ECE220a - Topic 2
ECE220a - Topic 2
Semiconductor Fundamentals
I. Introduction to Semiconductor
Diodes, transistors, integrated circuits, and other so-called "solid state"
devices are made from crystals of a semiconductor material, usually Silicon or
Germanium. At room temperature, the crystals of pure silicon and germanium are
neither good insulators nor good conductors. This is why they are called
semiconductors.
Semiconductor
- materials whose electrical conductivity lies between conductor and an
insulator
- have a medium energy gap that results in small amount of current flow
- have 4 electrons in its outer most orbit and which forms crystalline
structure
- pure semiconductor materials are Germanium, Silicon, and Carbon
- as the temperature increases in a semiconductor material, electrons drift
from one atom to another
- current flow in semiconductor materials consists of both electron flow and
hole movement
- has negative temperature coefficient of resistance, i.e. the resistance of
semiconductor decreases with increase in temperature and vice versa
- the resistivity lies between insulator and conductor
- doping increases conductivity of semiconductor
1. N-type Semiconductor
– Pentavalent materials
– Electrons are the majority carrier
– Holes are the minority carrier
2. P-type Semiconductor
– Trivalent materials
– Holes are the majority carrier
– Electrons are the minority carrier
Bonds in Semiconductor
- The valence electrons in semiconductor atoms take a vital role in bonding between
atoms in the semiconductor crystal.
- Bonding between atoms occurs because each atom has a tendency to feel its outer
most cell with eight electrons.
- Each semiconductor atom has four valence electrons; hence the atom can share four
other valence electrons of neighboring atoms to complete eight electrons in its outer
most cell.
- The bonding between atoms by sharing valence electrons is called the covalent
bond.
• Depletion Zone - The area where the positive and negative ions are located.
At the instant the p - n junction is formed, free electrons on the n side migrate
or diffuse across the junction to the p side. Once on the p side, the free electrons
are minority current carriers. The lifetime of these free electrons is short, however,
because they fall into holes shortly after crossing over to the p side. The important
effect here is that when a free electron leaves the n side and falls into a hole on the
p side, two ions are created: a positive ion on the n side and a negative ion on the
p side. As the process of diffusion continues, a barrier potential, V B , is created and the
diffusion of electrons from the n side to the p side stops.
• Barrier Potential , V B
• No Applied Bias ( V = 0 V)
Figure 5. A p–n junction with no external bias: (a) an internal distribution of charge; (b) a diode symbol,
with the defined polarity and the current direction; (c) demonstration that the net carrier
flow is zero at the external terminal of the device when V D = 0 V.
Figure 6. Reverse-biased p–n junction: (a) internal distribution of charge under reverse-bias conditions;
(b) reverse-bias polarity and direction of reverse saturation current.
* The current that exists under reverse-bias conditions is called the reverse
saturation current and is represented by I s .
* Leakage Current
Figure 7. Forward-biased p–n junction: (a) internal distribution of charge under forward-bias
conditions; (b) forward-bias polarity and direction of resulting current.
Shockleys Equation
Thermal Voltage
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