OPEN EDGE

Tomi Männikkö| HW Architect, NOKIA

25th June, 2019

1 © 2018 Nokia
AirFrame open edge server: 5G performance in compact size
First x86 solution designed to fully support edge / far-edge cloud deployments
ARCHITECTURE Environmental
• 19” compatible: fits in any 600mm deep cabinet • Full NEBS compliancy,
Compact form factor: 3RU high chassis seismic zone 4 [GR-63-
Ultra-small footprint •
Core, GR-1089-Core]
• Sleds either 1RU or 2RU high
• Fully front-operated (cabling, open rack-like • Extended operating
tool less serviceability) temperature range:
-5C..+45C [ETSI EN300
• Support for high end accelerators 019-1-3 Class 3.2]
• High availability: No SPOFs, redundant fans, hot swap storage
• Redundant fans; air flow configurable front to rear/rear to front

DIMENSIONS POWER MANAGEMENT COMMODITY

• 130.6 (3RU) x 440 x 430 mm (H • 2N redundant AC & DC • All sleds managed through support on server sleds
x W x D) power supplies single interface in RMC unit • Memories, disks and NICs
• Ca. 12.0 kg / 26.5 lbs. (Chassis • Power fed to sleds through • On board BMC from common AirFrame
with PSU’s and RMC) backplane (in server sleds) portfolio
• 400W per 1U sled

2 © 2018 Nokia
 AirFrame open edge server – 1U sled
Intel Xeon® SP next gen
Processor (single socket)
• Intel® Xeon® SP, up to 24cores, 2,4GHz
Chipset
• Intel® C621/C627

Thermal
• Max. CPU TDP support: 205W
• Four redundant fans per node; air flow front to
rear/rear to front

Memory Storage Expansion Slots

• DIMM slots: 6 typical (8 max) • 2x 2,5” Hot-plug bays for 7/9.5 • 1x PCIe Gen3 x16 OCP
• DIMM type: 16GB / 32GB / mm SATA / NVMe drives mezzanine slot
Dimensions, weight 64GB - DDR4 RDIMM 2933 • 2x internal M.2 2280 or 22110 • 1x PCIe Gen3 x16 FHHL PCIe slot
• 41 x 215x 427mm (H x W x D) MHz devices
• 3.4 kg / 7.5 lbs.** Management
• Redfish, IPMI v2.0 Compliant,
on board BMC Security
• Access through RMC unit • TPM 1.2/ 2.0
**) Server node with CPU and heatsink

3 © 2018 Nokia
AirFrame open edge server – 2U sled
Intel Xeon® SP next gen
Processor (single socket)
• Intel® Xeon® SP, up to 24cores, 2,4GHz
Chipset
• Intel® C621/C627

Thermal
• Max. CPU TDP support: 250W
• Two redundant dual rotor fans per node; air flow
front to rear/rear to front

Memory Storage Expansion Slots

• DIMM slots: 6 typical (8 max) • 2x 2,5” Hot-plug bays for • 1x PCIe Gen3 x16 OCP
• DIMM type: 16GB / 32GB / 7/9.5/15 mm SATA / NVMe mezzanine slot
Dimensions, weight 64GB - DDR4 RDIMM 2933 drives • 1-2x PCIe Gen3 x8/x16 FHHL slot
• 83 x 215x 427mm (H x W x D) MHz • 2x 2,5” Hot-plug bays for 7/9.5 • 1x PCIe Gen3 x16 FHFL double wide
• 4.7 kg / 10.4 lbs.** mm SATA / NVMe drives slot
Management
• 2x internal M.2 2280 or 22110
• Redfish, IPMI v2.0 Compliant, devices
on board BMC
• Access through RMC unit Security
**) Server node with CPU and heatsink
• TPM 1.2/ 2.0

4 © 2018 Nokia
Open Edge Chassis building blocks

Chassis (3RU)

AC PSU

DC PSU

RMC unit

5 © 2018 Nokia AirFrame open edge server | Public

 Open Edge server storage options

Solid State Disks (SATA)

• Form factor: 2.5”, 7/9 mm
• Interface: SATA
• hot-plug

Solid State Disks (NVMe)

• Form factor: 2,5”, 7mm /15mm
• Interface: PCIe
• hot-plug

Flash device on-board

• Form factor: M.2 (2280/22110)
• Interface: SATA / PCIe
• Dual M.2 riser
on motherboard

6 © 2018 Nokia
HW details

7 © 2018 Nokia AirFrame open edge server | Public

Open edge chassis overview

Key specifications
• 3U, 19” mountable (EIA-310 compatible)
• 130.6 x 440 x 430 mm (H x W x D)
• 1U and 2U, half width sleds are supported
• Redundant, centralized power supply
• 2000 W max power feed capacity, 80+ Platinum
• AC (100..127/ 200..240 VAC) and DC (-48 VDC) options
• Sled power feed capacity 400 W (1U sled), 700 W
(2U sled), 12 VDC

8 © 2019 Nokia
Open edge chassis overview

Key specifications
• Cooling: Fan units are part of sled solution
• Air flow direction configurable: front to rear/rear to front
• Chassis management controller (RMC)
• PSU management (control, sensors, ..)
• Management Ethernet interface to sleds
• 1 GE to all sleds via backplane
• 1x 1 GE (RJ45) + 2x 10 GE (SFP+) front panel interface for
external connectivity and chaining of multiple chassis

• Power distribution board and chassis backplane

provide connectivity between RMC, sleds and
PDUs

9 © 2019 Nokia
Open edge chassis front view

PSU1 PSU2 RMC 1U / 2U sleds

10 © 2018 Nokia
1U and 2U sleds are supported

5x 1U
• Open edge chassis allows flexible
installation of both 1U and 2U
sleds
• Supported configurations are
• 5x 1U
• 3x 1U + 1x 2U
• 1x 1U + 2x 2U 1x 1U + 2x 2U
• A support bracket for 1U sled is
removed when installing a 2U
sled (tool-less)

11 © 2018 Nokia
Server sled, 1U

Key specifications
• 1U, half width
• 215 mm x 41 mm x 423 mm (W x H x D)
• Power consumption 400 W, max
• Single-socket CPU, Intel® Xeon® Scalable Family,
Thermal Design Power (TDP): max. 205 W
• PCH options: Intel C621, C627 (with QAT)
• Memory: 6 x DDR4-2933 + 2 x Intel Optane PMM
• Single riser for disks and add-in cards
• Extension slots
• PCIe x16, FHHL, 75 W
• OCP Mezzanine 2.0, PCIe x16
• Storage
• 2 x hot-plug SSD, SATA/NVMe, 2.5 ”, 7/9.5 mm
• 2 x M.2 SSD, SATA/NVMe, 2280/22110

12 © 2019 Nokia
Server sled, 2U

Key specifications
• 2U, half width
• 215 mm x 83.6 mm x 423 mm (W x H x D)
• Power consumption 700 W, max
• Single-socket CPU, Intel® Xeon® Scalable Family,
Thermal Design Power (TDP): max. 250 W
• PCH options: Intel C621, C627 (with QAT)
• Memory: 6 x DDR4-2933 + 2 x Intel Optane PMM
• Single riser for disks and add-in cards
• Extension slots (depending on riser option)
• 1 x PCIe x16, FHFL, dual-wide, 300 W max
• 1-2 x PCIe x8/x16, FHHL, 75 W max
• OCP Mezzanine 2.0, PCIe x16
• Storage
• 2 x hot-plug SSD, SATA/NVMe, 2.5 ”, 7/9.5 mm
• 2 x hot-plug SSD, SATA/NVMe, 2.5 ”, 7/9.5/15 mm
• 2 x M.2 SSD, SATA/NVMe, 2280/22110

13 © 2019 Nokia
RMC
Management unit
Chassis management controller (RMC)
• PSU management (control, sensors, ..)
• Control and supervision of PSUs
• Access to sensor data (voltages, currents, power
consumption)
• RMC controller from AST2500 family
• USB debug port in front panel
• On-board unmanaged Ethernet switch simplifies HW
management connectivity
• Single management interface for entire chassis
• 1 GE management Ethernet interface to all sleds via backplane
(1000BASE-T)
• 1x 1 GE (RJ45, 1000BASE-T)
• 2x 10 GE (SFP+) front panel interface for external connectivity and
chaining of multiple chassis

14 © 2018 Nokia
Key environmental and regulatory compliancy

Operating conditions Safety

• IEC 62368-1:2014
• Operating temperature range: -5 C …+45 C [ETSI EN300
019-1-3 Class 3.2] • GR-1089-CORE (electrical safety, grounding and
bonding)
• Short term operating temperature: -5 C to +55 C [GR-63-
Seismic tolerance
CORE]
• GR-63-CORE (Zone 4)
• Operating humidity: 5 % to 95 %
Acoustic noise
EMC • GR-63-CORE (equipment room criteria)
• EN300386 (v1.6.1) Fire resistance
• FCC CFR47 15 (class A), CISPR 22/32 (class A) CISPR 24 • GR-63-CORE (shelf level criteria)
• TEC/EMI/TEL-001/01/FEB-09 and TEC/IR/SWN-
2MB/07/MAR-10
• GR-1089-CORE

15 © 2018 Nokia
Nokia contribution to OCP

• Nokia has contributed Open edge server chassis specification and design files and applied for
OCP accepted™ recognition.
• The contribution has been accepted by the Open Compute Telco/openEdge workgroup and
OCP incubation committee in March 2019.

• Telcos/openEdge Wiki page:

http://www.opencompute.org/wiki/Telcos/openEDGE

16 © 2018 Nokia
 Please join the open edge ecosystem development
- Dial-in into regular Open edge project calls

Visit Nokia booth at coming Regional OCP Summit in

Amsderdam

17 © 2018 Nokia
 Thank you

18 © 2018 Nokia