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H3C UniServer R4700 G3 Rack Server Data Sheet

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180 views

H3C UniServer R4700 G3 Rack Server Data Sheet

Uploaded by

sAuD huSSain
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PDF, TXT or read online on Scribd
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H3C UniServer R4700 G3 Server

High-performance dual-processor rack server for high-density


scenarios

Powered by Intel® processors

Release Date: October,2019

New H3C Technologies Co., Limited


H3C UniServer R4700 G3 Server

Excellent performance improves data Handle high-density workloads with excellent performance and
center productivity
extraordinary efficiency
- Support the most up-to-date tech
platforms and massive memory The R4700 G3 provides enhanced performance in high-density scenarios and delivers
expansion extraordinary computing performance with Intel processors in a 1U space. Its industry-
- Support high-performance GPU leading system design brings ease of use, enhanced security, and high availability.
acceleration
As an advanced high-performance dual-processor 1U rack server, the R4700 G3 uses the
Scalable configuration protects IT
investment
most recent Intel® Xeon® Scalable processors and six-channel 2933MHz DDR4 DIMMs,
increasing server performance by 50%. With GPU acceleration and NVMe SSD, the R4700
- Flexible subsystem selection
G3 provides excellent computing performance and I/O acceleration. Its support of power
- Modular design that allows phased
investment supplies with 96% efficiency and an operating temperature as high as 45°C (113°F) greatly
improves data center efficiency and brings high return on investment.
Comprehensive security protection

- Indigenous chip-level encryption The R4700 G3 is ideal for high-density scenarios:


- Security bezel, chassis lock, and
- High-density data centers – For example, data centers of medium- to large-sized
chassis intrusion monitoring
enterprises and service providers.

- Dynamic load balancing – For example, database, virtualization, private cloud, and
public cloud.

- Compute-intensive applications – For example, Big Data, smart commerce, and


geological prospecting and analysis.

- Low-latency and online trading applications – For example, querying and trading
systems of the financial industry.

The R4700 G3 supports Microsoft® Windows® and Linux operating systems, as well as
VMware and H3C CAS and can operate perfectly in heterogeneous IT environments.
2 × Intel® Xeon® Scalable processors
Computing
(Up to 28 cores and maximum 205 W power consumption)

3.0 TB (maximum)
24 × DDR4 DIMMs
Memory
(Up to 2933 MT/s data transfer rate and support for both RDIMM and LRDIMM)
(Up to 12 Intel ® Optane™ DC Persistent Memory Module.(DCPMM)

Embedded RAID controller (SATA RAID 0, 1, 5, and 10)


Storage Mezzanine HBA card (SATA/SAS RAID 0, 1, and 10) (Optional)
controller Mezzanine storage controller (RAID 0, 1, 5, 6, 10, 50, 60, and 1E) (Optional)
Standard PCIe HBA cards and storage controllers (Optional)

FBWC 4 GB DDR4-2133MHz

Front 4LFF + rear 2SFF or front 10SFF + rear 2SFF (supports SAS/SATA HDD/SSD and up to 8 front NVMe drives)
Storage
480 GB SATA M.2 SSDs

1 × onboard 1 Gbps management network port


Network 1 × mLOM Ethernet adapter that provides 4 × 1GE copper ports or 2 × 10GE copper/fiber ports (Optional)
1 × PCIe Ethernet adapters (Optional)

5 × PCIe 3.0 slots (two standard slots, one optional front slot, one for Mezzanine storage controller, and one for
PCIe slots
Ethernet adapter)

Front VGA connector (Optional)


Rear VGA connector and serial port
Ports
4 × USB 3.0 connectors (two at the rear and two in the server)
2 × MicroSD slots (Optional)

GPU 2 × single-slot wide GPU modules

External optical drive


Optical drive
Only the 4LFF and 8SFF drive models support built-in optical drives

Management HDM (with dedicated management port) and H3C FIST

Power supply Platinum 550W/800W/850W/1200W1600W, Titanium, or 800W –48V/336V DC power supplies (1+1 redundancy)
and ventilation Hot swappable fans (supports redundancy)

Standards CCC, CECP, SEPA,CE,UL,EAC etc.

5°C to 45°C (41°F to 113°F)


Operating
The maximum operating temperature varies by server configuration. For more information, see the technical
temperature
documentation for the device.

Dimensions (H × Without a security bezel: 42.88 × 434.59 × 768.3 mm (1.69 × 17.11 × 30.25 in)
W × D) With a security bezel: 42.88 × 434.59 × 780.02 mm (1.69 × 17.11 × 30.71 in)

Three years
Warranty
Next-business-day response, 5×9

Copyright © 2019 New H3C Technologies Co., Limited Reserves all rights
New H3C Technologies Co., Limited
Disclaimer: Though H3C strives to provide accurate information in this document, we cannot guarantee that details do not
Beijing Headquarters
contain any technical error or printing error. Therefore, H3C cannot accept responsibility for any inaccuracy in this document.
Tower 1, LSH Center, 8 Guangshun South Street, Chaoyang
H3C reserves the right for the modification of the contents herein without prior notification
District, Beijing, China

Zip: 100102

Hangzhou Headquarters
http://www.h3c.com/en

No.466 Changhe Road, Binjiang District, Hangzhou, Zhejiang,

China

Zip: 310052

Tel: +86-571-86760000

Fax: +86-571-86760001

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