ELECTRONIC

COMPONENTS,
PACKAGING AND
PRODUCTION
by

Leif Halbo and Per Ohlckers

University of Oslo

1995

ISBN 82-992193-2-9
 Leif Halbo and Per Ohlckers: Electronic Components, Packaging and Production

ELECTRONIC COMPONENTS,
PACKAGING AND PRODUCTION

Copyright:

Professor Leif Halbo

Present affiliation:
Norwegian Metrology and Accreditation Service
Fetveien 99
N-2007 Kjeller
1993

Revised 1995

Printed by:
Strandberg & Nilsen Grafisk a.s
Oslo

Cover photo by Jan D. Martens, SINTEF

Supported by COMETT Project INSIGHT

ISBN 82-992193-2-9
 Leif Halbo and Per Ohlckers: Electronic Components, Packaging and Production

PREFACE

The present book is primarily meant for university education in introductory electronic
packaging technology. We attempt to give an overview that encompasses aspects of
material technology, metallurgy, chemistry, physical properties, and mechanical
properties. An understanding of the interplay of all these basic fields is necessary for
choosing and using the available technologies in a best possible way in combination
with a good design to get a product with the right quality. We describe component
technologies, basic processing methods, design guidelines, the production of printed
circuit boards and the common hybrid technologies, including multichip modules.

The book is primarily based on a course developed at the University of Oslo during the
last 6 years. Parts of it have also been used at Norwegian Institute of Technology,
Trondheim, Møre og Romsdal ingeniørhøgskole, Ålesund, Narvik ingeniørhøgskole,
Narvik and the Defence Research Establishment, Kjeller, and a number of seminars.

When we started the course, there were practically no textbooks on the topic of
packaging technology. Now there is an abundance of very good books, review articles,
conference proceedings. Still we hope this presentation is found worthwhile, attempting
to give a view of a broader area than what is common.

The course at University of Oslo has included some 40 lectures, starting with a video,
made especially for the course, introducing the topic. Demonstrations of "hardware", i.e.
numerous examples of products that illustrate the different technologies discussed, have
been important as part of the lectures, bringing the principles "down to earth".

Three "projects" or lab experiments were part of the course:

- Design and manufacturing of a surface mounted printed circuit board
- Thermal simulation of a circuit (PCB) by a thermal CAD system
- High frequency calculations of characteristic impedance and losses.

Finally, 3 - 5 visits were made, to electronic companies producing advanced electronics

with various types of modern technology (highly automated surface mounting, printed
wiring board manufacturing, thick film and thin film hybrid circuits, monolithic silicon
circuits), with generous attention from the key technical and managerial people in the
companies.

We believe this combination of classroom teaching, lab work and a look inside the
practical reality in industry is a key for the students to understand the important issues
in packaging technology. They will not be skilled designers after this introduction, but
hopefully it will be easier for their later employer to make them good designers or
production specialists.

Thanks are due to the following people, among many others:

Markus Bayegan, Are Bjørneklett, Jan Brun Johansen, David Wormald, Henrik
Jakobsen, Thor-Erik Hansen, Benjamin Baraas, Helge Osvold, Ernest Skontorp, Per
Ohlckers, Helge Kristiansen, Agnar Grødal, Kjell Kristiansen, Torstein Gleditsch,
Jørgen Andersen, Øystein Ra, Ole Flesaker.

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 Leif Halbo and Per Ohlckers: Electronic Components, Packaging and Production

Their help is gratefully acknowledged, for good discussions, reading parts of the
manuscript, providing suggestions for contents, running labs, donations of illustrative
products even before they were on the market, etc.

Financial support from COMETT, Project INSIGHT, and the Norwegian Research
Council (NFR, previously NTNF), is gratefully acknowledged.

Oslo, September 1993

Leif Halbo

The most important change in this revised edition from 1995 is an additional chapter on
micromachined devices. (Chapter 9) The other chapters have only minor changes.
Figures and tables are integrated in the text, and page references are included in the
table of contents. These and other modifications should improve readability. To keep in
pace with new developments in electronic packaging technology, we recommend that
the book is supplemented with an appropriate choice of recent published literature in
emerging fields. For example, multichip technology and ball grid array technology are
emerging fields with new developments frequently published these days.

This textbook is now in regular use at several places. Examples are: University of Oslo,
Norwegian Institute of Technology in Trondheim, Oslo College, Faculty of
Engineering, Royal Institute of Technology in Stockholm and Ericsson Components in
Sweden.

The course at the University of Oslo has a web site:

http://www.fys.uio.no/kurs/fys317

Please refer to this page for updates, downloads and other information.

Please contact Per Ohlckers by e-mail for ordering of the book or other additional
information or communication:

[email protected]

Oslo, December 1995

Leif Halbo Per Ohlckers

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 Leif Halbo and Per Ohlckers: Electronic Components, Packaging and Production

TABLE OF CONTENTS

Chapter 1: INTRODUCTION 1.1

1.1 ELECTRONIC PRODUCTS, TECHNOLOGIES AND PACKAGING 1.1

1.2 PHASES IN THE DEVELOPMENT OF A PRODUCT 1.2

1.3 LEVELS OF INTERCONNECTION 1.3

REFERENCES 1.4

Chapter 2:
TECHNOLOGIES FOR ELECTRONICS - OVERVIEW 2.1

2.1 INTRODUCTION 2.1

2.2 HOLE MOUNTING TECHNOLOGY ON PRINTED WIRING BOARDS 2.1

2.3 SURFACE MOUNT TECHNOLOGY 2.4

2.4 CHIP ON BOARD 2.7

2.5 THICK FILM HYBRID TECHNOLOGY 2.9

2.5.1 High temperature thick film hybrid technology 2.9
2.5.2 Polymer thick film hybrid technology 2.11

2.6 THIN FILM HYBRID TECHNOLOGY 2.11

2.7 MULTICHIP MODULES 2.12

2.7.1 Multilayer ceramic modules 2.15
2.7.2 Multilayer thin film modules, silicon as a substrate 2.16
2.7.3 Wafer scale integration 2.18
2.7.4 Silicon sensor technology 2.18

2.8 APPLICATION SPECIFIC INTEGRATED CIRCUITS 2.18

2.8.1 PROM, PAL, GAL, field programmable gate arrays 2.18
2.8.2 Custom design Ics 2.20

2.9 OPTOELECTRONICS PACKAGING TECHNOLOGY 2.21

2.10 TECHNOLOGY TRENDS 2.21

2.11 SELECTING THE OPTIMAL TECHNOLOGY 2.22

2.12 FUTURE TRENDS FOR USERS AND DESIGNERS OF

ELECTRONIC SYSTEMS 2.24

REFERENCES 2.25

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 Leif Halbo and Per Ohlckers: Electronic Components, Packaging and Production

Chapter 3: MATERIALS AND BASIC PROCESSES 3.1

3.1 INTRODUCTION 3.1

MATERIALS 3.1

3.2 INORGANIC MATERIALS 3.1

3.2.1 Metals 3.1
3.2.2 Semiconductors 3.5
3.2.3 Inorganic insulators: ceramics and glasses 3.5

3.3 ORGANIC MATERIALS, PLASTICS 3.8

3.3.1 Basic composition 3.9
3.3.2 The polymerization process 3.12
3.3.3 Electrical properties 3.13
3.3.4 Mechanical, physical and chemical properties 3.14
3.3.5 Glass transition temperature 3.14
3.3.6 Specific materials 3.15

BASIC PROCESSES 3.19

3.4 TRANSFER OF PATTERNS BY PHOTOLITHOGRAPHY 3.19

3.5 SCREEN PRINTING AND STENCIL PRINTING 3.22

3.6 ETCHING 3.23

3.6.1 Wet, chemical etching 3.23
3.6.2 Dry etching 3.24

3.7 PLATING 3.24

3.7.1 Electrolytic plating 3.24
3.7.2 Chemical plating 3.25

3.8 VACUUM DEPOSITION AND SPUTTERING 3.26

3.8.1 Vacuum deposition 3.26
3.8.2 Sputtering 3.26

METHODS FOR ELECTRICAL AND MECHANICAL CONTACT 3.27

3.9 GENERAL 3.27

3.10 SOLDERING 3.28

3.10.1 Wetting 3.28
3.10.2 Solder metal 3.29
3.10.3 Flux and cleaning 3.33

3.11 GLUING 3.35

3.12 MOUNTING OF SEMICONDUCTOR CHIPS: DIE BONDING 3.37

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 Leif Halbo and Per Ohlckers: Electronic Components, Packaging and Production

3.12.1 Eutectic die bonding 3.37

3.12.2 Soft soldering 3.38
3.12.3 Gluing 3.38

3.13 WIRE BONDING 3.40

3.14 TAPE AUTOMATED BONDING 3.42

3.14.1 Process 3.43
3.14.2 Advantages and disadvantages with TAB technique 3.46
3.14.3 Alternative processes 3.47

3.15 FLIP CHIP SOLDERING 3.48

3.16 PLANAR BONDING WITH ADAPTIVE ROUTING 3.49

REFERENCES 3.51

Chapter 4: COMPONENTS FOR ELECTRONIC SYSTEMS 4.1

4.1 INTRODUCTION 4.1

4.2 RESISTORS 4.1

4.2.1 Hole mounted resistors 4.1
4.2.2 Surface mounted resistors 4.2

4.3 CAPACITORS 4.3

4.3.1 Electrical model 4.4
4.3.2 The main types of capacitors 4.5
4.3.3 Multilayer ceramic capacitors 4.6
4.3.4 Electrolytic capacitors 4.10

4.4 DIODES AND TRANSISTORS 4.12

4.5 MONOLITHIC INTEGRATED CIRCUITS 4.15

4.5.1 Plastic or ceramic packaging 4.15
4.5.2 Standard packages for hole mounted ICs 4.16
4.5.3 Standard packages for SMD 4.18
4.5.4 TapePak and moulded carrier ring packages 4.24
4.5.5 High performance packages 4.25
4.5.6 Future trends 4.28

4.6 VARIOUS COMPONENTS 4.29

4.7 TERMINAL METALLIZATION, SOLDERABILITY

AND RELIABILITY 4.29
4.7.1 Passive components 4.29
4.7.2 Integrated circuits 4.30

4.8 ELECTROSTATIC DISCHARGES - COMPONENT DAMAGE

AND PRECAUTIONS 4.31

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 Leif Halbo and Per Ohlckers: Electronic Components, Packaging and Production

4.9 COMPONENT PACKING FOR AUTOMATIC PLACEMENT 4.33

REFERENCES 4.35

Chapter 5: PRINTED WIRING BOARD 5.1

5.1 INTRODUCTION 5.1

5.2 PRINTED WIRING BOARDS, GENERAL 5.1

5.3 GENERATION OF DESIGN DATA, PHOTO- OR LASER PLOTTING 5.4

5.4 FABRICATION OF GLASS/EPOXY WIRING BOARD LAMINATES 5.5

5.5 SINGLE SIDED WIRING BOARDS 5.6

5.6 DOUBLE SIDED, THROUGH HOLED PLATED BOARDS 5.8

5.6.1 Process 5.8
5.6.2 Choice of surface metallization and solder resist 5.10

5.7 MULTILAYER PRINTED WIRING BOARDS 5.11

5.8 FINE LINE WIRING BOARDS, ADDITIVE PROCESS 5.15

5.8.1 Limitations in dimension control due to etching 5.15
5.8.2 Fine line wiring board 5.16
5.8.3 Additive process 5.18

5.9 METAL CORE BOARDS 5.19

5.10 NEW MATERIALS FOR DEMANDING WIRING BOARDS 5.21

5.11 WIRING BOARDS FOR HIGH FREQUENCIES 5.22

5.11.1 Demands on high frequency circuit boards 5.22
5.11.2 Important properties and parameters, new materials 5.23
5.11.3 Commercial products 5.24

5.12 FLEXIBLE PRINTED WIRING BOARDS 5.28

5.12.1 Regular flexible boards 5.31
5.12.2 Membrane switch panels 5.32

5.13 MOULDED BOARDS IN THREE DIMENSIONS 5.33

REFERENCES 5.37

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 Leif Halbo and Per Ohlckers: Electronic Components, Packaging and Production

CHAPTER 6: PCB DESIGN 6.1

6.1 INTRODUCTION 6.1

6.2 GENERAL GUIDELINES 6.1

6.2.1 Right quality 6.1
6.2.2 Design for producibility 6.3
6.2.3 Electromagnetic compatibility 6.3

6.3 HOLE AND SURFACE MOUNT PCBs 6.4

6.3.1 Minimum dimensions 6.4
6.3.2 Different PCBs and limitations on components
and solder processes 6.6
6.3.3 Some general rules 6.9
6.3.4 Dimensions of solder lands 6.11
6.3.5 Design of printing screens for solder paste 6.16

6.4 DESIGN FOR TESTABILITY 6.16

6.4.1 Functional test 6.17
6.4.2 In-circuit test 6.17
6.4.3 Design for improved testability 6.18
6.4.4 Guidelines 6.18

6.5 MATERIALS CONSIDERATIONS

FOR THERMAL COMPATIBILITY 6.20

6.6 THERMAL DESIGN 6.21

6.6.1 Why thermal design? 6.21
6.6.2 Heat transport 6.21
6.6.3 Thermal modelling and material properties 6.24
6.6.4 TCE design of metal core boards 6.26
6.6.5 Convection and improved cooling 6.27
6.6.6 Thermal simulation and measurement 6.32
6.6.7 Selection of cooling methods 6.34

6.7 HIGH FREQUENCY DESIGN 6.34

6.8 DESIGN OF FLEXIBLE PRINTED CIRCUITS 6.43

6.9 DESIGN OF MEMBRANE SWITCH PANELS 6.45

6.10 SYSTEM LEVEL DESIGN 6.47

REFERENCES 6.48

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 Leif Halbo and Per Ohlckers: Electronic Components, Packaging and Production

Chapter 7: PRODUCTION OF PRINTED CIRCUIT BOARDS 7.1

7.1 INTRODUCTION 7.1

7.2 PRODUCTION OF HOLE MOUNTED PCBs 7.1

7.2.1 Component mounting 7.1
7.2.2 Wave soldering 7.6
7.2.3 Cleaning 7.8
7.2.4 Repair 7.8
7.2.5 ESD precautions 7.8

7.3 PRODUCTION OF SURFACE MOUNTED PCBs 7.10

7.3.1 Glueing and wave soldering of SMD components 7.10
7.3.2 Solder paste deposition and reflow soldering 7.13
7.3.3 Component mounting 7.25
7.3.4 Repair 7.29
7.3.5 Solder faults 7.31

7.4 ROBOT MOUNTING 7.32

7.4.1 The components of the robot system 7.34
7.4.2 Programming 7.35
7.4.3 Auxillary equipment in the system 7.36
7.4.4 Areas of application for robot mounting 7.38

7.5 SEQUENCE IN THE PROCESS OF MIXED

SMD/HOLE MOUNTED PCB´s 7.38

7.6 TESTING OF PCB´s 7.39

7.6.1 Component testing 7.39
7.6.2 Mechanical parts for the testing 7.39
7.6.3 "Zero defect" philosophy 7.43

REFERENCES 7.43

Chapter 8:
HYBRID TECHNOLOGY AND MULTICHIP MODULES 8.1
8.1 INTRODUCTION 8.1

8.2 THICK FILM HYBRID TECHNOLOGY 8.1

8.2.1 Substrates 8.1
8.2.2 Materials for conductors, resistors, dielectrics 8.3
8.2.3 Production process 8.7
8.2.4 Component mounting, encapsulation 8.10
8.2.5 Design rules 8.12

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 Leif Halbo and Per Ohlckers: Electronic Components, Packaging and Production

8.3 POLYMER THICK FILM TECHNOLOGY AND MEMBRANE

SWITCH PANELS 8.12
8.3.1 General 8.12
8.3.2 Materials 8.16
8.3.3 Typical process 8.17

8.4 THIN FILM HYBRID TECHNOLOGY 8.18

8.4.1 Conventional thin film technology: Substrates, materials 8.18
8.4.2 Production process 8.19
8.4.3 Multilayer thin film technology, multichip modules 8.22

8.5 MULTILAYER CERAMIC MODULES 8.27

8.5.1 High temperature ceramic 8.27
8.5.2 Low temperature ceramic 8.32

8.6 POWER HYBRID MODULES AND CIRCUITS 8.34

8.6.1 General 8.34
8.6.2 Modest power levels 8.35
8.6.3 High power modules 8.35

8.7 COMBINATION TECHNOLOGIES 8.37

8.7.1 Multilayer thin film on multilayer ceramic 8.37
8.7.2 Thin film on thick film 8.38

REFERENCES 8.39

Chapter 9: MICRO STRUCTURE TECHNOLOGY AND

MICROMACHINED DEVICES 9.1

ABSTRACT 9.1

9.1 INTRODUCTION AND MOTIVATION:

DEFINITIONS, AN EXAMPLE OF A MICROMACHINED
DEVICES AND THE MAIN DRIVING FORCES 9.1

9.2 KEY FACTORS TO SUCCESSFUL INDUSTRIAL INNOVATION OF

MICROMACHINED DEVICES 9.15

9.3 BATCH PROCESSES ADAPTED FROM MICROELECTRONICS/IC

TECHNOLOGY WITH NO OR MINOR MODIFICATIONS 9.20

9.4 BATCH PROCESSES MODIFIED FROM MICROELECTRONICS/IC

TECHNOLOGY PROCESSES 9.24

9.5 BATCH PROCESSES ADAPTED OR MODIFIED FROM OTHER

TECHNOLOGIES THAN MICROELECTRONICS/IC TECHNOLOGY 9.25

9.6 BATCH PROCESSES MAINLY DEVELOPED

FOR MICROMACHINED DEVICES 9.25

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9.7 HIGHLIGHT EXAMPLE: SINTEF`S SILICON-TO-SILICON

ANODIC WAFER BONDING PROCESS 9.28

9.8 COMPANY PROFILE: SENSONOR IS

FOCUSING ON APPLICATION SPECIFIC SENSORS 9.30

9.9 SOME GENERAL RECOMMENDATIONS FOR FURTHER WORK

WITH BATCH PROCESSES FOR MICROMACHINED DEVICES 9.33

9.10 CONCLUSIONS 9.34

REFERENCES 9.35

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