ECE 361

Computer Architecture
Lecture 1

Prof. Alok N. Choudhary

[email protected]
ECE 361 1-1
Today’s Lecture
Computer Design
• Levels of abstraction
• Instruction sets and computer architecture

Architecture design process

Interfaces

Course Structure

Technology as an architectural driver

• Evolution of semiconductor and magnetic disk
technology
• New technologies replace old
• Industry disruption
Break
Cost and Price
• Semiconductor economics
ECE 361 1-2
 Computers, Levels of Abstraction
and Architecture

ECE 361 1-3

Computer Architecture’s Changing Definition

1950s Computer Architecture

• Computer Arithmetic

1960s
• Operating system support, especially memory management

1970s to mid 1980s Computer Architecture

• Instruction Set Design, especially ISA appropriate for compilers
• Vector processing and shared memory multiprocessors

1990s Computer Architecture

• Design of CPU, memory system, I/O system, Multi-processors, Networks
• Design for VLSI

2000s Computer Architecture:

• Special purpose architectures, Functionally reconfigurable, Special
considerations for low power/mobile processing, highly parallel
structures

ECE 361 1-4

Levels of Representation

temp = v[k];
High Level Language v[k] = v[k+1];
Program v[k+1] = temp;

Compiler lw $15, 0($2)

lw $16, 4($2)
Assembly Language sw $16, 0($2)
Program sw $15, 4($2)

Assembler
0000 1001 1100 0110 1010 1111 0101 1000
Machine Language 1010 1111 0101 1000 0000 1001 1100 0110
Program 1100 0110 1010 1111 0101 1000 0000 1001
0101 1000 0000 1001 1100 0110 1010 1111

Machine Interpretation

Control Signal Spec ALUOP[0:3] <= InstReg[9:11] & MASK

ECE 361 1-5

 Levels of Abstraction

Graphical Interface
Application
Programming Application
Libraries
Operating System
System Programming
Programming Language
Assembler Language
Instruction Set Architecture - “Machine Language”
Processor IO System
Firmware Microprogrammin
g
Computer Design Datapath and Control
Digital Design
Logic Design
Circuit Design Circuits and devices
Fabrication Semiconductors
Materials
ECE 361 1-6
 The Instruction Set: A Critical Interface
Computer Architecture = Instruction Set Design
Instruction Set Architecture + • Machine Language
Machine Organization • Compiler View
• "Computer Architecture"
• "Instruction Set
Architecture"

"Building Architect"
software
instruction set
hardware Computer Organization and
Design
This course • Machine Implementation
• Logic Designer's View
• "Processor Architecture"
• "Computer Organization"

"Construction Engineer"
ECE 361 1-7
Instruction Set Architecture
Data Types
Encoding and representation
Architecture Reference Manual
Memory Model Principles of Operation
Program Visible Processor State Programming Guide
General registers
…
Program counter
Processor status

Instruction Set
Instructions and formats
Addressing modes
Data structures

System Model
States . . . the attributes of a [computing] system
Privilege
as seen by the programmer, i.e. the
Interrupts
conceptual structure and functional
IO
behavior, as distinct from the organization
External Interfaces of the data flows and controls the logic
IO design, and the physical implementation.
Management

Amdahl, Blaaw, and Brooks, 1964

ECE 361 1-8
 Computer Organization

Capabilities & Performance Characteristics of Principal

Functional Units
(e.g., Registers, ALU, Shifters, Memory Management, etc.
Ways in which these components are interconnected
• Datapath - nature of information flows and connection of
functional units
• Control - logic and means by which such information flow
is controlled

Choreography of functional units to realize the ISA

Register Transfer Level Description / Microcode

“Hardware” designer’s view includes logic and firmware

ECE 361 1-9

 This Course Focuses on General Purpose Processors
A general-purpose computer system Unified main memory
• Uses a programmable processor • For both programs & data
• Can run “any” application • Von Neumann computer
• Potentially optimized for some
class of applications Busses & controllers to connect
processor, memory, IO devices
• Common names: CPU, DSP, NPU,
microcontroller, microprocessor
Processor
Input
Control
Memory

Datapath
Output
MIT Whirlwind, 1951

Computers are pervasive – servers, standalone PCs,

network processors, embedded processors, …
ECE 361 1-10
Today, “Computers” are Connected Processors

Proc

Caches
Busses

adapters
Memory

Controllers

Disks
I/O Devices:
Displays Networks
Keyboards

All have interfaces & organizations

ECE 361 1-11

What does a computer architect do?
Drivers Work Products
Business, product management, marketing

Measurement and Evaluation

Translates business and technology drives

into efficient systems for computing tasks.
ECE 361 1-12
Metrics of Efficiency - Examples

Desktop computing
• Examples: PCs, workstations
• Metrics: performance (latency), cost, time to market

Server computing
• Examples: web servers, transaction servers, file servers
• Metrics: performance (throughput), reliability, scalability

Embedded computing
• Examples: microwave, printer, cell phone, video console
• Metrics: performance (real-time), cost, power consumption,
complexity

ECE 361 1-13

Applications Drive Design Points
Numerical simulations
• Floating-point performance
• Main memory bandwidth

Transaction processing
• I/Os per second and memory bandwidth
• Integer CPU performance

Media processing
• Repeated low-precision ‘pixel’ arithmetic
• Multiply-accumulate rates
• Bit manipulation

Embedded control
• I/O timing
• Real-time behavior
Architecture decisions will often
exploit application behavior
ECE 361 1-14
 Characteristics of a Good Interface Design
Well defined for users and implementers

Interoperability (Hardware) / Compatibility (Software)

• Lasts through multiple implementations across Use 1 imp 1 time
multiple technologies (portability, compatibility)
• Efficiently supports multiple implementations Interface
Use 2 imp 2
- Competitive market
- Compatible at multiple cost / performance
design points Use 3 imp 3
IP Investment Preservation
• Extensible function grows from a stable base Interface usage can far exceed
• Generality of application permits reuse of the most optimistic projections of
training, tools and implementations it’s designer:
Applies to many types of interfaces • Instruction sets
• Instruction set architectures - S/360 1964 ~ present
• Busses - X86 1972 ~ present
• Network protocols
- SPARC 1981 ~ present
• Library definitions
• Network protocols
• OS service calls
- Ethernet 1973 ~ present
• Programming languages
- TCP/IP 1974 ~ present
• Programming languages
- C 1973 ~ present
ECE 361 1-15
 Course Structure

ECE 361 1-16

What You Need to Know from prerequisites

Basic machine structure

• Processor, memory, I/O

Assembly language programming

Simple operating system concepts

Logic design
• Logical equations, schematic diagrams, FSMs, Digital design

ECE 361 1-17

 Roadmap 1000
CP U
µProc
60%/yr.
(2X/1.5yr)
“Moore’s Law”
Input Input
Multiplicand Multiplier

32 100 Processor-Memory
Multiplicand Performance Gap:
Register LoadMp
(grows 50% / year)

Arithmetic

Performance
32=>34
signEx

Single/multicycle
32
<<1
34
34
10
32=>34 1 0
signEx 34x2 MUX
Multi x2/x1
34 34 DRAM
9%/yr.

Datapaths
34-bit ALU Sub/Add DRAM (2X/10 yrs)
Control
34
Logic
1

[0]"
32 2 32 ShiftAll

"LO

9
4

9
2

9
6
19
890
119
129
13
89
895
896
897
898
89
990
11
99
993
994
15
99
997
998
909
00
Encoder
ENC[2]

LO[1]
2 bits
Extra

Booth

1
8
8
8
1
1
1
1
1
1
1
9
1
1
1
9
1
1
1
2
Prev
2 HI register 2 LO register ENC[1]

(16x2 bits) (16x2 bits)

ENC[0]
2

LoadLO
ClearHI
LoadHI
LO[1:0]

Time

32 32

Result[HI] Result[LO]

IFetch Dcd Exec Mem WB

IFetch Dcd Exec Mem WB

IFetch Dcd Exec Mem WB

IFetch Dcd Exec Mem WB

Pipelining

I/O
ECE 361 Memory Systems 1-18
Course Basics
Website
• www.ece.northwestern.edu/~choudhar/361/index.htm
• Check regularly for announcements
• All course materials posted -- lecture notes, homework, labs, supplemental materials
• Communicate information, questions and issues

Office Hours – Tech L469 - Tuesday 3-4pm (or by appointment)

Text supplements lectures and assigned reading should be done prior to lectures. I assume that all
assigned readings are completed even if the material is not covered in class.

Homework, Labs and Exams

• Collaborative study and discussion is highly encouraged
• Work submitted must be your own
• Individual grade

Project
• Collaborative effort
• Team grade

ECE 361 1-19

Grade
35% Homework and Labs
• 4 homework sets
• Lab – individual grade,
- ALU

30% Team Project

• MIPS subset
• Design and CAD intensive effort

35% Late midterm Exam (Nov 16)

• Open book, open notes

ECE 361 1-20

Project
Teams of 3-4 students

You will be required to

• Use advanced CAD tools – Mentor Graphics
• Design a simple processor (structural design and implementation) – MIPS
subset
• Validate correctness using sample programs of your own and provided as
part of the assignment

Written presentation submitted (due Dec 3, 2004)

You may also use VHDL (structural) to design your system if you know VHDL
sufficiently well

ECE 361 1-21

 Course Structure

Lectures:
• 1 week on Overview and Introduction (Chap 1 and 2)
• 2 weeks on ISA Design
• 4 weeks on Proc. Design
• 2 weeks on Memory and I/O

Reading assignments posted on the web for each week. Please

read the appropriate material before the class.

Note that the above is approximate

Copy of all lecture notes available from the department for a

charge (bound nicely)

ECE 361 1-22

 Technology Drivers

ECE 361 1-23

Technology Drives Advances in Computer Design

Evolution Each level of abstraction is

continually trying to improve

Disruption Fundamental economics or

capability cross a major threshold

ECE 361 1-24

 Significant technology disruptions

Logic Relays  Vacuum tubes 

single transistors 
SSI/MSI (TTL/ECL)  VLSI (MOS)

Registers Delay lines  drum  semiconductor

Memory Delay lines  magnetic drum  core

 SRAM  DRAM

External Storage Paper tape  Paper cards 

magnetic drum 
magnetic disk

Today, technology is driven by semiconductor and magnetic

disk technology. What are the the next technology shifts?
ECE 361 1-25
Semiconductor and Magnetic Disk Technologies Have
Sustained Dramatic Yearly Improvement since 1975
Moore’s “Law” - The observation made in 1965
by Gordon Moore, co-founder of Intel, that the
number of transistors per square inch on
integrated circuits had doubled every year since
the integrated circuit was invented. Moore
predicted that this trend would continue for the
foreseeable future. In subsequent years, the
pace slowed down a bit, but data density has
doubled approximately every 18 months, and
this is the current definition of Moore's Law,
which Moore himself has blessed. Most experts,
including Moore himself, expect Moore's Law to
hold for at least another two decades.

Capacity Speed Cost

Logic 60% 40% 25%

Clock Rate 20%
DRAM 60% 7% 25%
Disk 60% 3% 25%
Network 40% 25%

ECE 361 1-26

 Device Density Increases Faster Than Die Size
1996
HP PA8000 –
17.68mmx19.1mm,
3.8M transistors.
1971
Intel 4004 was a 3 chip
set with a 2kbit ROM
chip, a 320bit RAM chip
and the 4bit processor
each housed in a 16 pin
DIP package. The 4004
processor required
roughly 2,300
transistors to
implement, used a
silicon gate PMOS
process with 10µm
linewidths, had a
108KHz clock speed
and a die size of
13.5mm2. Designer –
Ted Hoff.
i4004 PA9000 Factor Yearly Improvement
Area (mm) 13.5 338 1:25 14%
Source: http://micro.magnet.fsu.edu/chipshots/ Transistors 2300 3,800,000 1:1652 34%

ECE 361 1-27

 Example: Intel Semiconductor Roadmap

Process P856 P858 Px60 P1262 P1264 P1266

1st Production 1997 1999 2001 2003 2005 2007

Lithography 0.25um 0.18um 0.13um 90nm 65nm 45nm

Gate Length 0.20um 0.13um <70nm <50nm <35nm <25nm

Wafer Diameter (mm) 200 200 200/300 300 300 300

Source: Mark Bohr, Intel, 2002

ECE 361 1-28

 DRAM Drives the Semiconductor Industry

size

1000000000
Year Capacity Access
100000000 1980 64 Kb 250 ns
10000000
1983 256 Kb 220 ns
1986 1 Mb 190 ns
1000000 1989 4 Mb 165 ns
Bits

1992 16 Mb 145 ns
100000
1996 64 Mb 120 ns
10000 1999 256 Mb 100 ns
2002 1Gb 80 ns
1000
1970 1975 1980 1985 1990 1995 2000
Year

ECE 361 1-29

 Memory Wall: Speed Gap between Processor and DRAM

Log Performance

Processor 60% per year

DRAM 7% per year

Year

The divergence between performance and cost

Source: Junji Ogawa, Stanford drives the need for memory hierarchies, to be
discussed in future lectures.
ECE 361 1-30
 Semiconductor evolution drives improved designs
1970s
• Multi-chip CPUs
• Semiconductor memory very expensive
• Complex instruction sets (good code density)
• Microcoded control

1980s
• 5K – 500 K transistors
• Single-chip CPUs
• RAM is cost-effective
• Simple, hard-wired control
• Simple instruction sets
• Small on-chip caches

1990s
• 1 M - 64M transistors
• Complex control to exploit instruction-level parallelism
• Super deep pipelines

2000s
• 100 M - 5 B transistors
• Slow wires Note: Gate speeds and
• Power consumption power/cooling also improved
• Design complexity

ECE 361 1-31

 Processor Performance (SPEC)

120
Intel x86
100

80
Performance

60

40

20

0
1982

1983

1984

1985

1986

1987

1988

1989

1990

1991

1992

1993

1994

1995
Year

System performance improves 50% per year. More about SPEC

in a future lecture.

ECE 361 1-32

Technology drives industry disruption and creates opportunity

Microprocessors
Log of Performance

Supercomputers Mainframes

Minicomputers

Transistors
Alpha 21264: 15 million
Pentium Pro: 5.5 million
PowerPC 620: 6.9 million
Alpha 21164: 9.3 million
Sparc Ultra: 5.2 million
Pentium 4: 42 million
Itanium: 220 million

1970 1975 1980 1985 1990 1995 2000

Year

ECE 361 1-33

Why Such Change in 10 years?

Performance
• Technology Advances
- CMOS VLSI dominates older technologies (TTL, ECL) in cost and
performance
• Computer architecture advances improves low-end
- RISC, superscalar, RAID, …

Price: Lower costs due to …

• Simpler development
- CMOS VLSI: smaller systems, fewer components
• Higher volumes
- CMOS VLSI : same dev. cost 1,000 vs. 100,000,000 units
• Lower margins by class of computer, due to fewer services

Function
• Rise of networking / local interconnection technology

ECE 361 1-34

 Cost and Price

ECE 361 1-35

Integrated Circuit Manufacturing Costs

Die Cost = Wafer Cost

Dies per Wafer ! Die Yield

IC yield is a largely a function of defect density.

Yield curves improve over time with manufacturing
experience.

ECE 361 1-36

 Relationship of complexity, cost and yield
Generational Improvements
Cost per
function R&D and semiconductor equipment
suppliers

Larger wafers

Improved materials

Finer feature sizes

Number of functions per chip

Yield Improvement
Yield Time
• Learning curve: manufacturing costs
decrease over time measured by
change in yield

Manufacturing Volume
• Decreases the time needed to get
Chip Area down the learning curve
• Decreases the cost due to improved
manufacturing efficiency
Source: The History of the Microcomputer - Invention and Evolution, Stan Mazor

ECE 361 1-37

Example: FPGA Cost per 1M Gates

Improves 65% per year

Source: Xilinx

ECE 361 1-38

System Cost Example: Web Server

System Subsystem % of
total cost

Cabinet Sheet metal,

plastic 1%
Power supply,
fans 2%
Cables, nuts,
bolts 1%

(Subtotal) (4%)

Motherboard
Processor 20%
DRAM
20%
I/O
system 10%
Network
interface 4%
Printed Circuit
board 1%
Picture: http://developer.intel.com/design/servers/sr1300/
(Subtotal)
(60%)
ECE 361 1-39
I/O Devices
Disks 36%
Example: Cost vs Price

Average selling price

Profit (5-20%)

Distribution
+50–80% Costs (33–45%)

+25–100% Op Costs (33–14%)

+33% Direct Costs (8–10%)

Component (25–31%)
Cost

Input: Making it: R&D, rent, Commission,

chips, labor, scrap, marketing, discounts,
displays, ... returns, ... admin, ... channel support

ECE 361 1-40

Summary
Computer Design
• Levels of abstraction
• Instruction sets and computer architecture

Architecture design process

Interfaces

Course Structure

Technology as an architectural driver

• Evolution of semiconductor and magnetic disk
technology
• New technologies replace old
• Industry disruption

Cost and Price

• Semiconductor economics
ECE 361 1-41