Energy saving in semiconductor manufacturing as design goal

Carlo Luijten
System Engineering

Veldhoven, 5 February 2020

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A personal anecdote…
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Slide 2

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Important graph from October 2018 IPCC report
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Global warming relative to 1850-1900 average Slide 3

Further illustration:
https://www.youtube.com/
watch?v=sWik9jZ2tIw

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Energy consumption and carbon footprint
“Corporate Quick Scan Analysis” 2010 Public
Slide 4

ASML carbon footprint consists of:

• ~1% direct operations (own emissions, mainly VHV premises), ‘scope 1’
• ~5% indirect emissions (power plants delivering electricity & heating), ‘scope 2’
• ~94% other: ‘Scope 3’ →
to be reported from 2019!

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Tool energy use dominates ASML’s carbon footprint
“Corporate Quick Scan Analysis” 2010 Public
Slide 5

ASML carbon footprint consists of:

• ~1% direct operations (own emissions, mainly VHV premises)
• ~5% indirect emissions (power plants delivering electricity & heating)
• 94% other:
• supplier manufacturing
of parts and modules,
employee commuting,
business travel
• ~80% is in-use energy
consumption of tools
(note: at time of scan,
installed base entirely
consisted of NXT; with
NXE, this figure rises)
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TSMC concerned about EUV Power Consumption
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http://english.cw.com.tw/article/article.action?id=1663
Slide 6

TSMC caused
1/3 of recent
power usage
increase of
Taiwan

In 2017, Tsmc considered building new fab in

US due to electricity constraints → update:
permission for new fab in Taiwan, provided
Tsmc will utilize 20% renewable electricity
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Overview of EUV system configuration
Schematic only Slide 8

EUV Source EUV Scanner

Mask

Optics
Drive Source
laser vessel
Wafer

= infrared (drive laser)

= EUV light (13.5 nm)

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Overview of EUV system configuration
Fab layout

Lithography
FAB

Sub FAB
Drive Laser Drive Laser Drive Laser

Utility FAB Vacuum Cooling Vacuum Cooling Vacuum Cooling

pumps pumps pumps pumps pumps pumps

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The big picture of system energy flows
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Schematic energy diagram of EUV system Slide 10

Inputs:
- Electrical power
- Chemicals: H2 and CH4 (for abatement)
- Facilities: mainly cooling water, clean dry air, N2, vacuum, exhaust

Facilities Waste heat

Electrical power Useful outputs:

• EUV light
• Stage movements
Chemicals

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The big picture of system energy flows
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Indicative values for NXE:3400 Slide 11

Waste heat
Facilities (ex. PCW)
~ 8%
~ 115%
Electrical power
~ 100%

• EUV light ~ 0,03%

Chemicals
~ 8% • Stage movements ~ O(1%)
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The big picture of system energy flows
Indicative values for NXE:3400 = TEE = Total Equivalent Public
Slide 12
Electrical power in (S23)
Rejected heat
~ 25%
~ 135%

PCW Chiller
PCW heat load
Facilities
~ 8% ~~110%
1300 kW
Electrical power ~ 5%
cleanroom, exhaust
~ 100%

• EUV light ~ 0,03%

Chemicals
~ 8% • Stage movements ~ O(1%)
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Overview of EUV system configuration
Most energy going to drive laser, vacuum pumps and cooling

Lithography
FAB

Sub FAB
Drive Laser Drive Laser Drive Laser

Utility FAB Vacuum Cooling Vacuum Cooling Vacuum Cooling

pumps pumps pumps pumps pumps pumps

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EUV facility usage (block sizes are mutually to scale)
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Total equivalent energy consumption during lot production Slide 14

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EUV facility usage (block sizes are mutually to scale)
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Total equivalent energy consumption during lot production Slide 15

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EUV facility usage – examples of potential savings
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Total equivalent energy consumption and potential savings Slide 16

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 Example of potential reduction: ‘free cooling’
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Current design (typical) Slide 17

~11-18ºC 22ºC
Scanner PCW system
~10ºC
Chiller ~16ºC
~38ºC
~16ºC
~10ºC
Cooling tower Source PCW system

~11-18ºC
22ºC

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 Example of potential reduction: ‘free cooling’
Adding “free” cooling Public
Slide 18

~11-18ºC 22ºC
Scanner PCW system
~10ºC
Chiller ~16ºC
~38ºC
~16ºC
~10ºC
Cooling tower Source PCW system (cold)
~30ºC
~11-18ºC
22ºC
~32ºC Source? / PreVac? / Ecab?
35ºC ‘Hot’ PCW system Confidential
Example of potential reduction: ‘free cooling’
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NXE Fab Sites wet bulb temperatures worldwide (°C) Slide 19

http://www.city-data.com/forum/weather/1391165-highest-wet-bulb-temperatures-around-world.html
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Free cooling – Temperature level diagram
Basic level for ‘free’ (non-refrigerated) cooling: Wet Bulb temperature Public
Slide 20

‘Ground level’ dictated by weather/climate: Twet bulb = f(T,RH)

Need to look at ‘Wet Bulb’ statistics!

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 Wet Bulb temperature statistics, from ASHRAE data
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Worst case NXE locations show similar conditions Slide 21

Location A (Korea) Typical yearly statistics (worst case):

< 28ºC for 98% of time
< 29ºC for 99.6% of time
< ~32ºC 100% of time (~20 yr horizon)
Location B (Taiwan)

2%
Location C (Taiwan) 1%
0.4% ~0%

TWetBulb (C) → 28 29 32 35
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 Wet Bulb temperature statistics, from ASHRAE data
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Worst case NXE locations show similar conditions Slide 22

Location A (Korea)

Location B (Taiwan)

Location C (Taiwan)

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Free cooling – Temperature level diagram
Several margins needed on top of ‘Wet Bulb’ temperature Public
Slide 23

Indirect
users Cabinet water = Twet bulb + 8C

TPCW heat exchanger (2-4C)

Direct
Customer PCW = Twet bulb + 5C
users
TPCW heat exchanger (2-4C)
Cool tower return = Twet bulb + 3C
Tcooling tower (3-5C)
‘Ground level’ dictated by weather/climate: Twet bulb = f(T,RH) 32C
100%
Wet Bulb (C)

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Temperature level diagram
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ASML baseline: 32C PCW, indirect users on 35C Slide 24

Indirect
users Cabinet water = Twet bulb + 8C 35C

TPCW heat exchanger (2-4C)

Direct
Customer PCW = Twet bulb + 5C 32C
users
TPCW heat exchanger (2-4C)
Cool tower return = Twet bulb + 3C 30C
Tcooling tower (3-5C)
‘Ground level’ dictated by weather/climate: Twet bulb = f(T,RH) 27C
95%
Wet Bulb (C)

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‘Free cooling’ requires multiple parties to cooperate
SEMI organization is at ‘crossroads’, taking care of standardization Public
Slide 25

customers SEMI

3rd parties
ASML

suppliers

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SEMI S23 task force
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Towards a new standard (version) Slide 26

• SEMI: Semiconductor Industry Association, tasked with standardization

• S23: standard related to energy use, with guidelines on how to report

tool energy consumption. Current version dates from December 2016.
• Facility consumption is also included, via ‘Energy Conversion Factors’ (ECF)

• I joined S23 task force ~1.5 year ago, proposing two additions:
• Guidelines to implement ‘warm cooling water ‘HTPCW’ (for energy saving)
• Additional ECF’s for hydrogen and natural gas (for reporting accuracy)

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SEMI S23 task force
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Towards a new standard (version) Slide 27

• SEMI (and Task Force) membership is voluntary;

• some members are from industrial parties
• others are (sometimes retired) consultants, ‘ZZP-ers’

• Meeting structure: teleconferences, and twice a year face-to-face

• ‘Challenging’ process

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The organizational challenge…
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Slide 28

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The organizational challenge…
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Slide 29

• Broad support to put sustainability on the agenda:

• Top-down: quantitative targets, supported by increasing customer pressure
• Bottom up: many people see the need for climate action!

• Challenge for middle management levels:

• Energy saving not required from a (traditional) functional perspective:
easy victim in case priority calls needs to be made
• Financial business case often weak in (traditional) accounting

• Trend towards sustainability is clear and ASML acts on it via:

• Continuous alignment with leading customers on best way to approach it;
• Customer/supplier teams that guide product and fab infra improvements
• Sr management commitment to middle management. Company targets

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 The Balance
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Slide 30

Energy consumption per transistor

in a chip reduces drastically
Enabled by ASML technology Increase in # transistors per chip
(Moore’s law) and # chips outweighs
energy reduction per transistor
Fast and small chips enable energy
saving technologies • Data centers
• Bitcoin mining
• Advanced teleconferencing as • …
alternative for flying
• Computing power to optimize
device performance (e.g. ‘Toon’)
• Autonomous driving

To push the scaler further to the left, together with customers and
suppliers, ASML invests in reducing energy waste and improving energy
efficiency of its products.
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