Basic Electronics - JFET - Tutorialspoint
Basic Electronics - JFET - Tutorialspoint
The JFET is abbreviated as Junction Field Effect Transistor. JFET is just like a normal FET. The
types of JFET are n-channel FET and P-channel FET. A p-type material is added to the n-type
substrate in n-channel FET, whereas an n-type material is added to the ptype substrate in p-
channel FET. Hence it is enough to discuss one type of FET to understand both.
N-Channel FET
The N-channel FET is the mostly used Field Effect Transistor. For the fabrication of Nchannel FET,
a narrow bar of N-type semiconductor is taken on which P-type material is formed by diffusion on
the opposite sides. These two sides are joined to draw a single connection for gate terminal. This
can be understood from the following figure.
is called as a channel. The majority carriers pass through this channel. Hence the cross sectional
form of the FET is understood as the following figure.
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Ohmic contacts are made at the two ends of the n-type semiconductor bar, which form the source
and the drain. The source and the drain terminals may be interchanged.
Before going into the operation of the FET one should understand how the depletion layers are
formed. For this, let us suppose that the voltage at gate terminal say VGG is reverse biased while
the voltage at drain terminal say VDD is not applied. Let this be the case 1.
In case 1, When VGG is reverse biased and VDD is not applied, the depletion regions
between P and N layers tend to expand. This happens as the negative voltage applied,
attracts the holes from the p-type layer towards the gate terminal.
In case 2, When VDD is applied
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applied, the electrons flow from source to drain which constitute the drain current ID.
Let us now consider the following figure, to understand what happens when both the supplies are
given.
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The supply at gate terminal makes the depletion layer grow and the voltage at drain terminal allows
the drain current from source to drain terminal. Suppose the point at source terminal is B and the
point at drain terminal is A, then the resistance of the channel will be such that the voltage drop at
the terminal A is greater than the voltage drop at the terminal B. Which means,
VA>VB
Hence the voltage drop is being progressive through the length of the channel. So, the reverse
biasing effect is stronger at drain terminal than at the source terminal. This is why the depletion
layer tends to penetrate more into the channel at point A than at point B, when both VGG and VDD
are applied. The following figure explains this.
Now that we have understood the behavior of FET, let us go through the real operation of FET.
As the width of depletion layer plays an important role in the operation of FET, the name depletion
mode of operation implies. We have another mode called enhancement mode of operation, which
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will be discussed in the operation of MOSFETs. But JFETs have only depletion mode of
operation.
Let us consider that there is no potential applied between gate and source terminals and a potential
VDD is applied between drain and source. Now, a current ID flows from drain to source terminal, at
its maximum as the channel width is more. Let the voltage applied between gate and source
terminal VGG is reverse biased. This increases the depletion width, as discussed above. As the
layers grow, the cross-section of the channel decreases and hence the drain current ID also
decreases.
When this drain current is further increased, a stage occurs where both the depletion layers touch
each other, and prevent the current ID flow. This is clearly shown in the following figure.
The voltage at which both these depletion layers literally “touch” is called as “Pinch off voltage”. It
is indicated as VP. The drain current is literally nil at this point. Hence the drain current is a function
of reverse bias voltage at gate.
Since gate voltage controls the drain current, FET is called as the voltage controlled device. This
is more clearly understood from the drain characteristics curve.
Let us try to summarize the function of FET through which we can obtain the characteristic curve
for drain of FET. The circuit of FET to obtain these characteristics is given below.
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When the voltage between gate and source VGS is zero, or they are shorted, the current ID from
source to drain is also nil as there is no VDS applied. As the voltage between drain and source VDS
is increased, the current flow ID from source to drain increases. This increase in current is linear up
to a certain point A, known as Knee Voltage.
The gate terminals will be under reverse biased condition and as ID increases, the depletion
regions tend to constrict. This constriction is unequal in length making these regions come closer at
drain and farther at drain, which leads to pinch off voltage. The pinch off voltage is defined as the
minimum drain to source voltage where the drain current approaches a constant value
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denoted as B.
As VDS is further increased, the channel resistance also increases in such a way that ID practically
remains constant. The region BC is known as saturation region or amplifier region. All these
along with the points A, B and C are plotted in the graph below.
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The drain characteristics are plotted for drain current ID against drain source voltage VDS for
different values of gate source voltage VGS. The overall drain characteristics for such various input
voltages is as given under.
As the negative gate voltage controls the drain current, FET is called as a Voltage controlled
device. The drain characteristics indicate the performance of a FET. The drain characteristics
plotted above are used to obtain the values of Drain resistance, Transconductance and
Amplification Factor.
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