CY28447 - ETC PLL Clock Generator Datasheet
CY28447 - ETC PLL Clock Generator Datasheet
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PRELIMINARY CY28447
Clock Generator for Intel® Calistoga Chipset
CLKREQ9#
CLKREQ8#
CLKREQ6#
CLKREQ4#
VDD_SRC
VDD
VSS_SRC
XIN 14.318MHz
SRCC_8
SRCC_7
SRCC_6
SCRC_5
SCRC_4
SRCC_3
SRCT_8
SRCT_7
SRCT_6
SRCT_5
SRCT_4
SRCT_3
Crystal REF[1:0]
XOUT PLL Reference
IREF
SEL_CLKREQ VDD
PCI_STP# CPU CPUT[0:1] 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55
VSS_REF
REF1
CLKREQ2#
PCI1
CLKREQ3#
CLKREQ5#
VDD_PCI
VSS_PCI
PCI2
PCI3
VSS_PCI
VDD_PCI
CPU_STP#
PCI_STP#
PCI4 / FCTSEL1
REF0 / FSC_TEST_SEL
PLL
Divider
DOT96C
VDD48
48M
27M
PLL
Divider VDD48
VTT_PWRGD#/PD 27MNon-spread
SDATA I2C
SCLK Logic
Pin Description
Pin No. Name Type Description
1, 49, 54, 65 VDD_SRC PWR 3.3V power supply for outputs.
2, 3, 50, 51, SRCT/C[1:9] O, DIF 100 MHz Differential serial reference clocks.
52, 53, 55,
56, 58, 59,
60, 61, 63,
64, 66, 67,
69, 70
4, 68 VSS_SRC GND Ground for outputs.
5, 6 CPUT2_ITP/SRCT10, O, DIF Selectable differential CPU or SRC clock output.
CPUC2_ITP/SRCC10 ITP_SEL = 0 @ VTT_PWRGD# assertion = SRC10
ITP_SEL = 1 @ VTT_PWRGD# assertion = CPU2
7 VDDA PWR 3.3V power supply for PLL.
8 VSSA GND Ground for PLL.
9 IREF I A precision resistor is attached to this pin which is connected to the internal
current reference.
10, 11, 13, 14 CPUT/C[0:1] O, DIF Differential CPU clock outputs.
12 VDD_CPU PWR 3.3V power supply for outputs.
15 VSS_CPU GND Ground for outputs.
16 SCLK I SMBus-compatible SCLOCK.
17 SDATA I/O, OD SMBus-compatible SDATA.
18 VDD_REF PWR 3.3V power supply for outputs.
19 XOUT O, SE 14.318 MHz crystal output.
20 XIN I 14.318 MHz crystal input.
21 VSS_REF GND Ground for outputs.
22 REF1 O Fixed 14.318 MHz clock output.
23 REF0/FSC_TESTSEL I/O,PD Fixed 14.318 clock output / 3.3V-tolerant input for CPU frequency
selection/Selects test mode if pulled to VIMFS_C when VTT_PWRGD# is
asserted LOW.
Refer to DC Electrical Specifications table for VILFS_C,VIMFS_C,VIHFS_C specifi-
cations.
24 CPU_STP# I, PU 3.3V LVTTL input for CPU_STP# active LOW.
25 PCI_STP# I, PU 3.3V LVTTL input for PCI_STP# active LOW.
26, 28, 29, CLKREQ[1:9]# I, PU 3.3V LVTTL input for enabling assigned SRC clock (active LOW).
38, 46, 57,
62, 71, 72
27, 32, 33 PCI[1:3] O, SE 33 MHz clock outputs
30, 36 VDD_PCI PWR 3.3V power supply for outputs.
31, 35 VSS_PCI GND Ground for outputs.
34 PCI4/FCTSEL1 I/O, PD 33 MHz clock output / 3.3V LVTTL input for selecting pins 47,48 (SRC[T/C]0,
100M[T/C]) and pins 43,44 (DOT96[T/C] and 27M Spread and Non-spread)
(sampled on the VTT_PWRGD# assertion).
FCTS E L1 P in 43 P in 44 P in 47 P in 48
0 DOT96T DOT96C 96/100M_T 96/100M_C
1 27M_NSS 27M_SS SRCT0 SRCC0
37 ITP_SEL/PCIF0 I/O, PD, 3.3V LVTTL input to enable SRC10 or CPU2_ITP / 33-MHz clock output.
SE (sampled on the VTT_PWRGD# assertion).
1 = CPU2_ITP, 0 = SRC10
Frequency Select Pins (FSA, FSB, and FSC) initialize to their default setting upon power-up, and therefore
use of this interface is optional. Clock device register changes
Host clock frequency selection is achieved by applying the are normally made upon system initialization, if any are
appropriate logic levels to FSA, FSB, FSC inputs prior to required. The interface cannot be used during system
VTT_PWRGD# assertion (as seen by the clock synthesizer). operation for power management functions.
Upon VTT_PWRGD# being sampled LOW by the clock chip
(indicating processor VTT voltage is stable), the clock chip Data Protocol
samples the FSA, FSB, and FSC input values. For all logic
levels of FSA, FSB, and FSC, VTT_PWRGD# employs a The clock driver serial protocol accepts byte write, byte read,
one-shot functionality in that once a valid LOW on block write, and block read operations from the controller. For
VTT_PWRGD# has been sampled, all further VTT_PWRGD#, block write/read operation, the bytes must be accessed in
FSA, FSB, and FSC transitions will be ignored, except in test sequential order from lowest to highest byte (most significant
mode. bit first) with the ability to stop after any complete byte has
been transferred. For byte write and byte read operations, the
Serial Data Interface system controller can access individually indexed bytes. The
offset of the indexed byte is encoded in the command code,
To enhance the flexibility and function of the clock synthesizer, as described in Table 2.
a two-signal serial interface is provided. Through the Serial The block write and block read protocol is outlined in Table 3
Data Interface, various device functions, such as individual while Table 4 outlines the corresponding byte write and byte
clock output buffers, can be individually enabled or disabled. read protocol. The slave receiver address is 11010010 (D2h)
The registers associated with the Serial Data Interface
Table 1. Frequency Select Table FSA, FSB, and FSC[1]
FSC FSB FSA CPU SRC PCIF/PCI 27MHz REF0 DOT96 USB
1 0 1 100 MHz 100 MHz 33 MHz 27 MHz 14.318 MHz 96 MHz 48 MHz
0 0 1 133 MHz 100 MHz 33 MHz 27 MHz 14.318 MHz 96 MHz 48 MHz
0 1 1 166 MHz 100 MHz 33 MHz 27 MHz 14.318 MHz 96 MHz 48 MHz
0 1 0 200 MHz 100 MHz 33 MHz 27 MHz 14.318 MHz 96 MHz 48 MHz
.
Control Registers
Byte 0: Control Register 0
Bit @Pup Name Description
7 1 SRC[T/C]7 SRC[T/C]7 Output Enable
0 = Disable (Tri-state), 1 = Enable
6 1 SRC[T/C]6 SRC[T/C]6 Output Enable
0 = Disable (Tri-state), 1 = Enable
5 1 SRC[T/C]5 SRC[T/C]5 Output Enable
0 = Disable (Tri-state), 1 = Enable
4 1 SRC[T/C]4 SRC[T/C]4 Output Enable
0 = Disable (Tri-state), 1 = Enable
3 1 SRC[T/C]3 SRC[T/C]3 Output Enable
0 = Disable (Tri-state), 1 = Enable
2 1 SRC[T/C]2 SRC[T/C]2 Output Enable
0 = Disable (Tri-state), 1 = Enable
1 1 SRC[T/C]1 SRC[T/C]1 Output Enable
0 = Disable (Tri-state), 1 = Enable
0 1 SRC[T/C]0 SRC[T/C]0 / LCD_96_100M[T/C] Output Enable
/LCD_96_100M[T/C] 0 = Disable (Hi-Z), 1 = Enable
The CY28447 requires a Parallel Resonance Crystal. Substi- the crystal will see must be considered to calculate the appro-
tuting a series resonance crystal will cause the CY28447 to priate capacitive loading (CL).
operate at the wrong frequency and violate the ppm specifi- Figure 1 shows a typical crystal configuration using the two
cation. For most applications there is a 300-ppm frequency trim capacitors. An important clarification for the following
shift between series and parallel crystals due to incorrect discussion is that the trim capacitors are in series with the
loading. crystal not parallel. It’s a common misconception that load
capacitors are in parallel with the crystal and should be
Crystal Loading approximately equal to the load capacitance of the crystal.
Crystal loading plays a critical role in achieving low ppm perfor- This is not true.
mance. To realize low ppm performance, the total capacitance
As mentioned previously, the capacitance on each side of the The impact of deasserting the CLKREQ# pins is that all SRC
crystal is in series with the crystal. This means the total capac- outputs that are set in the control registers to stoppable via
itance on each side of the crystal must be twice the specified deassertion of CLKREQ# are to be stopped after their next
load capacitance (CL). While the capacitance on each side of transition. The final state of all stopped DIF signals is LOW,
the crystal is in series with the crystal, trim capacitors both SRCT clock and SRCC clock outputs will not be driven.
CLKREQ#X
SRCT(free running)
SRCC(free running)
SRCT(stoppable)
SRCT(stoppable)
PD
CPUT, 133MHz
CPUC, 133MHz
SRCT 100MHz
SRCC 100MHz
USB, 48MHz
DOT96T
DOT96C
PCI, 33 MHz
REF
CPUT, 133MHz
CPUC, 133MHz
SRCT 100MHz
SRCC 100MHz
USB, 48MHz
DOT96T
DOT96C
PCI, 33MHz
Tdrive_PWRDN#
REF <300 μs, >200 mV
CPU_STP# Assertion CPUT is driven HIGH with a current value equal to 6 x (Iref),
The CPU_STP# signal is an active LOW input used for and the CPUC signal will be tri-stated.
synchronous stopping and starting the CPU output clocks
while the rest of the clock generator continues to function. CPU_STP# Deassertion
When the CPU_STP# pin is asserted, all CPU outputs that are The deassertion of the CPU_STP# signal will cause all CPU
set with the SMBus configuration to be stoppable via assertion outputs that were stopped to resume normal operation in a
of CPU_STP# will be stopped within two–six CPU clock synchronous manner, synchronous manner meaning that no
periods after being sampled by two rising edges of the internal short or stretched clock pulses will be produce when the clock
CPUC clock. The final states of the stopped CPU signals are resumes. The maximum latency from the deassertion to active
CPUT = HIGH and CPUC = LOW. There is no change to the outputs is no more than two CPU clock cycles.
output drive current values during the stopped state. The
CPU_STP#
CPUT
CPUC
CPU_STP#
CPUT
CPUC
CPUT Internal
CPUC Internal
Tdrive_CPU_STP#,10 ns>200 mV
1.8 ms
CPU_STOP#
PD
CPUT(Free Running
CPUC(Free Running
CPUT(Stoppable)
CPUC(Stoppable)
DOT96T
DOT96C
1.8mS
CPU_STOP#
PD
CPUT(Free Running)
CPUC(Free Running)
CPUT(Stoppable)
CPUC(Stoppable)
DOT96T
DOT96C
PCI_STP# Assertion
The PCI_STP# signal is an active LOW input used for
synchronous stopping and starting the PCI outputs while the
rest of the clock generator continues to function. The set-up
time for capturing PCI_STP# going LOW is 10 ns (tSU). (See
Figure 10.) The PCIF clocks will not be affected by this pin if
their corresponding control bit in the SMBus register is set to
allow them to be free running.
Tsu
PCI_STP#
PCI_F
PCI
SRC 100MHz
PCI_STP# Deassertion
The deassertion of the PCI_STP# signal will cause all PCI and
stoppable PCIF clocks to resume running in a synchronous
manner within two PCI clock periods after PCI_STP# transi-
tions to a HIGH level.
Tsu Tdrive_SRC
PCI_STP#
PCI_F
PCI
SRC 100MHz
FS_A, FS_B,FS_C
VTT_PW RGD#
PW RGD_VRM
Off On
Clock Outputs
Off On
Clock VCO
S1 S2
VDD_A = 2.0V
S0 S3
VDD_A = off Normal Enable Outputs
Power Off Operation
VTT_PWRGD# = toggle
DC Electrical Specifications
Parameter Description Condition Min. Max. Unit
All VDDs 3.3V Operating Voltage 3.3 ± 5% 3.135 3.465 V
VILI2C Input Low Voltage SDATA, SCLK – 1.0 V
VIHI2C Input High Voltage SDATA, SCLK 2.2 – V
VIL_FS FS_[A,B] Input Low Voltage VSS – 0.3 0.35 V
VIH_FS FS_[A,B] Input High Voltage 0.7 VDD + 0.5 V
VILFS_C FS_C Input Low Voltage VSS – 0.3 0.35 V
VIMFS_C FS_C Input Middle Voltage 0.7 1.7 V
VIHFS_C FS_C Input High Voltage 1.8 VDD + 0.5 V
VIL 3.3V Input Low Voltage VSS – 0.3 0.8 V
VIH 3.3V Input High Voltage 2.0 VDD + 0.3 V
IIL Input Low Leakage Current Except internal pull-up resistors, 0 < VIN < VDD –5 5 μA
IIH Input High Leakage Current Except internal pull-down resistors, 0 < VIN < VDD – 5 μA
VOL 3.3V Output Low Voltage IOL = 1 mA – 0.4 V
VOH 3.3V Output High Voltage IOH = –1 mA 2.4 – V
IOZ High-impedance Output
–10 10 μA
Current
CIN Input Pin Capacitance 3 5 pF
COUT Output Pin Capacitance 3 6 pF
LIN Pin Inductance – 7 nH
VXIH Xin High Voltage 0.7VDD VDD V
VXIL Xin Low Voltage 0 0.3VDD V
IDD3.3V Dynamic Supply Current At max. load in low drive mode per Figure 15 and – 300 mA
Figure 17 @133 MHz
IPD3.3V Power-down Supply Current PD asserted, Outputs Driven – 70 mA
IPD3.3V Power-down Supply Current PD asserted, Outputs Tri-state – 5 mA
AC Electrical Specifications
Parameter Description Condition Min. Max. Unit
Crystal
TDC XIN Duty Cycle The device will operate reliably with input 47.5 52.5 %
duty cycles up to 30/70 but the REF clock
duty cycle will not be within specification
TPERIOD XIN Period When XIN is driven from an external 69.841 71.0 ns
clock source
T R / TF XIN Rise and Fall Times Measured between 0.3VDD and 0.7VDD – 10.0 ns
TCCJ XIN Cycle to Cycle Jitter As an average over 1-μs duration – 500 ps
LACC Long-term Accuracy Measured at crossing point VOX – 300 ppm
CPU at 0.7V
TDC CPUT and CPUC Duty Cycle Measured at crossing point VOX 45 55 %
TPERIOD 100-MHz CPUT and CPUC Period Measured at crossing point VOX 9.997001 10.00300 ns
TPERIOD 133-MHz CPUT and CPUC Period Measured at crossing point VOX 7.497751 7.502251 ns
TPERIOD 166-MHz CPUT and CPUC Period Measured at crossing point VOX 5.998201 6.001801 ns
TPERIOD 200-MHz CPUT and CPUC Period Measured at crossing point VOX 4.998500 5.001500 ns
TPERIODSS 100-MHz CPUT and CPUC Period, SSC Measured at crossing point VOX 9.997001 10.05327 ns
TPERIODSS 133-MHz CPUT and CPUC Period, SSC Measured at crossing point VOX 7.497751 7.539950 ns
TPERIODSS 166-MHz CPUT and CPUC Period, SSC Measured at crossing point VOX 5.998201 6.031960 ns
TPERIODSS 200-MHz CPUT and CPUC Period, SSC Measured at crossing point VOX 4.998500 5.026634 ns
TPERIODAbs 100-MHz CPUT and CPUC Absolute Measured at crossing point VOX 9.912001 10.08800 ns
period
TPERIODAbs 133-MHz CPUT and CPUC Absolute Measured at crossing point VOX 7.412751 7.587251 ns
period
TPERIODAbs 166-MHz CPUT and CPUC Absolute Measured at crossing point VOX 5.913201 6.086801 ns
period
TPERIODAbs 200-MHz CPUT and CPUC Absolute Measured at crossing point VOX 4.913500 5.086500 ns
period
TPERIODSSAbs 100-MHz CPUT and CPUC Absolute Measured at crossing point VOX 9.912001 10.13827 ns
period, SSC
TPERIODSSAbs 133-MHz CPUT and CPUC Absolute Measured at crossing point VOX 7.412751 7.624950 ns
period, SSC
TPERIODSSAbs 166-MHz CPUT and CPUC Absolute Measured at crossing point VOX 5.913201 6.116960 ns
period, SSC
TPERIODSSAbs 200-MHz CPUT and CPUC Absolute Measured at crossing point VOX 4.913500 5.111634 ns
period, SSC
TCCJ CPUT/C Cycle to Cycle Jitter Measured at crossing point VOX – 85[2] ps
TCCJ2 CPU2_ITP Cycle to Cycle Jitter Measured at crossing point VOX – 125[2] ps
LACC Long-term Accuracy Measured at crossing point VOX – 300 ppm
TSKEW CPU1 to CPU0 Clock Skew Measured at crossing point VOX – 100 ps
TSKEW2 CPU2_ITP to CPU0 Clock Skew Measured at crossing point VOX – 150 ps
T R / TF CPUT and CPUC Rise and Fall Time Measured from VOL = 0.175 to 175 700 ps
VOH = 0.525V
TRFM Rise/Fall Matching Determined as a fraction of – 20 %
2*(TR – TF)/(TR + TF)
ΔTR Rise Time Variation – 125 ps
ΔTF Fall Time Variation – 125 ps
Note:
2. Measured with one REF on.
33Ω Measurement
PCI/
Point
USB 60Ω 5pF
12Ω Measurement
Point
60Ω 5pF
REF 12Ω Measurement
Point
60Ω 5pF
The following diagram shows the test load configuration for the
differential CPU and SRC outputs.
33Ω M e a s u re m e n t
CPUT
SRCT P o in t
D O T96T 4 9 .9 Ω 2pF
96_100_SSC T 1 0 0 Ω D if f e r e n t ia l
M e a s u re m e n t
CPUC 33Ω
SRCC P o in t
D O T96C 4 9 .9 Ω 2pF
96_100_SSC C
IR E F
475Ω
3 .3 V s ig n a l s
T DC
- -
3 .3 V
2 .4 V
1 .5 V
0 .4 V
0V
TR TF
Ordering Information
Part Number Package Type Product Flow
Lead-free
CY28447LFXC 72-pin QFN Commercial, 0° to 85°C
CY28447LFXCT 72-pin QFN – Tape and Reel Commercial, 0° to 85°C
Package Diagram
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While SLI has reviewed all information herein for accuracy and reliability, Spectra Linear Inc. assumes no responsibility for the use of any cir-
cuitry or for the infringement of any patents or other rights of third parties which would result from each use. This product is intended for use in
normal commercial applications and is not warranted nor is it intended for use in life support, critical medical instruments, or any other applica-
tion requiring extended temperature range, high reliability, or any other extraordinary environmental requirements unless pursuant to additional
processing by Spectra Linear Inc., and expressed written agreement by Spectra Linear Inc. Spectra Linear Inc. reserves the right to change any
circuitry or specification without notice.