EVALUATION KIT AVAILABLE

MAX16840 LED Driver with Integrated MOSFET

for MR16 and Other 12V AC Input Lamps

General Description Benefits and Features

The MAX16840 is an LED driver IC for lighting applica- ●● Cost-Effective Solution for MR16 and Other SSL
tions. It includes all the necessary features to design low- Applications
component-count LED drivers for 12V AC and 24V AC • Proprietary Input Current-Control Scheme to
input (e.g., MR16) light bulbs. A proprietary input-current Achieve Electronic Transformer Compatibility
control scheme allows LED lamps based on this device and Dimmability
to be compatible with electronic transformers, and dim- • Buck, Boost, SEPIC, and Buck-Boost
mable with standard trailing-edge dimmers (where elec- Topologies
tronic transformers are present). • Analog Dimming
The IC can be used in buck, boost, and buck-boost ●● Minimal Component Count Saves Cost and Space
topologies and features. It has an integrated 0.2I (max), • Integrated 0.2Ω (max) 48V Switching MOSFET
48V switching MOSFET. ●● Protection Features and Wide Operating Temperature
The IC uses constant-frequency average current-mode Range Improves Reliability
control. It senses the input current through the voltage • Thermal-Foldback Protection
at the FB pin, and regulates its average. An input pin • Output Overvoltage Protection
(REFI) allows the setting of the input-current level. When • Internal Overtemperature Protection
the voltage at this pin is set below a certain threshold, the • Available in a 10-Pin Thermally Enhanced TDFN
input current is proportional to this voltage, while when Package
that voltage is beyond the threshold, the input current is • Operation Over -40°C to +125°C Temperature
set at a fixed, predefined level. This nonlinear behavior of Range
REFI allows its use to achieve thermal foldback, by con-
necting it to an NTC resistor. Ordering Information
The IC also features an internal overvoltage protection on PART TEMP RANGE PIN-PACKAGE
the IN pin to protect the internal switching MOSFET from MAX16840ATB+ -40NC to +125NC 10 TDFN-EP*
damage if the LED string is open or if the voltage on the +Denotes a lead(Pb)-free/RoHS-compliant package.
LED string is too high. *EP = Exposed pad.
The IC has a separate EXT pin that can be used to guar-
antee that there is a kick-start of current at turn-on for low-
input voltages for proper operation with electronic trans-
Typical Operating Circuit
formers. EXT drives an external npn transistor. Once the
UVLO threshold of 5.5V is crossed on IN, EXT is pulled LED-
to ground and the external npn transistor is turned off. L2 D1 C2
LED+
The IC is available in a 3mm x 3mm, 10-pin TDFN power
package, and is rated over the -40NC to +125NC operat- R3 DRAIN
L1 BD1
ing temperature range. REFI IN

MAX16840
12V AC C1 EXT
Applications
COMP SOURCE
MR16 and Other 12V AC or DC Input LED
C4 FB
Lighting Applications GND
R1
R2

19-5671; Rev 4; 1/15

MAX16840 LED Driver with Integrated MOSFET
for MR16 and Other 12V AC Input Lamps

Absolute Maximum Ratings

IN, DRAIN to GND..................................................... -0.3V, +52V Any Pin to Any Pin ESD Rating................................ ±2kV (HBM)
EXT, COMP, REFI to GND........................................ -0.3V, +6.0V Operating Temperature Range......................... -40NC to +125NC
FB, SOURCE to GND............................................... -0.3V, +1.5V Maximum Junction Temperature......................................+150NC
Maximum RMS Current, FB, SOURCE to GND.....................0.8A Storage Temperature Range............................. -65NC to +150NC
Maximum RMS Current Through DRAIN and SOURCE....... Q2A Lead Temperature (soldering, 10s).................................+300NC
Continuous Power Dissipation (TA = +70NC) Soldering Temperature (reflow).......................................+260NC
TDFN (derate 24.4mW/NC above +70NC)...................1951mW

Package Thermal Characteristics (Note 1)

TDFN
Junction-to-Ambient Thermal Resistance (BJA).......... 41NC/W
Junction-to-Case Thermal Resistance (BJC)................. 9NC/W
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional opera-
tion of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.

Electrical Characteristics
(VIN = 12V; VEXT = VSOURCE = VFB = VGND = 0V; COMP, REFI, and DRAIN = open; TA = TJ = -40NC to +125NC, unless otherwise
noted. Typical values are at TA = +25NC.) (Note 2)

PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS

Operating Voltage Range VIN   6.5 48 V
When MOSFET fully on 1 2
IN Supply Current IIN When MOSFET switching, VCOMP = 2V, mA
1.5 3
drain to 5V through 50I 
Undervoltage Lockout UVLOIN IN rising 5 5.6 6.1 V
UVLO Hysteresis   200 mV
Overvoltage Protection on IN VOVP IN rising 43.6 46 48 V
OVP Hysteresis 1.2 V
Switching Frequency 270 300 330 kHz
Ramp P-P Voltage   2 V
TA = +25NC 196 200 204
FB Average Voltage mV
-40°C P TA P +125NC 190 210
Transconductance gm   550 FS
No-Load Gain A   75 dB
COMP Sink Current ISINK VCOMP = 2V, VFB = 0.65V 150 250 350 FA
COMP Source Current ISOURCE VCOMP = 2V, VFB = 0V 70 115 160 FA
Power Switch On-Resistance RDSON IDS = 1A 0.1 0.2 I
Switch Leakage Current ILEAK VDRAIN = 48V, VCOMP = 0V 25 FA
DRAIN Rise Time tRDRAIN IDS = 1A 10 ns
DRAIN Fall Time tFDRAIN IDS = 1A 10 ns
SOURCE Limit Threshold VSOURCETH SOURCE connected to FB 0.66 0.72 0.78 V

www.maximintegrated.com Maxim Integrated │  2

MAX16840 LED Driver with Integrated MOSFET
for MR16 and Other 12V AC Input Lamps

Electrical Characteristics (continued)

(VIN = 12V; VEXT = VSOURCE = VFB = VGND = 0V; COMP, REFI, and DRAIN = open; TA = TJ = -40NC to +125NC, unless otherwise
noted. Typical values are at TA = +25NC.) (Note 2)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
SOURCE Current-Limit
25 ns
Comparator Propagation Delay
FB Input Bias Current IFB VFB = 0V and VFB = 0.3V -1 +1 FA
FB Current-Limit Comparator
  50 ns
Leading-Edge Blanking
REFI Source Current VREFI = 1.224V 47.5 50 52.5 FA
Foldback Kick in Threshold Falling on REFI 1.135 1.2 1.255 V
VREFI = 1.15V 178 189 201
FB Average Voltage During
VREFI = 1V 153 164.5 176 mV
Foldback
VREFI = 0.8V 120 132 143
FB Average Voltage to REFI
VREFI = 1V 6.075
Gain
EXT Drive Current VIN = 2V, VEXT = 1V 12.5 40 mA
EXT Pulldown Resistance 5 10 20 kI
Thermal-Shutdown Temperature Temperature rising 165 NC
Thermal Shutdown Hysteresis   15 NC
Note 2: All devices are 100% tested at TA = TJ = +25NC. Limits over temperature are guaranteed by design.

www.maximintegrated.com Maxim Integrated │  3

MAX16840 LED Driver with Integrated MOSFET
for MR16 and Other 12V AC Input Lamps

Typical Operating Characteristics

(TA = +25°C, unless otherwise noted.)

VFB vs. DUTY CYCLE FOR BUCK-BOOST IQ vs. TEMPERATURE IQ vs. VIN
210 1.6 2.0

MAX16840 toc03
MAX16840 toc02
MAX16840 toc01
1.4
200
1.2 1.5
190
1.0
VFB (mV)

IQ (mA)
IQ (mA)

180 0.8 1.0

0.6
170
0.4 0.5
160
0.2

150 0 0
30 40 50 60 70 80 90 100 10 35 60 85 110 5 10 15 20 25 30 35 40 45 50
DUTY CYCLE (%) TEMPERATURE (°C) VIN (V)

OSCILLATOR FREQUENCY
vs. TEMPERATURE ULVOIN vs. TEMPERATURE
300 5.8

MAX16840 toc05
MAX16840 toc04

5.7
250
5.6
VIN RISING AND FALLING

200
5.5
fSW (kHz)

150 5.4

5.3
100
5.2 VIN RISING
50 VIN FALLING
5.1

0 5.0
10 35 60 85 110 10 35 60 85 110
TEMPERATURE (°C) TEMPERATURE (°C)

VFB vs. TEMPERATURE-

COMPATIBILITY MODE VFB vs. VREFI
200 250
MAX16840 toc06

MAX16840 toc07

195
190 200
185
180 150
VFB (mV)

VFB (mV)

175
170 100
165
160 50
155
150 0
10 35 60 85 110 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6
TEMPERATURE (°C) VREFI (V)

www.maximintegrated.com Maxim Integrated │  4

MAX16840 LED Driver with Integrated MOSFET
for MR16 and Other 12V AC Input Lamps

Pin Configuration

TOP VIEW

DRAIN 1 + 10 SOURCE

DRAIN 2 9 SOURCE

IN 3 MAX16840 8 FB

EXT 4 7 GND

EP
COMP 5 6 REFI

TDFN

Pin Description
PIN NAME FUNCTION
1, 2 DRAIN Drain of the Internal Switching MOSFET
Input. Connect to LED string anode in boost and buck-boost configuration to get OVP protection
3 IN during open LED. Bypass it with a sufficient capacitor not to allow IN to go below 6.5V in buck
applications.
4 EXT Base Drive for External Bipolar Until Internal Driver Starts Switching for the First Time After Power-Up
Compensation Component Connection for the Switching Stage. Connect a suitable RC network to
5 COMP
ground. This is the output of the gm amplifier
Analog Dimming and Thermal Foldback. The IC sources 50µA current out of this pin. Whenever this
pin voltage is > 1.2V, the FB voltage is regulated to internal 200mV reference. Whenever this pin
6 REFI
voltage < 1.2V, the FB voltage is regulated to VREFI/6. Leave this pin unconnected to disable this
foldback feature.
7 GND Ground
Current-Sense. This pin includes a 5kI/4pF RC filter at its input to average the current information
8 FB
over the switching cycle. Connect this pin directly to SOURCE.
9, 10 SOURCE Source of the Internal Switching MOSFET
Exposed Pad. Connect EP to the ground plane for heatsinking. Do not use the EP as the only
— EP
electrical connection to ground.

www.maximintegrated.com Maxim Integrated │  5

MAX16840 LED Driver with Integrated MOSFET
for MR16 and Other 12V AC Input Lamps

Functional Diagram

IN

200mV I0
IN
1/6 I1
5V
LDO + POK
BG UVLO
1.2V S BANDGAP
5V
50µA
EXT
REFI 5kI gm
PWMC
DRAIN
4pF

COMP 0.65V
2VP-P DRIVER

CSLIMIT

OSCILLATOR SOURCE

GND
50ns
FB
BLANKING
IN
BG
OVP

MAX16840

Detailed Description The switch current is sensed on FB. The voltage on FB

The MAX16840 is an average current-mode control LED goes through an RC filter as shown in the Functional
driver IC for buck, boost, and buck-boost topologies in Diagram. This voltage is then fed to the negative input
low-voltage SSL applications. The IC has an integrated of a transconductance amplifier. The positive input of
0.2I (max), 48V switching MOSFET that allows the the gm amplifier is the programmed input current level.
device to be used in lighting applications for MR16 and The output voltage of the gm amplifier is compared with
other SSL applications. The LED driver uses constant- a ramp at the switching frequency to set the duty cycle.
frequency average current-mode control to control the The switching frequency is set at 300kHz. The average
duty cycle of the integrated switching MOSFET. The IC current-mode controller inside the IC regulates the input
has all the necessary features required for MR16 lighting current. The IC also features an internal overvoltage
applications using LEDs. The IC uses an input-current protection of 46V on IN to protect the internal switching
control scheme to achieve power factor correction. This MOSFET from damage if the LED string is open or if the
feature allows the IC to be compatible with electronic voltage on the LED string is too high.
transformers and dimmable with trailing-edge (for elec-
tronic transformers).

www.maximintegrated.com Maxim Integrated │  6

MAX16840 LED Driver with Integrated MOSFET
for MR16 and Other 12V AC Input Lamps

The IC has a control pin, REFI, to program the input External BJT Driver (EXT)
current. The IC regulates the average voltage on FB to EXT is a separate driver for an external npn transistor
200mV if REFI is left open. A control voltage on REFI can that is used to drive an external resistive load when the
be used to control the input current. The average voltage input voltage on IN is below the UVLO. This is useful for
on FB is regulated to VREFI/6, where VREFI is the voltage operation with electronic transformers at low-input volt-
on REFI. The linear control of the FB voltage ceases once ages. The minimum current capability of this pin is 20mA.
the voltage on REFI exceeds 1.2V. Once the voltage
increases beyond 1.2V, the voltage on FB is regulated Internal Switching MOSFET
to 200mV. REFI has an internal current source of 50FA The IC has an integrated switching MOSFET with a maxi-
and the voltage on REFI can also be set with a resistor to mum RDSON of 0.2I at +125NC. The typical RDSON at
ground on REFI. This pin can also be used with an NTC +25NC is 0.1I. This allows the IC to be used in a boost
resistor on the pin to achieve thermal foldback. LED driver for power levels up to 20W and for buck-boost
applications in MR16s for power levels up to 7W. The
The IC has a separate EXT pin that can be used to guar-
maximum voltage rating of the MOSFET is 48V opera-
antee that there is a kick-start of current at turn-on for
tion. The drain of the internal MOSFET is connected to
low-input voltages for proper operation with electronic
the DRAIN pin and the source of the internal MOSFET is
transformers. EXT drives an external npn transistor. Once
connected to the SOURCE pin.
the regulator MOSFET switches for the first time, after the
IN voltage has passed the 5.5V UVLO threshold, EXT is Current Sense (FB)
pulled to ground and the external npn transistor is turned The source of the internal MOSFET is connected to
off. SOURCE, so a current-sense resistor must be connected
Internal Oscillator between SOURCE and ground and the current informa-
tion is read by FB, so SOURCE must be connected to FB.
The IC has an internal oscillator with a fixed switching
The set point of the current is determined by REFI. If REFI
frequency of 300kHz.
is left open, the average current-sense voltage on FB is
Input Voltage (IN) regulated by the IC’s control loop to 200mV. There is a
The IC is powered by the voltage on IN. The operat- separate peak-limit comparator that terminates switching
ing voltage range on IN is from 6.5V to 48V. An internal every cycle if the voltage on FB exceeds 650mV. This
UVLO is set at 5.6V. Below 5.4V, there is no switching comparator has a leading-edge blanking time of 50ns.
of the internal power MOSFET and the gate driver for Control Loop
the MOSFET is low. The typical hysteresis of the UVLO
The IC uses an average current-mode control scheme
threshold is 200mV. There is an internal LDO of 5V that is
to regulate the input current (Figure 1). The control loop
used to power all the internal circuitry and the gate driver
regulates the average voltage on FB. An internal RC filter
for the internal switching MOSFET. An internal overvolt-
removes current spikes appearing on this pin. Additional
age protection on IN stops switching once the voltage on
filtering can be added if necessary. The current-regula-
IN exceeds 46V. The switching of the internal MOSFET
tion loop consists of the current-sense resistor RCS, the
ceases once the rising voltage on IN exceeds 46V and
RC filter shown in Figure 1, the transconductance error
stays off until the voltage on IN drops by 1.2V from the
amplifier (gm), an oscillator providing the 300kHz ramp,
OVP threshold of 46V.
the control voltage on the positive input of the gm ampli-
fier, and the PWM comparator (PWMC).

www.maximintegrated.com Maxim Integrated │  7

MAX16840 LED Driver with Integrated MOSFET
for MR16 and Other 12V AC Input Lamps

L1 LED+
INPUT

COMP
MAX16840
CONTROL
RCF VOLTAGE

CP CZ gm

PWMC DRIVER

2VP-P SOURCE
5kI FB

10pF RCS

Figure 1. Control Loop

Peak-Limit Comparator Current-Reference Input (REFI)

The IC has a peak-limit comparator that limits the peak The IC has a current-reference input (REFI). For VREFI >
current in the switching MOSFET. If the current-sense 1.2V, an internal reference sets the input average current
voltage on FB exceeds 0.65V, the peak-limit comparator to 200mV/RCS. For VREFI < 1.2V, the input current is
terminates switching for that switching cycle. This limits reduced proportionally to VREFI, and it can be reduced
the peak current in the switching MOSFET and the induc- down to zero. The maximum withstand voltage of this
tor during transients. input is 6V. REFI has an internal current source of 50FA,
and the voltage on REFI can also be set with a resistor to
PWM Comparator ground on REFI. This pin can also be used with an NTC
The PWM comparator (PWMC) determines the on-time of resistor on the pin to achieve thermal foldback.
the switching MOSFET on a cycle-by-cycle basis by com-
paring the output of the gm amplifier to a 2VP-P ramp sig-
nal. At the start of each clock cycle, an RS flip-flop resets
and the gate driver turns on the switching MOSFET. The
comparator sets the flip-flop as soon as the ramp signal
exceeds the COMP voltage, thus terminating the on cycle.

www.maximintegrated.com Maxim Integrated │  8

MAX16840 LED Driver with Integrated MOSFET
for MR16 and Other 12V AC Input Lamps

L2 D1 LED+

R3 DRAIN
L1 BD1 REFI IN

MAX16840 C3
12V AC C1 EXT

LED-
COMP SOURCE
C4
FB
GND
R1
R2

Figure 2. Boost LED Driver

Applications information peak current in the inductor occurs at the peak of the
highest input voltage. The P-P ripple at this input voltage
Boost Configuration
is ∆IL. The highest input voltage is 13.2V AC, which is
In MR16 and other 12V AC input applications, the boost 10% higher than the typical value.
configuration is used when the LED string voltage
exceeds 18V. This means that, in general, if the number The peak current in the inductor is:
of LEDs in series in the application is greater than or IPK = IIN + 0.5∆IL
equal to 6 LEDs, the IC can be used in the boost con- The output voltage of the LED string is given by VLED. As
figuration to provide the best efficiency. Figure 2 shows a a first-order approximation, the LED voltage is assumed
boost MR16 application. The number of LEDs can range constant. The duty cycle at the peak of the input voltage
from 6 to 10 LEDs. The maximum voltage across the LED is therefore:
string should not exceed 40V. 13.2V × 2 18.66V
In the boost configuration, the current in the inductor is D MIN =1− =1−
VLED VLED
the same as the current in the current-sense resistor R1.
The percentage P-P ripple is typically selected in the 30%
Resistor (R1) to 60% range of the maximum input current. Assuming a
The current in resistor R1 is the same as the current in 60% P-P inductor-current ripple, the maximum inductor
inductor L2. If the desired maximum output power with current is given by:
12V AC at 50Hz or 60Hz is POUT, the input power PIN
IPK = 1.3IINMAX
is given:
The minimum inductor value is given by:
PIN = POUT/n
where n is the efficiency. The input current is given by: 18.66V × D MIN
L MIN =
IIN = PIN/10.8V 0.6IINMAX × 300kHz
Resistor R1 is then given by: where the switching frequency is 300kHz. The saturation
R1 = 0.2V/IIN current of the inductor should be higher than P-P and the
minimum value of the inductor at IP-P should exceed LMIN.
where R1 is in ohms and IIN is in amps.
The temperature of the inductor can be in the +90NC to
Boost Inductor (L2) +100NC range in the application and the losses should
For optimum efficiency, the boost inductor must be oper- be estimated at these elevated temperatures.
ating in continuous-conduction mode. The maximum

www.maximintegrated.com Maxim Integrated │  9

MAX16840 LED Driver with Integrated MOSFET
for MR16 and Other 12V AC Input Lamps

Boost Diode (D1) Buck-Boost Configuration

A Schottky diode must be used as rectifier diode D1 to In MR16 applications, the buck-boost configuration is
reduce power dissipation. The voltage rating of diode used when the number of LEDs is in the 3-to-5 LED
D1 must be greater than the maximum output voltage. range. Figure 3 shows the schematic of a buck-boost
Choose a diode that minimizes dissipation at tempera- LED driver. The maximum voltage on LED+ should not
tures in the +90N to +100NC range. The diode should be exceed 40V.
selected to minimize reverse leakage at the maximum
output voltage while minimizing forward losses when the
Resistor (R1)
diode is conducting. If the desired maximum output power with 12V AC at
50Hz or 60Hz is POUT, the input power PIN is given:
Loop Compensation (R2, C4)
PIN = POUT/n
The crossover frequency of the loop must be maximized
to get the optimum performance. The maximum value of where n is the efficiency. The input current is given by:
R2 is given by: IIN = PIN/12V
2 × 300kHz × L2 The resistor R1 is then given by:
= R2 MAX in kΩ
R1× VLED × g m
R1 = 0.2V/IIN
where R1 is in ohms, VLED is in volts, gm is the transcon- where R1 is in ohms and IIN is in amps.
ductance of the error amplifier in FS, and the value of the
Buck-Boost Inductor (L2)
inductor L2 is in FH. Choose a value of R2 20% lower
than the above value. For optimum efficiency, the inductor must be operating
in continuous-conduction mode. The maximum peak
The zero from C4, R2 should be placed at: current in the inductor occurs at the peak of the highest
R1× VLED × g m × R2 input voltage. The P-P ripple at this input voltage is DIL.
fz = The maximum input current occurs at the highest input
12V × π × L
voltage. Typically, the highest input voltage is 13.2V AC,
Therefore, C4 is given by: which is 10% higher than the typical value.
1 The peak current in the inductor is:
C4 =
2 × π × fz × R2 IPK = IINDMIN + 0.5∆IL

LED-

L2 D1 C2
LED+

R3 DRAIN
L1 BD1 REFI IN

MAX16840
12V AC C1 EXT

COMP SOURCE

C4 FB
GND
R1
R2

Figure 3. Buck-Boost LED Driver

www.maximintegrated.com Maxim Integrated │  10

MAX16840 LED Driver with Integrated MOSFET
for MR16 and Other 12V AC Input Lamps

The output voltage of the LED string is given by VLED. As Output Diode (D1)
a first-order approximation, the LED voltage is assumed A Schottky diode must be used as rectifier diode D1 to
constant. The duty cycle at the peak of the input voltage reduce power dissipation. The voltage rating of diode D1
is, therefore: must be greater than the maximum peak input voltage
13.2V × 2 18.66V plus the maximum output voltage. Choose a diode that
D MIN = 1− =1−
VLED + 13.2V × 2 VLED + 18.66V minimizes dissipation at temperatures in the +90NC to
+100NC range. The diode should be selected to minimize
The percentage P-P ripple is typically selected in the 30% reverse leakage at the maximum output voltage while
to 60% range of the maximum input current. Assuming a minimizing forward losses when the diode is conducting.
60% P-P inductor-current ripple, the maximum inductor
current is given by:
IP-P = 1.3IIN
Package Information
For the latest package outline information and land patterns (foot-
The minimum inductor value is given by: prints), go to www.maximintegrated.com/packages. Note that a
“+”, “#”, or “-” in the package code indicates RoHS status only.
18.66V × D MIN 2 Package drawings may show a different suffix character, but the
L MIN =
0.6IIN × 300kHz drawing pertains to the package regardless of RoHS status.

where the switching frequency is 300kHz. The saturation PACKAGE PACKAGE OUTLINE LAND
current of the inductor should be higher than IP-P and the TYPE CODE NO. PATTERN NO.
minimum value of the inductor at IP-P should exceed LMIN. 10 TDFN-EP T1033+1 21-0137 90-0003

www.maximintegrated.com Maxim Integrated │  11

MAX16840 LED Driver with Integrated MOSFET
for MR16 and Other 12V AC Input Lamps

Revision History
REVISION REVISION PAGES
DESCRIPTION
NUMBER DATE CHANGED
0 12/10 Initial release —
1 2/11 Changed minimum temperature to -40°C 1, 2, 3, 8
2 5/11 Added missing dots in Typical Operating Circuit and Figure 3 1, 10
Added missing dots in Typical Operating Circuit and Figure 3 and updated PWMC
3 8/11 1, 8, 10
block in Figure 1
4 1 Updated Benefits and Features section 1

For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642, or visit Maxim Integrated’s website at www.maximintegrated.com.

Maxim Integrated cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim Integrated product. No circuit patent licenses
are implied. Maxim Integrated reserves the right to change the circuitry and specifications without notice at any time. The parametric values (min and max limits)
shown in the Electrical Characteristics table are guaranteed. Other parametric values quoted in this data sheet are provided for guidance.

Maxim Integrated and the Maxim Integrated logo are trademarks of Maxim Integrated Products, Inc. ©  2015 Maxim Integrated Products, Inc. │  12