Standard Printed Circuit Board Ltd.

Room 607, Yen Sheng Centre, 64 Hoi Yuen Road, Kwun Tong, Kowloon., Hong Kong
Tel: 852-29614637 Fax: 852-28932300 E-mail: [email protected]

File number: ME-M-II VER: B DATE: 2007-Sep-9

File name: Capability manual

GENERAL DATA

SERIAL ITEM TECHNICAL DATA

1 Layers 2－30(layers)

2 Max Board Size 18" x 24"

4（layers）16mil

6（layers）32mil
3 Min Board Thickness
8（layers）40mil

10（layers）48mil

4 Min Line Width 4mil

5 Min Line Space 4mil

6 Min Hole Size 8mil

7 PTH Wall Thickness 0.8mil

8 PTH dia tolerance ±3mil

9 NPTH hole dia tolerance ±1mil

10 Hole Position Deviation ±3mil

11 Outline Tolerance ±4mil

12 S/M Pitch 3mil

13 Insulation Resistance 1E+12Ω(Normal)

14 Aspect ratio 10:1

15 Thermal Shock 3x10Sec@288 ℃

16 Warp and Twist ≤0.7%

17 Electric Strength ＞1.3KV/mm

18 Peel Strength 1.4N/mm

19 Solder Mask Abrasion ≥6H

20 Flammability 94V-0

21 Impedance Control ±5%

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 Standard Printed Circuit Board Ltd.
Room 607, Yen Sheng Centre, 64 Hoi Yuen Road, Kwun Tong, Kowloon., Hong Kong
Tel: 852-29614637 Fax: 852-28932300 E-mail: [email protected]

SS/DS 4-L 6-L

Layers/Thickness/ Outline
Finish
Routing 0.3~2.4 0.5~2.4 0.75~2.4
Punching 0.3~1.6 0.5~1.6 0.75~1.6
V-cut 0.6~2.4 0.6~2.4 0.75~2.4

Layers/Thickness/ Outline Finish SS/DS ML

For 0.3~0.8 +/-0.0762 +/-0.10
For 0.8~1.2 +/-0.10 +/-.127
For 1.2~ +/-0.127 +/-10%

Finish Surface: Gold Flash, Minimum Thickness: 0.20mm

Finish Surface: HASL, Minimum Thickness: 0.60mm
Finish Surface: All, Maximum Thickness: 3.2mm
4. Drilled Hole Size and Tolerance
4.1 Minimum PTH Hole Size 0.15mm , Minimum PTH Slot size 0.4mm × 0.8mm
4.2 Minimum NPT Hole Size 0.20mm , Minimum NPT Slot Size 0.5mm × 1.0mm
4.3 Tolerance
PTH: +/-0.05mm(Gold flash & Entek), +0.075/-.0.05mm(HAL)min
NPTH: +/-0.05mm
5. Base material
5.1 Copper Clad Laminate
×48, 41×
5.1.1 Standard Size(inch): 42× ×49, 36×
×48, 43×
×49
5.1.2 Thickness(mm): 0.1,0.15,0.2,0.25,0.3,0.35,0.4,0.46,0.51,0.6,0.71,
0.8,0.9,1.0,1.1,1.2,1.4,1.5,1.6,2.0,2.4,3.2
5.1.3 Copper THK: 0.5OZ(18um), 1OZ(35UM), 2OZ(70UM), 3OZ(105UM)……6OZ(210UM)
5.1.4 Laminate Type: CEM-1, CEM-3, FR4, FR1, FR2
5.1.5 Flammability: 94-V0

Prepreg
Type 1080 2116 7628
Thickness 2.8mil+/-0.3mil 4.6mil+/-.5mil 7.4mil+/-.5mil
Size 49.5”x300mm 49.5”300mm 49.5”x150mm

6.Surface Finish and Thickness

 Standard Printed Circuit Board Ltd.
Room 607, Yen Sheng Centre, 64 Hoi Yuen Road, Kwun Tong, Kowloon., Hong Kong
Tel: 852-29614637 Fax: 852-28932300 E-mail: [email protected]

6.1 HASL 1~38um in hole, 2.54~25.4um on SMT

6.2 Gold Flash Ni: 2.5~7.62um, Au: 0.05~0.25um
6.3 Selective Gold Plating: Ni: 2.5~7.62um, Au: 0.05~0.25um
6.4 Immersion Gold: Ni: 2.5~7.62um, Au: 0.127~1.27um
6.5 Gold-Edge Contacts: Ni: 2.5~7.62um, Au: 0.127~1.27um
6.6 Entek M2602 (For single side and Double sides)

7.Solder mask
7.1Heat Cured Ink: ZSR-150 (PA-5B, NA-402)
7.2LPI resist ink: Green gloss (FSR-8000-9G05, R500-2G, PSR2000-G35A, PSR4000-
LDSM-3000 G-7, APR-8000 G-102)
Green matte (LM-600 5GM)
White (LSM-3000NW)
Black (FSR-8000 (10C10))
Red (LSM-3000SR)
Blue (FSR 8b89, LSM-3000NSBL)
Yellow (LSM-3000NSY-6)
7.3 UV Ink: Green (UVS-1000)
White (UVM-1800W)

8. Legend Ink
8.1 White: (ZM-400WF)
8.2 Black: (BK-3)
8.3 Yellow: (ZM-400YR)
9.Carbon Ink: PR-406, TU-15ST (25 Ohm/square)

10.Peelable Mask: B99-84B, PETERS SD 2955

File number: P ME-M-II VER: B DATE: 2006-Sep-9

File name: Capability manual
5.2 Surface copper plating thickness:
 Standard Printed Circuit Board Ltd.
Room 607, Yen Sheng Centre, 64 Hoi Yuen Road, Kwun Tong, Kowloon., Hong Kong
Tel: 852-29614637 Fax: 852-28932300 E-mail: [email protected]

Board type Bonding Flash gold HAL & Entek

Copper thickness 5um~10um 10um~25um 20um~40um

6. Etching
6.1 Etching factor: 1.5 max, 1.0Std.
6.2 Etch tolerance:

Board type Flash gold HAL

Line width tolerance +/-12% +/-20%(L>5mil) +/-1mil(L<=5mil)
(min.)

7. Solder Mask (LPI) Printing:

7.1 Registration Tolerance of Solder Mask to pattern: +/-2mil (min), +/-3mils(Std)
7.2 Solder Mask Thickness: 10um~40um on line surface, 6um min. at line edge
7.4 Plugged Hole Size: 0.6mm (Max.)
7.5 Minimum Solder Mask hide: 0.35mm
7.6 Minimum Spacing of Solder Mask Opening to Line: 3mil
7.7 Minimum solder bridge: 4mil
8. Silkscreen Printing
8.1 Legend Printing
8.1.1 Minimum Line Width 6mil, Minimum height of Legend 40mil
8.1.2 Registration of Legend to Reference Hole +/-6mil
8.2 Carbon Printing
8.2.1 Minimum Line Width/ Spacing 10mil/14mil
8.2.2 Registration of Carbon to Reference Hole +/-7mil
8.3 Peelable Mask
8.3.1 Thickness of Mask 0.2mm~0.4mm
8.3.2 Maximum Size of Tenting hole 4.0mm
9. Profile finish:
9.1 Outline Finish Tolerance: +/-0.1mm(min), +/-0.13mm(Std.)
9.2 Routing
9.2.1 Minimum Milling Cutter Size 0.8mm
9.2.2 Minimum Radius of Inner Copper 0.4mm
9.2.3 Minimum Position Tolerance of Routing Hole (Slot) or Edge to Drill hole +/-5mil
9.2.4 Minimum Position Tolerance of Routing Hole to Routing Hole (Slot) +/-3mil
9.2.5 Minimum Position Tolerance of Routing Hole (Slot) to Routing Edge +/-4mil
9.3 Punching
 Standard Printed Circuit Board Ltd.
Room 607, Yen Sheng Centre, 64 Hoi Yuen Road, Kwun Tong, Kowloon., Hong Kong
Tel: 852-29614637 Fax: 852-28932300 E-mail: [email protected]

9.3.1 Minimum Size of Punching Hole (Slot) 1.0mm

9.3.2 Maximum Size of Punching Board (panel) 350mm x 270mm
9.3.3 Maximum Thickness of Punching Board 1.6mm
9.3.4 Minimum Position Tolerance of Punching Hole (Slot) or Edge to Drill hole +/-5mil
9.3.5 Minimum Position Tolerance of Punching Hole to Punching Hole (Slot) +/-3mil
9.3.6 Minimum Position Tolerance of Punching Hole (Slot) to Punching Edge +/-4mil
9.4 V-cutting
9.4.1 Minimum Size of V-cut Board 50mm x 85 (v-cut direction) mm
9.4.2 Minimum Thickness of V-cut Board 0.6mm
9.4.3 Minimum Space of V-cut Line Per customer requirement
9.4.4 Minimum Space of V-cut Line to Panel Edge 3mm
9.4.5 Minimum Position Tolerance of V-cut Line to Primary Drilling Hole +/-7mil
9.4.6 Minimum Position Tolerance of V-cut Line to Second Drilling Hole +/-9mil
9.4.7 Minimum Position Tolerance of V-cut Line to Routing Edge +/-6mil
9.4.8 Minimum Position Tolerance of V-cut Line to Punching Edge +/-7mil
9.4.9 Minimum Position Tolerance of V-cut Line to V-cut line+/-4mil
9.4.10 Registration Tolerance of V-cut lines +/-4mil
9.4.11 V-Cut residual +/-4mil

10. E-Testing
10.1 Test Voltage 50V~300V Commonly: 200V~300V
10.2 Isolated Resistance 1K ohm~100M ohm Commonly: 20M ohm~40M ohm
10.3 Continuity Resistance 10 ohm~20K ohm Commonly: 50 ohm~100 ohm

11. FQC
11.1 Warp & Trap

Board Thk. <0.5mm 0.5~0.8mm 1.0~1.2mm >1.5mm

Warpage 1.5% max. 1% max. 0.75% max. 0.5% max.

File number: ME-M-II VER: B DATE: 2006-Spe-9

File name: Capability manual

Capability of Individual PROCESS

 Standard Printed Circuit Board Ltd.
Room 607, Yen Sheng Centre, 64 Hoi Yuen Road, Kwun Tong, Kowloon., Hong Kong
Tel: 852-29614637 Fax: 852-28932300 E-mail: [email protected]

1. Drill Process
1.1 Min. drill bit: 0.2mm, Max drill bit 6.5mm
1.2 Min. working panel size: 6”x6”, Max. working panel size: 24”x20”
1.3 Hole Position tolerance: +/-3mil (primary drilled), +/-5mil(Secondary drilled)
1.4 Min slot drill bit: 0.5mm

2. PTH and Panel Plating

2.1 Max. aspect ratio: 6 : 1
2.2 Copper plating thickness 5~10um

3. Imaging (Outer)
3.1 Minimum Line Width/Spacing 4mil/4mil (0.5OZ), 6mil/6mil (1OZ)
3.2 Minimum SMT Pitch 16 mil, Std. SMT Pith 20mil
3.3 Minimum Bonding Pitch 9 mil Std. Bonding Pitch 12mil
3.4 Minimum Theoretic Annual Ring 5mil, Std. Annual Ring 6mil
3.5 Minimum Mesh Gap: 8mil
3.6 Maximum Size of D/F Tending Hole D5.5mm, Slot Width 4.5mm (Board Thk. 0.8mm)
3.7 Registration tolerance of pattern to reference Hole: +/-2mil(min), +/-3mil(std.)
3.8 Film Compensation Value of Pattern:
Item 0.5 OZ 1.0 OZ 2 OZ
Outer (expect F/G board) 0.04mm 0.08mm 0.12mm
Inner 0.02mm 0.04mm 0.08mm
3.9 Minimum Spacing:
Item Line-Line Line-Logo Line-Plane Copper or Line-Npth Pad or
Line-Edge(R)
Spacing 4mil 5mil 4mil 8mil 10mil
Item Via Pad-Via Pad Comp. Pad-Comp. Pad Pad or Line-Edge (V) Pad or Line-Edge
(P)
Spacing 4mil 4mil or 10 mil 14 mil 12 mil
Item Line-Via Pad Line-Comp. Plane Via Pad-Plane Comp. Pad-Plane
Spacing 4mil 6mil 4mil 6mil

3.10 Imaging (Inner)

4.1 Minimum Line Width/Spacing 4mil/4mil (0.5OZ), 6mil/6mil (1OZ)
4.2 Minimum Theoretic Annual Ring of Signal Pad & Thermal Pad 6mil
4.3 Minimum Theoretic Annual Ring of Non-Functional Pad 10mil
4.4 Minimum Clearance of Isolation Pad 12mil (via) or 10mil (PTH>1mm)
 Standard Printed Circuit Board Ltd.
Room 607, Yen Sheng Centre, 64 Hoi Yuen Road, Kwun Tong, Kowloon., Hong Kong
Tel: 852-29614637 Fax: 852-28932300 E-mail: [email protected]

4.5 Film Compensation Value of Pattern (Ref to 3.5)

4.6 Registration Tolerance of Layer of Layer to Layer: +/-3mil (min.), +/-4mil (Std)
4.7 Minimum Spacing
Item Line-Line Line-d Copper or Line-Npth Pad or Line-Edge(R)
Spacing 4mil 4mil 8mil 10mil
Item Pad-Pad Line-Plane Pad or Line-Edge (V) Pad or Line-Edge (P)
Spacing 5mil 4mil 14 mil 16 mil
Item Pad-Plane Plane-Plane Line-PHT Edge (isolated)
Spacing 4mil 6mil 6mil (4L) or 8mil (>6L)

5. Pattern Plating
5.1 Hole wall copper plating thickness
Board type Bonding Flash gold HAL & Entek
Copper thickness 5um~10um 10um~20um 18um~35um