IPC J-STD-001E-2010

Requirements for
Soldered Electrical and
Electronic Assemblies

A joint standard developed by the IPC J-STD-001 development team

including J-STD-001 Task Group (5-22a), J-STD-001 Task Group
Asia (5-22aCN) and J-STD-001 Task Group Nordic (5-22aND) of the
Assembly and Joining Processes Committees (5-20 and 5-20CN) of IPC

Supersedes: Users of this publication are encouraged to participate in the

J-STD-001D - February 2005 development of future revisions.
J-STD-001C - March 2000
J-STD-001B - October 1996 Contact:
J-STD-001A - April 1992 IPC
3000 Lakeside Drive, Suite 309S
Bannockburn, IL 60015-1249
Phone ( 847) 615-7100
Fax (847) 615-7105
April 2010 IPC J-STD-001E-2010

Table of Contents
1 GENERAL ................................................................. 1 3 MATERIALS, COMPONENTS AND EQUIPMENT
REQUIREMENTS ...................................................... 6
1.1 Scope ................................................................... 1
3.1 Materials ............................................................. 6
1.2 Purpose ................................................................ 1
3.2 Solder .................................................................. 7
1.3 Classification ....................................................... 1
3.2.1 Solder - Lead Free .............................................. 7
1.4 Measurement Units and Applications ................ 1
3.2.2 Solder Purity Maintenance ................................. 7
1.4.1 Verification of Dimensions ................................. 1
3.3 Flux ..................................................................... 7
1.5 Definition of Requirements ................................ 2
3.3.1 Flux Application ................................................. 8
1.5.1 Hardware Defects and Process Indicators ......... 2
3.4 Solder Paste ........................................................ 8
1.5.2 Material and Process Nonconformance ............. 2
3.5 Solder Preforms .................................................. 8
1.6 General Requirements ........................................ 2
3.6 Adhesives ............................................................ 8
1.7 Order of Precedence ........................................... 3
3.7 Chemical Strippers ............................................. 8
1.7.1 Conflict ................................................................ 3
3.8 Components ........................................................ 8
1.7.2 Clause References .............................................. 3
1.7.3 Appendices .......................................................... 3 3.8.1 Component and Seal Damage ............................ 8
1.8 Terms and Definitions ........................................ 3 3.8.2 Coating Meniscus ............................................... 8
1.8.1 Defect .................................................................. 3 3.9 Soldering Tools and Equipment ......................... 8
1.8.2 Disposition .......................................................... 3 4 GENERAL SOLDERING AND ASSEMBLY
1.8.3 Electrical Clearance ............................................ 3 REQUIREMENTS ...................................................... 8
1.8.4 High Voltage ....................................................... 3 4.1 Electrostatic Discharge (ESD) ........................... 8
1.8.5 Manufacturer (Assembler) .................................. 3 4.2 Facilities .............................................................. 8
1.8.6 Objective Evidence ............................................. 3 4.2.1 Environmental Controls ...................................... 8
1.8.7 Process Control ................................................... 4 4.2.2 Temperature and Humidity ................................. 8
1.8.8 Process Indicator ................................................ 4 4.2.3 Lighting ............................................................... 9
1.8.9 Proficiency .......................................................... 4 4.2.4 Field Assembly Operations ................................ 9
1.8.10 Solder Destination Side ...................................... 4 4.3 Solderability ........................................................ 9
1.8.11 Solder Source Side ............................................. 4 4.4 Solderability Maintenance .................................. 9
1.8.12 Supplier ............................................................... 4 4.5 Removal of Component Surface Finishes ......... 9
1.8.13 User ..................................................................... 4 4.5.1 Gold Removal ..................................................... 9
1.8.14 Wire Overwrap ................................................... 4 4.5.2 Other Metallic Surface Finishes Removal ......... 9
1.8.15 Wire Overlap ...................................................... 4 4.6 Thermal Protection ............................................. 9
1.9 Requirements Flowdown .................................... 4 4.7 Rework of Nonsolderable Parts ......................... 9
1.10 Personnel Proficiency ......................................... 4 4.8 Presoldering Cleanliness Requirements ........... 10
1.11 Acceptance Requirements .................................. 4 4.9 General Part Mounting Requirements ............. 10
1.12 General Assembly Requirements ....................... 5
4.9.1 Stress Relief ...................................................... 10
1.13 Miscellaneous Requirements .............................. 5
4.10 Hole Obstruction .............................................. 10
1.13.1 Health and Safety ............................................... 5
4.11 Metal-Cased Component Isolation ................... 10
1.13.2 Procedures for Specialized Technologies .......... 5
4.12 Adhesive Coverage Limits ............................... 10
2 APPLICABLE DOCUMENTS .................................... 5 4.13 Mounting of Parts on Parts (Stacking of
2.1 EIA ...................................................................... 5 Components) ..................................................... 10
2.2 IPC ...................................................................... 5 4.14 Connectors and Contact Areas ......................... 10
2.3 Joint Industry Standards ..................................... 6 4.15 Handling of Parts .............................................. 10
2.4 ASTM ................................................................. 6 4.15.1 Preheating ......................................................... 10
2.5 Electrostatic Discharge Association ................... 6 4.15.2 Controlled Cooling ........................................... 10

vii
IPC J-STD-001E-2010 April 2010

4.15.3 Drying/Degassing ............................................. 10 6.2.1 Solder Application ............................................ 21

4.15.4 Holding Devices and Materials ........................ 11 6.2.2 Through-Hole Component Lead Soldering ..... 21
4.16 Machine (Nonreflow) Soldering ....................... 11 6.3 Unsupported Holes ........................................... 22
4.16.1 Machine Controls ............................................. 11 6.3.1 Lead Termination Requirements for
4.16.2 Solder Bath ....................................................... 11 Unsupported Holes ........................................... 22
4.17 Reflow Soldering .............................................. 11 7 SURFACE MOUNTING OF COMPONENTS .......... 23
4.17.1 Intrusive Soldering (Paste-in-Hole) ................. 11 7.1 Surface Mount Device Lead Forming ............. 23
4.18 Solder Connection ............................................ 11 7.1.1 Lead Deformation Limits ................................. 23
4.18.1 Exposed Surfaces .............................................. 12 7.1.2 Flat Pack Parallelism ........................................ 23
4.18.2 Solder Connection Defects ............................... 12 7.1.3 Surface Mount Device Lead Bends ................. 24
4.18.3 Partially Visible or Hidden Solder 7.1.4 Flattened Leads ................................................. 24
Connections ...................................................... 12
7.1.5 Dual-in-Line Packages (DIPs) ......................... 24
4.19 Heat Shrinkable Soldering Devices ................. 12
7.1.6 Parts Not Configured for Surface Mounting ... 24
5 WIRES AND TERMINAL CONNECTIONS ............. 12 7.2 Leaded Component Body Clearance ............... 24
5.1 Wire and Cable Preparation ............................. 12 7.2.1 Axial-Leaded Components ............................... 24
5.1.1 Insulation Damage ............................................ 12 7.3 Parts Configured for Butt Lead Mounting ...... 24
5.1.2 Strand Damage ................................................. 13 7.4 Hold Down of Surface Mount Leads .............. 24
5.1.3 Tinning of Stranded Wire ................................. 13 7.5 Soldering Requirements ................................... 24
5.2 Solder Terminals ............................................... 13
7.5.1 Misaligned Components ................................... 24
5.3 Bifurcated, Turret and Slotted Terminal
7.5.2 Unspecified and Special Requirements ............ 24
Installation ........................................................ 13
5.3.1 Shank Damage .................................................. 13 7.5.3 Bottom Only Terminations ............................... 26
5.3.2 Flange Damage ................................................. 13 7.5.4 Rectangular or Square End Chip
Components - 1, 3 or 5 Side Termination ....... 27
5.3.3 Flared Flange Angles ........................................ 14
7.5.5 Cylindrical End Cap Terminations ................... 28
5.3.4 Terminal Mounting - Mechanical .................... 14
7.5.6 Castellated Terminations .................................. 29
5.3.5 Terminal Mounting - Electrical ........................ 14
7.5.7 Flat Gull Wing Leads ....................................... 30
5.3.6 Terminal Soldering ........................................... 15
7.5.8 Round or Flattened (Coined) Gull
5.4 Mounting to Terminals ..................................... 15 Wing Leads ....................................................... 31
5.4.1 General Requirements ...................................... 15
7.5.9 ‘‘J’’ Leads .......................................................... 32
5.4.2 Bifurcated and Turret Terminals ...................... 16
7.5.10 Butt/I Connections (Not Permitted for
5.4.3 Slotted Terminals .............................................. 18 Class 3 Products) .............................................. 33
5.4.4 Hook Terminals ................................................ 18 7.5.11 Flat Lug Leads .................................................. 34
5.4.5 Pierced or Perforated Terminals ....................... 19 7.5.12 Tall Profile Components Having Bottom
5.4.6 Cup and Hollow Cylindrical Terminals ........... 19 Only Terminations ............................................ 35
5.5 Soldering to Terminals ..................................... 19 7.5.13 Inward Formed L-Shaped Ribbon Leads ........ 36
5.5.1 Cup and Hollow Cylindrical Terminals ........... 19 7.5.14 Surface Mount Area Array Packages ............... 37
7.5.15 Bottom Termination Components (BTC) ........ 39
6 THROUGH-HOLE MOUNTING AND
TERMINATIONS ...................................................... 20 7.5.16 Components with Bottom Thermal Plane
6.1 Through-Hole Terminations - General ............. 20 Terminations (D-Pak) ....................................... 40

6.1.1 7.5.17 Flattened Post Connections .............................. 41

Lead Forming ................................................... 20
6.1.2 7.6 Specialized SMT Terminations ........................ 41
Lead Deformation Limits ................................. 20
6.1.3 Termination Requirements ............................... 20 8 CLEANING PROCESS REQUIREMENTS ............. 42
6.1.4 Lead Trimming ................................................. 21 8.1 Cleanliness Exemptions .................................... 42
6.1.5 Interfacial Connections ..................................... 21 8.2 Ultrasonic Cleaning .......................................... 42
6.1.6 Coating Meniscus In Solder ............................. 21 8.3 Post-Solder Cleanliness .................................... 42
6.2 Supported Holes ............................................... 21 8.3.1 Particulate Matter ............................................. 42

viii
April 2010 IPC J-STD-001E-2010

8.3.2 Flux Residues and Other Ionic or Organic 12 REWORK AND REPAIR ....................................... 49
Contaminants .................................................... 42 12.1 Rework .............................................................. 49
8.3.3 Post-Soldering Cleanliness Designator ............ 42 12.2 Repair ................................................................ 49
8.3.4 Cleaning Option ................................................ 42 12.3 Post Rework/Repair Cleaning .......................... 49
8.3.5 Test for Cleanliness .......................................... 42
Appendix A Guidelines for Soldering Tools and
8.3.6 Testing ............................................................... 43 Equipment ............................................ 51

9 PCB REQUIREMENTS ........................................... 43 Appendix B Minimum Electrical Clearance -

9.1 Printed Circuit Board Damage ......................... 43 Electrical Conductor Spacing ............ 53
9.1.1 Blistering/Delamination .................................... 43
9.1.2 Weave Exposure/Cut Fibers ............................. 44 Figures
9.1.3 Haloing .............................................................. 44 Figure 1-1 Overwrap .......................................................... 4
9.1.4 Land Separation ................................................ 44 Figure 1-2 Overlap ............................................................. 4

9.1.5 Land/Conductor Reduction in Size .................. 44 Figure 4-1 Hole Obstruction ............................................. 10
Figure 4-2 Acceptable Wetting Angles ............................. 11
9.1.6 Flexible Circuitry Delamination ...................... 44
Figure 5-1 Flange Damage .............................................. 14
9.1.7 Flexible Circuitry Damage ............................... 44
Figure 5-2 Flare Angles .................................................... 14
9.1.8 Burns ................................................................. 44
Figure 5-3 Terminal Mounting - Mechanical .................... 14
9.1.9 Solder on Gold Contacts .................................. 44 Figure 5-4 Terminal Mounting - Electrical ........................ 14
9.1.10 Measles ............................................................. 44 Figure 5-5 Insulation Clearance Measurement ................ 15
9.2 Marking ............................................................. 44 Figure 5-6 Service Loop for Lead Wiring ......................... 15
9.3 Bow and Twist (Warpage) ................................ 44 Figure 5-7 Stress Relief Examples .................................. 15
Figure 5-8 Continuous Runs ............................................ 16
10 COATING, ENCAPSULATION AND STAKING
(ADHESIVE) .......................................................... 45 Figure 5-9 Wire and Lead Wrap Around .......................... 16

10.1 Conformal Coating ........................................... 45 Figure 5-10 Side Route Connections and Wrap on
Bifurcated Terminal ......................................... 17
10.1.1 Application ........................................................ 45 Figure 5-11 Top and Bottom Route Terminal Connection . 18
10.1.2 Performance Requirements .............................. 45 Figure 5-12 Hook Terminal Connections ............................ 18
10.1.3 Conformal Coating Inspection ......................... 46 Figure 5-13 Pierced or Perforated Terminal Wire Wrap .... 19
10.1.4 Rework of Conformal Coating ........................ 46 Figure 5-14 Solder Height .................................................. 19
10.2 Encapsulation .................................................... 46 Figure 6-1 Lead Bends .................................................... 20
10.2.1 Application ........................................................ 46 Figure 6-2 Lead Trimming ................................................ 21
Figure 6-3 Vertical Fill Example ....................................... 22
10.2.2 Performance Requirements .............................. 46
Figure 7-1 Surface Mount Device Lead Forming ............ 23
10.2.3 Rework of Encapsulant Material ..................... 46
Figure 7-2 Surface Mount Device Lead Forming ............ 23
10.2.4 Encapsulant Inspection ..................................... 46
Figure 7-3 Bottom Only Terminations .............................. 26
10.3 Staking (Adhesive) ........................................... 46
Figure 7-4 Rectangular or Square End Chip
10.3.1 Staking .............................................................. 47 Components ................................................... 27
10.3.2 Staking (Inspection) .......................................... 47 Figure 7-5 Cylindrical End Cap Terminations .................. 28
Figure 7-6 Castellated Terminations ................................ 29
11 PRODUCT ASSURANCE ...................................... 48
Figure 7-7 Flat Gull Wing Leads ...................................... 30
11.1 Hardware Defects Requiring Disposition ........ 48 Figure 7-8 Round or Flattened (Coined) Gull
11.2 Inspection Methodology ................................... 48 Wing Leads ..................................................... 31
11.2.1 Process Verification Inspection ........................ 48 Figure 7-9 ‘‘J’’ Leads ........................................................ 32

11.2.2 Visual Inspection .............................................. 48 Figure 7-10 Butt/I Connection ............................................ 33

Figure 7-11 Flat Lug Leads ................................................ 34
11.2.3 Sampling Inspection ......................................... 48
Figure 7-12 Tall Profile Components Having Bottom
11.3 Process Control Requirements ......................... 48 Only Terminations ........................................... 35
11.3.1 Opportunities Determination ............................ 49 Figure 7-13 Inward Formed L-Shaped Ribbon Lead ......... 36
11.4 Statistical Process Control ................................ 49 Figure 7-14 BGA Solder Ball Spacing ............................... 37

ix
IPC J-STD-001E-2010 April 2010

Figure 7-15 Bottom Termination Component ..................... 39 Table 7-4 Dimensional Criteria - Rectangular or
Figure 7-16 Bottom Thermal Plane Termination ................ 40 Square End Chip Components -
1, 3 or 5 Side Termination ................................ 27
Figure 7-17 Flattened Post Termination ............................. 41
Table 7-5 Dimensional Criteria - Cylindrical End
Cap Terminations .............................................. 28
Table 7-6 Dimensional Criteria - Castellated
Tables Terminations ...................................................... 29
Table 1-1 Design and Fabrication Specification ................. 3 Table 7-7 Dimensional Criteria - Flat Gull Wing Leads .... 30
Table 3-1 Maximum Limits of Solder Bath Contaminant .... 7 Table 7-8 Dimensional Criteria - Round or Flattened
Table 5-1 Allowable Strand Damage ................................ 13 (Coined) Gull Wing Leads ................................. 31

Table 5-2 Terminal Soldering Requirements ..................... 15 Table 7-9 Dimensional Criteria - ‘‘J’’ Leads ...................... 32

Table 5-3 Turret and Straight Pin Wire Placement ........... 16 Table 7-10 Dimensional Criteria - Butt/I Connections ......... 33

Table 5-4 AWG 30 and Smaller Wire Wrap Table 7-11 Dimensional Criteria - Flat Lug Leads .............. 34
Requirements .................................................... 17 Table 7-12 Dimensional Criteria - Tall Profile
Table 5-5 Bifurcated Terminal Wire Placement - Components Having Bottom Only
Side Route ........................................................ 17 Terminations ...................................................... 35
Table 5-6 Staking Requirements of Side Route Straight Table 7-13 Dimensional Criteria - Inward Formed
Through Connections - Bifurcated Terminals ... 17 L-Shaped Ribbon Leads ................................... 36
Table 5-7 Bifurcated Terminal Wire Placement - Table 7-14 Dimensional Criteria - Ball Grid Array
Bottom Route .................................................... 18 Components with Collapsing Balls ................... 37
Table 5-8 Hook Terminal Wire Placement ........................ 18 Table 7-15 Ball Grid Array Components with
Noncollapsing Balls ........................................... 38
Table 5-9 Pierced/Perforated Wire Placement .................. 19
Table 5-10 Solder Requirements Wire to Post ................... 19 Table 7 16 Column Grid Array ............................................ 38

Table 6-1 Lead Bend Radius ............................................ 20 Table 7-17 Dimensional Criteria - BTC ............................... 39

Table 6-2 Protrusion of Leads in Supported Holes ........... 21 Table 7-18 Dimensional Criteria - Bottom Thermal
Plane Terminations ............................................ 40
Table 6-3 Protrusion of Leads in Unsupported Holes ....... 21
Table 7-19 Dimensional Criteria Flattened
Table 6-4 Supported Holes with Component Leads, Post Connections .............................................. 41
Minimum Acceptable Conditions ....................... 22
Table 8-1 Designation of Surfaces to be Cleaned ............ 42
Table 6-5 Unsupported Holes with Component Leads,
Minimum Acceptable Conditions ....................... 22 Table 8-2 Cleanliness Testing Designators ....................... 42
Table 7-1 SMT Lead Forming Minimum Lead Length ...... 23 Table 10-1 Coating Thickness ............................................. 45
Table 7-2 Surface Mount Components ............................. 25 Table 11-1 Magnification Aid Applications for Solder
Connections ...................................................... 48
Table 7-3 Dimensional Criteria - Bottom Only
Terminations ...................................................... 26 Table 11-2 Magnification Aid Applications - Other .............. 48

x
April 2010 IPC J-STD-001E-2010

Requirements for Soldered

Electrical and Electronic Assemblies

1 GENERAL

1.1 Scope This standard prescribes practices and requirements for the manufacture of soldered electrical and electronic
assemblies. Historically, electronic assembly (soldering) standards contained a more comprehensive tutorial addressing prin-
ciples and techniques. For a more complete understanding of this document’s recommendations and requirements, one may
use this document in conjunction with IPC-HDBK-001, IPC-A-610 and IPC-HDBK-610.

1.2 Purpose This standard describes materials, methods and acceptance criteria for producing soldered electrical and
electronic assemblies. The intent of this document is to rely on process control methodology to ensure consistent quality
levels during the manufacture of products. It is not the intent of this standard to exclude any procedure for component
placement or for applying flux and solder used to make the electrical connection.

1.3 Classification This standard recognizes that electrical and electronic assemblies are subject to classifications by
intended end-item use. Three general end-product classes have been established to reflect differences in producibility, com-
plexity, functional performance requirements, and verification (inspection/test) frequency. It should be recognized that there
may be overlaps of equipment between classes.
The user (see 1.8.13) is responsible for defining the product class. The product class should be stated in the procurement
documentation package.

CLASS 1 General Electronic Products

Includes products suitable for applications where the major requirement is function of the completed assembly.

CLASS 2 Dedicated Service Electronic Products

Includes products where continued performance and extended life is required, and for which uninterrupted service is desired
but not critical. Typically the end-use environment would not cause failures.

CLASS 3 High Performance Electronic Products

Includes products where continued high performance or performance-on-demand is critical, equipment downtime cannot be
tolerated, end-use environment may be uncommonly harsh, and the equipment must function when required, such as life
support or other critical systems.

1.4 Measurement Units and Applications All dimensions and tolerances, as well as other forms of measurement (tem-
perature, weight, etc.) in this standard are expressed in SI (System International) units (with Imperial English equivalent
dimensions provided in brackets). Dimensions and tolerances use millimeters as the main form of dimensional expression;
micrometers are used when the precision required makes millimeters too cumbersome. Celsius is used to express tempera-
ture. Weight is expressed in grams.

1.4.1 Verification of Dimensions Actual measurement of specific part mounting and solder fillet dimensions and determi-
nation of percentages are not required except for referee purposes. For the purposes of determining conformance to this
specification, all specified limits in this standard are absolute limits as defined in ASTM E29.