Mechanical Actuators

• Actuation mechanisms:
– electrostatic = electrostatic attraction of charged plates
– thermal = expansion of solids or fluids
Mechanical MEMS – shape memory alloy = considerable change in length
– pneumatic/hydraulic = fluid pressure
– piezoelectric = electrically induced strain
Dr. Bruce K. Gale – magnetic
– chemical
Fundamentals of Micromachining
– biological

Electrostatic Actuators Electrostatic Actuation

• Cantilever Actuators
• Based on attraction of two oppositely – electrostatic force
charged plates εo  V
2

q( x) =  
• Typically low power 2  d − d ( x) 
– tip deflection
• Simple to fabricate x2
(dδ )T = (3L − x) wq ( x) dx
• Coulomb’s law: 6 EI
+ + + + + + + + + +
_ _ _ _ _ _ _ _ _ _ _
1 q1q 2
Felec =
4πε r ε o x 2
 Electrostatic Actuation Electrostatic Actuation
• Fabrication • Comb Drives
– polysilicon with sacrificial – use large number of
oxide electrostatically actuated
– electroplated metal with fine “fingers”
sacrificial organic layer
– attractive force is mainly
– sputtered metal with due to fringing fields
sacrificial organic layer
– generate large movements
• Torsional Actuators
– dual deflection electrodes
– small deflection

Torsional spring for mirror application

Electrostatic Actuation Electrostatic Actuation

• Rotary Micromotors • Linear Micromotors (Scratch Drive Actuators)
– use freely moving – uses flexible conductive plate with small bushing at one end
central rotor with – velocities up to > 1mm/s
surrounding
capacitive plates
– up to 300,000 rpm
– up to 300 V
– Fabrication:
• polysilicon/oxide
• metal/resist
 Thermal Actuation SMA Actuators
• Linear Thermal Expansion • Shape Memory Alloy
• Volume Expansion/Phase- (SMA) Actuators
Change – use alloys that exhibit
• Bimorph Thermal Actuators considerable changes in
length when heated
– uses difference in thermal
– heat causes material
coefficients of expansion
transition from one crystal
– heater is sandwiched between phase to another
two “two” active materials
– alloys: Au/Cu, In/Ti, Ni/Ti
– environmental ruggedness (+)
– high power, low bandwidth (-)

Thermal Bimorph Video

Gears from Sandia Random Mechanical Items

 Micro-Grippers Micro-Tweezers

Source: Berkeley Source: MEMS Precision Instruments

Strain Gages Accelerometers

• Gage factor is defined as relative
resistance change over strain
• Types include:
– Metal foil
– Thin-film metal
– Bar semiconductor
– Diffused semiconductor
• Implantable strain gages
• Penetrating micro-strain gage probe
Sources: Analog Devices, Lucas NovaSensor, and EG&G IC Sensors
 Accelerometers Accelerometers
• F=ma is basic concept
• Force measured by deflection or strain • Capacitive accelerometers most commercialized
• Can be related to spring constant, F=kx – Torsion bar with assymetric plates
• Generally displacement of proof mass is • Force-balanced capacitive used in autos
measured relative to frame – Comb of capacitors measures differential
• Dynamic system as described previously capacitance
– Highly sensitive, typical displacement only 10 nm
• Strain gage type most basic
– Force feedback to maintain central location of
– Strain in beam measured as proof mass deflects
proof mass
beam
– Force required to maintain equilibriumgenerates
– Lots of configurations
signal

Accelerometers Accelerometers
• Piezoelectric accelerometers • Switch arrays
– Generally show no DC response – Array of switches sensitive to increasing levels
• Special circuitry to create DC response of acceleration
– Typically use ZnO – Simple to build
• Tunneling accelerometers – Optimizes range of accelerometer in use
– Highly sensitive • Multi-axis acclerometers
– More difficult to fabricate
– Only one example to date
– Requires closed loop control
– Cross-axis sensitivity problem
– Long term drift
– Precise alignment and low cost are advantages
• Latching accelerometers
– Lock in place if acceleration exceeded
• All require extensive circuitry
 Gyroscopes Gyroscopes
• Measure rotation • Tuning forks
• Couple energy from one
– Large inertial mass, increased sensitivity
vibrational axis to another
due to Coriolis effect – Metallic ring structure
• Two micromachined • Dual accelerometer
modes: Open loop
vibration and Force-to- • Vibrating shells
rebalance mode – Two-axis
• Vibrating prismatic beams
– Vibration in z direction
– Beam driven in one
direction, deflection – Output in both x and y
measured in orthogonal
direction

Pressure Sensor (conventional) Pressure Sensor (ultra-miniature)

Source: Maluf Source: NovaSensor

 Piezoresistive Pressure Sensors Capacitive Pressure Sensors
• Piezoresistivity is a material property where • Capacitive sensors convert charge into
bulk resistivity is influenced by mechanical change in capacitance
stress applied to material • Advantages:
• Common piezoresistors: Si, poly Si, SiO2, – more sensitive than piezoresistive
ZnO – less temperature dependent
• Typical design: 4 piezoresistors in a • Disadvantages:
Wheatstone bridge on a diaphragm – gap fabrication
• Pressure sensitivity (mV/V-bar): S = – diaphragm mechanical properties
(∆R/∆P)(1/R)

Capacitive Pressure Sensors Microphones

• Basic concept: C = ε A/d • Convert acoustic energy into electrical
• Sensitivity: ∆C/∆d = -ε A/d2 energy
• Small Gaps: • High sensitivity pressure sensors
– larger capacitance • Types:
– easier capacitance detection – Capacitive
– plates may stick together • variable gap capacitor; most common
• require DC bias
• Large Gaps:
• sensitivity: 0.2 to 25 mV/Pa
– small capacitance • response: 10 Hz to 15 kHz
– may require wafer bonding
 Microphones (cont)
– Piezoresistive
• diaphragm with 4 pezoresistors in a Wheatsone
bridge
• sensitivity: ~25 µV/Pa
• response: 100 Hz to 5 kHz
– Piezoelectric
• use piezoelectric material mechanically coupled to
diaphragm
• sensitivity: 50 to 250 µV/Pa
• response: 10 Hz to 10 kHz