M.Tech-VLSISD - R18 - Syllabus
M.Tech-VLSISD - R18 - Syllabus
DETAILED SYLLABUS
[Link]
VLSI SYSTEM DESIGN
For
[Link] TWO YEAR DEGREE PROGRAMME
(Applicable for the batches admitted from 2018-2019)
COURSE STRUCTURE
(R18 Regulations applicable for the batches admitted from Academic Year 2018-19 onwards)
I-SEMESTER
II-SEMESTER
Department of ECE
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[Link]-VLSI System Design R18 Regulations
COURSE STRUCTURE
(R18 Regulations applicable for the batches admitted from Academic Year 2018-19 onwards)
III-SEMESTER
IV-SEMESTER
****
Department of ECE
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UNIT –I:
MOS Design
Pseudo NMOS Logic – Inverter, Inverter threshold voltage, Output high voltage, Output Low
voltage, Gain at gate threshold voltage, Transient response, Rise time, Fall time, Pseudo NMOS
logic gates, Transistor equivalency, CMOS Inverter logic.
UNIT –II:
Combinational MOS Logic Circuits:
MOS logic circuits with NMOS loads, Primitive CMOS logic gates – NOR & NAND gate,
Complex Logic circuits design – Realizing Boolean expressions using NMOS gates and CMOS
gates , AOI and OIA gates, CMOS full adder, CMOS transmission gates, Designing with
Transmission gates.
UNIT –III:
Sequential MOS Logic Circuits:
Behavior of bistable elements, SR Latch, Clocked latch and flip flop circuits, CMOS D latch and
edge triggered flipflop.
UNIT –IV:
Dynamic Logic Circuits:
Basic principle, Voltage Bootstrapping, Synchronous dynamic pass transistor circuits, Dynamic
CMOS transmission gate logic, High performance Dynamic CMOS circuits.
UNIT –V:
Semiconductor Memories:
Types, RAM array organization, DRAM – Types, Operation, Leakage currents in DRAM cell
and refresh operation, SRAM operation Leakage currents in SRAM cells, Flash Memory- NOR
flash and NAND flash.
TEXT BOOKS:
1. Digital Integrated Circuit Design – Ken Martin, Oxford University Press, 2011.
2. CMOS Digital Integrated Circuits Analysis and Design – Sung-Mo Kang, Yusuf
Leblebici, TMH, 3rd Ed., 2011.
REFERENCE BOOKS:
1. Introduction to VLSI Systems: A Logic, Circuit and System Perspective – Ming-BO Lin,
CRC Press, 2011
2. Digital Integrated Circuits – A Design Perspective, Jan M. Rabaey, Anantha
Chandrakasan, Borivoje Nikolic, 2nd Ed., PHI.
COURSE OUTCOMES:
After the completion of this course, the students should be able to
Define the basic of CMOS technology
Relate, compare, interpret and make the use of the best CMOS design techniques for
Department of ECE
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***
Department of ECE
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UNIT –I:
MOS Devices and Modeling
The MOS Transistor, Passive Components- Capacitor & Resistor, Integrated circuit Layout,
CMOS Device Modeling – Simple MOS Large-Signal Model, Other Model Parameters, Small-
Signal Model for the MOS Transistor, Computer Simulation Models, Sub-threshold MOS
Model.
UNIT –II:
Analog CMOS Sub-Circuits:
MOS Switch, MOS Diode, MOS Active Resistor, Current Sinks and Sources, Current Mirrors-
Current mirror with Beta Helper, Degeneration, Cascode current Mirror and Wilson Current
Mirror, Current and Voltage References, Band gap Reference.
UNIT –III:
CMOS Amplifiers:
Inverters, Differential Amplifiers, Cascode Amplifiers, Current Amplifiers, Output Amplifiers,
High Gain, Amplifiers Architectures.
UNIT –IV:
CMOS Operational Amplifiers:
Design of CMOS Op Amps, Compensation of Op Amps, Design of Two-Stage Op Amps,
Power-Supply Rejection Ratio of Two-Stage Op Amps, Cascode Op Amps, Measurement
Techniques of OP Amp.
UNIT –V:
Comparators:
Characterization of Comparator, Two-Stage, Open-Loop Comparators, Other Open-
Loop-Comparators, Improving the Performance of Open-Loop Comparators, Discrete-Time
Comparators.
TEXT BOOKS:
1. CMOS Analog Circuit Design – Philip E. Allen and Douglas R. Holberg, Oxford
University Press, International Second Edition/Indian Edition, 2010.
2. Analysis and Design of Analog Integrated Circuits- Paul R. Gray, Paul J. Hurst, S. Lewis
and R. G. Meyer, Wiley India, Fifth Edition, 2010.
REFERENCE BOOKS:
1. Analog Integrated Circuit Design- David A. Johns, Ken Martin, Wiley Student Edn,
2013. Design of Analog CMOS Integrated Circuits- Behzad Razavi, TMH Edition.
2. CMOS: Circuit Design, Layout and Simulation- Baker, Li and Boyce, PHI.
COURSE OUTCOMES:
Upon completion of this course, students should demonstrate the ability to:
Department of ECE
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Define the parameters of MOS Devices & can predict the performance or behavior of
Analog VLSI circuit.
Use mathematical models of MOS transistors to evaluate their behavior in analog circuits
& selects suitable design approaches while trading off conflicting requirements
Analyze & characterize analog devices and systems & Designing CMOS analog circuits
to achieve performance specifications
Understand design issues related to analog VLSI system 7&working of MOS based data
converter circuits.
Make the significant use of knowledge of subject in research or on project in VLSI
domain.
***
Department of ECE
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REFERENCES
1. Samir palnitkar, ”Verilog HDL”, Pearson education, Second Edition,20O3.
2. J. Bhasker, “A Verilog HDL Primer”, Second Edition, Star Galaxy, 2005.
3. J. Bhasker, “A Verilog Synthesis: A Practical Primer”, Star Galaxy, 1998
4. [Link]., Anitha Chandrakasan Borivoje Nikolic, "DigitalIntegrated Circuits", Second
Edition
5. Neil H.E Weste and Kamran Eshraghian, "Principles of CMOS VLSI Design", 2nd Edition
Addition ,Wesley, 1998.,
Department of ECE
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COURSE OUTCOMES:
Upon completion of this course, students should demonstrate the ability to:
Design and analyze combinational, sequential and arithmetic circuits using HDL.
Understand digital system design flow, timing, synthesis and FPGA implementation
issues.
Solve engineering problems in the area of digital system design & Examine or Inspect for
an optimum layout for IC layout at VLSI backend design.
Design, analyze & can predict the performance characteristics of logic gates using
NMOS, PMOS & CMOS technology at VLSI backend design.
Tell an optimum trade with respect to three basic parameters of VLSI design for VLSI
circuit at frontend or backend VLSI design
***
Department of ECE
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REFERENCES
1. K.K Parhi: “VLSI Digital Signal processing”, John-wiley, 2nd Edition Reprint, 2008.
2. John [Link], Dimitris [Link], “Digital Signal Processing”, Prentice Hall of India, 1st
Edition, 2009.
COURSE OUTCOMES:
Upon completion of this course, students should demonstrate the ability to:
Apply the concepts of pipelining, parallel processing, retiming, folding and unfolding to
optimize digital signal processing architectures
Use of proper techniques for parallel processing design for scaling and round off noise
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computation
Apply all techniques to improve implementations of several DSP algorithms, using both
ASICs and off –the -shelf programmable digital signal processors
Design high-speed, low-area, and low-power VLSI systems for a broad range of DSP
applications
Minimize the computational complexity using fast convolution algorithms & Make the
significant use of knowledge of subject in research or on project in VLSI domain
***
Department of ECE
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(M18VL05)VLSI TECHNOLOGY
(Program Elective – I)
M. Tech:I-Semester LTPC
3 00 3
COURSE OBJECTIVES:
To understand the impact of the physical and chemical processes of integrated circuit
fabrication technology on the design of integrated circuits.
To understand physics of the Crystal growth, wafer fabrication and basic properties of
silicon wafers.
To Learn the concepts of Design rules and Scaling, BICMOS ICs.
UNIT –I:
Review of Microelectronics and Introduction to MOS Technologies:
MOS, CMOS, BiCMOS Technology. Basic Electrical Properties of MOS, CMOS & BiCMOS
Circuits: Ids – Vds relationships, Threshold Voltage VT, Gm, Gds and ωo, Pass Transistor,
MOS, CMOS & Bi CMOS Inverters, Zpu/Zpd, MOS Transistor circuit model, Latch-up in
CMOS circuits.
UNIT –II:
Layout Design and Tools:
Transistor structures, Wires and Vias, Scalable Design rules, Layout Design
tools. Logic Gates & Layouts:Static Complementary Gates, Switch Logic,
Alternative Gate circuits, Low power gates, Resistive and Inductive
interconnect delays.
UNIT –III:
Overview of semiconductor industry, Stages of Manufacturing, Process and product trends,
Crystal growth, Basic wafer fabrication operations, process yields, Semiconductor material
preparation, Basic wafer fabrication operations, Yield measurement, Contamination sources,
Clean room construction, Oxidation and Photolithography, Doping and Depositions,
[Link] step patterning process, Photoresists, physical properties of photoresists,
Storage and control of photoresists, photo masking process, Hard bake, develop inspect, Dry
etching Wet etching, resist stripping
UNIT –IV
Doping and depositions: Diffusion process steps, deposition, Drive-in oxidation, Ion
implantation-1, Ion implantation-2, CVD basics, CVD process steps, Low pressure CVD
systems, Plasma enhanced CVD systems, Vapour phase epitoxy, molecular beam epitaxy.
UNIT –V
Design rules and Scaling, BICMOS ICs: Choice of transistor types, pnp transistors, Resistors,
capacitors, Packaging: Chip characteristics, package functions, package operations
TEXT BOOKS:
1. Peter Van Zant, Microchip fabrication, McGraw Hill, 1997.
2. C.Y. Chang and S.M. Sze, ULSI technology, McGraw Hill, 2000
REFERENCE BOOKS:
1. Micro Electronics circuits Analysis and Design 2 nd Edition, Muhammad H Rashid,
CENAGE Learning2011.
2. Eugene D. Fabricius, Introduction to VLSI design, McGraw Hill, 1999
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3. Wani-Kai Chen (editor), The VLSI Hand book, CRI/IEEE press, 2000
4. S.K. Gandhi, VLSI Fabrication principles, John Wiley and Sons, NY, 1994
COURSE OUTCOMES:
Upon completion of this course, students should demonstrate the ability to:
Department of ECE
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M. Tech:I-Semester LTPC
3 00 3
COURSE OBJECTIVES:
Understand the concepts of Physical Design Process such as partitioning, Floorplanning,
Placement and Routing.
Discuss the concepts of design optimization algorithms and their application to physical design
automation.
Understand the concepts of simulation and synthesis in VLSI Design Automation
Formulate CAD design problems using algorithmic methods.
UNIT I:
PRELIMINARIES
Introduction to Design Methodologies, Design Automation tools, Algorithmic Graph Theory,
Computational complexity, Tractable and Intractable problems.
UNIT II:
GENERAL PURPOSE METHODS FOR COMBINATIONAL OPTIMIZATION
Backtracking, Branch and Bound, Dynamic Programming, Integer Linear Programming, Local
Search, Simulated Annealing, Tabu search, Genetic Algorithms.
UNIT III:
LAYOUT COMPACTION, PLACEMENT, FLOORPLANNING AND ROUTING
Problems, Concepts and Algorithms.
MODELLING AND SIMULATION
Gate Level Modelling and Simulation, Switch level Modelling and Simulation.
UNIT IV:
LOGIC SYNTHESIS AND VERIFICATION
Basic issues and Terminology, Binary-Decision diagrams, Two-Level logic Synthesis
HIGH-LEVEL SYNTHESIS
Hardware Models, Internal representation of the input Algorithm, Allocation, Assignment and
Scheduling, Some Scheduling Algorithms, Some aspects of Assignment problem, High-level
Transformations.
:UNIT V:
PHYSICAL DESIGN AUTOMATION OF FPGAs
FPGA technologies, Physical Design cycle for FPGAs, partitioning and Routing for segmented
and staggered Models.
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TEXT BOOKS
1. Algorithms for VLSI Design Automation, S.H. Gerez, 1999, WILEY Student Edition,
John wiley & Sons (Asia) Pvt. Ltd.
2. Algorithms for VLSI Physical Design Automation – Naveed Sherwani, 3 rd Ed., 2005,
Springer International Edition.
REFERENCE BOOKS
1. Computer Aided Logical Design with Emphasis on VLSI – Hill & Peterson, 1993, Wiley.
2. Modern VLSI Design: Systems on silicon – Wayne Wolf, 2 nd ed., 1998, Pearson Education
Asia.
COURSE OUTCOMES:
Upon completion of this course, students should demonstrate the ability to:
Describe and formulate the flow of VLSI Design for any application.
Explain the algorithms for partitioning, floor planning, placement and routing the
digital designs at frontend level & at backend VLSI Design level.
Compare the various scheduling algorithms & Analyze & solve the issues related
to logic synthesis & verification
Explain the algorithms for partitioning, floor planning, placement and routing the
MCM modules
Make significant contribution in the research in based on design of CAD tool for
VLSI design
***
Department of ECE
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COURSE OBJECTIVES:
To introduce students to the modern embedded systems and to show how to understand and
program such systems using a concrete platform built around A modern embedded processor like
the Intel ATOM.
To introduce the students to Embedded Firmware.
To understand the concepts of RTOS based Embedded design.
UNIT –I:
Introduction to Embedded Systems
Definition of Embedded System, Embedded Systems Vs General Computing Systems, History
of Embedded Systems, Classification, Major Application Areas, Purpose of Embedded Systems,
Characteristics and Quality Attributes of Embedded Systems.
UNIT –II:
Typical Embedded System:
Core of the Embedded System: General Purpose and Domain Specific Processors, ASICs, PLDs,
Commercial Off-The-Shelf Components (COTS), Memory: ROM, RAM, Memory according to
the type of Interface, Memory Shadowing, Memory selection for Embedded Systems, Sensors
and Actuators, Communication Interface: Onboard and External Communication Interfaces.
UNIT –III:
Embedded Firmware:
Reset Circuit, Brown-out Protection Circuit, Oscillator Unit, Real Time Clock, Watchdog Timer,
Embedded Firmware Design Approaches and Development Languages.
UNIT –IV:
RTOS Based Embedded System Design:
Operating System Basics, Types of Operating Systems, Tasks, Process and Threads,
Multiprocessing and Multitasking, Task Scheduling.
UNIT –V:
Task Communication: Shared Memory, Message Passing, Remote Procedure Call and Sockets,
Task Synchronization: Task Communication/Synchronization Issues, Task Synchronization
Techniques, Device Drivers, How to Choose an RTOS.
TEXT BOOKS:
1. Introduction to Embedded Systems – Shibu K.V, Mc Graw Hill.
REFERENCE BOOKS:
1. Embedded Systems – Raj Kamal, TMH.
2. Embedded System Design – Frank Vahid, Tony Givargis, John Wiley.
3. Embedded Systems – Lyla, Pearson, 2013
4. An Embedded Software Primer – David E. Simon, Pearson Education.
COURSE OUTCOMES:
Upon completion of this course, students should demonstrate the ability to:
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.
Know the Basic Concept of Embedded Systems.
Interpret the difference between Microcontrollers and Microprocessors.
Apply the Software for Embedded System Design & concepts of Embedded OS.
Explain and apply the concept of Embedded Firmware, RTOS Based Embedded
System Design and Task function.
Make significant contribution in the research in applications based on embedded
system design.
***
Department of ECE
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M. Tech:I-Semester LTPC
3 00 3
COURSE OBJECTIVES:
To make the student understand how MOSFET and other semiconductor devices are
modeled
To impart knowledge to simulate MOSFET for various operational requirements.
To impart a knowledge on advanced structures of MOSFETs like SOIFET, FinFET etc.
UNIT -I:
Introduction to Semiconductor Physics:
Review of Quantum Mechanics, Boltzman transport equation, Continuity equation, Poisson
equation.
Integrated Passive Devices:
Types and Structures of resistors and capacitors in monolithic technology, Dependence of model
parameters on structures
UNIT -III:
Integrated MOS Transistor:
NMOS and PMOS transistor – Threshold voltage – Threshold voltage equations – MOS device
equations – Basic DC equations second order effects – MOS models – small signal AC
characteristics – MOS FET SPICE model level 1, 2, 3 and 4
UNIT -IV:
VLSI Fabrication Techniques: An overview of wafer fabrication, Wafer Processing –
Oxidation – Patterning – Diffusion – Ion Implantation – Deposition – Silicon gate nMOS process
– CMOS processes – n-well- p-well- twin tub- Silicon on insulator – CMOS process
enhancements – Interconnects circuit elements
UNIT -V:
Modeling of Hetero Junction Devices: Band gap Engineering, Band gap Offset at abrupt
Hetero Junction, Modified current continuity equations, Hetero Junction bipolar transistors
(HBTs), SiGe
TEXT BOOKS:
1. Introduction to Semiconductor Materials and Devices – Tyagi M. S, 2008, John Wiley
Student Edition.
2. Solid State Circuits – Ben G. Streetman, Prentice Hall, 1997
REFERENCE BOOKS:
1. Physics of Semiconductor Devices – Sze S. M, 2 nd Edition, Mcgraw Hill, New York,
1981.
2. Introduction to Device Modeling and Circuit Simulation – Tor A. Fijedly, Wiley-
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Interscience, 1997.
3. Introduction to VLSI Systems: A Logic, Circuit and System Perspective – Ming-BO Lin,
CRC Press, 2011
COURSE OUTCOMES:
Upon completion of this course, students should demonstrate the ability to:
***
Department of ECE
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M. Tech:I-Semester LTPC
2 00 0
Course Objectives:
To understand the nuances of language and vocabulary in writing a Research Paper.
To develop the content, structure and format of writing a research paper.
To give the practice of writing a Research Paper.
To enable the students to evolve original research papers without subjected to plagiarism.
UNIT I:
ACADEMIC WRITING: What is Research? - Meaning & Definition of a research paper–
Purpose of a research paper – Scope – Benefits – Limitations – outcomes.
UNIT II:
RESEARCH FORMAT: Title – Abstract – Introduction – Discussion - Findings – Conclusion
– Style of Indentation – Font size/Font types – Indexing – Citation of sources.
UNIT III:
RESEARCH METHODOLOGY: Methods (Qualitative – Quantitative) – Literature Review –
Who did what – Criticizing, Paraphrasing & Plagiarism.
UNIT IV:
PROCESS OF WRITING A RESEARCH PAPER: Choosing a topic - Thesis Statement –
Outline – Organizing notes - Language of Research – Word order, Paragraphs – Writing first
draft –Revising/Editing - Typing the final draft
UNIT V:
HOW TO & WHERE TO GET PUBLISHED: Reputed Journals – National/International –
ISSN No, No. of volumes, Scopes Index/UGC Journals – Free publications - Paid Journal
publications – /Advantages/Benefits
TEXT BOOKS:
1. MLA Hand book for writers of Research Papers, East West Press Pvt. Ltd, New Delhi, 7 th
Edition.
2. C. R Kothari, Gaurav, Garg, Research Methodology Methods and Techniques, New Age
International Publishers. 4th Edition.
3. Lauri Rozakis, Schaum’s Quick Guide to Writing Great Research Papers, Tata McGraw
Hills Pvt. Ltd, New Delhi.
4. N. Gurumani, Scientific Thesis Writing and Paper Presentation, MJP Publishers
REFERENCES:
1. NPTEL: [Link]
COURSE OUTCOMES:
Upon completion of this course, students should demonstrate the ability to:
Department of ECE
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Department of ECE
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(M18MC01)RESEARCH METHODOLOGY
UNIT I:
RESEARCH METHODOLOGY: Objectives and Motivation of Research, Significance of
Literature review, Types of Research, Research Approaches, and Research Methods verses
Methodology, Research and Scientific Method, Importance of Research Methodology, Research
Process, Criteria of Good Research.
UNIT II:
RESEARCH DESIGN: Meaning of Research Design, Need of Research Design, Feature of a
Good Design Important Concepts Related to Research Design, Different Research Designs,
Basic Principles of Experimental Design, Data collection methods, Collection of primary data,
Secondary data, Data organization, Methods of data grouping, Diagrammatic representation of
data, Graphic representation of data.
UNIT III:
RESEARCH REPORT WRITING: Format of the Research report, Synopsis, Dissertation,
References/Bibliography/ Webliography, Research Proposal Preparation: Writing a Research
Proposal and Research Report, Writing Research Grant Proposal.
UNIT IV:
NATURE OF INTELLECTUAL PROPERTY: Patents, Designs, Trade and Copyright.
Process of Patenting and Development: technological research, innovation, patenting,
development.
UNIT V:
PATENT RIGHTS: Scope of Patent Rights. Licensing and transfer of technology.
Patentinformation and databases. New Developments in IPR: Administration of Patent System.
TEXT BOOKS:
1. C.R Kothari, “Research Methodology, Methods & Technique”. New Age International
Publishers, 2004.
2. R. Ganesan, “Research Methodology for Engineers”, MJP Publishers, 2011.
3. Robert P. Merges, Peter S. Menell, Mark A. Lemley, “Intellectual Property in New
Technological Age”, Aspen Publishers, 2016.
4. T. Ramappa, “Intellectual Property Rights Under WTO”, S. Chand, 2008.
5. Satarkar, S.V,.“Intellectual property rights and copy right”. ESS Publications, 2000.
REFERENCES:
1. Ranjit Kumar, “Research Methodology: A Step by Step Guide for beginners”, SAGE
Publications Ltd.
2. Halbert, “Resisting Intellectual Property”, Taylor & Francis Ltd ,2007
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COURSE OUTCOMES:
Upon completion of this course, students should demonstrate the ability :
Develop an understanding of IPR/ research methodology in the process of creation of
patents through research
Develop further research capabilities
Design Important Concepts Related to Research Design
Learn better report writing skills and Patenting.
***
Department of ECE
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M. Tech:I-Semester LTPC
0 04 2
Note: Any 10 of the following digital/analog circuits are to be designed and implemented
using Xilinx/Altera/Equivalent CAD tools.
Programming can be done using any complier. Down load the programs on FPGA/CPLD boards
and performance testing may be done apart from verification by simulation with any of the front
end tools.
COURSE OBJECTIVES:
To design Various Combinational and Sequential circuits using VHDL
To design Various Combinational and Sequential circuits using Verilog HDL.
To verify different logic circuits using FPGA/CPLD Boards.
List of Experiments:
COURSE OUTCOMES:
Upon completion of this course, students should demonstrate the ability :
***
Department of ECE
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M. Tech:I-Semester LTPC
0 04 2
Note: Any 10 of the following digital/analog circuits are to be designed and implemented
using Mentor Graphics / Tanner Tools/Microwind-DSCH/Equivalent CAD tools.
COURSE OBJECTIVES:
To design Various Combinational circuits using CMOS Logic.
To design Various Sequential circuits using CMOS Logic.
To design Various circuits using Different Logic Styles.
To design Layout of Different logic circuits.
List of Experiments:
COURSE OUTCOMES:
***
Department of ECE
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M. Tech:II-Semester LTPC
3 00 3
COURSE OBJECTIVES:
To know mixed signal circuits like DAC, ADC, PLL etc.
To gain knowledge on filter design in mixed signal mode.
To acquire knowledge on design different architectures in mixed signal mode.
UNIT -I:
Switched Capacitor Circuits:
Introduction to Switched Capacitor circuits- basic building blocks, Operation and Analysis, Non-
ideal effects in switched capacitor circuits, Switched capacitor integrators first order filters,
Switch sharing, biquad filters.
UNIT -II:
Phased Lock Loop (PLL):
Basic PLL topology, Dynamics of simple PLL, Charge pump PLLs-Lock acquisition,
Phase/Frequency detector and charge pump, Basic charge pump PLL, Non-ideal effects in PLLs-
PFD/CP non-idealities, Jitter in PLLs, Delay locked loops, applications
UNIT -III:
Data Converter Fundamentals:
DC and dynamic specifications, Quantization noise, Nyquist rate D/A converters- Decoder based
converters, Binary-Scaled converters, Thermometer-code converters, Hybrid converters
UNIT -IV:
Nyquist Rate A/D Converters:
Successive approximation converters, Flash converter, Two-step A/D converters, Interpolating
A/D converters, Folding A/D converters, Pipelined A/D converters, Time interleaved converters.
UNIT -V:
Oversampling Converters:
Noise shaping modulators, Decimating filters and interpolating filters, Higher order modulators,
Delta sigma modulators with multibit quantizers, Delta sigma D/A
TEXT BOOKS:
1. Design of Analog CMOS Integrated Circuits- Behzad Razavi, TMH Edition, 2002
2. CMOS Analog Circuit Design - Philip E. Allen and Douglas R. Holberg, Oxford
University Press, International Second Edition/Indian Edition, 2010.
3. Analog Integrated Circuit Design- David A. Johns,Ken Martin, Wiley Student Edition,
2013
REFERENCE BOOKS:
1. CMOS Integrated Analog-to- Digital and Digital-to-Analog converters-Rudy Van De
Plassche, Kluwer Academic Publishers, 2003
2. Understanding Delta-Sigma Data converters-Richard Schreier, Wiley Interscience, 2005.
3. CMOS Mixed-Signal Circuit Design – R. Jacob Baker, Wiley Interscience, 2009.
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COURSE OUTCOMES:
After completing this course the students should be able to:
Build mixed signal circuits like DAC, ADC, PLL etc &Gain knowledge on filter design
in mixed signal mode &To acquire knowledge on design different architectures in mixed
signal mode.
Analyze digital test and linear test engineers to the mixed signal world by teaching the
basics of analog and mixed signal test methods. Sampling Theory, Frequency Domain
Testing, and Digital Signal Processing
Apply these fundamental concepts to different test methods and data validation for mixed
signal parameters together with debugging, noise reduction and device interface
techniques.
Deal with the theory and design skills of CMOS op-amps, voltage reference circuits,
switched capacitor circuits, sample-and- hold circuits, and A/D & D/A converters used in
modern communication systems and consumer electronic products.
Design of core mixed-signal IC blocks: comparators and data converters & System level
design flow: top-down and bottom-up design methodologies
***
Department of ECE
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M. Tech:II-Semester LTPC
3 00 3
COURSE OBJECTIVES:
To gain knowledge on digital testing as applied to VLSI design.
To acquire knowledge on testing of algorithms for digital circuits.
To learn various testing methods for digital circuits.
UNIT -I:
Introduction to Testing:
Testing Philosophy, Role of Testing, Digital and Analog VLSI Testing, VLSI Technology
Trends affecting Testing, Types of Testing, Fault Modeling: Defects, Errors and Faults,
Functional Versus Structural Testing, Levels of Fault Models, Single Stuck-at Fault.
UNIT -II:
Logic and Fault Simulation:
Simulation for Design Verification and Test Evaluation, Modeling Circuits for Simulation,
Algorithms for True-value Simulation, Algorithms for Fault Simulation, ATPG.
UNIT -III:
Testability Measures:
SCOAP Controllability and Observability, High Level Testability Measures, Digital DFT and
Scan Design: Ad-Hoc DFT Methods, Scan Design, Partial-Scan Design, Variations of Scan.
UNIT -IV:
Built-In Self-Test:
The Economic Case for BIST, Random Logic BIST: Definitions, BIST Process, Pattern
Generation, Response Compaction, Built-In Logic Block Observers, Test-Per-Clock, Test-Per-
Scan BIST Systems, Circular Self Test Path System, Memory BIST, Delay Fault BIST.
UNIT -V:
Boundary Scan Standard:
Motivation, System Configuration with Boundary Scan: TAP Controller and Port, Boundary
Scan Test Instructions, Pin Constraints of the Standard, Boundary Scan Description Language:
BDSL Description Components, Pin Descriptions.
TEXT BOOKS:
1. Essentials of Electronic Testing for Digital, Memory and Mixed Signal VLSI Circuits –
M.L. Bushnell, V. D. Agrawal, Kluwer Academic Pulishers.
REFERENCE BOOKS:
1. Digital Systems and Testable Design - M. Abramovici, [Link] and A.D Friedman,
Jaico Publishing House. Digital Circuits Testing and Testability - P.K. Lala, Academic
Press.
COURSE OUTCOMES:
After completing this course the students should be able to:
Gain knowledge on digital testing as applied to VLSI design &Acquire knowledge on
Department of ECE
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Department of ECE
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UNIT –I:
Fundamentals:
Need for Low Power Circuit Design, Sources of Power Dissipation – Switching Power
Dissipation,Short Circuit Power Dissipation, Leakage Power Dissipation, Glitching Power
Dissipation, ShortChannel Effects –Drain Induced Barrier Lowering and Punch Through,
Surface Scattering, Velocity Saturation, Impact Ionization, Hot Electron Effect.
UNIT –II:
Low-Power Design Approaches:
Low-Power Design through Voltage Scaling – VTCMOS circuits, MTCMOS circuits,
Architectural Level Approach –Pipelining and Parallel Processing Approaches.
Switched Capacitance Minimization Approaches:
System Level Measures, Circuit Level Measures, Mask level Measures.
UNIT –III:
Low-Voltage Low-Power Adders:
Introduction, Standard Adder Cells, CMOS Adder’s Architectures – Ripple Carry Adders, Carry
Look-Ahead Adders, Carry Select Adders, Carry Save Adders, Low-Voltage Low-Power Design
Techniques –Trends of Technology and Power Supply Voltage, Low-Voltage Low-Power Logic
Styles.
UNIT –IV:
Low-Voltage Low-Power Multipliers:
Introduction, Overview of Multiplication, Types of Multiplier Architectures, Braun Multiplier,
Baugh- Wooley Multiplier, Booth Multiplier, Introduction to Wallace Tree Multiplier.
UNIT –V:
Low-Voltage Low-Power Memories:
Basics of ROM, Low-Power ROM Technology, Future Trend and Development of ROMs,
Basics of SRAM, Memory Cell, Precharge and Equalization Circuit, Low-Power SRAM
Technologies, Basics of DRAM, Self-Refresh Circuit, Future Trend and Development of
DRAM.
TEXT BOOKS:
1. CMOS Digital Integrated Circuits – Analysis and Design – Sung-Mo Kang, Yusuf Leblebici,
TMH, 2011.
2. Low-Voltage, Low-Power VLSI Subsystems – Kiat-Seng Yeo, Kaushik Roy, TMH
Professional
Engineering.
COURSE OUTCOMES:
Department of ECE
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***
Department of ECE
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M. Tech:II-Semester LTPC
3 00 3
COURSE OBJECTIVES:
To gain knowledge on Optimization techniques involved in VLSI circuits.
To explore various Statistical modeling and performance analysis of VLSI Circuits..
To understand the Concept of Genetic Algorithms and Routing Procedures.
UNIT –I:
Statistical Modeling:
Modeling sources of variations, Monte Carlo techniques, Process variation modeling- Pelgrom’s
model, Principle component based modeling, Quad tree based modeling, Performance modeling-
Response surface methodology, delay modeling, interconnect delay models.
UNIT –II:
Statistical Performance, Power and Yield Analysis
Statistical timing analysis, parameter space techniques, Bayesian networks Leakage models,
High level statistical analysis, Gate level statistical analysis, dynamic power, leakage power,
temperature and power supply variations, High level yield estimation and gate level yield
estimation.
UNIT –III:
Convex Optimization:
Convex sets, convex functions, geometric programming, trade-off and sensitivity analysis,
Generalized geometric programming, geometric programming applied to digital circuit gate
sizing, Floor planning, wire sizing, Approximation and fitting- Monomial fitting, Maxmonomial
fitting, Posynomial fitting.
UNIT –IV:
Genetic Algorithm:
Introduction, GA Technology-Steady State Algorithm-Fitness Scaling-Inversion GA for VLSI
Design, Layout and Test automation- partitioning-automatic placement, routing technology,
Mapping for FPGA- Automatic test generation- Partitioning algorithm Taxonomy-Multi-way
Partitioning Hybrid genetic-encoding-local improvement-WDFR Comparison of CAS-Standard
cell placement-GASP algorithm-unified algorithm.
UNIT –V:
GA Routing Procedures and Power Estimation:
Global routing-FPGA technology mapping-circuit generation-test generation in a GA frame
work-test generation procedures, Power estimation-application of GA-Standard cell placement-
GA for ATGproblem encoding- fitness function-GA Vs Conventional algorithm.
Department of ECE
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Press,
COURSE OUTCOMES:
After completing this course the students should be able to:
• Gain knowledge on Optimization techniques involved in VLSI circuits.
• Analyze methods of optimization to engineering students, including linear programming,
nonlinear programming, and heuristic methods
• Understand balance between theory, numerical computation, problem setup for solution
by optimization software, and applications to engineering systems.
• Studies General optimization algorithm; necessary and sufficient conditions for
optimality
• Demonstrate the Concept of Genetic Algorithms and Routing Procedures
***
Department of ECE
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REFERENCES
1. Kerry Bernstein, Keith M. Carrig, “High Speed CMOS Design Styles”, Kluwer Academic
Publishers, 2002.
2. Evan Sutherland, Bob Stroll, David Harris,” Logical Efforts, Designing Fast CMOS Circuits”,
Kluwer Academic Publishers, 1999 3. David Harris, “Skew Tolerant Domino Design”, IEEE
Journal of Solid State Circuits, 2001..
COURSE OUTCOMES:
After completing this course the students should be able to:
• Gain knowledge on circuits and techniques involved in high speed VLSI circuits.
• Explore various design strategies to be followed for designing a high speed VLSI circuits.
• Understand the logic styles for designing a high speed VLSI circuit & Learn the basics of
VLSI design for high speed processing
• Apply methods for logical efforts, logic styles, latching strategies, interface techniques
and related issues.
• Acquire knowledge about High Speed VLSI Circuits Design & Learn the basics of VLSI
design for high speed processing
***
Department of ECE
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REFERENCES
1. M. J. S. Smith , "Application Specific Integrated Circuits”, Addison - Wesley Longman
Inc., 1997.
2. Farzad Nekoogar and Faranak Nekoogar , “From ASICs to SOCs: A Practical
Approach”, Prentice Hall PTR, 2003.
COURSE OUTCOMES:
After completing this course the students should be able to
To learn the fundamentals of ASIC and its design methods
To gain knowledge on programmable architectures for ASICs & physical design of ASIC
To prepare the student to be an entry level industrial standard cell ASIC or FPGA
designer
To give the student an understanding of issues and tools related to ASIC/FPGA design.
Department of ECE
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Prepare the student for implementation, including timing, performance and power
optimization, verification and manufacturing test
***
Department of ECE
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[Link]-VLSI System Design R18 Regulations
M. Tech:II-Semester LTPC
3 00 3
COURSE OBJECTIVES:
To learn System on chip fundamentals, their applications.
To gain knowledge on SOC design.
To learn the various computation models of SOCs.
UNIT –I:
Introduction to the System Approach:
System Architecture, Components of the system, Hardware & Software, Processor Architectures,
Memory and Addressing. System level interconnection, An approach for SOC Design, System
Architecture and Complexity.
UNIT –II:
Processors:
Introduction , Processor Selection for SOC, Basic concepts in Processor Architecture, Basic
concepts in Processor Micro Architecture, Basic elements in Instruction handling. Buffers:
minimizing Pipeline Delays, Branches, More Robust Processors, Vector Processors and Vector
Instructions extensions, VLIW Processors, Superscalar Processors.
UNIT –III:
Memory Design for SOC:
Overview of SOC external memory, Internal Memory, Size, Scratchpads and Cache memory,
Cache Organization, Cache data, Write Policies, Strategies for line replacement at miss time,
Types of Cache, Split – I, and D – Caches, Multilevel Caches, Virtual to real translation , SOC
Memory System, Models of Simple Processor – memory interaction.
UNIT -IV:
Interconnect Customization and Configuration:
Inter Connect Architectures, Bus: Basic Architectures, SOC Standard Buses , Analytic Bus
Models, Using the Bus model, Effects of Bus transactions and contention time. SOC
Customization: An overview, Customizing Instruction Processor, Reconfiguration Technologies,
Mapping design onto Reconfigurable devices, Instance- Specific design, Customizable Soft
Processor, Reconfiguration - overhead analysis and trade-off analysis on reconfigurable
Parallelism.
UNIT –V:
Application Studies / Case Studies:
SOC Design approach, AES algorithms, Design and evaluation, Image compression – JPEG
compression.
TEXT BOOKS:
1. Computer System Design System-on-Chip - Michael J. Flynn and Wayne Luk, Wiely
IndiaPvt. Ltd.
2. ARM System on Chip Architecture – Steve Furber –2nd Ed., 2000, Addison Wesley
Professional.
Department of ECE
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REFERENCE BOOKS:
1. Design of System on a Chip: Devices and Components – Ricardo Reis, 1st Ed., 2004,
Springer
2. Co-Verification of Hardware and Software for ARM System on Chip Design (Embedded
Technology) – Jason Andrews – Newnes, BK and CDROM.
3. System on Chip Verification – Methodologies and Techniques –Prakash Rashinkar, Peter
Paterson and Leena Singh L, 2001, Kluwer Academic Publishers.
COURSE OUTCOMES:
After completing this course the students should be able to:
To learn the fundamentals of ASIC and its design methods
To gain knowledge on programmable architectures for ASICs & physical design of ASIC
To prepare the student to be an entry level industrial standard cell ASIC or FPGA
designer
To give the student an understanding of issues and tools related to ASIC/FPGA design.
Prepare the student for implementation, including timing, performance and power
optimization, verification and manufacturing test
***
Department of ECE
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M. Tech:II-Semester LTPC
3 00 3
COURSE OBJECTIVES:
To know the design of MOS memories and the various precautionary methods to be used in
their design.
To gain knowledge on various testing methods of semiconductor memories.
To get an overview on reliability of semiconductors and their testing.
UNIT -I:
Random Access Memory Technologies:
SRAM – SRAM Cell structures, MOS SRAM Architecture, MOS SRAM cell and peripheral
circuit operation, Bipolar SRAM technologies, SOI technology, Advanced SRAM architectures
and technologies, Application specific SRAMs, DRAM – DRAM technology development,
CMOS DRAM, DRAM cell theory and advanced cell structures, BICMOS DRAM, soft error
failure in DRAM, Advanced DRAM design and architecture, Application specific DRAM
UNIT -II:
Non-volatile Memories:
Masked ROMs, High density ROM, PROM, Bipolar ROM, CMOS PROMS, EPROM, Floating
gate EPROM cell, One time programmable EPROM, EEPROM, EEPROM technology and
architecture, Non-volatile SRAM, Flash Memories (EPROM or EEPROM), advanced Flash
memory architecture
UNIT -III:
Memory Fault Modeling Testing and Memory Design for Testability and Fault Tolerance:
RAM fault modeling, Electrical testing, Pseudo Random testing, Megabit DRAM Testing, non-
volatile memory modeling and testing, IDDQ fault modeling and testing, Application specific
memory testing, RAM fault modeling, BIST techniques for memory
UNIT -IV:
Semiconductor Memory Reliability and Radiation Effects:
General reliability issues RAM failure modes and mechanism, Non-volatile memory reliability,
reliability modeling and failure rate prediction, Design for Reliability, Reliability Test Structures,
Reliability Screening and qualification, Radiation effects, Single Event Phenomenon (SEP),
Radiation Hardening techniques, Radiation Hardening Process and Design Issues, Radiation
Hardened Memory characteristics, Radiation Hardness Assurance and Testing, Radiation
Dosimetry, Water Level Radiation Testing and Test structures
UNIT -V:
Advanced Memory Technologies and High-density Memory Packing Technologies:
Ferroelectric RAMs (FRAMs), GaAs FRAMs, Analog memories, magneto resistive RAMs
(MRAMs), Experimental memory devices, Memory Hybrids and MCMs (2D), Memory Stacks
and MCMs (3D), Memory MCM testing and reliability issues, Memory cards, High Density
Memory Packaging Future Directions
TEXT BOOKS:
1. Semiconductor Memories Technology – Ashok K. Sharma, 2002, Wiley.
2. Advanced Semiconductor Memories – Architecture, Design and Applications - Ashok K.
Sharma- 2002, Wiley.
Department of ECE
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3. Modern Semiconductor Devices for Integrated Circuits – Chenming C Hu, 1st Ed., Prentice
COURSE OUTCOMES:
After completing this course the students should be able to:
Know the design of MOS memories and the various precautionary methods to be used in
their design
Learn overview of memory chip design, DRAM circuits, voltage generators, performance
analysis and design issues of ultra-low voltage memory circuits
Acquire knowledge about High-Performance Subsystem Memories & Analyse RAM and
DRAM Design
Demonstrate Advanced Memory Technologies and High-density Memory Packing
Technologies & Gains knowledge on various testing methods of semiconductor
memories
Get an overview on reliability of semiconductors and their testing
***
Department of ECE
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M. Tech:II-Semester LTPC
2 00 0
Course Objectives:
This course provides understanding stress such as work related stress and individual
stress
This course serves time management such as importance of planning the day and
developing concentration
This course serves career plateau such as Identifying Career plateaus and Structural and
Content Plateauing and Making a fresh start
This course provides controlling crisis management
This course provides self development
UNDERSTANDING STRESS
Meaning – Symptoms – Work Related Stress – Individual Stress – Reducing Stress -sources of
stress –consequence of stress-burnout-symptoms of Burnout- stress verses Burnout-model of
stress-strategies for coping stress (individual and organizational strategies) –case study
TIME MANAGEMENT
Techniques – Importance of Planning the day –developing concentration – Prioritizing
Beginning at the start – Techniques for conquering procrastination – Sensible delegation –
Taking the right breaks – Learning to say “No”
CAREER PLATEAU
Career plateau – Identifying Career plateaus – Structural and Content - Plateauing – Making a
fresh start – Importance of Sabbaticals – Counseling out – Executive leasing – Sustaining a
marketable Career.
CRISIS MANAGEMENT
Implications – People issues – Structure issues – Environmental issues – Learning to keep calm -
Preventing interruptions – Controlling crisis – Pushing new ideas – Empowerment – Work place
Humour, Developing a sense of Humour – Learning to laugh – role of group cohesion and team
spirit.
SELF DEVELOPMENT
Improving personality – Leading with Integrity – Enhancing Creativity – Effective decision
making – Sensible Communication – The Listening Game – Managing Self – Mediation for
peace – Yoga for Life
TEXT BOOKS
1. Bhatia R.L., The Executive Track: An Action Plan for Self Development Wheeler Publishing,
New Delhi
2. Charavathy.S.K, “Human Values for Manager”, McGraw Hill/Henely Management Series
REFERENCES
1. Jeffr Davison, Managing Stress, Prentice Hall of India, New Delhi
2. Jerrold S Greenberg, Comprehensive Stress Management, Jain Books, 2009
Department of ECE
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COURSE OUTCOMES:
• Enhance of Physical strength and flexibility.
• Learn to relax and focus.
• Relieve physical and mental tension
• Improve work performance/ efficiency.
****
Department of ECE
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M. Tech:II-Semester LTPC
0 04 2
Note: Any 10 of the following digital/analog circuits are to be designed and implemented
using Mentor Graphics / Tanner Tools/Microwind-DSCH/NG-Spice/Equivalent CAD tools.
COURSE OBJECTIVES:
To design Various Characteristics of MOS Logic.
To design Various Amplifier circuits using CMOS Logic.
To design Various circuits using Different Logic Styles.
To design Layout of Different logic circuits.
List of Experiments:
COURSE OUTCOMES:
After completing this course the students should be able to:
Department of ECE
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[Link]-VLSI System Design R18 Regulations
M. Tech:II-Semester LTPC
0 04 2
Note: Any 10 of the following digital/analog circuits are to be designed and implemented
using Mentor Graphics / Tanner Tools/Microwind-DSCH/NG-Spice/Equivalent CAD tools.
COURSE OBJECTIVES:
To design Various Amplifier circuits using CMOS Logic.
To design Various Complex circuits using Different Logic Styles.
To design Layout of Different logic circuits.
List of Experiments:
COURSE OUTCOMES:
After completing this course the students should be able to:
Department of ECE
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[Link]-VLSI System Design R18 Regulations
M. Tech:II-Semester LTPC
0 0 4 2
COURSE OUTCOMES:
After the completion of this course, the students should be able to
Department of ECE
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[Link]-VLSI System Design R18 Regulations
M. Tech:III-Semester LTPC
3 00 3
COURSE OBJECTIVES:
UNIT I – UNFOLDING:
Algorithm for Unfolding- Properties of Unfolding- Critical Path- Unfolding and Retiming-
Applications of Unfolding. Folding: Folding TransformationRegister Minimization Techniques-
Lifetime analysis-Data Allocation using forward-Backward register Allocation- Register
Minimization in Folded Architectures- Folding of Multirate Systems.
Synchronous Pipelining and Clocking Styles- Clock Skew and Clock Distribution in Bit-Level
Pipelined VLSI Designs- Wave PipeliningConstraint Space Diagram and Degree of Wave
Pipelining- Implementation of Wave-Pipelined Systems- Asynchronous Pipelining- Signal
Transition Graphs- Use of STG to Design Interconnection Circuits- - Implementation of
Computational Units.
REFERENCES
1. K.K Parhi, “VLSI Digital Signal processing”, John-Wiley 2008.
2. Behrooz Parhami, “Computer Arithmetic : Algorithms & Hardware Designs”, Oxford
Department of ECE
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COURSE OUTCOMES:
After completing this course the students should be able to:
Know about the graph representations of DSP algorithms, Convolution algorithms and
the concept of parallel recursive and adaptive filters
Analyze The graph representations of DSP algorithms, Convolution algorithms &
concept of parallel recursive and adaptive filters
Gain the idea of scaling and round off noise and about digital lattice filter structures
Contribute the knowledge in the design of parallel recursive and adaptive filters
Demonstrate variable description of digital filters and digital lattice filter structures
***
Department of ECE
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M. Tech:III-Semester LTPC
3 00 3
COURSE OBJECTIVES:
To learn the various limitation on MOSFETS and the alternates.
To gain knowledge on SET and Carbon nano tubes in the design of transistors
To learn the basics of molecular electronics and spintronics.
UNIT V – SPINTRONICS:
Spin Vs charge, AMR, GMR, TMR, Spin devices- Spin valves, Magnetic tunnel junctions,
Applications – memories (MRAM, STRAM), Logic device, and microwave oscillators.
REFERENCES:
COURSE OUTCOMES:
After completing this course the students should be able to:
Understand the fundamental function of cells, and how nanotechnologies interact &
Describe the various applications of nanotechnology in biotechnology & [Link]
cells.
Explain the process of self-assembly – from single molecules into nanoparticles
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Describe and explain how nanoparticles are fabricated and characterized & principles of
loading small molecule drugs, proteins or nucleic acids (DNA/RNA) into nanoparticles
Describe and explain the scientific basis and medical benefits for using nanotechnology
for treating diseases
Demonstrate how nanotechnology-based innovation can drive better medicine and a
stronger economy
***
Department of ECE
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Department of ECE
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***
VAAGDEVI COLLEGE OF ENGINEERING
(AUTONOMOUS)
M. Tech:III-Semester LTPC
3 00 3
COURSE OBJECTIVES:
To understand the concepts of soft computing techniques.
To enable to develop applications of soft computing in real life problems.
REFERENCE BOOKS:
Department of ECE
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COURSE OUTCOMES:
After completing this course the students should be able to:
Understand important and unique engineering issues at microwave and millimeter wave
frequency
Learn microwave network theory and the use of scattering matrix
Learn design criteria for waveguide and coaxial microwave components.
Learn the application of these components in the design of useful systems such as radars,
receivers, etc.
Work in small teams and design, fabricate and test a useful microwave component or
device, which may be designed using microstripline technology.
***
Department of ECE
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UNIT –V STATISTICS:
Tchebyshev’s inequality – Maximum likelihood estimation- correlationpartial correlation-
multiple correlations- regression- Multiple regressions.
REFERENCES:
1. S C Gupta, V K Kapoor,” Fundamentals of Mathematical statistics”, Sultan Chand &
sons, 2002.
2. Narsngh Dev, “Graph theory with applications to engineering and computer science”,
Prentice Hall of IndiaLtd, 1998.
3. Hoffmann and Kunze,” Linear algebra”, PHI, 1994.
4. Rao S.S , “ Engineering optimization : Theory and practice”, New age International Pvt.
Ltd, 3rd edition ,1998.
COURSE OUTCOMES:
After completing this course the students should be able to:
Understand the concepts of probability & statics
Identify the strength and weakness of different theories
Design and employ appropriate method for solving computing problems
Analyze and compare the methods.
Solve computing problems independently.
***
Department of ECE
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References:
1. George Techobanoglous et al,”Integrated Solid Waste Management” McGraw - Hill,
1993.
2. Techobanoglous Thiesen Ellasen; Solid Waste Engineering Principles and Management,
McGraw - Hill 1997.
3. [Link] and [Link],” Municipal Solid Wastes-Problems & Solutions” ,Lewis,
1997.
4. Manual on Municipal 1 Solid waste Management, CPHEEO, Ministry of Urban
Development, Govt. Of. India, New Delhi, 2000. 5) Blide A.D.& Sundaresan, B.B,”Solid
Waste Management in Developing Countries”, INSDOC, 1993.
Department of ECE
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[Link]-VLSI System Design R18 Regulations
5. Ecology Science and Practice; Claude Fourie, Christian Ferra, Paul Medori, Tean
Devaux, Oxford and IBH Publishing Co (Pvt) LTD, special Indian edition.
COURSE OUTCOMES:
Understand how waste management practices protect environmental health and safety.
Apply physical and chemical analysis on municipal solid wastes
Enhance the route for solid waste collection and transport system.
Develop a method to use energy from solid wastes
Explain different methods of disposal of hazardous solid waste
Department of ECE
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[Link]-VLSI System Design R18 Regulations
(M18VL25)DISSERTATION PHASE - I
M. Tech:III-Semester 1. LTPC
0 0 20 10
COURSE OUTCOMES:
In Master’s Project Phase-I, the students should select a recent topic from a reputed
International Journal, preferably IEEE, ACM, Springer in the field that has direct or indirect
relation to the area of specialization.
After conducting a detailed literature survey, they should compare and analyze research work
done and review recent developments in the area and prepare an initial design of the work to
be carried out as Master’s Project.
It is mandatory that the students should refer National and International Journals and
conference proceedings while selecting a topic for their Project.
Emphasis should be given for introduction to the topic, literature survey, and scope of the
proposed work along with some preliminary work carried out on the Project topic.
Students should submit a copy of Phase-I Project report covering the content discussed above
and highlighting the features of work to be carried out in Phase-II of the Project.
****
Department of ECE
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(M18VL26)DISSERTATION PHASE - II
M. Tech:IV-Semester 1. LTPC
0 0 32 16
COURSE OUTCOMES:
Use Specialized knowledge and skills in engineering and apply it effectively on a project.
Apply knowledge of the ‘real world’ situations that a professional engineer can
encounter.
Apply critical and creative thinking in the design of VLSI System Design projects.
Demonstrate a sound technical knowledge of selected project topic.
Demonstrate the skills and attitude of a professional engineer.
Summarize an appropriate list of literature review, analyse previous work and relate them
to current project.
Deliver technical seminar based on the Project work carried out.
Publish the conducted research work in a National / International Conference or Journal
preferably IEEE, ACM, Springer and Scopus indexed/SC Indexed/ESCI.
Department of ECE
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