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10 Steps To LF Array Rework

The document outlines 10 steps for lead-free array package rework. Lead-free soldering requires higher temperatures that can damage delicate components, so rework stations must have precise thermal profiling and control. Key steps include establishing accurate thermal profiles with extra ramping zones, ensuring temperature differences of less than 5°C, and training operators on the different appearance of lead-free solder joints during inspection. Precise rework systems with closed-loop control of temperature profiles are needed to achieve high quality, low-cost lead-free array package rework.

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dilipjrane
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39 views

10 Steps To LF Array Rework

The document outlines 10 steps for lead-free array package rework. Lead-free soldering requires higher temperatures that can damage delicate components, so rework stations must have precise thermal profiling and control. Key steps include establishing accurate thermal profiles with extra ramping zones, ensuring temperature differences of less than 5°C, and training operators on the different appearance of lead-free solder joints during inspection. Precise rework systems with closed-loop control of temperature profiles are needed to achieve high quality, low-cost lead-free array package rework.

Uploaded by

dilipjrane
Copyright
© Attribution Non-Commercial (BY-NC)
Available Formats
Download as PDF, TXT or read online on Scribd
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10 steps to lead-free array package rework

The higher temperatures of lead-free soldering, combined with the more delicate
nature of array package components, means that suitable rework stations must
feature excellent profiling and tolerances, plus offer easy calibration if thermal
damage is to be avoided and optimum results achieved.

1. Time, cost, quality, repeatability


These are the primary concerns of the repair and rework cycle: too much time means
excess cost, while poor quality has never been acceptable and repeatability requires
good process control. But the ability to duplicate precise heating profiles from
operator to operator, facility to facility and country to country underlies the entire
repair and rework process, and feeding back in to the time, cost and quality equation.
Today's manufacturers have to deal with small, sensitive array packages with
complex profiles and hundreds of connections that can only be seen with
sophisticated vision systems. Operator turnover is also often high; yet, conversely,
experience with array packages is essential if time and quality goals are to be
achieved. Now with lead-free solders as an added variable, reflow temperatures are
higher, time above the higher reflow temperatures are different, appearance of the
joint is considerably different, and the need for process control is even greater than
for eutectic solders. But with the right thermal profiles, equipment and knowledge, it
is still possible to reach the time, cost and quality goals with array packages and
lead-free solder.

2. The basic steps


Reworking array package components using lead-free solder follows similar steps to
leaded components with eutectic solder: establish the thermal profile, remove the
failed component, clean and prepare the site, place a new component with flux or
solder paste, reflow, and inspect. But forget the soldering iron for these devices, as
convection, not radiation, is the heating method of choice, as in the assembly
process, allowing the greater process control without this repeatability is impossible.

3. Solder Paste Compositions


Different lead-free compositions exist and these will be fine-tuned as time and
processes mature. The most common are based on tin alloyed with small amounts of
silver, copper or bismuth, with melting points in the range 206-221°C. Solder peak
temperatures are higher 217°C to 235°C.

4. The lead-free temperature squeeze


The operating window for lead-free is being squeezed by component suppliers and
solder manufacturers. The maximum solder temperature peaks around 235°C, but
the component suppliers' maximum temperature is 265°C, with most ranging from
240 to 250°C – and these are very close to the 225-233°C soldering temperature.
The time above reflow is also reduced from 60-90 seconds for eutectic tin-lead solder
down to 15-30 seconds for lead-free. So rework systems must be capable of ramping
up and down very fast to achieve this small temperature peak.

5. Thermal profiling
Using convection makes it easier to establish a repeatable thermal profile that won’t
overheat the package or hold it above reflow for too long. Establishing the ideal
profile takes experience, patience and knowledge of lead-free. In addition to the
standard pre-heat, soak and reflow (plus cool down) zones, lead-free demands an
extra ramp zone and more precise heating control.

6. Extra heating required


The higher temperatures needed for lead-free, coupled with the thermal sensitivity of
BGAs and CSPs, demands precise temperature and the addition of a ramp stage
where temperatures rise at a rate that will not harm packages. That’s why today’s
more sophisticated rework systems employ four heating zones and one cooling zone.
Lead-free rework is doomed without this extra step, because the higher temperature
requirements and thermal sensitivity of area arrays can be problematic without the
ability to ramp temperatures at a rate that will not harm components. Having a
controllable pre-heater allows for efficient pre-heating that avoids the thermal damage
risked when working with expensive, but sensitive, packages unsuitable for heating
above 235°C with quick reflow times.

7. Ramping up the temperature


Thermal profiles for lead-free are different from those of eutectic solder, as tolerances
are tighter and some type of repeatability and process control is required in the
rework station. A typical lead-free profile would be to pre-heat to 140°C in 100s,
followed by a soak zone below 170°C for 90s, then a ramp up to 225°C in 100s,
reflow up to 235°C for 20s and then cool down for 60 seconds. The differences
between this and a tin-lead profile are substantial, and the key is system control with
the ability to ramp up faster and cool down quicker.

8. Delta T considerations
Another factor to consider with lead-free is the temperature difference, or delta T,
across the soldering area. A delta T of 10°C is considered acceptable to produce a
good tin-lead joint, but this is halved to 5°C for lead-free, which is difficult to achieve
in practice. The second delta is vertical this is usually 10 °C from lid to solder ball,
and also the underside of the BGA this is the bottom surface of PCB under
component opposite surface of the board.

Delta Measurements across


the surface of the
BGA components used to be 10°C
but lead-free requires 5 °C.
9. Accurate control
The wetting process and temperature profiles must be controlled to make sure the
resulting joints are strong and not brittle. Improved heating regulation and faster
ramp-up are needed with lead-free – particularly in the under-board heater, which
means that hot plates should not be used. Temperatures must be high enough to
melt and form intermetallics, activate flux and optimise wetting, yet low enough to
avoid damaging the PCB and component.

10. Inspection
Lead-free solder joints look grainy compared to traditional soldering and
inexperienced operators often reject them for quality reasons. When lead-free is
implemented, companies must set a new standard and train operators in proper
inspection criteria. X-ray inspection works well, because joint appearance is not then
an issue, but visual systems are becoming more popular due to the expense of
X-ray. There are also some newer vision systems on the market, such as Metcal's
VPI-1000 series, that feature endoscope-like technology that can look at the top and
bottom of the solder balls to check the formation of the intermetallic joint.

Array packages and lead-free processes will continue to require post production
processes and rework is not going away anytime soon. The basic rework steps are
the same, but substantial temperature differences between eutectic and lead-free
solders mean tighter processes, better temperature profiles and the use of precise
rework systems with closed-loop process control are required if high quality, low cost
rework is to be achieved.

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