)θ － 160 － － deg

View Angle
(H)φ － 160 － － deg

Contrast Ratio CR Dark 2000:1 － － －

T rise － － 10 － μs
Response Time
T fall － － 10 － μs

Display with 100% check Board Brightness 100 120 － cd/m2

CIEx(Yellow) (CIE1931) 0.45 0.47 0.49 －
CIEy(Yellow) (CIE1931) 0.48 0.50 0.52 －

Page 14 , Total 28 Pages

8.OLED Lifetime

ITEM Conditions Min Typ Remark

Ta=25°C
Operating
/ Initial 50% check board 50,000 Hrs - Note
Life Time
brightness 100cd/ m2

Notes:
1. Life time is defined the amount of time when the luminance has decayed to <50% of the
initial value.
2. This analysis method uses life data obtained under accelerated conditions to extrapolate
an estimated probability density function (pdf) for the product under normal use
conditions.
3. Screen saving mode will extend OLED lifetime.

Page 15 , Total 28 Pages

9.Reliability
Content of Reliability Test
Environmental Test
Applicable
Test Item Content of Test Test Condition
Standard
High
Endurance test applying the high 85°C
Temperature ——
storage temperature for a long time. 240hrs
storage
Low
Endurance test applying the low storage -40°C
Temperature ——
temperature for a long time. 240hrs
storage
Endurance test applying the electric
High
stress (Voltage & Current) and the 80°C
Temperature ——
thermal stress to the element for a long 240hrs
Operation
time.
Low Endurance test applying the electric
-40°C
Temperature stress under low temperature for a long ——
240hrs
Operation time.
High
Endurance test applying the high
Temperature/ 60°C,90%RH
temperature and high humidity storage ——
Humidity 240hrs
for a long time.
Storage
High
Endurance test applying the high
Temperature/ 60°C,90%RH
temperature and high humidity ——
Humidity 120hrs
Operation for a long time.
Operation
Endurance test applying the low and
high temperature cycle.
Temperature -40°C 25°C 80°C -40°C /80°C
——
Cycle 30 cycles
30min 5min 30min
1 cycle
Mechanical Test
Frequency:10~55Hz
Endurance test applying the vibration amplitude:1.5mm
Vibration test ——
during transportation and using. Time:0.5hrs/axis
Test axis:X,Y,Z
Others

Static Endurance test applying the electric Air Discharge model

——
electricity test stress to the finished product housing. ±4kv,10 times

*** Supply voltage for OLED system =Operating voltage at 25°C

Page 16 , Total 28 Pages

 Test and measurement conditions
1. All measurements shall not be started until the specimens attain to temperature stability.
After the completion of the described reliability test, the samples were left at room
temperature for 2 hrs prior to conducting the failure test at 23±5°C; 55±15% RH.
2. All-pixels on/off exchange is used as operation test pattern.
3. The degradation of Polarizer are ignored for High Temperature storage, High Temperature/
Humidity Storage, Temperature Cycle
Evaluation criteria
1. The function test is OK.
2. No observable defects.
3. Luminance: > 50% of initial value.
4. Current consumption: within ± 50% of initial value.
APPENDIX:
RESIDUE IMAGE
Because the pixels are lighted in different time, the luminance of active pixels
may reduce or differ from inactive pixels. Therefore, the residue image will occur.
To avoid the residue image, every pixel needs to be lighted up uniformly.

Page 17 , Total 28 Pages

10.Inspection specification
Inspection Standard:
MIL-STD-105E table normal inspection single sample level II.
Definition
1 Major defect : The defect that greatly affect the usability of product.
2 Minor defect : The other defects, such as cosmetic defects, etc.
Definition of inspection zone:
C
B

Zone A: Active Area

Zone B: Viewing Area except Zone A
Zone C: Outside Viewing Area
Note: As a general rule, visual defects in Zone C are permissible, when it is no trouble of
quality and assembly to customer`s product.

Inspection Methods
1 The general inspection : Under fluorescent light illumination: 750~1500 Lux, about 30cm
viewing distance, within 45º viewing angle, under 25±5°C.
2 The luminance and color coordinate inspection : By SR-3 or BM-7 or the equal
equipments, in the dark room, under 25±5°C.

NO Item Criterion AQL

1.1 Missing vertical, horizontal segment, segment contrast defect.
1.2 Missing character , dot or icon.
1.3 Display malfunction.
Electrical 1.4 No function or no display.
01 0.65
Testing 1.5 Current consumption exceeds product specifications.
1.6 OLED viewing angle defect.
1.7 Mixed product types.
1.8 Contrast defect.
Black or
white
2.1 White and black spots on display ≦0.25mm, no more than
spots on
02 three white or black spots present. 2.5
OLED 2.2 Densely spaced: No more than two spots or lines within 3mm.
(display
only)

Page 18 , Total 28 Pages

NO Item Criterion AQL

3.1 Round type :

As following
OLED
drawing SIZE Acceptable
black Zone
Φ=( x + y ) / 2 QTY
spots,
Φ≦0.10 ignore A+ B,
white 2.5
spots, 0.10＜Φ≦0.20 2 A+ B
contamin 0.20＜Φ≦0.25 1 A+ B
ation (non- 0.25＜Φ 0 A+ B
display)

3.2 Line type : (As following drawing)

03

Length Width Acceptable

Zone
Q TY 2.5
--- W≦0.02 ignore A+B
L≦3.0 0.02＜W≦0.03 A+B
2
L≦2.5 0.03＜W≦0.05 A+B
--- 0.05＜W As round type

4.1 If bubbles Size Φ Acceptable Q TY Zone

are visible, judge Φ≦0.20 ignore A+B
Polarizer using black spot 0.20＜Φ≦0.50 3 A+B
04 bubbles specifications, 2.5
0.50＜Φ≦1.00 2 A+B
/Dent not easy to find,
must check in 1.00＜Φ 0 A+B
specify direction. Total Q TY 3
4.2 The polarizer dent follows this specification.

05 Scratches Follow NO.3 OLED black spots, white spots, contamination.

Page 19 , Total 28 Pages

NO Item Criterion AQL
Symbols Define:
x: Chip length y: Chip width z: Chip thickness
k: Seal width t: Glass thickness a: OLED side length
L: Electrode pad length:
6.1 General glass chip :
6.1.1 Chip on panel surface and crack between panels:

2.5

z: Chip thickness y: Chip width x: Chip length

Z≦1/2t Not over viewing area x≦1/8a
Chipped 1/2t＜z≦2t Not exceed 1/3k x≦1/8a
glass ☉If there are 2 or more chips, x is total length of each chip.

6.1.2 Corner crack:

06
2.5
z: Chip thickness y: Chip width x: Chip length
Z≦1/2t Not over viewing area x≦1/8a
1/2t＜z≦2t Not exceed 1/3k x≦1/8a
☉If there are 2 or more chips, x is the total length of each chip.

Symbols :
x: Chip length y: Chip width z: Chip thickness
k: Seal width t: Glass thickness a: OLED side length
L: Electrode pad length
6.2 Protrusion over terminal :
6.2.1 Chip on electrode pad :
Glass
2.5
crack

y: Chip width x: Chip length z: Chip thickness

y≦0.5mm x≦1/8a 0 ＜ z≦t

Page 20 , Total 28 Pages

NO Item Criterion AQL
6.2.2 Non-conductive portion:

y: Chip width x: Chip length z: Chip thickness

y≦ L x≦1/8a 0 ＜ z≦t
☉If the chipped area touches the ITO terminal, over 2/3 of the ITO
must remain and be inspected according to electrode terminal
Glass specifications.
06 2.5
crack ☉If the product will be heat sealed by the customer, the alignment
mark not be damaged.

6.2.3 Substrate protuberance and internal crack.

y: width x: length
y≦1/3L x≦a

Cracked
07 The OLED with extensive crack is not acceptable. 2.5
glass

8.1 Illumination source flickers when lit. 0.65

Backlight 8.2 Spots or scratched that appear when lit must be judged. Using 2.5
08
elements OLED spot, lines and contamination standards.
8.3 Backlight doesn’t light or color wrong. 0.65

9.1 Bezel may not have rust, be deformed or have fingerprints, 2.5
09 Bezel stains or other contamination.
9.2 Bezel must comply with job specifications. 0.65

Page 21 , Total 28 Pages

NO Item Criterion AQL
10.1 COB seal may not have pinholes larger than 0.2mm or
contamination. 2.5
10.2 COB seal surface may not have pinholes through to the
IC. 2.5
10.3 The height of the COB should not exceed the height 0.65
indicated in the assembly diagram.
10.4 There may not be more than 2mm of sealant outside the 2.5
seal area on the PCB. And there should be no more than
10 PCB , COB three places.
10.5 No oxidation or contamination PCB terminals. 2.5
10.6 Parts on PCB must be the same as on the production 0.65
characteristic chart. There should be no wrong parts,
missing parts or excess parts.
10.7 The jumper on the PCB should conform to the product 0.65
characteristic chart.
10.8 If solder gets on bezel tab pads, OLED pad, zebra pad or 2.5
screw hold pad, make sure it is smoothed down.

11.1 No un-melted solder paste may be present on the PCB. 2.5

11.2 No cold solder joints, missing solder connections, 2.5
11 Soldering oxidation or icicle.
11.3 No residue or solder balls on PCB. 2.5
11.4 No short circuits in components on PCB. 0.65

12.1 No oxidation, contamination, curves or, bends on interface 2.5

Pin (OLB) of TCP.
12.2 No cracks on interface pin (OLB) of TCP. 0.65
12.3 No contamination, solder residue or solder balls on 2.5
product.
12.4 The IC on the TCP may not be damaged, circuits. 2.5
12.5 The uppermost edge of the protective strip on the interface 2.5
pin must be present or look as if it cause the interface pin
General
12 to sever.
appearance
12.6 The residual rosin or tin oil of soldering (component or 2.5
chip component) is not burned into brown or black color.
12.7 Sealant on top of the ITO circuit has not hardened. 2.5
12.8 Pin type must match type in specification sheet. 0.65
12.9 OLED pin loose or missing pins. 0.65
12.10 Product packaging must the same as specified on 0.65
packaging specification sheet.
12.11 Product dimension and structure must conform to product 0.65
specification sheet.

Page 22 , Total 28 Pages

 Check Item Classification Criteria

No Display Major

Missing Line Major

Pixel Short Major

Darker Short Major

Wrong Display Major

Un-uniform
B/A x 100% < 70% Major
A/C x 100% < 70%

Page 23 , Total 28 Pages

 11.Precautions in use of OLED Modules
Modules
(1) Avoid applying excessive shocks to module or making any alterations or modifications to it.
(2) Don’t make extra holes on the printed circuit board, change the components or modify its
shape of OLED display module.
(3) Don’t disassemble the OLED display module.
(4) Do not apply input signals while the logic power is off.
(5) Don’t operate it above the absolute maximum rating.
(6) Don’t drop, bend or twist OLED display module.
(7) Soldering: only to the I/O terminals.
(8) Hot-Bar FPC soldering condition: 280~350C, less than 5 seconds.
(9) Raystar has the right to change the passive components (Resistors, capacitors and other
passive components will have different appearance and color caused by the different
supplier.) and change the PCB Rev. (In order to satisfy the supplying stability, management
optimization and the best product performance...etc, under the premise of not affecting the
electrical characteristics and external dimensions, Raystar have the right to modify the
version.)
(10) Raystar has the right to upgrade or modify the product function.

11.1. Handling Precautions

(1) Since the display panel is being made of glass, do not apply mechanical impacts such as
dropping from a high position.
(2) If the display panel is broken by some accident and the internal organic substance leaks out,
be careful not to inhale nor lick the organic substance.
(3) If pressure is applied to the display surface or its neighborhood of the OLED display module,
the cell structure may be damaged. So, be careful not to apply pressure to these sections.
(4) The polarizer covering the surface of the OLED display module is soft and easily scratched.
(5) When the surface of the polarizer of the OLED display module has soil, clean the surface. It
takes advantage by using following adhesion tape.
* Scotch Mending Tape No. 810 or an equivalent
Never try to breathe upon the soiled surface nor wipe the surface using cloth containing
solvent such as ethyl alcohol, since the surface of the polarizer will become cloudy.
Also, pay attention that the following liquid and solvent may spoil the polarizer:
* Water
* Ketone
* Aromatic Solvents
(6) Protection film is being applied to the surface of the display panel and removes the protection
film before assembling it. At this time, if the OLED display module has been stored for a long
period of time, residue adhesive material of the protection film may remain on the surface of
the display panel after removed of the film. In such case, remove the residue material by the
method introduced in the above Section 5.
(7) Do not touch the following sections whenever possible while handling the OLED display
modules.
* Pins and electrodes
* Pattern layouts such as the TCP & FPC
(8) Hold OLED display module very carefully when placing OLED display module into the

Page 24 , Total 28 Pages

 System housing. Do not apply excessive stress or pressure to OLED display module. And,
do not over bend the film with electrode pattern layouts. These stresses will influence the
display performance. Also, secure sufficient rigidity for the outer cases.

(9) Do not apply stress to the LSI chips and the surrounding molded sections.
(10) Pay sufficient attention to the working environments when handing OLED display modules
to prevent occurrence of element breakage accidents by static electricity.
* Be sure to make human body grounding when handling OLED display modules.
* Be sure to ground tools to use or assembly such as soldering irons.
* To suppress generation of static electricity, avoid carrying out assembly work under dry
environments.
* Protective film is being applied to the surface of the display panel of the OLED display
module. Be careful since static electricity may be generated when exfoliating the protective
film.

11.2. Storage Precautions

(1) When storing OLED display modules, put them in static electricity preventive bags to avoid
be directly exposed to sun or lights of fluorescent lamps. And, also, place in the temperature
25±5°C and Humidity below 65% RH.(We recommend you to store these modules in the
packaged state when they were shipped from Winstar. At that time, be careful not to let water
drops adhere to the packages or bags.)

(2) When the OLED display module is being dewed or when it is placed under high temperature
or high humidity environments, the electrodes may be corroded if electric current is applied.
Please store it in clean environment.

11.3. Designing Precautions

(1) The absolute maximum ratings are the ratings which cannot be exceeded for OLED display
module, and if these values are exceeded, OLED display module may be damaged.
(2) To prevent occurrence of malfunctioning by noise, pay attention to satisfy the VIL and VIH
specification and to make the signal line cable as short as possible.
(3) We recommend you to install excess current preventive unit (fuses, etc.) to the power circuit
(VDD / VCC). (Recommend value: 0.5A)
(4) Pay sufficient attention to avoid occurrence of mutual noise interference with the nearby
devices.
(5) As for EMI, take necessary measures on the equipment side basically.
(6) If the power supplied to the OLED display module is forcibly shut down by such errors as
taking out the main battery while the OLED display panel is in operation, we cannot
guarantee the quality of this OLED display module.

Page 25 , Total 28 Pages

 * Connection (contact) to any other potential than the above may lead to rupture of the IC.
(7) If this OLED driver is exposed to light, malfunctioning may occur and semiconductor
elements may change their characteristics.
(8) The internal status may be changed, if excessive external noise enters into the module.
Therefore, it is necessary to take appropriate measures to suppress noise generation or to
protect module from influences of noise on the system design.
(9) We recommend you to make periodical refreshment of the operation statuses (re-setting of
the commands and re-transference of the display data) to cope with catastrophic noise.
(10) It's pretty common to use "Screen Saver" to extend the lifetime and Don't use the same
image for long time in real application. When an OLED display module is operated for a long
of time with fixed pattern, an afterimage or slight contrast deviation may occur.
(11) The limitation of FPC and Film bending.

(12) The module should be fixed balanced into the housing, or the module may be twisted.
(0.1 Max.)

0.1

(13) Please heat up a little the tape sticking on the components when removing it; otherwise the
components might be damaged.

11.4. Precautions when disposing of the OLED display modules

(1) Request the qualified companies to handle industrial wastes when disposing of the OLED
display modules. Or, when burning them, be sure to observe the environmental and hygienic
laws and regulations.

Page 26 , Total 28 Pages

 Page: 1
Module Sample Estimate Feedback Sheet
Module Number：

1、Panel Specification：
1. Panel Type： □ Pass □NG ,
2. Numbers of Pixel： □ Pass □NG ,
3. View Area： □ Pass □NG ,
4. Active Area： □ Pass □NG ,
5.Emitting Color： □ Pass □NG ,
6.Uniformity： □Pass □NG ,
7.Operating □ Pass □NG ,
Temperature：
8.Storage □ Pass □NG ,
Temperature：
9.Others：
2、Mechanical Specification：
1. PCB Size： □Pass □NG ,
2.Frame Size： □Pass □NG ,
3.Materal of Frame： □Pass □NG ,
4.Connector Position： □Pass □NG ,
5.Fix Hole Position： □Pass □NG ,
6. Thickness of PCB： □Pass □NG ,
7. Height of Frame to □Pass □NG ,
PCB：
8.Height of Module： □Pass □NG ,
9.Others： □Pass □NG ,
3、Relative Hole Size：
1.Pitch of Connector： □Pass □NG ,
2.Hole size of □Pass □NG ,
Connector：
3.Mounting Hole size： □Pass □NG ,
4.Mounting Hole Type： □Pass □NG ,
5.Others： □Pass □NG ,
＞＞ Go to page 2 ＜＜

Page 27 , Total 28 Pages

 Page: 2
Module Number：
4、Electronic Characteristics of Module：
1.Input Voltage： □Pass □NG ,
2.Supply Current： □Pass □NG ,
3.Driving Voltage for □Pass □NG ,
OLED：
4.Contrast for OLED： □Pass □NG ,
5.Negative Voltage □Pass □NG ,
Output：
6.Interface Function： □Pass □NG ,
7.ESD test： □Pass □NG ,
8.Others： □Pass □NG ,
5、Summary：

Sales signature：
Customer Signature： Date： / /

Page 28 , Total 28 Pages