Profiling Software 2G

User Manual

Version 4.3
Publication Number SFT-317000-000
Profiling Software 2G User Manual Version 4.3

Profiling Software 2G User Manual

Copyright © 2020 KIC. All rights reserved. Patents pending.

16120 West Bernardo Drive
San Diego, CA 92127
Phone: +1 858 673 6050 Fax: +1 858 673 0085
A Division of Embedded Designs Inc.

This document contains information that is proprietary to KIC. Said information, is copyrighted as is all associated
software and hardware. All rights are reserved. Patents are pending.

This document and the information contained in it may not be sold, duplicated, used, or disclosed, in whole or in
part, except as specifically authorized in writing by KIC. The information contained in this document and
associated software is subject to change without notice.

There are no warranties with respect to the information contained in this document, express or implied, except as
provided by written contract between KIC and the customer.

All KIC product names and logos are trademarks of Embedded Designs, Inc. All other trademarks used herein are
the property of their respective owners.

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Version 4.3 Profiling Software 2G User Manual

Software Licensing Agreement and Product Warranty

The KIC software is subject to the following license terms and conditions.
1. KIC SOFTWARE LICENSE
1.1 This is a software license granted by KIC, mailing address 16120 West Bernardo Drive San Diego, CA 92127.
1.2 The KIC software is licensed to you as the end user and is not sold.
1.3 The KIC software is copyrighted material.
1.4 The KIC software is licensed for use with one or more pieces of associated hardware that together constitute a thermal process
management system. This license allows you to use the software with the purchased system. You must purchase additional copies of
the software if used with additional system hardware.
1.5 You may not change, modify, decompile, disassemble, or otherwise reverse engineer the licensed software or any associated
hardware.
2. LIMITED WARRANTY
2.1 KIC warrants that the system hardware and software are free from defects in material and workmanship under normal use. KIC
warrants that the system as a whole will perform substantially in accordance with the specifications set forth in the documentation
provided with it.
2.2 Warranty regarding rated temperature: Components of the system hardware are rated by KIC for proper performance up to a specified
maximum temperature. Any component that KIC determines to have been exposed to temperatures higher than the rated temperature
is not covered under this warranty.
2.3 Start of the Warranty period. The warranty period begins the day the KIC product is delivered to you as the first customer.
2.4 Obligations of KIC during the warranty period:
2.4.1 Return for complete refund: If, within the first thirty (30) days after the start of the warranty, the customer returns, for any
reason whatsoever, any of the purchased hardware or software in its original condition, KIC will refund the associated money
paid and accept the return as payment for any money owed.
2.4.2 Replacement: Within the first year of the start of the warranty, KIC will replace, on an exchange basis and without additional
charge, any product proven defective in materials or workmanship.
2.4.3 Correction of software: KIC will either replace or repair, without additional charge, any software that does not perform in
substantial compliance with its documented specifications. In the foregoing circumstances, KIC will deliver either corrective
code or a corrected copy of the software.
2.4.4 Final Remedy: If KIC is unable to replace defective media or provide a corrected copy of the software within a reasonable
amount of time, KIC will either replace the software with a functionally similar program or refund the license fees paid for use
of the software.
2.5 Exclusion of Other Warranties
2.5.1 KIC does not warrant that the functions contained in the software will meet your requirements or that the operation of the
software will be uninterrupted or error free. The Warranty does not cover any copy of the software that has been altered or
changed in any way by you or others. KIC is not responsible for problems caused by changes in the operating characteristics of
the computer hardware or operating system which are made after delivery of the software.
2.5.2 EXCEPT WHERE LIMITED BY LOCAL JURISDICTIONS, KIC SHALL NOT IN ANY
CASE BE LIABLE FOR SPECIAL, INCIDENTAL, CONSEQUENTIAL, INDIRECT OR
OTHER SIMILAR DAMAGES ARISING FROM ANY BREACH OF THESE WARRANTIES
EVEN If KIC OR ITS AGENT HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH
DAMAGES.
2.6 Other Conditions
2.6.1 THE WARRANTIES SET FORTH ABOVE ARE IN LIEU OF ALL OTHER WARRANTIES,
WHETHER ORAL, WRITTEN, OR IMPLIED, INCLUDING BUT NOT LIMITED TO ANY
IMPLIED WARRANTIES OF MERCHANTABILITY OR FITNESS FOR ANY
PARTICULAR USE. THE REMEDIES SET FORTH ABOVE ARE THE CUSTOMER’S
SOLE AND EXCLUSIVE REMEDIES. Only an authorized officer of KIC may make modifications to this
warranty, or additional warranties binding on KIC. Accordingly, additional statements such as advertising, collateral, or
presentations, whether oral or written, do not constitute warranties by KIC and should not be relied upon as such. This
warranty gives you specific legal rights, and you may have other rights, which vary by state and/or country.
3. LIMITATION OF LIABILITY
3.1 In no case shall KIC's liability exceed the license fees paid for the right to use the licensed software or One Hundred Dollars
($100.00), whichever is greater.

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Table of Contents
INTRODUCING THE SOFTWARE ............................................................................................................... 1
INSTALLING THE SOFTWARE .......................................................................................................................... 2
Languages ............................................................................................................................................. 2
To install the software: ........................................................................................................................... 2
STARTING THE SOFTWARE ............................................................................................................................ 3
To start the software: ............................................................................................................................. 3
To end the software session: ................................................................................................................. 4
SELECTING GLOBAL PREFERENCES ..................................................................................................... 5
RESTRICTING ACTIONS BY PASSWORD........................................................................................................... 6
To enable password protection: ............................................................................................................. 6
COPYING DATA TO THE NETWORK ................................................................................................................. 7
DEFINING THE PROCESS WINDOW SETUP ............................................................................................ 8
Selecting a solder paste ........................................................................................................................ 9
Editing Process Window specifications ............................................................................................... 10
Assigning separate thermocouple specifications ................................................................................. 11
Saving the Process Window ................................................................................................................ 12
To create a Process Window: .............................................................................................................. 12
Change Specs Name ........................................................................................................................... 13
Using Sweet Spot Target (Optional) .................................................................................................... 13
MONITORING HARDWARE STATUS ....................................................................................................... 14
RUNNING A PROFILE ............................................................................................................................... 15
SPECIFYING OVEN CHARACTERISTICS.......................................................................................................... 16
To identify a new oven to the system: ................................................................................................. 16
To specify an oven recipe: ................................................................................................................... 17
ATTACHING THERMOCOUPLES .................................................................................................................... 19
Attaching the Air TC ............................................................................................................................. 19
Attaching standard TCs ....................................................................................................................... 19
SELECTING THERMOCOUPLES FOR THE PROFILE .......................................................................................... 20
STARTING THE PROFILE .............................................................................................................................. 21
To start the profile: ............................................................................................................................... 21
VIEWING THE LIVE PROFILE GRAPH .............................................................................................................. 22
VIEWING THE PROFILE AND STATISTICS ....................................................................................................... 24
MANUAL PROFILE PREDICTION .................................................................................................................... 25
ANALYZING THE PROFILE GRAPH DISPLAY .................................................................................................... 26
ANALYZING PROFILE DATA WITH THE GRAPH OPTION TOOLS .......................................................................... 28
Viewing temperature data at selected points ....................................................................................... 28
Enlarging graph details with the zoom option ...................................................................................... 28
Statistics Table ..................................................................................................................................... 31
Editing oven recipes and TC labels ..................................................................................................... 32
To display and use the TC and Recipe Editor screen: ........................................................................ 32
Profile screen buttons .......................................................................................................................... 33
Upon exiting the graph screen ............................................................................................................. 34
USING PROFILE EXPLORER ................................................................................................................... 36
UNDERSTANDING THE COMMAND BUTTONS .................................................................................................. 37
COMPARING MULTIPLE PROFILES ................................................................................................................ 37
To create an overlay profile: ................................................................................................................ 37
INSERTING SOFTWARE DATA FILES FROM AN OUTSIDE SOURCE ..................................................................... 41
PRINTING PROFILE DISPLAY SCREENS ............................................................................................... 42
PRINT FORMAT #1- PORTRAIT .................................................................................................................... 42
PRINT FORMAT #2- LANDSCAPE ................................................................................................................. 43

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PROFILING WITH A WAVE SOLDER MACHINE ..................................................................................... 44

Wave Surfer profiling fixture ................................................................................................................ 44
WAVE SOLDER PROFILING .......................................................................................................................... 45
Global Preferences .............................................................................................................................. 45
Process Window .................................................................................................................................. 45
RUNNING A WAVE SOLDER PROFILE ............................................................................................................. 47
Zone length, minimum and maximum temperature settings................................................................ 48
Customize Wave Solder Machine Configuration ................................................................................. 48
Entering temperature setpoints and conveyor speed .......................................................................... 50
Connecting the Air TC.......................................................................................................................... 50
Connecting wave TCs .......................................................................................................................... 51
Connecting product TCs ...................................................................................................................... 52
Selecting the thermocouples and starting a profile .............................................................................. 53
VIEWING THE LIVE PROFILE GRAPH .............................................................................................................. 55
PROFILE GRAPH DISPLAY ............................................................................................................................ 57
Preheat tab .......................................................................................................................................... 57
Wave tab .............................................................................................................................................. 58
Pointer Slopes tab................................................................................................................................ 59
Manual profile prediction ...................................................................................................................... 59
Analyzing the profile graph .................................................................................................................. 60
Graph Controller .................................................................................................................................. 61
Graph option menu .............................................................................................................................. 62
Tips for profiling wave solder ............................................................................................................... 65
ADDITIONAL WAVE APPLICATION SETTINGS ................................................................................................. 66
Run A Profile ........................................................................................................................................ 66
Select TC Screen ................................................................................................................................. 67
............................................................................................................................................................. 67
Profile Graph Display ........................................................................................................................... 67
PROFILING THERMAL CURING PROCESSES ....................................................................................... 68
To run a cure process profile: .............................................................................................................. 68
PROFILING TEMPERATURE VS. TIME PROCESSES ............................................................................ 69
CONSIDERATIONS WHEN USING THE SOFTWARE ........................................................................................... 69
Global Preferences .............................................................................................................................. 69
PROCESS WINDOW SETUP ......................................................................................................................... 70
To run a temperature vs time process profile: ..................................................................................... 71
Selecting the thermocouples and starting a profile .............................................................................. 72
VIEWING THE LIVE PROFILE GRAPH DISPLAY ................................................................................................. 74
VIEWING THE PROFILE AND ITS STATISTICS .................................................................................................. 75
Description tab ..................................................................................................................................... 75
Graph Controller .................................................................................................................................. 76
Graph Option menu ............................................................................................................................. 77
Profile screen buttons .......................................................................................................................... 78
EXITING THE PROFILE SCREEN .................................................................................................................... 79
Saving changes to the profile .............................................................................................................. 79
Saving changes to the Process Window ............................................................................................. 79
USING THE SRA SMART REFLOW ANALYZER ..................................................................................... 80
SRA PROFILING ......................................................................................................................................... 81
Global Preferences .............................................................................................................................. 81
RUNNING AN SRA PROFILE ........................................................................................................................ 82
Zone length, Minimum and Maximum temperature settings................................................................ 83
Entering temperature setpoints and conveyor speed .......................................................................... 83
Selecting a Process Window ............................................................................................................... 84
Creating a New Process Window ........................................................................................................ 84
Starting an SRA profile ........................................................................................................................ 85

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VIEWING THE LIVE PROFILE GRAPH .............................................................................................................. 86

SRA PROFILE GRAPH DISPLAY.................................................................................................................... 88
General tab .......................................................................................................................................... 88
Avg Temps By Zone tab ...................................................................................................................... 88
Reflow Specifications tab ..................................................................................................................... 88
Oven Recipe; Measured vs Setpoint; HTI ........................................................................................... 89
Compare tab ........................................................................................................................................ 89
SPC CHARTING WITH SRA ........................................................................................................................ 90
APPENDIX A: USING OPTIONAL SOFTWARE ....................................................................................... 91
USING NAVIGATOR POWER FOR PROFILE OPTIMIZATION ............................................................................... 92
Conveyor speed constraints ................................................................................................................ 92
USING AUTO-FOCUS POWER ...................................................................................................................... 93
Selecting profile optimization settings .................................................................................................. 93
Conveyor speed constraints ................................................................................................................ 93
Setting product dimensions for Auto-Focus ......................................................................................... 94
Auto-Focus confirm screen .................................................................................................................. 94
DISPLAYING STATISTICAL PROCESS CONTROL DATA ..................................................................................... 97
To view a product’s chart(s) and/or SPC data: .................................................................................... 97
SPC chart display ................................................................................................................................ 98
SPC charting for SRA data ................................................................................................................ 100
USING LIVE DATA OUTPUT (LDO) ............................................................................................................. 101
Configuration ...................................................................................................................................... 101
Operation ........................................................................................................................................... 102
CENTRALIZED PROCESS WINDOW CONTROL ............................................................................................. 103
KIC File Administrator ........................................................................................................................ 103
Configuration of PS2G software ........................................................................................................ 106
Operation of PS2G software .............................................................................................................. 107
USING VIRTUAL PROFILING ....................................................................................................................... 108
Establishing a baseline profile ........................................................................................................... 108
To run a baseline profile: ................................................................................................................... 108
Running a Virtual Profile .................................................................................................................... 112
To run a Virtual Profile: ...................................................................................................................... 112
Verification profiles ............................................................................................................................. 115
APPENDIX B: WRITING DATA OVER A NETWORK ............................................................................. 119
APPENDIX C: USING THE PROCESS WINDOW INDEX TO QUANTIFY THERMAL PROFILE
PERFORMANCE ...................................................................................................................................... 121
APPENDIX D: HOW TO RUN PROFILES WITH PROFILE STACKING ................................................ 124
LED MODES AND DESCRIPTIONS FOR THE SPS SMART PROFILER ............................................................. 124
AT THE PC .............................................................................................................................................. 125
AT THE OVEN .......................................................................................................................................... 127
BACK AT THE PC ..................................................................................................................................... 128
Downloading and Viewing Profiles .................................................................................................... 128
Name Product and Select Process Window ...................................................................................... 129
Enter Oven SetPoints and Conveyor Speed Screen ......................................................................... 129
Label Thermocouples for the Profile .................................................................................................. 130
CONTACTING KIC ................................................................................................................................... 132

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Introducing the software

Used together with a profiler, this software provides all the tools you need for basic thermal profiling. It lets you:
• Specify operating parameters
• Define individual process setups
• Monitor the status of your profiler hardware
• Graphically display profile data for analysis
• Manage data from multiple profiling runs

Optional programs
The functionality of the standard software can be enhanced by using the optional software programs:
• Navigator Power – automatically finds the optimal oven setup for each product you profile.
• Auto-Focus Power – calculates the ideal initial oven recipe to avoid typical oven setup problems.
• Statistical Process Control – displays profile data to chart Process Capability Index (Cpk) values.
• Virtual Profiling – calculates virtual product profiles when the MVP fixture is run through the reflow oven.

These enhancement options are distributed on and activated from a software key—a removable USB thumb drive
that can be separately purchased from KIC.

Profilers
The software is compatible with several different hardware models:
1. SPS Smart Profiler
2. SRA Smart Reflow Analyzer
5
3. X
2
4. K
5 2
Some illustrations in this manual may reference the X profiler. When using the software with the K profiler
references to that model will appear in the same locations. The user interface is otherwise identical. Some functions
are only available with the SPS Smart Profiler (See Appendix D: How to run profiles with Profile Stacking). For
specific information regarding your profiler hardware, consult one of the following publications:
• SPS Smart Profiler Hardware Guide, (Publication Number PTG-330310-000)
• SRA Smart Reflow Analyzer Hardware Guide, (Publication Number SRA-330200-000)
5
• X Profiler Hardware Guide, (Publication Number EXP-337310-000)
2
• K Profiler Hardware Guide, (Publication Number EXP-331310-000)

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Installing the software

Minimum PC requirements
• Dual Core / 1GHz processor PC with 2GB RAM
• 2GB available storage
• Video 1024 x 768 / 16-bit color
• 1 available USB port (for software key)
• 1 available USB port for data download
• For product compatibility with Windows® operating systems, visit our website at
http://kicthermal.com/support-download/os-compatibility-chart
Note: Additional powered USB ports may be needed for additional accessories.

Languages
The software supports the following languages:
• English • Japanese
• German • Korean
• Spanish • Simplified Chinese
• Traditional Chinese

The use of specific languages depends on the operating system:

• English, German, and Spanish can be run on any of the supported Windows operating systems.
• Japanese, Korean, Simplified Chinese, and Traditional Chinese cannot be used with English versions of
Windows operating systems.
• To run the software in Japanese, the operating system must be Windows-Japanese version.
• To run the software in Simplified or Traditional Chinese, the operating system must be Windows-Chinese
version.

To install the software:

1. Insert the USB flash drive into a USB port on your computer

2. Depending upon your computer setup, a dialog box may appear. If it does, select Open folder to view files.
If a dialog box does not appear, use Windows Explorer to browse to the USB flash drive directory.

3. Double-click the installation file in the root directory to begin the installation and follow the instructions*
for the installation program as prompted as the screens are displayed.
The software installation automatically adds a KIC folder to main Windows Start Menu.

*When installing the software over an existing Profiling Software 2G directory, the installation will
automatically create a backup folder of the existing directory. A warning message will be displayed when
selecting an existing directory, and a checkbox can be de-selected if you do not wish to create a backup.
The name of the backup directory created will be C:\Profiling Software 2G_Old_MM-DD-YYYY.

*Some optional features may require a selection to be made during the installation process to be enabled. You
should only select the optional feature if it was purchased and/or you have a license for that feature.

Note: If you have a question regarding your hardware or software configuration, contact KIC Tech Support at
[email protected]

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Starting the software

To start the software:
1. From the Windows Start button, navigate through the All
Programs list to locate and open the software product
folder that was automatically setup during installation.

2. Click on the software icon/filename.

The main screen appears:

3. Click on one of the buttons to

begin one of the software
function described below:

Global Preferences Run a Profile

Set units of measure, maximum Begins the step-by-step procedure
product start temperature, hardware for running a product profile.
configuration, and password.
Run Profile Stacking
Define/Edit Process Window Begins the step-by-step procedure
Create or edit Process Window files for for running multiple profiles in
solder paste and profile specifications. stacking mode. See Appendix D

Hardware Status
Show the status of the oven controller Profile Explorer
(if applicable), the profiler, and the Filing system used to manage and
optional software key. view all profiles run using the
software.

Exit
Exits the program, closing the
application.

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To end the software session:

1. Return to the main screen by clicking one of these buttons:

• From the Global Preferences, Run a

Profile, or Define Process Window
screens, click…

• From the Hardware Status screen, click…

• From the Profile Explorer screen, click…

2. Back on the main screen, click on the Exit button.

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Selecting Global Preferences

Figure 1: Preferences – Global Tab

You access the Global Preferences settings by clicking on the globe button on the main screen. You set your
preferences on the Global tab.

• Units of measure – There are two drop down menus to choose units for Conveyor Speed and Distance, and
weight. (The Weight is only used with the Auto-Focus program.)

• Product start temperature – The temperature of all the thermocouples attached to the product and the profiler
must be below this temperature to start a profile. This will insure that a profile is not started while the board is
still too hot. Input a value in the field or use Slider bar.

5 2
• Profiling hardware – The software detects and displays the model(SPS, X , K ) of any connected profiler. If
5
you connect a Wi-Fi SPS or Dual model X , the software displays radio buttons that let you identify the
communication mode of the unit as either Datalogger or Transmitter:

• Using an optional hardware fixture lets you perform Manual Virtual Profiling (MP). If you check the MVP
box, a percentage field appears that lets you specify the maximum Process Window Index value needed to start
Virtual Profiling. (See Using Virtual Profiling section for details)

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Note: If you are running on an oven with communication compatibility with the software, there will also be a
field appears to let you input an oven name. The name is saved with the profile and can be sorted on in the
Profile Explorer.

• Languages – Select the language that you wish to run the software. It is necessary to restart the software after
changing to a different language. See important information about Languages on page 2.

• Engineer password – By checking this and entering a password you can control access to certain menus in the
software.

• Copy Data to Network – Checking the Copy Data to Network box lets you store files and data to a network
location for backup or archival purposes.

Restricting actions by password

At various points in the software you can restrict the ability to perform certain functions by protecting access to
them with passwords.

To enable password protection:

1. On the Global Preferences screen, click the Engineer Password check box.

A text entry field appears to the right.

2. Type the password in the field.

3. Click the Save button to establish the password.

After the password is established, the software will prompt

for entry when a protected function is attempted. For
example, clicking the Global Preferences button on the
main screen displays the prompt shown here:

Similar password protection applies to the functions listed

below:

• Saving or deleting Process Windows or changes to Process Windows in the Process Window screen

• Removing ovens on the first Run a Profile screen

• Deleting a profile in the Profile Explorer

• Accessing the Optimization tab on the Profile Graph and Statistics screen

• Accessing the graph controller

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Copying data to the network

The Copy to Network tool allows you to save copies of all Profiling Software files and data to a network location for
backup or archival purposes. All data will still be resident in the local directory. When you click the check box, the
tool software launches, and an icon appears in the system tray area. Right click, and then choose Settings to
configure the CopyToNetwork settings.

CopyToNetwork software tool screen

Select the folders and/or data to be copied and then enter or browse to the network location. You must enter a valid
network path. Click the Save and Start button to begin copying the selected files and folders to selected network
location.

The software will prompt you to either, copy all the data now or save the settings without copying the data.

CopyToNetwork message

Yes – The selected data is copied to the selected network location and the settings are saved.
No- The settings are saved, but no data is copied.

Notes:
• If the network location is not available, is an invalid path, or the network is disconnected, Profiling
Software temporarily writes the selected data to the C:\Profiling Software 2G\_Data_Backup_ folder until
the network path or connection has been reestablished.

• The CopyToNetwork tool launches automatically if the Copy to Network option is checked in the Global
Preferences-Barcode tab.

• Whenever any selected folder is updated with new/modified information, the new information is
automatically backed up to the network location without any further user interaction.

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Defining the Process Window setup

Deselect this check box

to assign separate specs
for each thermocouple
used. See details below.

Figure 2: Process Window Setup

Process Window name – Name of the Process Window file that includes the statistics chosen and limits for those
statistics, along with whatever text is typed in the Description field. See Figure 2.

• Solder paste menu - A read only library list of numerous solder pastes along with the statistics and limits
suggested by the paste mfg., also included is a User-Defined option in the list which allows you to create a spec.
of your own. See below for additional details.
• Edit specs – Screen allowing you to edit or choose statistics and limits for a chosen solder paste or define your
own specs
• Wave – This checkbox switches between the process specs and the Wave process specs for the selected Process
Window. Set up a Process Window specific to Wave TCs for Wave Solder profiling.
• Read only text box – Shows the paste name, statistics name, and limits for a Process Window chosen, edited,
or saved by you. To edit select the Edit Specs button.
• Same specs for all TCs – By deselecting this checkbox, you can assign separate specifications for each
individual thermocouple you are using. After deselecting the checkbox, you’ll need to click on the Edit Specs
button to choose which statistics will be used and what spec limits will be set for each thermocouple used. This
option would be used if you had component specific specifications that differ from the general solder paste
specs. Another use for this would be if you wanted to monitor the actual board temperature as well as
component temps. You would then only select the statistics for that TC that are relevant. If you wish to use the
same specifications for all thermocouples, put a check mark in the box.
• Select TC to view – This dialog box will appear only if the Same Specs for all TCs checkbox is deselected. By
clicking on the dropdown menu, you can view the specifications that have been defined for that number
thermocouple. If a description was included, it will be displayed next to Label.
• Process Window description – Field allowing for freehand notes for a particular Process Window.

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Selecting a solder paste

Figure 3: Solder Paste List

Solder Paste menu - Once you have clicked on the Solder Paste Menu you will have a list of pastes to choose from.
Use the scroll bar on the right to find your paste, and then click on the paste in the list. See Figure 3.

• Clicking on the green check will accept that paste and load its specs automatically. You will then return to the
Process Window screen, after being presented disclaimer information.

• Clicking on the picture of the paste jar and tube will give you technical support information for the solder paste
Mfg. that you chose.

• Clicking on the red X will cancel your selection and return you to the Process Window screen without making
any changes.

Note: The solder paste list is updated periodically. Check the Internet for updates -- www.kicthermal.com

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Editing Process Window specifications

Figure 4: Process Window – Edit Specs

Process Window name is listed at the top of the screen. See Figure 4.

There is a single drop-down list at the top that contains all of the available specifications that can be applied to your
Process Window. These specifications are specific limits or a group of limits that define the overall Process
Window for your product. These specifications include Slope, Preheat, Soak, Peak temperatures, and Time above
temperatures.

Spec details – The Spec details coincide with the selected Specification. For each Specification selected, enter the
Temperature, and Time limits. These limits are usually dictated by the solder paste used. The software uses the
limits to measure the profile PWI.

Note: Changes made within this screen will have a direct effect on the profile PWI value.

Once you complete all spec modifications, click on the green check button to apply your changes. Clicking on the
red X (cancel) button will cancel your changes and exit.

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Assigning separate thermocouple specifications

Figure 5: Process Window – Separate Specs

TC selection & label

If you choose to assign separate specs for each TC, click the Edit Specs button and the screen will now appear with
an additional area for TC Selection & Label. See Figure 5.

• Select - Use the Select drop-down menu to select the TC whose specifications you wish to view/edit. The Spec
Details for the selected TC is displayed.
• TC label – This area will allow you to type in a description or label to identify that particular TC. If left blank,
the TCs will simply be identified as TC2, TC3, etc.

Note: When separate specs are being used, this is the only place where you can select or deselect which TCs will be
used for a profile.

Once you have completed all edits of the specs you can click on the Green Check button and your changes will be
applied. Clicking on the Red X (Cancel) button will cancel your changes and exit. See Figure 5.

Note: If you are having trouble defining your process specifications, contact us at [email protected]

Select TC to view – Drop-down menu containing

the TCs that have already been defined. (Previous
step) See Figure 6.

Figure 6: Process Window – Separate Specs – Select TCs

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Saving the Process Window

Figure 7: Save Process Window

To create a Process Window:

1. Choose a solder paste from the Solder Paste menu.
2. Edit the specs if necessary. See Page 10 for details.
3. Enter a name the Process Window.
4. Save the Process Window.

To save - Click on the green check (Save and Exit) button. A dialog box will appear asking if you want to save the
changes to the new Process Window file. See Figure 8.

Figure 8

Clicking on Yes will save it and exit to the main screen. You can click on No and click on the red X “cancel button”
to exit without accepting or saving any changes.

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Change Specs Name

If you wish to rename the label for a particular statistic, start by clicking on the Change Specs Name button (found
on the Edit Specs screen), which opens a separate window. Put a check mark in the checkbox at the top of the screen
to enable the change function. Next, locate the desired specification in the greyed out columns, and type in the new
name in the corresponding editable column. Click Save, then Exit to close the window and return to the Edit Specs
screen.

Using Sweet Spot Target (Optional)

If you purchased the Sweet Spot Target option, you will see an additional checkbox on the main Process Window
screen. Putting a checkmark in this box will enable this feature for the specified Process Window:

Normally, when selecting a specification, only an upper and lower limit is defined, and the “target” value is
automatically the center of the upper/lower limits. With the Sweet Spot Target option, enabling this feature allows
you to manually define your own Target value for each statistic. This function may be desired when there is a
defined specification window, but the desired optimal value may not be the exact center of the limits.

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Monitoring Hardware Status

Figure 9: Hardware Status

Oven Controller – Shows the status of the connection between the software and any connected oven. Contact KIC
for details about connecting your reflow oven.

Profiler status panel– Names the currently selected profiler and displays the following information:
• Profiler communication status
• COM port – when connected.
• Temperature display – for all connected thermocouples.
• Battery Voltage.
• Internal Temperature – of profiler.
• Maximum Temperature Capability – This value determines the maximum temperature that the profiler can
read.

Software Key – Shows the status of any software key that is connected. Displays the functions associated with the
software key.

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Running a profile

The Run a Profile button will guide you through a series of screens, which will finish at a completed and graphed
profile. To move through these screens you can use the Back, Next, or Cancel buttons located at the bottom of the
screen.

Figure 10: Run a Profile Screen #1

Settings on the Name Product and Select Process Window:

Product Name – Enter in a unique product name (long file names are acceptable) or choose an existing product
name from the drop down list.
Process Window – Choose a Process Window from the drop down list. These Process Windows are created in the
Define/Edit Process Window screen which is accessed from the main screen.
Application – Select your Application type/profiling fixture from the drop-down list.
Sample Rate - Select the number of samples per second from the drop-down list for each product.
Set Trigger – Manually set the Middle and profile End temperature triggers for each product.
• Note: The Profile start temperature trigger is determined by the Maximum Product Temperature at Start
of Profile setting in the Global Preferences screen. The start trigger value is always 2ºC above this value.
• Note: For Temperature vs. Time profiling, trigger temperatures are not used. Instead a Profile Stop
button is displayed in the bottom-right hand corner of the profile graph screen.
Oven Name – Enter a unique oven name or choose an existing oven from the drop-down list. The oven will have
information about the number of zones saved with it as well as other zone information. This is entered on the next
screen.
Remove Oven button will delete the oven name currently displayed in the field.
• If you are running the software on an oven controller computer that is communication compatible with
the software the number of zones is already known and the oven name will be entered in the Global
Preferences screen, not on this screen. In addition, the Enter Oven Setpoints and Conveyor Speed screen
is skipped because the software already has the recipe information from the oven controller.
Enable Auto-Focus – Enables or disables the Auto Focus tool for the current profile (requires software key).
Profile Description – Allows for freehand typing of any notes you may want to include with this profile.

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Specifying oven characteristics

To ensure accurate profile data, you may need to enter specific information into the software about the oven(s) you
intend to use--information that changes the default values used by the software’s predictive algorithms. These
default values are stored in an oven initialization file that the software creates when you first enter the name of a
new oven. The software adds the extension .kiccfg to the name you entered and stores the file in this location:
C:\Profiling Software 2G\Ovens

Unless you specify otherwise, the software works with the following initialization file default assumptions:
• The zones are uniform and consecutive with no large gaps between them.
• The minimum temperature for all zones is 70° C.
• The maximum temperature for all zones is 350° C
• Default setpoint values start at 100° C and increases at 5° intervals at each zone.

At the start of the profiling process, the software displays a series of screens that let you change the default values in
the file to accurately reflect your equipment. You will likely need to set some values, such as the length of oven
heating zones, and min/max temperature limits only once--when you first set up the oven. Others, such as
temperature setpoints and conveyor speed values that make up an oven recipe, you may change frequently to match
to new products.

To identify a new oven to the system:

1. On the Name Product and Select Process Window screen, type a
new, unique name in the Oven Name field.

2. Click the next arrow button.

The Verify the Length of Each Zone

and the Minimum and Maximum
Setpoint Temperatures screen appears.

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3. In the Number of Zones field, type in the quantity for the oven.

The screen populates with numbered zones and associated

temperature fields:

4. Deselect the All Zone Lengths are the same check box.
The screen populates with default length values:

5. Type new values in the Length fields.

6. If needed, type in replacement values for the minimum and maximum

temperature setpoint values.

7. Click the back arrow button to save the settings or click the next arrow
button to save the settings and display the next screen to specify an
oven recipe.

To specify an oven recipe:

1. On the Name Product and Select Process Window screen, select an
oven from the Oven Name field pull down list.

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2. Click the next arrow button.

The Enter Oven Setpoints and Conveyor

Speed screen appears.

Note: This screen does not appear when the software is communicating with an oven controller.

3. Type in new temperature values for the top of the oven zones.

4. If the bottom of the zones are to have different setpoint

values than the top, deselect the Top and Bottom
Setpoint are the same checkbox.
The bottom row of fields becomes editable (white).

5. Enter new temperature values in the bottom row fields.

6. Type in a value in the Conveyor Speed field.

7. Click the next arrow button to advance to the thermocouple attachment phase of running a
profile.

Note: If the zone lengths of your oven have been changed since you first
characterized the unit in the software, or you just want to check the current
settings, use the Zone Length button to display the Verify the Length of
Each Zone and the Minimum and Maximum Setpoint Temperatures screen.

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Attaching thermocouples
Thermocouples (TCs), attached to solder joints or other important sites on the board, directly measure the
temperature at the point that the TC bead is in contact with the PCB. The TC measurements are collected by the
profiler and the software to create thermal profiles.

As part of the running a profile process, the software displays illustrations that show how to attach thermocouples
using aluminum tape. These images also appear in the procedures that follow.

The system works with two kinds of TCs—standard TCs and the air TC. Standard TCs record the temperature data
for various sites on the board. The air TC gets specific positioning because its temperature triggers the start of the
profile data processing, aids with TC shifting, and improves the prediction capabilities of the software.

Attaching the Air TC

There are two important considerations regarding the Air TC:

1. It must be attached at the leading

edge of the board, extending one
inch (25 mm) in front of the
leading edge of the board.

2. It MUST be plugged into channel 1

on the profiler.

Attaching standard TCs

Attach the standard TCs at selected sites on
the board, and plug them into the remaining
connectors on the profiler. Order is not
important, unless you plan on labeling where
each TC is attached.

When selecting a position for the standard

TCs, you want to measure points on the
product that represent the mass-range of the
product. Select at least one position that is a
high mass (large component) area of the
board and at least one position that is a low-
mass (small component) area of the board. If
you can develop an acceptable profile for the
low and high-mass areas of the board, you
can process the other areas of the board
within the same parameters.

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Selecting thermocouples for the profile

Figure 11: Run a Profile screen #7 – Select TCs

Include thermocouple (TC) labels (20 char. Max) – Checking this will display a field below each TC that is
checked. Up to 20 characters can be used to describe the placement or location of that TC.

TC number check box – Place a check next to each TC channel that is going to be used for this profile. TC number
1 is always used for the AIR TC. You must have at least one other TC being used.

Note: If the selected Process Window has Separate Specs for TCs, then you must return to the Process Window-
Edit Specs screen in order select/deselect TCs or change their text labels.

Live reading – When the profiler is on and either plugged into the download cable for data logging or transmitting
to the receiver which is plugged in, you will see live temperature updates for the TCs plugged into the profiler. The
TC checkbox must be checked as well to get the temperature updates. If you do not see live temperature readings
recheck all the cable and or computer connections.

Battery voltage – This displays a live reading of the profiler battery voltage. The software will recognize if your
battery voltage is too low to complete the profile and not allow you to start a profile until the batteries have been
replaced.

Profiler internal temperature – This displays the internal temperature of the profiler. If the temperature is too
high to complete the profile and stay under the maximum temperature rating for the unit, it will not allow you to
start the profile. You must wait until the profiler is cool enough. The software will let you know what temperature
the profiler should drop below.

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Starting the profile

Before you can start the profile run, you need to make sure your profiler is powered on and ready and that the oven
temperature has stabilized. Depending on the settings in the profiler and in the software, you may have to initialize
the profiler at times. The software lets you know when this is necessary. To initialize, connect the communication
cable to the profiler, and click OK when the initialization successful message appears.

To start the profile:

1. On the Select the Thermocouples for the profile screen, click on the Start Profile button.

The software asks if the oven control TCs are within 2 degrees of the setpoint value:

2. Click the appropriate response button:

If you click YES the next screen in the If you click NO, the software asks if the stabilizing oven is
profile sequence appears, prompting you to getting closer to 2 degree limit:
place the profiler and board into the oven:

• Click YES to wait for the oven to stabilize within the 2-

degree limit and continue profiling.

• Click NO if the oven has stabilized but is still not within

two degrees of the setpoint values. In the oven software,
3. Follow the further on-screen change the setpoint values to the temperatures the control
instructions. thermocouples are currently reading. The software will
recalculate the zone separation capability. Clicking OK
on the next screen allows the Navigator to suggest a new
recipe that your oven will more likely be able to control
to. From there, you will step through running the profile.
Change the values, return to the main screen, and start the
profile sequence over.

IMPORTANT NOTE: All profilers have a maximum operating temperature that, to avoid damage, should never be
exceeded. See the product datasheet for temperature tolerance information.

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Viewing the live profile graph

Figure 12: Live Profile Graph Display

The Live Graph screen shows the real-time plot of the product going through the oven. This will only appear for the
profiler-RF models or for Temp vs. Time profiles. During the live profile all of the tabs on the screen are
inaccessible. The only action that you can take at this point is to cancel the profile by clicking on the RED X button
or the Profile Stop button for Temp vs. Time.

The Live Profile Graph display will remain on your screen until the profiler has achieved the trigger temperature
that determines the profile end.

Profile status
The bottom part of the screen will keep you apprised of the progress of the profile in reference to the profiler
hardware status. Status messages include:
• Waiting for the Air TC to exceed the start trigger temperature.
• Profile started- Waiting for the Air TC to exceed the midpoint trigger temperature.
• Profile will stop when all thermocouples drop below 80 Celsius.
• Profiler currently retransmitting.
• Profiler retransmission successful!

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During the live profile:

• The live profile is plotted on the graph. (Profilers with wireless only.)
• The current temperatures for each thermocouple and the delta between them are displayed in a small
window in the upper-left hand corner of the profile graph. The elapsed time is also displayed, profiler
transmitter models only.
• The current oven temperature setpoints and conveyor speed for this profile is displayed beneath the
Statistics table.

Profile retransmission
While a profiler with wireless capability transmits the live profile data to the software; it simultaneously stores the
profile data in its memory. Once the profiler detects that all of the thermocouples have cooled below the profile-end
trigger value, it will begin retransmitting the profile data to the software via the profiler Base Station. When
retransmission begins, the profiler will send the profile in data packets. The retransmission status is displayed at the
bottom of the screen. See Figure 13.

Figure 13: Retransmission of Profile Data, RF Profilers only

When all the data packets have been received, the software will display a message asking you to turn the profiler off,
choose OK. Failing to turn the profiler off will drain the batteries.

Next, the software will automatically analyze the profile data and presents the profile and statistics. If you
purchased the Navigator option, the predicted oven settings will be displayed as well.
See Figure 14 through Figure 17.

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Viewing the profile and statistics

Figure 14 Figure 15
General Tab – Shows graph, statistics, and recipe General Tab – Graph view (double-click on graph)

Figure 16 Figure 17
General Tab – Statistic view (double-click on stats table) Description Tab – Shows Description notes, statistics, and
recipe

At the top of the screen is the temperature plot of the TCs, in the center of the screen is the statistical table, and the
bottom of the screen shows the recipe information – setpoints and conveyor speed settings.

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Manual profile prediction

The software has automatic (Navigator), and Manual Prediction capabilities. The standard software installation
includes Manual Prediction capabilities.

Manual Prediction gives you the flexibility to easily predict changes to the oven settings (temperature settings,
conveyor speed), and view the results without having to spend the time actually running the profile. This feature is
very helpful to minimizing the time spent fine tuning or developing a thermal profile.

Figure 18: Original/Predicted setpoints – Manual Prediction

Figure 19: Original/Predicted setpoints – Navigator (Optional)

This is an example of how the software (standard and with Navigator) lists the PWI, and oven settings for the
profile. This table is divided into the original section (top), and the Predicted section (bottom). See Figure 18.

The original values represent the oven settings at the time the profile was run. The predicted values represent the
prediction results as determined by the Navigator software. See Figure 19.

If you purchased the Navigator software option, the software will automatically generate results that are best suited
for the selected Process Window. In the event you wish to modify the prediction results of the Navigator, you can
do so. See Figure 20.

To predict changes to the oven settings, or modify the Navigator prediction results, click on the zone you wish to
change. In the example below, zone 1 has been selected. See Figure 20.

Figure 20

Type the new temperature setting, and then press Enter. The Navigator will predict the results of that change, and
then automatically update the PWI, predicted Statistics, and the profile graph. The new predicted results will be
displayed on the graph in a dotted-line format. This format enables you to easily determine the difference between
the original and predicted profiles. See Figure 21.

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Analyzing the profile graph display

Original profile plot

(solid lines)

Predicted profile plot

(dotted lines)

Figure 21: Graph Display

The PWI for the profile is displayed in the bottom-left corner of this screen. If the measured PWI is below 100%,
the value will be displayed in green. See Figure 21. If the measured PWI is 100% or higher, the value will be
displayed in red. See Figure 22.

A PWI under 100% A PWI above 100%

is acceptable is unacceptable

Figure 22: Profile PWI

Note: This display method enables you to easily identify whether the profile is in- or out-of-spec.

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Adjusting the appearance of the profile graph

The Graph Controller screen lets you modify
the appearance of the profile graph. To open
the Graph Controller, click on the TCs and
Settings column header in the statistics table.

Auto Scale – The Auto Scale feature

automatically adjusts the X and Y axis scales
to fit all of the data in the profile graph.
When the feature is disabled, you must input
the scale settings manually.

TCs – The TCs section lists the

thermocouples used for the profile. In the
event that you wish to view the profile
without one or more thermocouples, you can
deselect individual thermocouples, or
deselect the All check box, and choose only
the thermocouples you wish to view. In the
event a single, or multiple thermocouples
become disconnected from the product Figure 23: Graph Controller
during the profile, you can deselect the
affected thermocouple(s). The software will
recalculate the PWI and update the profile
statistics based on the remaining
thermocouples selected. You must select at
least one product thermocouple.

Grid – Enables/disables the view of the X and Y Axis scales.

Reference lines – These lines represent any temperatures referenced in the selected Process Window. When you
use separate thermocouple specs, the Reference Lines check box is disabled, and no lines appear on the graph.

Zone lines – Enables the view for the oven zone lines on the profile graph.

Predicted TCs only – Removes the original TC data form view, displaying only the prediction profile plot

Zero decimal – When using the Pointer tool, this setting enables or disables the decimal display. When unchecked,
the software will display one decimal point.

Internal temp – Enables the view of the profiler’s internal temperature profile plot on the graph.

Display Detailed PWI – Disables the PWI calculations for the individual statistics, and only shows the “overall”
PWI.

Extra Cooling Slope – Enables the display of multiple Cooling Slope calculations at specified intervals.

Display of Pointers – If you choose to add pointers to the graph, this area allows you to select which calculations
will be displayed in the Pointer Slopes tab of the statistics table.

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Analyzing profile data with the graph option tools

The Graph Option menu includes tools to let you analyze the
profile data in closer detail. To view the menu (Figure 24),
right-click anywhere within the profile graph area.

Figure 24: Graph Options

Viewing temperature data at selected points

The Examine option lets you use the mouse pointer to display temperature values at any
selected point along a graph line.
Wherever the pointer is moved across the profile, the data shown in Figure 25 appears:
• The first column is the actual temperature for each TC.
• The second column is the temperature of the predicted profile data – based on
setpoint or belt speed changes.
Figure 25: Graph Pointer
• The Delta T for both actual and predicted TC data.
• The Time during the profile at which the pointer is placed
To disable the Examine view, right-click on the graph and deselect Examine.

Enlarging graph details with the zoom option

You can get an enlarged view of selected areas of the profile display.
Right-click on the graph to display the Graph Option Menu, then select
the Zoom option. See Figure 26. A chart appears on the left side of the
graph. See Figure 27.

Figure 26: Zoom Option

Figure 27: Graph Option Menu - Zoom

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Using your mouse pointer, click and drag the view window in the graph over the area you wish to enlarge.

Figure 28: Graph Option Menu - Zoom

To disable the Zoom view, right-click on the graph, and deselect the option.

Move TC line
The Move TC line feature allows the user to manually move the thermocouple plot
on the profile graph. This is used to fine-tune the profile or make corrections in the
event the software did not properly display the plot. See Figure 29.

Select the thermocouple you wish to move and then click and drag the highlighted
plot and move it to the desired location on the profile graph. See Figure 30.
Figure 29: Move TC Line

Figure 30: Move TC Line

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Move Zone line

The Move Zone line feature allows the user to manually move the zone separation lines on
the profile graph. This is used to fine-tune the profile or make corrections in the event the
software did not properly display the zones.

Figure 31: Zone Resize

Figure 32: Move Zone Line

Zone Resize
Select to move the first line (zone beginning) or the last line (Zone
ending) and then click and drag it to the desired location on the profile
graph. See Figure 33.

Figure 33: Zone Resize

Reset
The Reset feature will reset the profile and undo any changes you have
made to the graph using the Graph Option Menu. Select the TC Line, or
Zone Line option. See Figure 34.

Figure 34: Reset

Move Last Zone Line
For special profiling conditions, such as on vacuum reflow ovens, this tool
lets you extend out the last zone size, better visually representing the size of the vacuum zone.

Pointer/Slopes
This tool lets you place up to six (6) pointers on the graph, which can be used for calculating/highlighting data in
specific areas of the profile. Use the Remove All Pointer/Slopes tool to clear all pointers from the graph.

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Statistics Table

Profile Tab

Pointer Slopes Tab

The statistics table is displayed in the center of the graph screen and lists a variety data, depending on which tab is
selected, for the current profile being shown. It will list any measured value, as well as the corresponding PWI value
(where applicable).

Profile Tab – Displays any statistical value selected during the Process Window setup. Any statistic displayed in
green is within the specification limits. Any statistic in red is outside of the spec limits defined.

Pointer Slopes – This tab will display the calculations for any Pointers that were placed on the graph. It can display
the temperature at each pointer location, as well as the Slope, Time, and Peak temperature between any two
Pointers. Right click on the graph and click Pointer/Slopes then left click to add a pointer on the plot. Open the
Graph Controller menu to select which data to show in this table.

Automatic calculation of Delta T + Delta (or range) for all stats

The software will automatically calculate, and display in the statistical chart, the Delta for both the original and
predicted profile data for all TCs for all Statistics. This is the range of the highest to the lowest value for any given
specification. This information is strictly being displayed and is not factored in to the PWI value and is not used in
any predictive calculations.

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Editing oven recipes and TC labels

Sometime after you have run a profile, you might need to update various values associated with it such as:
• Oven name
• Conveyor speed
• Zone temperature setpoints
• Labels originally assigned to individual TCs

The software provides an editor screen for this purpose.

To display and use the TC and Recipe Editor screen:

1. Display the profile graph screen (any tab view).

2. Right click anywhere within the statistics table at the bottom of the screen.

The TC and Recipe Editor screen appears:

3. Place the cursor in any field and type in new values.

Note: The conveyor speed and zone setpoint fields only allow numerical values:
• Zone setpoint values must be between 70 and 350°C (158 and 662°F)
• Conveyor speed values must be between 5.0 and 100.0 inches (12.7 and 254.0 cm)

4. Click the check button to save the changes.

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Profile screen buttons

There are four buttons at the bottom of the profile screen:

Edit/Define Process Window – Choose this button to either view or edit the process
specification(s) for the product used in this profile.

Copy to clipboard – Choose this button to copy the profile data to the windows clipboard. You
can then paste the data to a different application.

Print – Choose this button to print a copy of the profile that is currently on your screen.

Main menu – When finished viewing or analyzing the profile, select this button to either run
another profile with this product or return to the main menu. You will be returned to the Profile Explorer if the
profile was opened from there.

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Upon exiting the graph screen

Do you want to run another profile with this
product? See Figure 35.

If you select No, you will be returned to the main

screen or the Profile Explorer if the profile was
originally opened from there.

Figure 35
If you select Yes, you will need to choose from the
Original or Predicted recipe settings. See Figure 36.

Original – The same recipe settings used when this

profile was originally run.

Predicted - The recipe settings as predicted by the

Navigator option, or a standard prediction manually
input by you.
Figure 36

For both the original and predicted recipe settings, the software will automatically send the selected recipe
information to the oven controller. If there is no communication between the software and the Oven controller, the
software will display a dialog box showing the recipe information. You must manually enter this recipe information
in the oven control software. See Figure 37.

Figure 37

The software will automatically apply the changes to the Run a Profile –Enter Setpoints screen. You will exit to the
Run a Profile –Enter Setpoints screen. If you are running on the oven controller PC, and the oven is compatible with
the software, the oven recipe will automatically be updated.

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Saving changes to the profile:

Any changes to the Description Notes or the Process
Window can be saved with the profile. See Figure 38.
This will permanently update this profile with the
changes. Changes to the Process Window saved here
only save the changes with the profile. To save the
changes to Process Window file see next dialog box.
See Figure 39.
Figure 38

Saving changes to the Process Window:

If you have made changes to the Process Window

from the Graph screen you can save these changes
when you exit the graph screen. The Process Window
will permanently have these changes whenever it is
used to profile from this point forward.

The software will take you to the Edit Process

Window screen in order to save the changes that you Figure 39
have made.

The first dialog – “Do you want to run a profile with this product?” will appear each time you exit the graph screen.
Click on No if you do not wish to profile.

You will be sent back to the main menu if you had just completed running a profile. If you opened the profile from
the Profile Explorer you will be returned to the Profile Explorer. The other two dialogs will only appear if changes
are made to the Description notes or Process Window.

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Using Profile Explorer

Figure 40: Profile Explorer

The Profile Explorer is a data file management tool that creates a folder for each unique product you name when
profiling. The software gives the folder the product name, and under that folder, all the profiles for that product are
saved. See Figure 40.
• The list of product folders is in the upper left of the Profile Explorer. Click on a folder to display the
profiles in the profile section at the bottom.
• The profile section can be sorted by click on any of the column headers. Single clicking on a profile will
display the Profile Description in the upper-Right corner.
• Double clicking on a profile will display the graph and statistics for that profile.
• Clicking on the Display Graph… button will also display the profile.

Note: The default data path can be changed, see page 119 for details.

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Understanding the command buttons

Save button – Allows you to save a copy of a profile to another folder or to an external drive.

Delete button (trashcan) – Allows you to delete the selected profile.

Display profile button – Displays the profile for viewing or analysis.

Main menu button – In the lower right corner returns you to the Main Menu.

Optional Buttons (Only displayed if software key is detected)

Product dimensions button (Ruler) – For Auto-Focus users, allows you to edit the length, width, and
weight of the selected product. Whenever the product dimensions are changed in the Profile Explorer, all the
profiles in the directory will be updated automatically.

MVP - Virtual profile – Select this button to run a Virtual Profile using the MVP profiling fixture.

SPC – display charts – Select this button to display the SPC charts for the selected profiles in the SPC
Column.

Comparing multiple profiles

The Profiler Explorer screen can display profile data in an overlay mode that lets you simultaneously compare
multiple profiles in a single chart. Overlay mode lets you combine the plotted data from up to three profiles into a
single display file that can be saved for future reference.

To create an overlay profile:

1. In the lower-left corner of the Profile Explorer screen,

click the Overlay radio button to switch the Profile
Mode from Standard.

Overlay Mode option buttons appear to the right, a

Profile Overlay selection column appears in the profile
list, and the Overlay icon joins the other command
buttons along the bottom of the screen.

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2. Click the checkboxes to select the profiles that you

want to overlay, choosing the last selected as the target
profile.

Note: As shown below, the target profile appears highlighted in blue. The overlay display compares the
other selected profiles against the target. View target profile information in the Profile Overlay Graph
Controller (Figure 43).

Target Profile
(Highlighted)

Overlay Icon Button

Figure 41: Profiler Explorer – Overlay Option

3. Click the Overlay icon.

The data for the selected profiles appear plotted in a single chart with statistics displayed in a table as
shown below:

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Figure 42: Overlay Option – Graph display

The curves for each TC are shown in different

colors while distinct shapes (square, circle,
and triangle) indicate the different profiles in
the overlay view.

4. When finished analyzing the data, click the Profile Explorer button.

A message appears, prompting you to save the overlay profile:

5. Click Yes.

Note: After saving overlay profiles you can display them

exclusively by selecting the Show Saved Overlay Profiles
option on the Overlay Mode panel.

Note: While viewing multiple profiles, the prediction capabilities are disabled.

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Adjusting the appearance of the overlay graph

Target profile Info

Figure 43: Overlay Option – Graph Controller

The Profile Overlay Graph Controller screen lets you modify the view of the multiple profile graph display. To
open the screen, click on the TCs column header in the Process Window data table. The screen’s features are
described below:
Auto Scale – The Auto Scale feature automatically adjusts the X and Y axis scales to fit all of the data in the profile
graph. When the Auto Scale feature is disabled, the user must manually input the minimum and maximum scale
settings for the X and Y axis scale of the profile graph.

Target Profile – Displays the profile information for the profile selected as the Target Profile. The Target Profile is
the highlighted profile when selecting multiple profiles from the Profile Explorer Main Screen.

List Compare Profiles – Displays the profile information for the profiles that have been selected. Scroll to view
the information. Deselect the check box to remove the profile from the graph.

Selecting thermocouples to view

The TCs section is a list of the thermocouples used for the profile. By selecting All you are selecting that all the
thermocouples used for the original profile will be displayed on the profile graph. In the event that you wish to view
the profile without a particular or multiple thermocouples, you can deselect individual thermocouples, or deselect
the All check box, and choose only the thermocouples you wish to view.

Deselecting thermocouples
You can deselect thermocouple(s). The software will recalculate the PWI and update the profile statistics based on
the remaining thermocouples selected. You must select at least one product thermocouple.

Grid – Enables/disables the view of the X and Y-Axis scales.

Reference lines – Clicking this check box enables the view of Reference Lines displayed on the profile graph.
These lines represent any temperatures referenced in the selected Process Window. When you use separate
thermocouple specs, the Reference Lines check box is disabled, and no lines appear on the graph.

Zone Lines – Enables the view for the furnace zone lines on the profile graph.

Zero Decimal – When viewing the Pointer tool, this setting enables or disables the decimal display. When
unchecked, the software will display one decimal point.

Internal Temp – Enables the view of the profilers’ internal temperature profile plot on the graph.
Number of seconds to calculate slope over- User defined field for entering the time in seconds to calculate the
Slope values for the Pointer/Slopes feature.

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Inserting software data files from an outside source

Software data files can be sent or received via email. To view them using the KIC software, copy them to the
Profiling Software 2G\Profiles folder using Windows Explorer.

The next time you enter the Profile Explorer screen, the software will automatically create folders for those profiles
based on the profile name and move the profiles to the correct folders.

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Printing profile display screens

The software will print profiles only from within the profile display screens. There are two print formats available.
Print Format #1 is the default.

Select the print button at the bottom of the screen to print a profile. A print dialog box will appear.
See Figure 44.

Print Format #1- Portrait

Print

Print Preview

Close

Figure 44: Print Options Screen – Print Format #1 - Portrait

Enter the “Company Name” and “Site ID.” Check the items you wish to include on your profile printout.
Pass/Fail – Adds additional notation on printout to designate if the PWI is within user specified value.
Press the Print button to print the report.
Press the Print Preview Button to display a preview of the report. See Figure 45.

Print Format # 1 Print Preview

Figure 45: Sample Print Preview for Report Format #1. Report is printed in Portrait layout.
Includes the Company Name, Site ID, Date, Statistics, Profile Information, Setpoints,
Profile Graph, Statistic Limits and Profile Description.

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Print Format #2- Landscape

Figure 46: Print Options Screen – Print Format #2 - Landscape

Enter the “Company Name” and “Engineer”. Check the items you wish to include on your profile printout. See
Figure 46.

Press the Print button to print the report.

Press the Print preview button to display a preview of the report. See Figure 47.
Pass/Fail – Adds additional notation on printout to designate if the PWI is within user specified value.
Memo Box –Enables/Disables a Memo Box area for Draft, Review and Approval Signatures and Dates.
Image/Logo – Enables/Disables the Image/Logo display area
Image/Logo Path – When Image/Logo is enabled, specify the path to any BMP image file that you want to appear
in the Image/Logo display area on the report.

Print Format # 2 Print Preview

Figure 47: Sample Print Preview for Report Format #2. Report is printed in Landscape layout.
Includes the Company Name, Engineer, Date, Statistics, Process Window, Setpoints,
Profile Graph, Profile Description, Image/Logo Area and Memo Box Area

Note: Optionally, you can print the contents of any screen in the software by pressing F9 on your keyboard. The F9
function will not work while viewing the Profile Printout Setup dialog box.

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Profiling with a wave solder machine

KIC profilers can be used to measure thermal profiles in a wave solder machine. The process is very similar to
profiling a solder reflow oven. The software guides you through the process.

Note: KIC does not recommend installing this software on an oven controller PC if you plan to run wave solder
profiles.

Wave Surfer profiling fixture

Wave Surfer is a wave solder machine accessory
specifically designed for use with the KIC
profilers. See Figure 48.

The Wave Surfer has embedded thermocouples

that give wave specific data including conveyor
speed each time you run it through your wave
solder machine.

Wave Surfer users can collect profile and wave

data and using the Navigator and SPC option(s) to
optimize their process. Figure 48: Wave Surfer Fixture

The Wave Surfer simplifies wave soldering

profiling. The device is used to routinely check the wave machine. Using the Process Window Index, the machines
performance is measured each time a pass is made based on your selected Process Window.

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Wave solder profiling

This section will outline the steps necessary to setup and run a wave solder profile using your profiler and the
software. This section is written assuming you have a basic understanding of the software and its functions before
attempting to run profiles on a wave solder machine.

Global Preferences
Unit of measure – Wave solder machines generally use the Fahrenheit scale for preheat and solder pot temperature
measurements. If necessary change the temperature units to Fahrenheit.

Product start temperature – This temperature setting can be changed. It is up to you to determine what
temperature setting will work best for their process.

Maximum product temperature at start of profile – This setting will determine the maximum product
temperature before the software will allow you to start a profile. If any of the thermocouples connected to the
profiler or your product measure above this setting, the software will not allow you to proceed. You will be
prompted with a message stating that one of the selected TCs is not reading valid temperatures. You will have to
wait until the thermocouple or the object your thermocouples are connected to cools below this temperature setting
before the software will allow you to proceed. This software feature helps you to collect consistent profile data by
always beginning the profile with the same or nearly the same product temperatures.

The software also uses this setting to determine the profile start - temperature trigger value. The profile start–
temperature trigger is always set 2ºC above the “Maximum product temperature at start of profile”. If the maximum
product temperature at start of profile is set to 31ºC, the profile start–temperature trigger is automatically set to
33ºC, which is the default setting. When the Air TC reads above 33ºC, the profile will begin.

Process Window
The software does not contain a list of fluxes or materials used specifically for wave soldering; only a list of solder
pastes generally associated with solder reflow. Users defining a Process Window for a wave solder process may
have to define their own specifications.

Select the line item at the top of the list- Define your own spec from the Solder paste Menu. You will be
automatically directed to the Edit Specs window where you can enter your unique process specifications. Enter your
process specifications, when finished; select the Green check button.

Including the wave portion of the profile

Select the Wave checkbox to activate the wave specific process specs. When the Wave checkbox is checked the
software will display profile statistics for the wave portion of the profile when viewing the completed or saved
profile. See Figure 49.

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Figure 49

If you have followed the above directions, you should be looking at the Process Window screen. If you are satisfied
with the settings and wish to apply these specifications to all the thermocouples used, type a descriptive name in the
top field and select the green check button. Select Yes when prompted to save the Process Window file.

If you want to use different specifications for one or more thermocouples, you can do so.

Note: When running wave solder profiles with the wave on, the profilers use two wave TCs in addition to the Air
TC to collect wave specific data. The Wave TCs will connect to channels #2 and 3 on the profiler. See the
“Connecting Wave TCs” section of this manual for details, page 51.

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Running a wave solder profile

Figure 50: Run a Profile Screen

• Select your Product Name from the list. If you are profiling a new product type the name.

• Select your Process Window from the list.

• Select your process type from the Applications list. The software profile and prediction results are based on this
setting. It is imperative that your select the correct Application type. Failing to do so can affect the profile
results. For wave solder select to run the profile with the wave On or Off using extra thermocouples to measure
wave characteristics such as Dwell Time, Parallelism, and solder temperature. Select the Wave Profile option
to run a profile without the wave characteristics data .
• If you select Wave On, the software will utilize two wave TCs in addition to the Air TC. The Wave TCs
will measure: wave Dwell Time and Parallelism when profiling with the wave on. The Air TC must be
positioned to run through the wave(s).
• If you select Wave On, the software will display preheat and wave profile data, but offer prediction results
only for the pre-heat section of the profile. The Air TC must be positioned to run through the wave(s).
• If you select Wave Off, the software will not display wave charachteristics data. The Air TC must be
positioned to NOT run through the wave(s).
• If you select Wave Profile, The Air TC must be positioned to run through the wave(s).
• If you purchased the Wave Surfer select Wave Surfer from the Applications list.
• Select the Sample Rate from the drop-down list.

• Select your oven name from the list. If you’re profiling on a new oven or machine, type the name in the “Oven
Name” field.
• Optionally you can type notes or descriptions for this profile in the “Profile Description” field. These notes will
be stored with the profile and can be edited later if necessary,
• When you are finished with your selection, choose the Forward Arrow button to proceed. See Figure 50.

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Zone length, minimum and maximum temperature settings

If you typed a new oven name, the
software also requires you to enter the
length of each zone as well as the
minimum and maximum zone temperature
settings. This information will help the
software narrow the possibilities of
prediction results that your oven can
actually achieve. See Figure 51.

For wave solder processes you are

required to enter the distance from the end
of the last preheat zone to the beginning
of the main wave. Enter this value in the
field labeled Distance from end of last
preheat zone to the main wave.

Once you have finished entering this

information select the Forward Arrow
button to continue. Figure 51: Zone Length

Customize Wave Solder

Machine Configuration
Many wave solder machines have non-
uniform zone configurations – such as
different quantities of top and bottom
preheaters. If desired, you have the ability
to specify the exact layout of your machine.

To enable this function, exit the software

and run the PSConfig.exe utility program
from the C:\Profiling Software 2G
directory.

Select the “Use Wave Machine

Configuration Tab” and then OK. A
message will display alerting you that the
configuration utility will need to be
restarted. Choose OK.

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Restart the PSConfig.exe and a new

“Machine Configuration” tab will appear.

Wave Solder Machine Name: Enter a

new name for your wave solder machine or
select an existing wave solder machine
name to modify the configuration.

Number of Preheaters/Waves: For

preheaters, enter the maximum number of
zones (for the Top or Bottom). So, if there
are 4 bottom preheaters and 1 top, enter 4.

Zone Order: Allows you to define the

zone numbering display in the software to
match your machine layout.

Wave Label: Specifies the name of each

wave in the profile display.

TOP/BOTTOM: Select via checkbox

which zones have top and/or bottom
preheaters. When enabled, you can also
define the units for the temperature
setpoint – C, F, or %.

Top Preheater/Bottom Preheater: Enter

the length of each of the preheaters, as well
as the Minimum and Maximum allowable
setpoint in that zone.

Distance from end of last preheat zone to the main wave: Enter distance to the beginning of the actual solder
wave.

Conveyor Speed Units/Zone Measurement Units: Allows you to specify how the information is entered.

Click Apply or OK to save your changes.

Any wave solder machine name that is configured within this utility will show up in the “Oven Name” list on the
first RUN A PROFILE screen.

NOTE: When the Wave Machine Configuration tab is enabled, you can only create/define new Wave Solder
machine configurations through this utility. If you try to enter a new Wave Solder machine name in the oven drop-
down menu on the Run A Profile screen, a message will display letting you know to use this configuration tab:

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Entering temperature setpoints and conveyor speed

If you typed a new oven name, the software requires you to enter the number of heated zones or pre-heat zones in
your wave solder machine. See Figure
52.

If your process requires different top and

bottom setpoints, deselect the check box
labeled Top and Bottom setpoints are the
same This will allow you to enter
different values for top and bottom heaters
in each zone. If your oven has top and
bottom heaters, but not in all of the heated
zones, just enter the same value as the
actual setpoint in that zone for both the
top and bottom setting.

This is also where you will enter the

temperature settings for each zone or pre-
heater in your wave solder machine and
the conveyor speed setting. In the field Figure 52: Enter recipe
marked Solder temperature enter the
setting for the solder pot temperature from your
wave solder machine.

When you have finished entering this

information select the Forward Arrow button to
continue.

If you used the Machine Configuration Tab to

define the layout of your wave solder machine,
the recipe screen will represent those settings.

Connecting the Air TC

The next screen shows directions for attaching the Air TC to your
product. It is important to follow these instructions. See Figure
53.
The Air TC starts and stops the profile automatically, measures the
oven, and provides useful profile information.

In certain processes it may be beneficial to wrap the end of the Air

TC with tape to give it more surface area. KIC recommends
wrapping the Air TC when profiling:
• Wave Solder.
• Anytime IR heat is present.

Figure 53: Connecting Air TC

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Wave Surfer
Wave Surfer users connect the designated thermocouples to the
corresponding channels on the profiler.

Make sure the retainers holding the profiler are in place and
secure. See Figure 54.
If any of the embedded thermocouples are damaged or show
signs of wear replace them.

Note: In addition to the instructions given, it is very important

that you position the “Air TC” so that it touches the wave(s). The
“Air TC must pass through the wave in order to provide accurate
profile results. Of course if you are profiling a Wave Solder
machine with the wave off, the Air TC position is not critical to
the profile results. Figure 54: Wave Surfer

Select the Forward Arrow button to continue.

Connecting wave TCs

The next screen will depict thermocouple attachment
for wave solder profiling with the wave on. The
software utilizes two Wave TCs in addition to the
Air TC to collect wave specific data. See Figure 55.

One Wave TC is placed on the right side of the board

and one on the left side near the leading edge of the
profile board.

Note: KIC recommends using high temperature

solder to connect both Wave TCs.

The wave TCs will measure Wave Dwell Time and

Parallelism when profiling a wave solder machine
with the wave on. Figure 55: Connecting wave TCs

Select the Forward Arrow button to continue.

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The next screen will depict the placement of the

Wave TCs and instructs what slot/channel of the
profiler to connect each Wave TC to.
See Figure 56.

It is very important to follow these directions.

• Plug the Left-Wave TC into the #2 slot of

the profiler.

• Plug the Right-Wave TC into the #3 slot of

the profiler.

When you have properly connected your Wave TCs,

select the Forward Arrow button to proceed.
Figure 56: Connecting wave TCs cont.

Connecting product TCs

The next screen will depict placement of the
thermocouples used for profiling the product (Product
TCs). See Figure 57.

Product TCs are connected to the product in key

locations across the product. The selected locations
need represent the highest and lowest- mass areas of
the product or even specific temperature sensitive
components.

Once you have connected your Product TCs to your

product, connect them to the profiler stating with slot
or TC #4.

Select the Forward Arrow button to continue.

Figure 57: Connecting product TCs

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Selecting the thermocouples and starting a profile

This screen displays the live readings from the profiler for all thermocouples selected, as long as the hardware is
properly connected. See Figure 58. Make sure your profiler has a fresh battery and is powered on.

Selecting thermocouples - To select a thermocouple, check the box next to the thermocouple number. The live
temperature is displayed beneath each thermocouple label.

Thermocouple labels - Optionally you can check the box to include thermocouple labels. When this box is checked
you can type a text label for each selected thermocouple. 20 character maximum.

Figure 58: Select TCs

Distance from the Air TC – Measure and enter the

distance from the Air TC to each thermocouple used,
including the Wave TCs.

Select the Help Measurement (Tape Measure Help)

button for an example of how to correctly measure
the distance from the Air TC. See Figure 59.

Figure 59: Wave-On TC measurements

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Once you have selected your thermocouples, you are ready to profile.

Make sure your profiler hardware is properly connected to the computer. You will be able to view the live readings
for each selected thermocouple. If you do not see the live readings, the profiler hardware is not connected properly.
Recheck the cable connections.

Select the Start Profile (green traffic light) button to begin profiling.

The software requires that the selected thermocouples read valid temperatures below the maximum product
temperature at start of profile as set in the Global Preferences screen. The default setting is 31ºC/88ºF.

If any of the selected thermocouples read too high, the following message Figure 60 appears:

Figure 60

When the software detects valid temperatures for all of the selected thermocouples, it will allow you to start the
profile.

Note: In certain situations the software may display other messages with directions in addition to what is outlined
below. Read these messages and follow these directions carefully.

The software will ask you to verify the oven is stable.

See Figure 61.

• Yes – The software will prompt you to put

the profiler and the board in to the oven.
• No – The software will ask if the oven is
getting closer to the setpoints. Figure 61
See Figure 62.

• Yes – The software will return to previous

screen to wait untill the oven is ready, oven
setpoints within 2.0ºC/3.6ºF.
• No – The software will ask you to change
the oven setpoint temperatures to the
temperatures that the control thermocouples
are currently reading, and then press OK. Figure 62

• The software will have you enter the new setpoints and then recalculate the capability of your oven. Then
continue forward through the Thermocouple Attachment screens until you get to the Select thermocouples
screen. Then select the Start Profile button (Green traffic light) to start the profile, once the oven has stabilized.

If you selected yes, the software shows a picture of and instructs you to put the profiler and the board into the wave
machine, and then select the Arrow Forward button. Next, the software will display the Live Profile graph.

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Viewing the live profile graph

The live profile graph display only appears when you’re using a profiler in wireless mode—not as a datalogger. The
live profile graph display will show the profile plot on the graph for the current profile that is running. See Figure
63.

Figure 63: Live Profile Graph Display

While the profiler is in the oven, and until the profile has ended, the software will continue to display the live profile
graph. The other tabs at the top of the screen; Description, and Optimization are inaccessible. See Figure 63.

• The live profile is plotted on the graph.

• The current temperatures for each thermocouple and the Delta between them are displayed in a small
window in the upper-left hand corner of the profile graph. The elapsed time is also displayed.
• The current oven temperature setpoints and conveyor speed for this profile is displayed beneath the
statistics table.
• The profile status is continually updated throughout the profile. Wireless models only.

The Live profile graph display will remain on your screen until the profiler has achieved the trigger temperature that
determines the profile end.

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Profile retransmission
Retransmission is only available in profilers with RF transmit capability.

While the profiler transmits the live profile data to the profiler’s Base Station; it simultaneously stores the profile
data in its memory.

Once the profiler detects that all of the thermocouples have cooled below the profile-end trigger temperature, it will
begin retransmitting the profile data to the software via RF. The profiler will send the profile in data packets. The
retransmission status is displayed at the bottom of the screen. See Figure 64.

Figure 64: Profiler status – RF models

When all of the data packets have been received, the software will display a message asking you to turn the profiler
off, choose OK. Failing to turn your profiler off will drain the battery.

Next, the software automatically analyzes the profile data and presents the profile and profile statistics. If you
purchased the Navigator option, the predicted oven settings will be displayed as well.

If the Air TC or either Wave TC does not touch the wave(s), the software will display an error message: See Figure
65.

Figure 65

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Profile graph display

Once the software opens the Profile Graph Display, all the tabs at the top will be accessible. The General Tab will
show the profile results for both the Preheat and Wave sections of the profile. You can select either the Preheat tab
or the Wave tab above the Statistic table. See Figure 66.

Preheat tab
The Preheat tab represents only the section of the profile before the wave. The software draws a blue rectangle
around the area that is considered preheat. The profile statistics and setpoints which are shown below the profile
graph depict only the preheat section of the profile, the profile data inside the blue rectangle. See Figure 66.

Information regarding the Wave TCs are displayed in a window at the upper-right hand corner of the profile graph.
This information includes Dwell Time, Parallelism, and the solder temperatures for the wave(s).

Figure 66: Profile Graph Display

Profile Information from the Wave TCs displayed in a window at the upper-
Right hand corner of the profile graph. See Figures 66 and 67. This information
includes; Dwell Time and Parallelism in seconds, and the Solder temperature
setpoint and actual for the wave(s) portion of the profile.

The Dwell Time is measured by the Wave TCs. The Parallelism is the measured
time difference between when the Wave TC-Left, and Wave TC-Right hit the
wave.
Figure 67: Wave Information
The Solder Temperature setpoint is input by you before the profile when
entering oven setpoint information. The solder temperature value is measured by the Air TC during the profile.

Navigator – The Navigator software option will optimize only for the preheat section of the profile. The Navigator
will not predict changes to the wave section of the profile.

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Statistics - Below the profile graph is the Profile Statistics. The statistics are a numeric representation of the profile
and how well the profile fits the selected Process Window. The statistics for this profile and the predicted profile are
shown. A percentage value is displayed in each cell beside the Statistic value. This percentage represents the
amount of Process Window being used. A PWI under 100% indicate the profile fits within the selected Process
Window, a PWI 100% or higher indicates the profile has exceeded the selected Process Window. The software only
displays PWI values for the Preheat Statistics.

Original/Predicted Setpoints - Below the profile Statistics is the oven temperature and conveyor settings. The
original setpoints represent the oven settings when this profile was run; the predicted settings represent the
recommendation of the Navigator prediction software. If you did not purchase the Navigator option, the software
will display the same oven settings for the original and predicted statistics. Navigator is an optional software
capability that automatically finds the best profile for your product based on your solder paste specifications.

Note: The software will not show the predicted setpoints should you want to print the profile. If you wish to print
the predicted setpoints, you can do so by pressing the F9 key. The F9 function key will print any active profile
screen of the software.

Wave tab
The Wave tab will show profile information specific to the wave portion of the profile. The software draws a blue
rectangle around the area that is considered Wave. The profile statistics and setpoints which are shown below the
profile graph depict only the Wave section of the profile. See Figure 68.

Wave PWI – If the Displayed Detailed PWI option is enabled, and you entered wave-specific Process Window
specs when setting up your Process Window, the Wave PWI will also be displayed when viewing the Wave tab. See
Figure 68.

Figure 68: Profile Graph Display – Wave Tab

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Pointer Slopes tab

Figure 69: Pointer Slopes Tab

This tab will display the calculations for any Pointers that were placed on the graph. It can display the temperature
at each pointer location, as well as the Slope, Time, and Peak temperature between any two Pointers. Right click on
the graph and click Pointer/Slopes then left click to add a pointer on the plot. Open the Graph Controller menu to
select which data to show in this table.

Manual profile prediction

The software has automatic (Navigator), and manual prediction capabilities. The standard software installation
includes manual prediction capabilities.

Manual prediction gives you the flexibility to easily predict changes to the oven settings (temperature settings,
conveyor speed), and view the results without having to spend the time actually running the profile. This feature is
very helpful to minimizing the time spent fine-tuning or developing a thermal profile.

Figure 70: Original/Predicted setpoints – Navigator (Optional)

This is an example of how the software (standard and with Navigator) lists the PWI, and oven settings for the
profile. This table is divided into the Original section (top), and the Predicted section (bottom). The original values
represent the oven settings at the time the profile was run. The predicted values represent the prediction results as
determined by the Navigator software. See Figure 70.
If you purchased the Navigator software option, the software will automatically generate results that are best suited
for the selected Process Window. In the event you wish to modify the prediction results of the Navigator, you can
do so.
To predict changes to the oven settings, or modify the Navigator prediction results, click on the zone you wish to
change and then click enter. In the example below, zone 1 has been selected. See Figure 71.

Figure 71
The Navigator will predict the results of that change, and then automatically update the PWI, predicted Statistics,
and the profile graph. The new predicted results will be displayed on the graph in a dotted-line format. This format
enables you to easily determine the difference between the original and predicted profiles.

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Analyzing the profile graph

Preheat Section of Profile Graph

Predicted profile plot

(dotted lines)

Original profile plot

(solid lines)

Figure 72

The PWI for the profile is displayed in the bottom-left corner of this screen. If the measured PWI is below 100%,
the value will be displayed in a Green font. If the measured PWI is more than 100%, the value will be displayed in a
red font. See Figure 73.

A PWI under 100% A PWI above 100%

is acceptable is unacceptable

Figure 73: Profile PWI

Note: This display method enables you to easily identify whether the profile is in or out-of-spec.

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Graph Controller
The Graph Controller allows you to modify the view of
the profile graph. To open the Graph Controller, click
on the TC column header or click, anywhere just
outside the profile graph.

Auto scale – The Auto Scale feature will automatically

adjust the X and Y axis scales to fit all of the data in the
profile graph. When the Auto Scale feature is disabled,
you must manually input the minimum and maximum
scale settings scale of the profile graph.

TCs – The TCs section lists the thermocouples used for

the profile. In the event that you wish to view the
profile without one or more thermocouples, you can
deselect individual thermocouples, or deselect the All
check box, and choose only the thermocouples you
wish to view. In the event a single, or multiple
thermocouples become disconnected from the product
Figure 74: Graph Controller – Wave-On
during the profile, you can deselect the affected
thermocouple(s). The software will recalculate the
PWI and update the profile statistics based on the remaining thermocouples selected. You must select at least one
product thermocouple.

Distance from Air TC – Displays the Distance from the Air TC for each thermocouple. You can edit these values.
These values were originally entered before the Profile start.

Wave TC 1/TC 2 – Distance from Air TC to each Wave TC.

Distance Between Last Preheat and Wave – This is the distance from the main wave to the last preheat zone. You
can edit this if necessary. This value was originally entered by you in the Enter Oven Setpoints and Conveyor Speed
screen.

Grid – Enables/disables the view of the X and Y Axis scales.

Reference lines – Clicking this check box enables the view of Reference Lines displayed on the profile graph.
These lines represent any temperatures referenced in the selected Process Window. When you use separate
thermocouple specs, the Reference Lines check box is disabled, and no lines appear on the graph.

Zone lines – Enables the view for the oven zone lines on the profile graph.

Predicted TCs only - Removes the Original profile plot form view, displaying only the prediction profile plot.

Zero decimal – When viewing the Pointer tool, this setting enables or disables the decimal display. When
unchecked, the software will display one decimal point.

Internal temp – Enables the view of the profiler’s internal temperature profile plot on the graph.

Display Wave TCs – Enables the display of the Wave TCs and the Divider Timestamp Line on the profile graph

Display Detailed PWI – This default-selected checkbox enables Process Window Index (PWI) percentage values to
appear on profile graph displays. (See Appendix C: Using the Process Window Index to quantify thermal profile
performance)

Display of Pointers – If you choose to add pointers to the graph, this area allows you to select which calculations
will be displayed in the Pointer Slopes tab of the statistics table.

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Graph option menu

To view the graph option menu, right-click anywhere within the profile graph area. See
Figure 75.

Examine line
The Examine line feature displays the temperature for the location of the pointer on the
profile graph. See Figure 76.
Figure 75: Graph Option
Wherever the pointer is moved across the profile, the following data will be displayed: menu
• The first column is the actual temperature for each TC.
• The second column is the temperature of the predicted profile data
• The Delta T for both actual and predicted TC data.
• The time during the profile at which the pointer is placed

Automatic calculation of Delta T + Delta (or range) for all stats

The software will automatically calculate, and display in the statistical chart, the Delta for
both the original and predicted profile data for all TCs for all Statistics. This is the range Figure 76: Graph Pointer
of the highest to the lowest value for any given specification. This information is strictly
being displayed and is not factored in to the PWI value and is not used in the Navigator or
Auto-focus calculations.

Zoom
You can also view the profile by zooming in to get a better view of a particular area
of the profile display. Right-click on the graph, this will bring up a menu. See
Figure 77. Select the Zoom and a chart will appear on the left side of the graph.

Figure 77: Graph Option Menu - Wave

Figure 78: Graph Option Menu – Zoom

Using your mouse pointer, click and drag the view window in the graph over the area you wish to enlarge.

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To disable the Zoom view, right-click on the graph and deselect Zoom.

Move TC line
The Move TC line feature allows the user to manually move the thermocouple
plot on the profile graph. This is used to fine-tune the profile or make corrections
in the event the software did not properly display the plot. See Figure 79.

Select the thermocouple you wish to move and then click and drag the
highlighted plot and move it to the desired location on the profile graph. See Figure 79: Graph Option Menu – Move TC Line
Figure 80.

Figure 80: Move TC Line

Move zone line

The Move Zone line feature allows the user to manually move the zone separation
lines on the profile graph. This is used to fine tune the profile or make corrections in
the event the software did not properly display the zones.
Figure 81: Zone Resize
Select to move the first line (Zone beginning) or the Last line (Zone ending) (See
Figure 81) and then click and drag it to the desired location on the profile graph.

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Figure 82: Move Zone Line

Move preheat and wave dividers

The Move Preheat and wave divider feature allows the user to manually move the
Preheat and Wave locations on the profile graph. This is used to fine tune the
profile or make corrections in the event the software did not properly display
these points. Place the cursor over the blue wave divider line and then click and
drag it to the desired location on the profile graph. See Figure 84. Figure 83: Move Preheat and Wave
Divider

Figure 84 Preheat and Wave Divider

Zone Resize
Select to move the first line (Zone beginning) or the last line (Zone ending and then
click and drag it to the desired location on the profile graph. See Figure 85.

Reset Figure 85: Graph Option Menu – Zone Resize

The Reset feature will reset the profile and undo any changes you have
made to the graph using the Graph Option Menu. Select the TC Line, or
Zone Line option. See Figure 86.

Move Last Zone Line

For special profiling conditions, such as on vacuum reflow ovens, this
tool lets you extend out the last zone size, better visually representing
the size of the vacuum zone.
Figure 86: Graph Option Menu -Reset

Pointer/Slopes
This tool lets you place up to six (6) pointers on the graph, which can be used for calculating/highlighting data in
specific areas of the profile. Use the Remove All Pointer/Slopes tool to clear all pointers from the graph

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Tips for profiling wave solder

Listed below are tips for profiling wave solder machines using your profiler. Your process may not match the
picture below.

• If you are not using a Wave Surfer device, use a blank, spare board, or pallet to carry the profiler on. It may be
helpful to secure the profiler and thermal shield to the board/pallet.
• Use a board stiffener when available. This will help prevent the board from sagging due to the weight of the
profiler.
• This will also help prevent liquid solder from flowing onto the board, possibly contacting the thermal shield
or profiler.
• It is helpful to raise the profiler thermal shield at least 1/8” to 1/4” off the carrier board/palette in order to
prevent any liquid solder from entering the thermal shield. See Figure 87.
• You can run the profile with or without the spray fluxer active. If you choose to run wave solder profiles with
the spray fluxer on, you run the risk of contaminating the Wave Surfer or thermal shield. If operating properly
all the spray flux should be removed by the process.

Figure 87: Profiling Wave Solder Using a Profiler

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Additional Wave Application Settings

There are additional capabilities for the wave solder process that can be enable if the specific operation is desired.
These extra functions are turned on/off via a configuration program. To enable/disable any of these, first exit the
PS2G software, browse to the C:\Profiling Software 2G directory, and run the PSConfig.exe.

Use Alternate Dwell Time Calculation –

When using the Wave Solder-Wave On application for
profiling, enabling this selection changes the method used
to determine the contact time (dwell) of the wave TC’s
attached to the bottom side of the profile board.
NOTE: Changing this setting is NOT typically
recommended and is only for specialized use.

Use Alternate Parallelism Calculation –

When using the Wave Solder-Wave On application for
profiling, the software calculates both Dwell Time and
Parallelism. By default, the parallelism value displayed is
the Left Dwell Time minus the Right Dwell Time.
When this alternate method is selected, the parallelism
value displayed is the difference in time between when
the left and right-side wave TCs first contact the wave.

Use Conveyor Speed Measurement from bottom side

TCs –
If you attach TCs to the bottom side of your profile board,
you can use this function to perform a conveyor speed
measurement during profiling. The software will use the
following parameters to perform the calculation:
• Selection of channels on the profiler with bottom-side TCs connected
• Specified distance between the bottom side TC locations (must be 3 inches minimum)
• Difference in contact time with the solder wave of the two selected TCs

When the Conveyor speed measurement is enabled, additional selection boxes will appear in the profiling process.

Run A Profile

On the first screen, a checkbox

will display for ‘Enable Conveyor
Speed Measurement’. Select this
box to have the speed calculation
performed. The selection will be
saved per product.

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Select TC Screen

At the Select TC screen, you will find

a new drop-down menu in the lower
left for selecting the TCs to be used for
the speed calculation.
The following apply:
• Only two (2) TCs can be
selected
• They must be bottom-side
TCs
• There must be at least three
(3) inches distance (length
wise) between selected TCs

After making your selections, they will

be shown next to the drop-down menu.

Profile Graph Display

When the profile is completed and downloaded, the data for
Dwell time, Parallelism, Solder Pot temperature, and Conveyor
Speed will be displayed in a window on the graph:

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Profiling thermal curing processes

The software can be used to profile thermal processes that cure epoxy and other thermosetting polymers. The
procedure is similar to that used with reflow soldering, but may involve creating specifications aimed at your
specific cure application

To run a cure process profile:

1. From the main screen, click the Run a Profile button.

The Name Product and Select Process Window screen appears.

2. Select your Process Window from the pull down list.

3. From the Application pull down, select Cure.

Note: To have valid profile data in a cure application, it is imperative that you correctly specify the
application type.

4. Select from the pull down or enter an oven name in the Oven Name field.

5. Add any appropriate production notes in the Profile Description field that you want stored with the profile.
(These can be edited later.)

6. Click the Next arrow to proceed.

The software guides you through the command input screens needed to run a profile.

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Profiling Temperature vs. Time processes

The Temperature vs. Time application lets you profile a variety of thermal processes beyond the more typical
soldering uses. These include rework, batch curing, environmental temperature cycling, and extreme temperature
(-150 to 1050 C) applications. It can be used with any thermal process or experiment that can benefit from plotted
temperature/time data.

Temperature vs. Time (T Vs.T) profiling differs from other applications in the following ways:
• Profilers don’t use temperature triggers to start and stop the profile. These actions are performed manually.
• TC #1 is not used as an Air-TC and operates as a normal TC. TC #1 can be included in Process Window
calculations. Data for TC #1 is displayed on the profile graph. Using any other application type, it is not.
• The software prediction capabilities by design are not compatible with T Vs. T profiles. Neither Navigator
or Auto-Focus work on T Vs. T profiles. PWI is calculated for each profile.
• The datalogger profiler (or wireless unit used as a datalologger) needs to be connected to the
communication cable when you initiate the T Vs. T profile and when you stop it.
• Some profilers can utilize the RF option for wireless T Vs. T profiles.
• Using T Vs. T, users can measure negative temperatures. Because temperature triggers are not used, the
software can display data as low as -150C.

Considerations when using the software

This section outlines the special considerations you need to take into account when using the software to set up and
run a T vs T profile using your profiler and the software. This section is written assuming you have a basic
understanding of the software before attempting to run a T Vs. T profile.

Global Preferences
Units of measure – Set the unit of measure for each item. These settings will determine the units used to display
the profile graph.
Product start temperature – The default setting is 31C. This setting is used for T Vs. T profiling even though
temperature triggers are not used. Instead the profile can start as soon as the Start Profile button is selected and
as long as the product TCs are below this temperature setting.
Profiling hardware – Even if your profiler has RF capability but you run it as a datalogger, it still needs to be
connected to the communication cable when you initiate the T Vs. T profile and when you stop it.
Auto Focus tab – The Auto Focus feature by design is not compatible with T Vs. T profiles.

Note: If you have made any changes, be sure and select the green check mark button to save those changes when
exiting the Global Preferences screen.

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Process Window Setup

The Process Window is a set of limits applied to the profile data. You have the option of either not using a defined
Process Window in which case no PWI will be calculated, or define a Process Window and have the software
calculate and display a PWI for that profile.

Deselect this check box

to assign separate specs
for each thermocouple
used. See details below.

Figure 88: Process Window

Process Window Name – Name of the Process Window file that includes the statistics chosen and limits for those
statistics, along with whatever text is typed in the Description field.
• Solder paste menu - A read only library list of numerous solder pastes along with the statistics and limits
suggested by the paste mfg., also included is a User-Defined option in the list which allows you to create a spec.
of your own. See below for additional details.
• Edit specs – Screen allowing you to edit or choose statistics and limits for a chosen solder paste or define your
own specs
• Wave – This radio button switches between the process specs and the Wave process specs for the selected
Process Window. Set up a Process Window specific to Wave TCs for Wave Solder profiling.
• Read only text box – Shows the paste name, statistics name, and limits for a Process Window chosen, edited,
or saved by you. To edit select the Edit Specs button.
• Same specs for all TCs – By deselecting this checkbox, you can assign separate specifications for each
individual thermocouple you are using. After deselecting the checkbox, you’ll need to click on the Edit Specs
button to choose which statistics will be used and what spec limits will be set for each thermocouple used. This
option would be used if you had component specific specifications that differ from the general solder paste
specs. Another use for this would be if you wanted to monitor the actual board temperature as well as
component temps. You would then only select the statistics for that TC that are relevant. If you wish to use the
same specifications for all thermocouples, put a check mark in the box.
• Select TC to view – This dialog box will appear only if the Same Specs for all TCs checkbox is deselected. By
clicking on the dropdown menu, you can view the specifications that have been defined for that number
thermocouple. If a description was included, it will be displayed next to Label.
• Process Window Description – Field allowing for freehand notes for a particular Process Window

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To run a temperature vs time process profile:

1. From the main screen, click the Run a Profile button.

The Name Product and Select Process Window screen appears.

2. Select your Process Window from the pull down list.

3. From the Application pull down, select Temperature Vs Time.

Note: To have valid profile data in a Time Vs Temperature application, it is imperative that you correctly
specify the application type.

4. Select from the pull down or enter an oven name in the Oven Name field.

5. Add any appropriate production notes in the Profile Description field that you want stored with the profile.
(These can be edited later.)

6. Click the Next arrow to proceed.

The software guides you through the command input screens needed to run a profile.

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Selecting the thermocouples and starting a profile

This screen displays the live readings for all thermocouples connected to your profiler. Select the thermocouples by
clicking the check box next to each TC number. Make sure the profiler has fresh batteries and is powered on. See
Figure 89.

Selecting Thermocouples - To select a thermocouple, check the box next to the thermocouple number. The live
temperatures are displayed beneath each thermocouple label.

Thermocouple Labels - Optionally you can check the box to include thermocouple labels. When this box is
checked you can type a text label for each selected thermocouple. 20 character maximum.

Select this
button to start
a profile.

Figure 89: Run a Profile Screen #2 – Time vs. Temperature

Note: If the selected Process Window has Separate Specs for TCs, then you must return to the Process Window-Edit
Specs screen in order select/deselect TCs or change their labels.

Expected profile length – This value controls the X-Axis on the profile graph. Make sure to enter enough time to
complete your profile. Otherwise the profile plot will stop as soon as the Expected profile Length is achieved.
Data outside this time limit will not be displayed.
Note: to decrease the number of samples, enter a longer Expected Profile Length

Once you have selected your thermocouples, you are ready to profile.

Make sure your profiler hardware is properly connected to the computer. You will be able to view the live readings
for each selected thermocouple. If you do not see the live readings, then your profiler hardware is not connected
properly.

Recheck the connections. Temperature vs. Time profiles cannot begin until your profiler is connected via the cable,
and communication established.

Select the Start Profile (green traffic light) button to begin profiling. The profile will begin at this point.

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The software requires that the selected thermocouples read valid temperatures below the Maximum product
temperature at start of profile as set in the Global Preferences screen. The default setting is 31ºC/88ºF.

Note: If any of the selected thermocouples read too high, this message will appear. See Figure 90.

Figure 90

When the software detects valid temperatures for all of the selected thermocouples, it will allow you to start the
profile.

IMPORTANT NOTE: All profilers have a maximum operating temperature that, to avoid damage, should never be
exceeded. See the product datasheet for temperature tolerance information.

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Viewing the live profile graph display

The Live Profile Graph display will show the profile plot on the graph for the current profile that is running. See
Figure 91.

Live temperature readings and Delta

Temperature plot

Profile status

Figure 91: Live Profile Graph Display

While the profiler is in the oven, and until the run has ended, the software will continue to display the Live Profile
Graph. The Description tab at the top of the screen is inaccessible.
• The live profile is plotted on the graph
• The current temperatures for each thermocouple and the Delta between them are displayed in a small
window in the upper-left hand corner of the profile graph. The elapsed time is also displayed.

The Live Profile Graph display will remain on your screen until the Stop
Profile button is selected even if the profile time has completed and the profile
plot has ended. See Figure 91.

The software will display two messages when the Stop Profile button is
pressed:
Figure 92
The first will ask you to confirm the Profile Stop. See Figure 92.

If you select No, then the profile continues.

If you select Yes, then the second message instructs you to turn your profiler
off. See Figure 93.
Figure 93

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Viewing the profile and its statistics

Figure 94: Profile Graph Display – Time vs. Temperature

The Profile screen General Tab displays the product name and profile start time at the top of the screen. The profile,
profile statistics and PWI are also displayed. See Figure 94.

Profile view – To maximize the profile display, double click inside the profile graph area. The profile graph will
change and be displayed in a full screen format. Double click again to return to normal view.

Statistics view – To maximize the Statistics view, double click inside the Statistics table area. The Statistics will
change and be displayed in a full screen format. Double click again to return to normal view.

Description tab
The Description tab contains a text area that displays
a description of the profile should you wish to enter
any. See Figure 95.

This text is the same text that you can enter in the
Select Product screen at the beginning of the Run
Profile Routine.

This text is also displayed in the Profile Explorer

view for each profile.

Figure 95: Description Tab – Time vs. Temperature

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Graph Controller
The Graph Controller allows you to modify the view
of the profile graph. To open the Graph Controller,
click on the TC column header or click, anywhere just
outside the profile graph. See Figure 96.

Auto Scale
The Auto Scale feature will automatically adjust the X
and Y axis scales to fit all of the data in the profile
graph. When the Auto Scale feature is disabled, you
must manually input the minimum and maximum
scale settings for the X and Y axis scale of the profile
graph.

Selecting thermocouples to view

The TCs section is a list of the thermocouples used for
the profile. By selecting All you are selecting that all
the thermocouples used for the original profile will be
displayed on the profile graph. In the event that you
wish to view the profile without one or more
thermocouples, you can deselect individual Figure 96: Graph Controller – Time vs. Temperature
thermocouples, or deselect the All check box, and
choose only the thermocouples you wish to view.

Excluding disconnected thermocouples

If a thermocouple becomes disconnected during the profile, the profile results (PWI) may be affected due to an
erratic reading. In the event a single or multiple thermocouples become disconnected from the product during the
profile, you can deselect the affected thermocouple(s). The software will recalculate the PWI and update the profile
statistics based on the remaining thermocouples selected. You must select at least one product thermocouple.

Grid – Enables/disables the view of the X and Y-Axis scales.

Reference lines – Clicking this check box enables the view of Reference Lines displayed on the profile graph.
These lines represent any temperatures referenced in the selected Process Window. When you use separate
thermocouple specs, the Reference Lines check box is disabled, and no lines appear on the graph.

Zero decimal – When viewing the Pointer tool, this setting enables or disables the decimal display. When
unchecked, the software will display one decimal point.

Internal temp – Enables the view of the profiler’s internal temperature profile plot on the graph.

Display Detailed PWI – This default-selected checkbox enables Process Window Index (PWI) percentage values to
appear on profile graph displays. (See Appendix C: Using the Process Window Index to quantify thermal profile
performance)

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Graph Option menu

To view the Graph Option menu, right-click anywhere within the profile graph area.
See Figure 97.

Examine line
Figure 97: Graph Option Menu
The Examine line feature displays the temperature for the location of the pointer on the
profile graph. See Figure 98.

Wherever the pointer is moved across the profile, the following data will be displayed:
• The first column is the actual temperature for each TC.
• The second column is the temperature of the predicted profile data – based on
setpoint or belt speed changes.
• The Delta T for both actual and predicted TC data.
• The time during the profile at which the pointer is placed Figure 98: Examine Line

Automatic calculation of Delta T + Delta (or range) for all stats

The software will automatically calculate, and display in the statistical chart, the Delta for both the original and
predicted profile data for all TCs for all Statistics. See Figure 98. This is the range of the highest to the lowest
value for any given specification. This information is strictly being displayed and is not factored in to the PWI value
and is not used in the Navigator or Auto-focus calculations.

Move TC line
The Move TC line feature allows the user to manually move the thermocouple
plot on the profile graph. This is used to fine-tune the profile or make corrections
in the event the software did not properly display the plot. See Figure 99. .

Select the thermocouple you wish to move and then click and drag the
highlighted plot and move it to the desired location on the profile graph. See
Figure 100. Figure 99: Move TC Line

Figure 100: Move TC Line

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Reset
The Reset feature will reset the profile and undo any changes you have made to
the graph using the Graph Option Menu. Select the TC Line, or Zone Line
option. See Figure 101.

Figure 101: Reset

Profile screen buttons
There are four buttons at the bottom of the profile screen.

View/Edit Window – Click this button to either view or edit the process specification(s) for the
product used in this profile.

Copy to clipboard – Click this button to copy the profile data to the windows clipboard. You can
then paste the data to a different application.

Print – Click this button to print a copy of the profile that is currently on your screen.

Profile Explorer screen – When finished viewing or analyzing the profile click this button to
either run another profile with this product or return to the Profile Explorer screen if the profile was opened from
there.

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Exiting the profile screen

Saving changes to the profile
Any changes to the Description Notes or the Process
Window can be saved with the profile. This will
permanently update this profile with the changes.
Changes to the Process Window saved here only, save
the changes with the profile. To save the changes to
Process Window file see next dialog box. See Figure
102.
Figure 102

Saving changes to the Process

Window
If you have made changes to the Process Window
while viewing a profile you can save these changes
when you exit the Profile screen. The Process
Window will permanently have these changes
whenever it is used to profile from this point forward.
See Figure 103.

The software will take you to the Edit Process Figure 103
Window screen in order to save the changes that you
have made.

Note: These 2 messages will only appear if changes have been made while viewing the profile.

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Using the SRA Smart Reflow Analyzer

The SRA Smart Reflow Analyzer is a fixture

specifically designed for collecting machine related
data which allows you to analyze and track
machine stability from run to run, and over time,
and for various oven verification purposes.

The SRA uses six embedded thermocouples – three

Air TCs and three Mass TCs – which collect a
variety of data for each oven zone such as
measured zone temperatures and side to side
uniformity. With the use of the SRA, you will also
be able to identify changes in heat transfer in a
zone over time, through the display of HTI (Heat
Transfer Index). It also utilizes the latest in laser
sensor technology to automatically calculate SRA Smart Reflow Analyzer
conveyor speed each time you run it through your
machine.

It has a built-in data collection module, so there is no need for a separate profiler.

The device is used to routinely check the performance of your machine. Using a variety of available specifications,
the machine’s performance is measured each time a pass is made based on your selected Process Window. The
included SPC charting feature allows you to track the performance of individual zones, based on specifications
selected.

For additional details on the SRA Smart Reflow Fixture hardware, consult the following publication:
• SRA Smart Reflow Analyzer Hardware Guide, (Publication Number SRA-330200-000)

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SRA profiling
This section will outline the steps necessary to setup and run a profile using your SRA fixture. It is written assuming
you have a basic understanding of the software and its functions before attempting to run profiles.

Global Preferences
Product start temperature – This temperature setting can be changed. It is up to you to determine what
temperature setting will work best for your process. NOTE: When the SRA is detected by the software, this setting
will only apply specifically to the SRA device. When a profiler is detected by the software, such as an SPS, X5, or K2,
the value set will only apply to profiler usage. This allows you to use different triggers for fixture use and standard
product profiling.

Maximum product temperature

at start of profile – This setting
will determine the maximum
temperature before the software
will allow you to start a profile. If
any of the thermocouples in the
device measure above this setting,
the software will not allow you to
proceed. You will be prompted
with a message stating that one of
the selected TCs is not reading
valid temperatures. You will have
to wait until the thermocouple cools
below this temperature setting
before the software will allow you
to proceed. This software feature
helps you to collect consistent
profile data by always beginning
the profile with the same or nearly
the same device temperatures.

The software also uses this setting

to determine the profile start -
temperature trigger value. The
profile start–temperature trigger is always set 2ºC above the “Maximum product temperature at start of profile”. If
the maximum product temperature at start of profile is set to 35ºC (default for the SRA), the profile start–temperature
trigger is automatically set to 37ºC. When the Air TCs read above 37ºC, the data collection will begin.

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Running an SRA profile

• Select or enter a name from the Product Name list. When using the SRA it is recommended that you use the
oven recipe name for this field. That will allow you to easily identify runs by machine setup.

• Select Smart Reflow Analyzer from the Application drop-down list. The software profile results are based on
this setting. It is imperative that your select the correct Application type, as this configures the software for the
proper type of data collection. Failing to do so can affect the profile results.
Note: When the Smart Reflow Analyzer application type is selected, the Process Window selection will
disappear. The selection for the Process Window will be made on a different screen.

• Optional: Select the Sample Rate from the drop-down list to adjust, or just leave the default settings.

• Select your oven name from the list. If you’re profiling a new oven or machine, type the name in the Oven
Name field.
NOTE: If you are running the software on an oven controller computer that is communication compatible with
the software, the number of zones is already known and the oven name will be entered in the Global
Preferences screen, not on this screen. Additionally, the Zone length, and Minimum/Maximum temperature
settings described on the following page will also be accessed from the Global Preferences screen.

• Optionally you can type notes or descriptions for this profile in the Profile Description field. These notes will
be stored with the data and can be edited later if necessary,

• When you are finished with your selection, choose the Forward Arrow button to proceed.

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Zone length, Minimum and Maximum temperature settings

When using the SRA, the software
requires you to enter the length of each
zone as well as the minimum and
maximum zone temperature settings.
With the SRA, you will be seeing data
calculations per zone. If you wish to
include data from the cooling section of
your machine, you must specify the
number of Cooling Zones and
measurements for each.

Once you have finished entering this

information select the Forward Arrow
button to continue.

Entering temperature
setpoints and conveyor speed

If your process requires different top and

bottom setpoints, deselect the check box
labeled Top and Bottom setpoints are the
same. This will allow you to enter
different values for top and bottom heaters
in each zone. If your oven has top and
bottom heaters, but not in all of the heated
zones, just enter the same value as the
actual setpoint in that zone for both the
top and bottom setting.
Use the scroll bar below the setpoints to
enter settings for additional zones not
shown – including cooling zones.

NOTE: If your software is installed and

communicating with an oven controller
software, the heated setpoints and speed
will automatically be filled in. You will
need to manually enter the setpoint for
any defined Cooling zones.

This screen is also where you will enter the Conveyor Speed setpoint.

When you have finished entering this information select the Forward Arrow button to continue.

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Selecting a Process Window

The next screen is where you will select a Process
Window to apply to the data. For the first few runs
with the SRA, you will not necessarily know what the
upper and lower limits for the different specifications
should be for a given machine. In this case, you can
select ‘None’ and the data collected will simply be
displayed with no reference to an in-spec or out-of-
spec condition.
You can also choose to create a new Process Window
– by clicking the Create a new Process Window
button – or select an existing one from the list if one
had already been defined.

NOTE: Only Process Windows associated to the oven

chosen will be displayed in the drop-down menu.

Creating a New Process Window

If you chose to create a new Process Window, you
will be brought to the Define/Edit Process Window
screen. Ensure the Fixture checkbox is selected. Enter
a new name in the Process Window Name field. You
will then select which ovens this Process Window
will be linked to. Click the Oven Name drop-down
menu to display the oven files you’ve created and put
a checkmark next to each one that you want
associated with this Process Window.

NOTE: You can only select multiple ovens if each

have the same number of heated and cooling zones.

Click the Edit Specs button to define the upper and lower limits for your specs. Clicking the drop-down menu will
display all the available specs. At the top of the list are the SRA specific specs. To assign spec limits, put a
checkmark next to a desired spec and then enter the
desired value/range.
You will notice for several of the specs, there are tabs for
each of the defined zones (based on the oven you
linked). You can apply the same limits to ALL zones by
clicking the button. Or you can click a zone tab to set
different limits for different areas of the machine.

Below the SRA specific specs, you will find a list of

common reflow specifications. If you select any of these,
the specifications chosen will only be calculated for the
Mass TCs.

NOTE: The software does not contain pre-defined

specification limits for the fixture specific calculations.
This will be determined by you after several runs and
identifying what is the normal or acceptable amount of range and variation in your machine.

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After defining your desired specifications/limits, click the green check mark to return to the main Process Window
screen. Click the green checkmark on the main Process Window screen to save your changes. You will be returned
to the Select a Process Window screen of the Run a Profile sequence. Arrow forward to continue.

Starting an SRA profile

This screen displays the live readings from the SRA for all channels selected. All six channels are enabled by default.
A minimum of two (2) Air TCs and two (2) Mass TCs must be enabled to collect data. If a channel is not reading
correctly, it can be turned off by unchecking the box above the channel.

Conveyor Speed sensor – A display box will show whether the two speed sensors are operating properly. Green
means it is ready; Red means there is a problem with one or both sensors. If Red, try cleaning the lenses on the SRA
module and thermal shield.

Indication of
self-test of Select this
laser sensors button to start
a profile

Select the Start Profile (green traffic light) button to begin profiling.

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Viewing the live profile graph

The live profile graph display only appears when you’re using the device in Wi-Fi mode - not as a datalogger. The
live profile graph display will show the profile plot on the graph for the current profile that is running.

While the device is in the oven, and until the profile has ended, the software will continue to display the live profile
graph. The other tabs at the top of the screen; Description, and Comparison are inaccessible.

• The live profile is plotted on the graph.

• The current temperatures for each thermocouple and the Delta between them are displayed in a small
window in the upper-left hand corner of the profile graph. The elapsed time is also displayed.
• The current oven temperature setpoints and conveyor speed for this profile are displayed beneath the
statistics table.
• The profile status is continuously updated throughout the profile. Wireless models only.

The Live profile graph display will remain on your screen until the SRA has achieved the trigger temperature that
determines the profile end.

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Profile retransmission
Retransmission is only available in SRA models with Wi-Fi transmit capability.

While the device transmits the live profile data to the Smart Dock, it simultaneously stores the profile data in its
memory.

Once the device detects that all the thermocouples have cooled below the profile-end trigger temperature, it will
begin retransmitting the profile data to the software via Wi-Fi. The device will send the profile in data packets. The
retransmission status is displayed at the bottom of the screen.

When all the data packets have been received, the software will display a message asking if you want to put the
device to sleep. Selecting Yes will turn off the SRA; if you select No, the SRA will remain on.

Next, the software automatically analyzes the data and presents the completed data plot and all statistical
measurements.

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SRA Profile graph display

General tab
The top of the screen shows the data plot for all selected channels and representations of the defined zones:

A floating window displays information about the

Conveyor Speed including:
• Setpoint – value entered from oven recipe
• Measured – as measured by SRA sensors
• Delta – Difference between setpoint and
measured

Avg Temps By Zone tab

This tab will show the average measured temperature for all 6 embedded TCs (Air and Mass). The data is displayed
for each zone and includes the Uniformity or Delta T (Temperature) across the embedded TCs per zone.
Any value within the defined specification will display in Green; any value outside the defined specification will
display in Red. If no specifications were defined in the Process Window, all statistical calculations will be displayed
in Black color

Reflow Specifications tab

If when creating a Process Window, you selected any of variables from the Reflow Specifications section, those
calculations will be displayed here. For any specification chosen, it will display the measured value, along with the
corresponding PWI for that measured value. As noted in the Edit Specs screen area, a PWI will only be calculated
for the Mass TCs.

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Oven Recipe; Measured vs Setpoint; HTI

At the bottom of the screen is additional information including:

Original Top/Original Bottom – This area displays the oven recipe settings used in this run (Zone Setpoints and
Conveyor Speed).
Average Measured Air Temperature – This is the average value of all three of the Air TC readings for each zone
Delta T – This is the temperature difference between the zone setpoint, and the Average Measured Air Temperature
for each zone.
Heat Transfer Index (HTI) – This is a calculation which allows you to quantify the performance and/or
consistency of a zone. In the heated zones, a value of ‘0.00’ indicates no thermal energy is being transferred into a
part; a value of ‘1.00’ indicates the maximum amount of thermal energy is being transferred. In a cooling zone, the
range is reversed – from ‘0.00’ to ‘-1.00’.

Compare tab

This screen allows a comparison of the currently displayed run to another previous run. Only runs using the same
oven configuration (same size and number of heated and cooling zones) and oven recipe can be compared.
The top left Profile 1 area shows the date/time of the current run being viewed. Select the Compare Profile 2 drop-
down to display a menu of the available runs that can be compared. Select one from the list, then click on the
Analyze button to the right to display the comparison of the two runs.

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Select/Deselect TC Data to compare

By default, all TCs are selected. Deselect any TC you want to remove from the comparison and the display will
automatically update with only the selected TC(s).

Comparison graphs
The top graph will display an overlay of the complete profile runs for the selected TC(s). A legend is shown on the
right side of the graph for whichever TC(s) data is selected.
The bottom graph displays a plot of the variation – or Delta T – between the two runs for the selected TC(s). If
upper/lower specifications were defined as part of the Process Window setup, those limits will be displayed on the
graph. A legend is shown on the right side of the graph for whichever data is selected.
Double click on a graph to expand it to a larger size. Right click on either graph screen to open a menu of available
tools such as an Examine line and Zoom functions.

Run to Run Delta T

• Average Delta – displays an average of the variation in
temperature across the entire data collection between the two
selected runs
• Max Delta – displays the single largest amount of variation (in
degrees Celsius) between the two runs. A negative value would
indicate that the current run is “x” degrees cooler than the compared run at that location.
• Time of Max Delta – displays the point in the data collection where the Maximum Delta occurred. In the
example above, it occurred at 260 seconds, which in this case was in the first cooling section.

Conveyor Speed
• Delta – displays the largest variation in measured conveyor
speed between the two selected runs. A negative value would
indicate the current run is “x” amount slower than the compared run.

HTI
• Delta – displays the variation in Heat Transfer Index for
each zone between the two selected runs. A negative
value would indicate the HTI in the current run is lower than compared run.

SPC Charting with SRA

The data collected from the SRA can be analyzed over time by using the SPC charting capabilities. See the SPC
Charting section for details.

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Appendix A: Using optional software

The software functionality can be enhanced by several available options, including Navigator Power, Auto-Focus
Power, Statistical Process Control, Live Data Output, Centralized Process Window Control and Virtual Profiling.
The sections that follow describe each of the options in detail.

The software options are distributed on and activated from a software key—a removable USB dongle key that can
be separately purchased from KIC. The software key installs in any open USB port. When connected, the software
key enables the use of the functions associated with each software option.

Note: Do not connect the software key to the computer before installing the Profiler Software. Install the software,
and then connect the software key to a USB port.

To check that the software key is working properly, start the software and display the Hardware Status screen. The
options available on the connected key appear in the Software Key field.

If the message No software key found appears, the software does not detect the software key. The problem might be
with the USB port, the software key, or the software drivers. The software key drivers install as part of the software
installation so reinstallation of the base software will likely repair any driver related issues.

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Using Navigator Power for profile optimization

Figure 104: Optimization Tab

The Optimization Tab allows you to set the search functions of the Navigator Power Option. The Navigator Power
will search through millions of setpoint and conveyor speed combinations to find the optimal setting for each
product. This optimization is based on what options you select in this tab.

Original PWI – The Process Window Index for the original profile

Best PWI – The best Process Window Index that can be found based on the oven recipe optimization constraints
selected.

Speed change – The total change to the conveyor speed for the best oven recipe found.

Total setpoint change – The sum of all setpoint changes for the best oven recipe found.
Search Mode for Optimization
• Minimize PWI – Search for the combination of setpoint temperatures and conveyor speed that will
minimize the Process Window Index.
• Allow zone setpoints to change – This option will determine if Navigator will include zone setpoint
changes when predicting new solutions.
• Allow conveyor speed to change - Choose whether to allow Navigator to vary the conveyor speed. If you
choose this feature, you can set the minimum and maximum speeds.
• Maximize conveyor speed – Search for the setpoint temperatures that will maximize conveyor speed.
• Minimize energy consumption – Search for the oven settings that will minimize the power consumption
of the oven by finding setpoint solutions with slower conveyor speeds and lower temperature settings.

Conveyor speed constraints

As long as the Allow Conveyor Speed to Change feature is selected, these options will be available.
Minimum – Select the minimum conveyor speed you want to allow.
Maximum – Select the maximum conveyor speed you want to allow.

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Using Auto-Focus Power

If you have Auto-Focus Power available through the software key, its settings appear on the Auto-Focus tab that is
part of the Global Preferences.

Figure 105: Global Preferences – Auto Focus Tab

Selecting profile optimization settings

Search Mode for Auto-Focus

• Minimize PWI – Search for the combination of setpoint temperatures and conveyor speed that will
minimize the Process Window Index (PWI).

• Allow zone setpoints to change – This option will determine if Auto-Focus will include zone setpoint
changes when predicting new solutions.

• Allow conveyor speed to change - Choose whether to allow Auto-Focus to vary the conveyor speed. If
you choose Allow to Vary you can set the minimum and maximum.

• Maximize conveyor speed – Search for the setpoint temperatures that will maximize conveyor speed.

• Minimize energy consumption – Search for the oven settings that will minimize the power consumpotion
of the oven by finding setpoint solucitons with slower conveyor speeds and lower temperature settings

Conveyor speed constraints

Minimum – Select the minimum conveyor speed you want to allow.
Maximum – Select the maximum conveyor speed you want to allow.

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Setting product dimensions for Auto-Focus

Figure 106: Run a Profile – Auto Focus screen #1

If you have purchased the Auto-Focus software option, this screen will appear. Enter the length, width, and weight
of your product, and then choose the Forward Arrow button. See Figure 106.

• This product will be included in the Auto-Focus library from this point forward.
• Make sure to measure using the correct units of measurement.

Auto-Focus confirm screen

This screen is displayed in order to
confirm the product measurements as
entered by you. See Figure 107.

You have two options:

Use current Oven Recipe – use
the most recent oven recipe
setting for this product.
The next screen will display the
most recent setpoints and
conveyor speed for this product.

Use Auto-Focus to find an in-

spec Oven Recipe – This will
initiate the Auto-Focus option
for this product.
Figure 107: Run a Profile – Auto Focus screen #2

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If the Use Auto-Focus… button is selected, and no matching

product is found, this dialog box will appear, choose the OK
button. (Figure 108.)

You will be returned to the Confirm screen. Select the Use

Current Oven Recipe button and enter the oven setpoints and
conveyor speed you want to start with.
Figure 108
If the Use Auto-Focus… button is selected, but there are not
enough products in the database to confidently give an
expected PWI, this dialog box will appear. (Figure 109.)

If you select Yes, the next dialog box shows the Auto-Focus–
First Guess recipe in order for you to confirm.

If No, you will be returned to the Confirm screen. Select the

Use Current Oven Recipe button and enter the oven setpoints
and conveyor speed you want to start with.
Figure 109
If the Use Auto-Focus… button is selected and there are a
sufficient number of boards in the data base, the following
dialog box will appear: (Figure 110.)

If you select Yes, the next dialog box shows the Auto-Focus
–First Guess recipe in order for you to confirm.

If No, you will be returned to the Confirm screen. Select the

Use Current Oven Recipe button and enter the oven setpoints
and conveyor speed you want to start with.
Figure 110

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If you select YES, you will be prompted to Confirm the First Guess Recipe. See Figure 111.

Figure 111: Run a Profile – Auto Focus screen #3

Confirm the recipe and select the Forward Arrow button. If there is no communication with the oven controller, the
following dialog box appears: You must manually enter the recipe information on the oven. See Figure 112.

Figure 112

If there is communication with the oven, then the recipe is copied directly to the oven.

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Displaying statistical process control data

The Statistical Process Control (SPC) option displays profile data to chart Process Capability Index (Cpk) values.
When the software detects the SPC option on the key, the SPC column appears in the Profile Explorer screen:

SPC mini-charts for

selected profiles. Click and drag Selector line…

Click a chart to enlarge.

SPC Column

Show Charts Button

Figure 113: Profiler Explorer – SPC Option

To view a product’s chart(s) and/or SPC data:

1. Select a product folder.
2. In the SPC column select the profiles to be charted by clicking the check box for each profile.
(The maximum number of boards that can be selected for SPC charting is 35.)
Note: MVP Users - Select either Baseline profiles or Virtual Profiles since the software can
only chart one type of profile at any given time.
3. Next, select the Show Charts button.
4. The charts for the selected profiles will be displayed in a full screen format.

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SPC chart display

Chart Display Controller Button

Figure 114: SPC Option – Chart Display

The Chart tab will display a control chart for the overall profile PWI and for each individual process specification
with upper and lower alarm limits as defined in the Process Window setup. The chart data will coincide with the
stored profile data for the selected board, date and time.

The control charts hold all of the historical profile data for your product as selected in the Profile Explorer SPC
column. Each chart contains data for every product thermocouple used during the profile.

Selector Line - Each chart has a Selector Line. The Board or Profile # will be displayed at the top of the screen;
along with the date and time that profile was run. You can move the Selector line position by clicking and dragging
the small triangle at the bottom of the Selector line in any chart window.

The Maximum PWI and Cpk for the selected board, date and time will be highlighted above the corresponding
chart(s). In the bottom-left corner of the screen, the PWI for the selected profile is displayed.

Chart display controller

Select the Chart Display Controller button (Upper-Right Corner) to:
Select the number of control charts to display
Enable/Disable Cpk.
Edit the minimum and maximum number of data points to calculate SPC (Cpk) data for the selected product.

Figure 115: SPC Option - Chart Display, Full Screen

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Viewing chart data

To view individual chart data, select a chart and then click inside the chart area. This will display that particular
chart in a full screen format.

Display Info Box

Meter Window

Figure 116: SPC Option - Chart Display, Full Screen

Move the mouse pointer over the chart data, and a Display Info box will appear. This Display Info box data
includes PWI, Cpk, date, and time for each board.

• Meter window – Right click anywhere in the full screen chart area. A menu will appear, select Meter Window.
This will display a small data box in the upper-left corner of the profile graph. This data box will display the
historical – statistic data for any selected board. To select a board move your mouse pointer along the chart
data, at each data point the historical – statistic data for that board will be displayed. Right-click in the chart
area again and de-select Meter Window to disable this feature.

• Point protector – When this feature is enabled, the charts will display individual data points for each board.
To activate this feature right click anywhere in the full-screen chart area. A menu will appear, select Point
Protector. This will display the individual data points on each control chart. De-selecting this feature will
remove the data points from the control chart, showing only a plot of the same data. By default, the Point
Protector will be enabled for charts containing 20 boards or less. Click in the full screen chart area again to
return to the regular Chart tab view.

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SPC charting for SRA data

In addition to the charting described above, when using an SRA Smart Reflow Analyzer you can track the stability
over time of various machine related parameters. Additional tabs will be displayed on the main chart tab when
viewing data from the SRA.
Note: Specifications must be selected, and limits defined, in a Process Window to view the SPC charting with SRA
data.

Separate Tabs for Reflow Specifications,

Conveyor Speed, and individual Zones

• Reflow Specifications – This tab will display a control chart for the overall profile PWI and for each individual
process specification with upper and lower alarm limits as defined in the Process Window setup. The chart data
will coincide with the stored profile data for the selected run, date and time.
• Conveyor Speed – This tab will display a control chart for the measured Conveyor Speed for each run, with
upper and lower limits displayed as defined in the Process Window setup.
• Zone tabs – There will be separate tabs displaying the SRA specific calculations for each zone. The number of
Zone tabs displayed (heated and cooling) will be based on the oven configuration file selected when the runs
were collected.

The Reflow Specifications SPC charts will calculate and display Cpk calculations for the selected specifications as
these are ‘process related’ variables. The Conveyor Speed and individual Zone charts will display Cm and Cmk
calculations for the selected specifications as these are ‘machine related’ variables.

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Using Live Data Output (LDO)

The Live Data Output, or LDO, option allows you to automatically create an external data and/or image file for a
profile. The data file can be used by third-party applications such as Line Balancing/Production Monitoring Host or
external SPC software. The data includes all relevant profile data, statistics, and limits. The image output function
provides users an automatically created ‘picture’ of the completed profile.

Note: For the Live Data output to function, the appropriately programmed USB dongle key must remain connected
to the PC at all times during use. You can verify if you have the LDO feature by viewing the Software Key panel in
the Hardware Status screen.

Configuration
The LDO option is enabled in the PSConfig.exe
utility.

1. Shut down the PS2G software

2. Browse to the C:\Profiling Software 2G
directory
3. Run the PSConfig.exe file
4. Select the LDO tab

Image Output – Select to generate an image file

each time a profile is downloaded. Click the
Browse button to select a directory where the
image files should be saved. Select the type of
image file.

Data Output – Select to generate an external data

file each time a profile is downloaded. Click the
Browse button to select a directory where the data
files should be saved. Select the type of data file.

5. Click OK to save and close the utility

The format of the Image Output file is based on the Printout preferences set. To change the layout between either
Portrait or Landscape mode, see the Printing profile display screens section of this manual.

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Operation

Output of the LDO file – When downloading of a profile is completed, the data and/or image files are
automatically created and saved to the directory specified by the user.

Viewing LDO data – The LDO output files can be generated in commonly used file formats: .csv, .txt, or .xml for
data files; .png or .jpeg for image files.

Note: For the Live Data output to function, the appropriately programmed USB dongle key must remain connected
to the PC at all times during use. You can verify if you have the LDO feature by viewing the Software Key panel in
the Hardware Status screen.

Examples of data output file

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Centralized Process Window Control

This optional feature enables a customer to ensure that every instance of the software is always using the same
Process Window files and prevents unauthorized editing of specifications.
Some factories may have multiple PCs across the production floor where they run profiles from, and the same
Process Windows may need to be used at any one of those PCs. This can lead to mistakes being made when
transferring files from one machine to another. Or, someone may make a change to a specification on one machine,
and the change may not be made on others or the updated file is not copied to all other software. This can lead to
varying profile results depending on which PC the data is collected in.

This feature eliminates these situations by ‘centralizing’ the creation and editing of Process Window files through
the use of a separate application, accessible only by authorized personnel. All Process Window files reside in a
specified central directory, and each instance of the Profiling Software 2G get their Process Windows from this
location. Additionally, all creation and editing functions within the PS2G software are disabled. This ensures that no
matter who is running the profile or at which location, the correct, approved Process Window specifications are the
only ones shown.

Note: For the Centralized Process Window Control to function, the appropriately programmed USB dongle key
must remain connected to the PC at all times during use. You can verify if you have the optional feature by viewing
the Software Key panel in the Hardware Status screen.
Additionally, each instance of the PS2G software that you want to use this option on must be connected to your
company network and have access to the directory where the Process Windows are saved.

KIC File Administrator

The KIC File Administrator is the application that will be used for creating and editing Process Windows for use
with the Centralized Process Window Control option.

Note: For the KIC File Administrator (or KFA) to function, the appropriately programmed USB dongle key must
remain connected to the PC at all times during use. Only authorized users should be allowed to have access to this
application.

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As an added protection, this application requires a password for use.

The default password is Admin, but can be changed in the Settings
menu after logging in.

Login/Logout – Allows you to display or deactivate all areas of the application.

Change Specs Name – Allows a user to change the name of a specification. See Change Specs Name section below
for details.
Settings – Used for setting units of measure (for this application), changing password, inactivity time-out, etc.
Working Directory – This is the network location where you will be saving/storing the Process Window files. By
default, it will show the path where the KFA application is located. Use the Browse button to point to the desired
network directory.
Convert Old PW files – This section is used for updating existing Process Window files for compatibility* with the
Centralized Process Window Control option.
Drop-down menu – Displays list of currently available Process Window files. User can also type in a new name if
creating a new Process Window.
OK – Saves any changes and closes application
Cancel – Ignores any changes made and closes application
Apply – Saves changes and keeps open the application

*The Centralized Process Window Control option uses a unique file format for Process Windows. When the option
is in use, the PS2G will only read Process Window files that were created or converted using the KIC File
Administrator application. ‘Standard’ Process Window files will not be recognized by the PS2G software when this
option is enabled.

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Working Directory

As this is the network location where the Process Window files will be stored, and ALL PS2G software installations
will need to access this directory, you may need to contact your IT department to identify a proper location for this
directory.
Once a network directory is identified, click on the Browse button to select the location. Click OK in the selection
window, then click Apply to save the change. Two subfolders named Ovens and ProcessSpecs will automatically be
generated in the specified directory. All new Process Windows created, and any existing ones that are converted to
the compatible format, will be saved into the ProcessSpecs folder of this Working Directory location.

Convert Old PW files

This section enables you to easily convert any existing Process Window files you already have into the updated
format so they can be used with the Centralized Process Window Control option. To update existing files:

Click on the Browse button and point to the ProcessSpecs sub-folder of a Profiling Software 2G directory. Click the
Apply button. All Process Windows files (.PSProcessSpec) will be automatically copied, converted into the new
format (.CentralProcessSpec), and then pasted into the ProcessSpecs folder of the Working Directory on the
network. To ensure all of your Process Windows are updated and available, repeat these same steps for each PC
where you have the PS2G software installed.

Change Spec Name

This functionality is available for users who
need to customize the name of a given
specification to meet their internal naming
conventions for process specifications. The
updated name is what will display in the
PS2G Process Windows.
If you need to change a specification, check
the Use Change Specs Name checkbox.
From the left side columns (greyed out),
locate the specification names you want to
modify and type the new name into the
corresponding right side column. Click Save
then Exit when you’ve completed your
changes.

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Configuration of PS2G software

To use the Centralized Process Window Control option in the PS2G software, a selection needs to be made during
the software installation. This will automatically configure the software to use this function. A message will appear
on the screen asking if you wish to enable this functionality:

NOTE: Only select the checkbox if you have purchased the Centralized Process Window Control option and want
to implement the capability in the software.

After installation of the PS2G software is completed, you will also need to specify the network directory where the
Process Window files will be retrieved from. This will be done through the PSConfig.exe utility.

1. Shut down the PS2G software

2. Browse to the C:\Profiling
Software 2G directory
3. Run the PSConfig.exe file
4. In the Process Window
Directory section, click Browse
and select the ProcessSpecs
folder in the network drive
previously specified in the KFA
utility
5. Click Apply and OK to save the
changes and close the utility

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Operation of PS2G software

When the Centralized Process Window option is in use, the PS2G software will populate the drop-down menu at the
top of the screen with only the Process Window files from the specified network directory. All edit and naming
functions are removed. The user can only view the Process Window files.
The Process Window files will automatically be downloaded into the local PS2G directory from the specified
network location. This ensures that whenever a Process Window needs to be accessed – either from opening the
Process Window screen, or from the Run a Profile screen – the most up-to-date version of the Process Windows are
always being used.

Note: For the Centralized Process Window Control to function, the appropriately programmed USB dongle key
must remain connected to the PC at all times during use. You can verify if you have the optional feature by viewing
the Software Key panel in the Hardware Status screen.
Additionally, each instance of the PS2G software that you want to use this option on must be connected to your
company network and have access to the directory where the Process Windows are saved.

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Using Virtual Profiling

The optional Virtual Profile feature is automatically enabled when the software detects that the MVP software key is
connected to the computer. The Virtual Profiling feature requires the MVP (Manual Virtual Profile) hardware in
order to collect Baseline and/or Virtual Profile data.

The combination of MVP hardware and Virtual Profile software gives the user the advantage of not having to run an
actual instrumented profile board through the oven every time in order to check the current thermal profile of a
process. Instead the user simply runs the MVP through the oven and a Virtual Profile is calculated based on the
MVP’s temperature readings.
After setting up an in-spec profile for your PCB, you will create a baseline by running a single profile for your PCB
with the MVP fixture attached. Subsequent verification profile runs only require the use of the MVP fixture without
the need of the PCB. The single programming run eliminates the need to further sacrifice your PCB for periodic
process checks.

Required hardware:
• MVP hardware kit, including MVP software key
• Profiler
• Profile board (instrumented with type K thermocouples).

Standard profiles, or profiles run without the MVP profiling fixture cannot be used with the Virtual Profiling feature.
In order to utilize the Virtual Profiling feature you must run the profiles for your product(s) using the MVP profiling
fixture. These profiles are called MVP profiles.

There are three types of MVP profiles:

Baseline profile – The Baseline profile is used by the software as a set of data to which it will compare or measure a
Virtual Profile against. Using the thermal profile data from the user’s profile board as well as the MVP profiling
fixture as a model the software can calculate the current Virtual Profile each time the MVP is run through the oven.
Note: The default criterion for a Baseline profile is that the PWI is less than 90%. This maximum PWI value can be
changed in the Global Preferences screen.

Virtual profile – A Baseline profile must be established for any given product before a Virtual Profile can be run.
Once a Baseline profile has been established the user can then run a Virtual Profile using only the MVP profiling
fixture eliminating the need to run the actual profile board. The MVP is run through the oven and the Virtual Profile
is calculated based on the temperature readings of the MVP.

Verification profile – A Verification profile is run whenever the user wishes to verify the actual thermal profile of
the oven. A Verification profile requires the user to run a profile using their instrumented profile board along with
the MVP, similar to a Baseline profile. If the PWI of the Verification profile meets the Baseline profile criteria then
it becomes the new Baseline profile for that product.

Establishing a baseline profile

In order to obtain Virtual Profile data, a Baseline profile must first be established.

To run a baseline profile:

Install the software.
Connect the MVP software key to the computer.
Start the software.
In the Global Preferences screen select the MVP check box and then enter the maximum PWI value to allow
Virtual Profiling.

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Figure 117: Global Preferences – MVP option

Next run a profile by selecting the Run a Profile button from the main menu.
In the Select screen, select your Product, Process Window, Application type, Sample Rate, Oven, and then
select the MVP profile check box. Notice the “Run a Baseline Profile” is grayed out and automatically selected
for you. Select the forward arrow button to proceed.

Figure 118: Run a Profile – Select Screen

The next screen will have you enter the oven setpoints and conveyor speed. Then select the forward arrow
button to proceed.

The next screen will graphically depict the connection of the MVP thermocouples to the profiler. Follow the on
screen directions and then select the forward arrow button to proceed.

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Figure 119: Run a Profile - Attach MVP Thermocouples

The next screen instructs the user to insert the (instrumented) profile board into the MVP board clamps and then
attach the thermocouples to the profiler. Follow the on screen directions and then select the forward arrow
button to proceed.

Figure 120: Run a profile – Insert Profile Board and Attach Thermocouples

In the next screen the user selects the thermocouples to be used. Select the check box for each thermocouple
and then select the Start Profile button when ready. As long as the profiler is on and connected, the
temperatures for all connected thermocouples are below 31C, and the oven is within 2 degrees of the setpoint
temperatures the profile can begin.

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Figure 121: Run a Profile - Select Thermocouples

The next screen will depict the MVP, profile board, and the profiler being loading onto the conveyor and
entering into the oven. Select the forward arrow button to proceed to the profile graph where the profile will be
displayed.

Figure 122: Run a Profile – Baseline Profile – Profiler Entering Oven

When the profile run has finished the software calculates the profile’s PWI value. If the PWI value is less than
90% (default max PWI value for Virtual Profiling)) then the profile qualifies as a Baseline profile. A Virtual
Profile cannot be run until a Baseline profile for the product has been established.

Baseline profiles are listed in the Profile Explorer Profile Type column. They also have a “BL” designation as
the icon.

Figure 123: Profile Explorer – Profile Types - Baseline

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Running a Virtual Profile

Unlike Standard profiles which are initiated by selecting the Run a Profile button on the main menu, Virtual Profiles
can only be run from the Profile Explorer screen and only if a Baseline profile exists for the selected product.

To run a Virtual Profile:

Connect the MVP software key to the computer
Start the software
Select the Profiler Explorer button from the main menu.
Select a Product folder.
Select a Baseline profile
Select the “Create VP” button.

Create VP button

Figure 124: Profile Explorer – Virtual Profiling Option

Next a message will appear asking “Do you want to start Virtual Profiling this product?” Select OK to continue;
Cancel to cancel the Virtual Profile. If you choose OK then you will be guided through the subsequent Virtual
Profiling screens.

Figure 125: Start Virtual Profiling Message

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Since the software already knows the Product name, Process Window, and Sample Rate for the product, the only
available actions are to select the Oven Name and/or type a profile description in the text field and then select the
forward arrow to proceed. Select the red X button to cancel the Virtual Profile.

Figure 126: Run a Virtual Profile – Select Screen

The next screen will graphically depict the connection of the MVP thermocouples to the profiler and inserting
/attaching the MVP Carrier. Follow the on screen directions and then select the forward arrow button to proceed.

Figure 127: Run a Virtual Profile – Attach MVP, Insert Carrier

In the next screen the current temperatures for the MVP thermocouples are displayed. Select the Start Profile
button. As long as the profiler is on and connected, the temperatures for both of the MVP thermocouples are below
31C, and the oven is within 2 degrees of the setpoint temperatures the Virtual Profile can begin.

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Profile Start Button

Figure 128: Run a Virtual Profile – Select Thermocouples screen

The next screen will depict the MVP, MVP Carrier, and profiler being loading onto the conveyor and entering into
the oven. Select the forward arrow button to proceed to the profile graph.

Figure 129: Run a Virtual Profile – MVP, Carrier, and Profiler Entering Oven

During the live profile there will no profile data displayed on the profile graph. When the profile has finished the
profile results including PWI, and the profile Statistics will be displayed on the profile graph. The Virtual Profiles
for each product are listed in the Profile Explorer Profile Type column. Virtual Profiles also have a “VP”
designation as the icon.

Figure 130: Profiler Explorer – Profile Types

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Virtual Profile

Figure 131: Profiler Explorer – Virtual Profile

Verification profiles
A Verification profile is run whenever the user wishes to verify the actual thermal profile of the product. A
Verification profile requires the user to run a profile using their instrumented profile board along with the MVP,
similar to a Baseline profile. If the PWI of the Verification profile meets the Baseline profile criteria then it
becomes the new Baseline profile for that product.

Follow these steps to run a Verification Profile:

Connect the MVP software key to the computer
Start the software
Select the Profiler Explorer button from the main menu.
Select a Product folder.
In the Profile Type column select a Virtual Profile and then select the Display Graph button. The selected
Virtual Profile graph will be displayed.
From the profile graph screen select the Profiler Explorer button. A message will appear asking the user “Do
you want to run a MVP Verification profile with this product?” Select Yes.

Figure 132: Verification Profiler Message

In the Select screen, select your Product, Process Window, Application type, Sample rate, Oven. In the MVP
profile area, notice the “Run a Baseline Profile” is grayed out and automatically selected for you. Select the
forward arrow button to proceed.

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Figure 133: Verification Profile – Select screen

The next screen will graphically depict the connection of the MVP thermocouples to the profiler. Follow the on
screen directions and then select the forward arrow button to proceed.

Figure 134: Verification Profile – Attach MVP Thermocouples

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The next screen instructs the user to insert the (instrumented) profile board into the MVP board clamps and then
attach the thermocouples to the Profiler. Follow the on screen directions and then select the forward arrow
button to proceed.

Figure 135: Verification Profile – Insert Profile Board and Attach Thermocouples

In the next screen the user selects the thermocouples to be used. Click the check box for each thermocouple and
then select the Start Profile button when ready. As long as the profiler is on and connected, the temperatures for
all connected thermocouples are below 31C, and the oven is within 2 degrees of the setpoint temperatures the
profile can begin.

Figure 136: Verification Profile – Select Thermocouples

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The next screen depicts the MVP, profile board, and profiler being loading onto the conveyor and entering into
the oven. Select the forward arrow button to proceed to the profile graph where the profile data will be
displayed.

Figure 137: Verification Profile – MVP, Profile Board, and Profiler Entering Oven

When the Verification profile is finished the software calculates the product’s thermal profile and resulting PWI
value. If the PWI value is less than 90% (default max PWI value) then the profile becomes the new Baseline
profile as shown below:

` Figure 138: New Baseline profile

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Appendix B: Writing data over a network

The software can easily be configured to write the collected data directly to a network drive location. This allows
data from one or even multiple systems to be stored in one centralized location (Server/Shared Hard Drive).

You must have a mapped network drive on the PC running the software to the desired network location. Due to the
varieties of OS and network configurations, KIC cannot detail this step. We recommend you contact your
IT/Network administrator if you need assistance setting up a mapped network drive.

Once you have mapped the drive, select a folder on the network drive and copy in the following folders from the
C:\Profiling Software 2G directory – Ovens, Process Specs, and Profiles. Once completed follow the steps below on
the PC where the software is installed:

Ensure the software is shutdown. Open Windows Explorer, and locate the file:
C:\Profiling Software 2G\Log\PSDataPath.kiccfg

Double-click on the PSDataPath.kiccfg to open it in Notepad. See Figure 139:

Figure 139

Change the line AllowUserToManuallyChangeWorkingDataPathInThisIniFile=0 to the

value =1. See Figure 140.

Figure 140

Change the KIC2000DefaultDataPath= to the desired network location. See Figure 141.

Figure 141

Once the PSDataPath.kiccfg file has been modified with the new locations, choose File/Save from
the drop down menu to save the changes.
Close Windows Explorer and start the software.

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With the software running, go into Profile Explorer. You should now see the new data path directory
displayed in the upper right hand corner of the screen. See Figure 142.

Figure 142

All data generated (oven files and process specs) and collected (profiles) will be written directly to the specified
network directory. You can now view the collected data from any PC on the network that is running the software.

If the network is unavailable when accessing various areas of the software (Define/Edit Process Window, Run A
Profile, Profile Explorer), a message will appear alerting you to the issue:

When this occurs, you are still able to use the software. It will temporarily reset back to the local install directory
and any new files generated or updated will be saved in the local directory (C:\Profiling Software 2G). If the
network connection is re-established, the Profiling Software 2G software must be restarted to begin writing directly
to the network directory again.

Any data that was collected while the software was offline will be moved to the network directory after the
connection has been re-established and the Profiling Software 2G software is restarted.

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Appendix C: Using the Process Window Index to

quantify thermal profile performance
The problem
While there are currently statistically valid methods for quantifying pick and place and screen printer performance,
there is no widely accepted method for comparing performance of thermal profiles, and thus, no quantifiable system
of ranking thermal process performance. Once a thermal profile has been run, it is judged as being either in or out
of spec, and perhaps subjectively judged as being OK, good, or really good. Efforts to track process performance
for SPC or QC generally focus on a single, or a small group, of profile statistics; for example, peak temperature of
one or two thermocouples on a golden board. The Process Window Index is a statistical method for ranking thermal
profile and thermal process performance.

Defining the Process Window Index

The Process Window Index (PWI) is a measure of
how well a profile fits within user defined process
limits. See Figure 143.

This is done by ranking process profiles on the basis

of how well a given profile “fits” the critical process
statistics. A profile that will process product without
exceeding any of the critical process statistics is said
to be inside the Process Window. The center of the
Process window is defined as zero, and the extreme
edge of the process window as 99%.
Figure 143: Process Window and PWI

A PWI of 100% or more indicates that the profile will

not process product in spec. A “Process Window
Index” of 99% indicates that the profile will process
product within spec, but it is running at the very edge
of the Process Window. A “Process Window Index”
of less than 99% indicates that the profile is in spec
and tells users what percentage of the process window
they are using: for example, a PWI of 70% indicates a
profile that is using 70 percent of the process spec.
Figure 144: The Process Window Index
(Single Statistic—Peak Temperature of one Thermocouple)

The PWI tells users exactly how much of their process window a given profile uses, and thus how robust that profile
is. The lower the PWI, the better the profile. A PWI of 99% is risky because it indicates that the process could
easily drift out of control. Most users seek a PWI of below 80%, and profiles with a Process Window Index
between 50% and 60% are commonly achieved (if the oven is sufficiently flexible and efficient).

Figure 144 shows the Process Window Index for the Peak Temperature of a single thermocouple. The Process
Window Index for a complete set of profile statistics is calculated as the worst case (highest number) in the set of
statistics.

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For example: if a profile is run with six thermocouples, and four profile statistics are logged for each thermocouple,
then there will be a set of twenty-four statistics for that profile, and the PWI will be the worst case (highest number
expressed as a percentage) in that set of profile statistics. Note that Figure 145 shows the user-designated critical
statistics for a single thermocouple.

Figure 145: The Process Window Index

(Multiple Statistics for a Single Thermocouple and Final PWI Calculation)

Calculating the PWI

To calculate the Process Window Index: i=1 to N (number of thermocouples); j=1 to M (number of statistics per
thermocouple); measured_value[i,j] is the [i,j]th statistic’s value; average_limits[i,j] is the average of the [i,j]th
statistic’s high and low limits; and range[i,j] is the [i,j]th statistic’s high limit minus the low limit.

Figure 146: Formula for calculating the PWI

Thus, the PWI calculation includes all thermocouple statistics for all thermocouples. The profile PWI is the worst
case profile statistic (maximum, or highest percentage of the process window used), and all other values are less.

Note: When using non-centered Target values, a modified formula is used.

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Benefits of ranking thermal profile performance

The analysis of thermal profiles with the Process Window Index offers four significant benefits. The first is that
profiles can be easily compared, and users can be confident that they are using the best profile their process can
achieve. Before the PWI was available for profile analysis, comparing profiles was subjective, and users could
never be certain they had the best profile for their product. The PWI provides an excellent opportunity for process
improvement and its use is a significant step towards Zero-defect Production.

The second benefit is that the PWI greatly simplifies the profiling process. When used in advanced profiling tools,
all profile statistics are reduced to a single number (the PWI) that even the most inexperienced operator can
understand. This means significant savings in terms of training costs and a reduction in defects caused by operator
error. It further means that in a few minutes, an inexperienced operator can setup an oven with the optimal profile, a
job that formerly could take an experienced engineer hours.

The third benefit is that because the PWI reflects the performance of the whole profile, it provides much better
indicator of process capability than tracking a single statistic. The PWI thus provides excellent data for SPC and
other QC monitoring programs while simplifying data gathering and reducing process monitoring costs.

Finally, the PWI gives users a simple method for comparing thermal process performance. Comparisons may be
made between individual lines on the shop floor, between processes at multiple plants, and between processes using
dissimilar equipment. The ability to quantify thermal process performance will give electronics assemblers a means
for comparing the performance of their soldering equipment. This is of value in selecting equipment, for buy off,
and for process troubleshooting.

Table 1 is the result of a series of tests comparing oven performance using several sizes of PCBs. Each board was
profiled in the given oven, and then an automated profile prediction tool was used to find the optimal profile for that
board in the given oven. After the oven setpoints were changed and the oven stabilized, a second profile was run to
confirm that the predicted PWI had been achieved. Table 1 shows that there is significant variation in oven
performance between various makes and models. In this test, Oven C had more zones than Ovens A and B, and
performed better, as would be expected.

Oven Board Type

Display
Manufacturer Model Motherboard Cell Phone Adapter Mainframe
A X PWI = 87% PWI = 62% PWI = 79% PWI = 126%
B Y PWI = 71% PWI = 58% PWI = 61% PWI = 93%
C Z PWI = 33% PWI = 29% PWI = 34% PWI = 58%
Table 1: Comparison of Oven Performance – Best Achievable PWI

Conclusion
The simplicity of the Process Window Index makes its validity as a statistical tool readily apparent and its adoption
as an industry standard clearly offers a significant opportunity for the improvement of the soldering process. The
advantages detailed above point to its value in demystifying the soldering process and open the door to precision
control of a process that has been ignored for too long. Issues like Lead-free electronic assembly mean that
electronics assemblers can no longer be complacent about their soldering process. Sophisticated tools utilizing the
PWI as a standard for accurately measuring the thermal process will mean more efficient production, improved and
simplified process control, and higher quality final product.

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Appendix D: How to run profiles with Profile Stacking

Profile stacking allows you to run multiple profiles (up to 30) without having to download the profile after each run.
This feature is only available with the SPS Smart Profiler. The SPS Smart Profiler has the memory and logic built
in to manage collection of multiple profile runs before returning to Profiling Software 2G to download the data. The
device Alert LED will indicate the status of the SPS Smart Profiler, so you know when it is ready to start the next
profile, without having to plug into the software.

LED Modes and Descriptions for the SPS Smart Profiler

LED Name/ Mode LED Mode Description
Icon/Color Behavior
Battery Charging Combined Plugged into USB for charging.
solid and Each LED represents 1/3rd of battery capacity.
flashing. Starting from the left the lights go from
See flashing to solid as the battery charge fills.
description Full charge when all 3 are solid.
Using battery Flashing LEDs will flash depending on amount of charge
power every 3 left.
seconds Minimum to 1/3rd charge left – LED 1
1/3rd to 2/3rd charge left – LED 1-2
2/3rd to full charge left – LED 1-2-3
Alert Not Ready Solid On Cannot profile: due to TC 1 missing, TCs too
hot, SPS too hot, Battery too low, startup
failure, voltage too low to charge or memory
full. Plug into PC and software to identify alert.

Ready Off Ready to begin profiling.

Data Collection Profiling Fast Profiling in progress.

Flashing
Profile Complete Flashing One or more profiles are complete and stored
every 3 in memory.
seconds
Data Empty Off No profiles stored in memory.

Communications No Off Wi-Fi not in use or not available.

Wi-Fi Communications

Wi-Fi In Use Fast flashing When profiling or downloading.

Wi-Fi Ready Slow Flashing every 3 seconds when paired with
flashing Smart Dock
ANT Beacon Flashing Beacon mode starts when device is tapped.
LED flashes until SPS finds a Smart Dock beacon
and pairs with it to make private Wi-Fi
connection.

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At the PC

Select the Run Profile Stacking button on the main screen.

If using the Smart Dock (transmitter mode), the software will set the SPS to profile stacking mode via the Wi-Fi
connection. If running datalog mode, the user will connect a USB cable and then the software will set the SPS Smart
Profiler to profile stacking mode.

1. Once the SPS and the Smart Dock are paired or the SPS is plugged directly into the USB port, click the Profile
Stacking button.
See the SPS Smart Profiler Hardware Guide for instructions on connecting the hardware to the PC.

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2. The first screen in Profile Stacking confirms the connection of your SPS Smart Profiler. You must have your
unit on and communicating to advance. The green checkmark indicates the software has identified the SPS, set
it to profile stacking mode, and it is ready to collect data. If the TCs or Internal Temperature are too hot, or the
battery voltage is too low, the green checkmark will not appear. Click the Next arrow to continue (right arrow).

3. The profiler is now ready for you to unplug from the PC (if connected) and with your SPS Smart Profiler,
thermal shield, and PCB with thermocouples attached and plugged into the SPS, proceed to run your 1 st profile
at the oven. Always remember to place the SPS Smart Profiler into the thermal shield prior to running the
profile through the oven.

4. Unplug SPS (if connected) and you are ready to go to the oven to profile. If using in Wi-Fi mode, simply
proceed to run your 1st profile.

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At the Oven
1. Plug in TCs connected to the PCB you are profiling, if you have not already done so.
Check the Alert LED on the SPS for readiness to collect a profile (Alert LED should be off).

2. When ready, put the profiler in the shield and then feed the PCB and profiler into the oven.

3. IMPORTANT: Once the PCB and profiler come out of the oven, open the shield and remove the SPS from the
shield (helps to cool) and view the Alert status. Alert LED will typically be on until the product TCs are below
the defined Start Trigger and the SPS internal temp is cool enough to run another profile.

4. Proceed to collect more profiles at the oven or at other ovens, making sure to pay attention to the Alert LED
status between each run. Follow steps 1-3 until all profiles are collected then return the PC.

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Back at the PC
Downloading and Viewing Profiles

When the last profile is completed, return to the PC with the

software running.

1. You are now back at the screen you left, to go run

profiles. Connect your SPS Smart Profiler and click the
Ready to Download Stacked Profiles (green downward
arrow) button.

Note: Wireless mode for profile stacking is strictly a

wireless download. No live profile transmission occurs
during profile runs.

2. The software determines the number of profiles stored in

the SPS, and temporarily downloads the data. A message
will display asking “Do you want to view profiles?”
Click Yes to start the routine to identify each
profile/product. Click No to cancel out of profile
stacking mode and return to the Main Screen.

Note: If you selected No in the above step, the data will

not be saved in the software, but will remain inside the
profiler. From the Main Screen, re-enter profile stacking
mode and you will have the choice to either download
and view the data, or delete the data from the device.

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Name Product and Select Process Window

1. Product Name: Choose an existing product name from the drop down or enter a unique product name.

2. Process Window: Choose a process window from the drop-down list. These Process Windows are created in
the Define/Edit Process Window screen accessed from the main screen.

3. Application: Solder Reflow Only

4. Oven Name: Choose an existing oven from the drop-down list. You may need to modify the existing oven
recipe on the screen that follows.
If the oven list is empty, refer to the “Identify a New Oven to the System” section of the manual.

5. Profile Description: Allows for freehand typing of any notes you may want to include with this profile.

Enter Oven SetPoints and Conveyor Speed Screen

1. Enter new temperature values for the top of the oven zones.

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2. If the bottom of the zones have different setpoint values from the top, deselect the “Top and Bottom Setpoint
are the same” checkbox and enter new temperature values in the bottom row fields as well.

Top

Bottom

3. Type in a value in the Conveyor Speed field.

4. Click Next.

Label Thermocouples for the Profile

1. TC checkboxes – The software will identify the number of TCs used in each individual profile and
preselect the TC checkboxes.

2. Include thermocouple (TC) labels (20 char. Max) – Clicking this checkbox allows the user to enter a
label for each checked TC.

3. Label – Enter up to 20 characters to describe the placement or location of that TC.

Note: If the selected Process Window has Separate Specs for TCs, then you must return to the Process
Window-Edit Specs screen in order select/deselect TCs or change their text labels.

4. Click Traffic Light Button to download and display the first completed profile.

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5. After viewing the first profile graph, when

clicking the green checkmark button, you will be
asked if you want to view the next profile:

Click Yes and repeat the steps noted above to enter

the Product Name, Process Window, oven, oven
recipe, etc. for the second profile collected.

6. After the last profile in the sequence is viewed,

clicking the green checkmark will let you know that
it is the last of the Stacked Profiles collected.
Clicking Yes will remove all data from the profiler
and return you to the main screen of the software.

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Contacting KIC

On the Web
You can find the latest KIC product news along
with a library of useful information at our website:
www.kicthermal.com or www.kic.cn

KIC Technical Support

KIC Tech Support is available by email:
USA: [email protected]
Europe: [email protected]
Asia: [email protected]

KIC Product Training

Contact KIC Customer Support by email, [email protected]

KIC Sales
Contact KIC sales:
USA: [email protected]
Europe: [email protected]
Asia: [email protected]
China: [email protected]

Find the KIC Representative in Your Area

Send an email or visit our web page to find a local representative.

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