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MAX14783E High-Speed 3.3V/5V RS-485/RS-422 Transceiver

with ±35kV HBM ESD Protection

General Description Benefits and Features

The MAX14783E is a half-duplex RS-485/422 transceiver ●● Integrated Protection Increases Robustness
that operates at either 3.3V or 5V rails with high ±35kV • High ESD Protection
ESD performance and up to 42Mbps data rate. The • ±35kV HBM ESD per JEDEC JS-001-2012
device is optimized for high speeds over extended cable • ±20kV Air Gap per IEC 61000-4-2
runs while maximizing tolerance to noise. • ±12kV Contact ESD per IEC 61000-4-2
The MAX14783E is available in 8-pin µMAX®, 8-pin SO, • ±4kV EFT per IEC 61000-4-4
and 8-pin TDFN-EP packages. The device in the TDFN-EP • Short-Circuit Protected Outputs
package operates over the -40°C to +125°C temperature • True Fail-Safe Receiver Prevents False Transition
range. The MAX14783E in the μMAX and SO packages on Receiver Input Short or Open Events
operates over the -40°C to +85°C and -40°C to +125°C • Hot-Swap Capability Eliminates False Transitions
temperature ranges. During Power-Up or Hot Insertion
●● 3V to 5.5V Supply Voltage Range
Applications ●● High-Speed Data Rates up to 42Mbps
●● Motion Controllers ●● -40°C to +125°C Operating Temperature
●● Field Bus Networks
●● Allows Up to 32 Transceivers on the Bus
●● Encoder Interfaces
●● Backplane Busses ●● Low 10µA (max) Shutdown Current for Lower Power
Consumption

Ordering Information appears at end of data sheet.

Functional Diagram

VCC

MAX14783E

RO R

RE
B
SHUTDOWN
A
DE

DI D

GND

µMAX is a registered trademark of Maxim Integrated Products, Inc,.

19-6734; Rev 2; 7/20

MAX14783E High-Speed 3.3V/5V RS-485/RS-422 Transceiver
with ±35kV HBM ESD Protection

Absolute Maximum Ratings

(Voltages referenced to GND.) Junction Temperature.......................................................+150°C
VCC ......................................................................-0.3V to +6.0V Storage Temperature Range............................. -65°C to +150°C
RO............................................................. -0.3V to (VCC + 0.3V) Continuous Power Dissipation (TA = +70°C)
RE, DE, DI.............................................................-0.3V to +6.0V µMAX (derate at 4.8mW/°C above +70°C)..................387mW
A, B (VCC ≥ 3.6V) ..............................................-8.0V to +13.0V SO (derate at 7.6mW/°C above +70°C).......................606mW
A, B (VCC < 3.6V) .............................................-9.0V to +13.0V TDFN-EP (derate at 24.4mW/°C above +70°C).........1951mW
Short-Circuit Duration (RO, A, B) to GND..................Continuous Lead Temperature (soldering, 10s).................................. +300ºC
Operating Temperature Range Soldering Temperature (reflow)....................................... +260°C
MAX14783EE_................................................ -40°C to +85°C
MAX14783EA_.............................................. -40°C to +125°C
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these
or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.

Package Information
PACKAGE TYPE: 8 SOIC
Package Code S8+4
Outline Number 21-0041
Land Pattern Number 90-0096
THERMAL RESISTANCE, FOUR-LAYER BOARD
Junction to Ambient (θJA) 132°C/W
Junction to Case (θJC) 38°C/W

PACKAGE TYPE: 8 TDFN

Package Code T833+2
Outline Number 21-0137
Land Pattern Number 90-0059
THERMAL RESISTANCE, FOUR-LAYER BOARD
Junction to Ambient (θJA) 41°C/W
Junction to Case (θJC) 8°C/W

PACKAGE TYPE: 8 µMAX

Package Code U8+1
Outline Number 21-0036
Land Pattern Number 90-0092
THERMAL RESISTANCE, FOUR-LAYER BOARD
Junction to Ambient (θJA) 206°C/W
Junction to Case (θJC) 42°C/W

For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages. Note that a “+”, “#”,
or “-” in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains
to the package regardless of RoHS status.

Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board.
For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.

www.maximintegrated.com Maxim Integrated │  2

MAX14783E High-Speed 3.3V/5V RS-485/RS-422 Transceiver
with ±35kV HBM ESD Protection

Electrical Characteristics
(VCC = +3.0V to +5.5V, TA = TMIN to TMAX, unless otherwise specified. Typical values are at VCC = +5V and TA = +25°C.) (Notes 1, 2)

PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS

POWER SUPPLY (Test)
Supply Voltage VCC 3.0 5.5 V
Supply Current ICC DE = VCC, RE = GND, no load 1.9 4 mA
Shutdown Supply Current ISHDN DE = GND, RE = VCC 10 µA
DRIVER
VCC = 4.5V, RL = 54Ω, Figure 1 2.1
Differential Driver Output VOD VCC = 3V, RL = 100Ω, Figure 1 2.0 V
VCC = 3V, RL = 54Ω, Figure 1 1.5
Change in Magnitude of Differential
ΔVOD RL = 54Ω or 100Ω, Figure 1 (Note 3) -0.2 0 +0.2 V
Output Voltage
Driver Common-Mode Output
VOC RL = 54Ω or 100Ω, Figure 1 VCC / 2 3 V
Voltage
Change in Magnitude of Common-
ΔVOC RL = 54Ω or 100Ω, Figure 1 (Note 3) -0.2 +0.2 V
Mode Voltage
Single-Ended Driver Output High VOH A or B output, IA or B = -20mA 2.2 V
Single-Ended Driver Output Low VOL A or B output, IA or B = 20mA 0.8 V
Differential Output Capacitance COD DE = RE = VCC, f = 4MHz 12 pF
0 ≤ VOUT ≤ +12V, output low 250 mA
Driver Short-Circuit Output Current |IOST|
-7V ≤ VOUT ≤ VCC, output high 250 mA
RECEIVER
DE = GND, VCC = GND VIN = +12V 400 1000
Input Current IA, B µA
or +5.5V VIN = -7V -800 300
Differential Input Capacitance CA, B Between A and B, DE = GND, f = 4MHz 12 pF
Receiver Differential Threshold
VTH -7V ≤ VCM ≤ +12V -200 -105 -10 mV
Voltage
Receiver Input Hysteresis ΔVTH VCM = 0V 10 mV
Receiver Input Resistance RIN -7V ≤ VCM ≤ +12V 12 kΩ
LOGIC INTERFACE (DI, DE, RE, RO)
Input Voltage High VIH DE, DI, RE 2.0 V
Input Voltage Low VIL DE, DI, RE 0.8 V
Input Hysteresis VHYS DE, DI, RE 50 mV
Input Current IIN DE, DI, RE ±1 µA
Input Impedance on First Transition DE, RE 1 10 kΩ
RE = GND, IRO = -2mA,
RO Output Voltage High VOHRO VCC – 0.4 V
(VA - VB) > 200mV
RE = GND, IRO = 2mA,
RO Output Voltage Low VOLRO 0.4 V
(VA - VB) < -200mV

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MAX14783E High-Speed 3.3V/5V RS-485/RS-422 Transceiver
with ±35kV HBM ESD Protection

Electrical Characteristics (continued)

(VCC = +3.0V to +5.5V, TA = TMIN to TMAX, unless otherwise specified. Typical values are at VCC = +5V and TA = +25°C.) (Notes 1, 2)

PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS

Receiver Tri-State Output Current IOZR RE = VCC, 0 ≤ VRO ≤ VCC ±1 µA
Receiver Output Short-Circuit
IOSR 0 ≤ VRO ≤ VCC ±110 mA
Current
PROTECTION
Thermal Shutdown Threshold TSHDN Temperature rising +160 °C
Thermal Shutdown Hysteresis 15 °C
IEC 61000-4-2 Air Gap Discharge to GND ±20
ESD Protection on A and B Pins IEC 61000-4-2 Contact Discharge to GND ±12 kV
Human Body Model ±35
ESD Protection, All Other Pins Human Body Model ±2 kV

Switching Characteristics MAX14783E

(VCC = +3V to +5.5V, TA = TMIN to TMAX, unless otherwise specified. Typical values are at VCC = +5V and TA = +25°C.) (Notes 1, 2, 4)

PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS

DRIVER
tDPLH RL = 54Ω, CL = 50pF, 20
Driver Propagation Delay ns
tDPHL Figures 2 and 3 20
Driver Differential Output Rise or RL = 54Ω, CL = 50pF,
tHL, tLH 7 ns
Fall Time Figures 2 and 3
Differential Driver Output Skew RL = 54Ω, CL = 50pF,
tDSKEW 3 ns
|tDPLH - tDPHL| Figures 2 and 3 (Note 5)

MAX14783EATA 42

MAX14783EEUA 30

MAX14783EESA 40
3.0V ≤ VCC ≤
42
3.6V
Maximum Data Rate DRMAX MAX14783EAUA Mbps
3.0V ≤ VCC ≤
6
5.5V

3.0V ≤ VCC ≤
42
3.6V
MAX14783EASA
3.0V ≤ VCC ≤
16
5.5V

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MAX14783E High-Speed 3.3V/5V RS-485/RS-422 Transceiver
with ±35kV HBM ESD Protection

Switching Characteristics MAX14783E (continued)

(VCC = +3V to +5.5V, TA = TMIN to TMAX, unless otherwise specified. Typical values are at VCC = +5V and TA = +25°C.) (Notes 1, 2, 4)

PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS

RL = 110Ω, CL = 50pF,
Driver Enable to Output High tDZH 30 ns
Figures 4 and 5 (Note 6)
RL = 110Ω, CL = 50pF,
Driver Enable to Output Low tDZL 30 ns
Figures 4 and 5 (Note 6)
RL = 110Ω, CL = 50pF,
Driver Disable Time from Low tDLZ 30 ns
Figures 4 and 5
RL = 110Ω, CL = 50pF,
Driver Disable Time from High tDHZ 30 ns
Figures 4 and 5
Driver Enable from Shutdown to RL = 110Ω, CL = 15pF,
tDLZ(SHDN) 6 µs
Output High Figures 4 and 5 (Note 6)
Driver Enable from Shutdown to RL = 110Ω, CL = 15pF,
tDHZ(SHDN) 6 µs
Output Low Figures 4 and 5 (Note 6)
Time to Shutdown tSHDN (Note 6) 50 800 ns
RECEIVER
tRPLH 25
Receiver Propagation Delay CL = 15pF, Figures 6 and 7 ns
tRPHL 25
CL = 15pF, Figures 6 and 7
Receiver Output Skew tRSKEW 2 ns
(Note 5)
Maximum Data Rate DRMAX 42 Mbps
RL = 1kΩ, CL = 15pF,
Receiver Enable to Output High tRZH 30 ns
Figure 8 (Note 6)
RL = 1kΩ, CL = 15pF,
Receiver Enable to Output Low tRZL 30 ns
Figure 8 (Note 6)
Receiver Disable Time from Low tRLZ RL = 1kΩ, CL = 15pF, Figure 8 30 ns
Receiver Disable Time from High tRHZ RL = 1kΩ, CL = 15pF, Figure 8 30 ns
Receiver Enable from Shutdown to RL = 1kΩ, CL = 15pF,
tRLZ(SHDN) 6 µs
Output High Figure 8 (Note 6)
Receiver Enable from Shutdown to RL = 1kΩ, CL = 15pF,
tRHZ(SHDN) 6 µs
Output Low Figure 8 (Note 6)
Time to Shutdown tSHDN (Note 6) 50 800 ns

Note 1: All devices 100% production tested at TA = +25°C. Specifications over temperature are guaranteed by design.
Note 2: All currents into the device are positive; all currents out of the device are negative. All voltages are referenced to ground,
unless otherwise noted.
Note 3: ΔVOD and ΔVOC are the changes in VOD and VOC, respectively, when the DI input changes state.
Note 4: Capacitive load includes test probe and fixture capacitance.
Note 5: Guaranteed by design; not production tested.
Note 6: The timing parameter refers to the driver or receiver enable delay, when the device has exited the initial hot-swap protect
state and is in normal operating mode.
Note 7: Shutdown is enabled by driving RE high and DE low. The device is guaranteed to have entered shutdown after tSHDN has
elapsed.

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MAX14783E High-Speed 3.3V/5V RS-485/RS-422 Transceiver
with ±35kV HBM ESD Protection

Test and Timing Diagrams

A VCC

RL DE
2 A
DI
VOD RL CL
VOD B

RL
2 VOC

Figure 1. Driver DC Test Load Figure 2. Driver Timing Test Circuit

f = 1MHz, tLH = 3ns, tHL = 3ns

VCC

DI 1.5V 1.5V

tDPLH tDPHL

VOD
VOD = [VA - VB]
VO
90% 90%
VOD 0
10% 10%
-VO
tLH tHL

tDSKEW = |tDPLH - tDPHL|

Figure 3. Driver Propagation Delays

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MAX14783E High-Speed 3.3V/5V RS-485/RS-422 Transceiver
with ±35kV HBM ESD Protection

A
S1
GND OR VCC DI D OUT VCC
CL 1.5V
B
50pF RL = 110Ω DE tDZH, tDZH(SHDN) 0
DE 0.25V
VOH
1.5V
GENERATOR 50Ω OUT 0
tDHZ

Figure 4. Driver Enable and Disable Times (tDZH, tDHZ)

VCC

RL = 110Ω
A VCC
S1
0 OR VCC DI D OUT 1.5V
DE tDZL, tDZL(SHDN) 0
B
tDLZ
DE VCC
OUT 1.5V
VOL 0.25V
GENERATOR 50Ω

Figure 5. Driver Enable and Disable Times (tDZL, tDLZ)

A
ATE VID R RO
B

Figure 6. Receiver Propagation Delay Test Circuit

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MAX14783E High-Speed 3.3V/5V RS-485/RS-422 Transceiver
with ±35kV HBM ESD Protection

A 1V

B -1V

tRPHL tRPLH
VOH

RO 1.5V 1.5V
VOL
tRSKEW = |tRPHL - tRPLH|

Figure 7. Receiver Propagation Delays

+1.5V S3 R S1
1kΩ VCC
-1.5V
VID R RO
S2
CL
15pF
RE

GENERATOR 50Ω

VCC VCC
S1 OPEN S1 CLOSED
RE 1.5V S2 CLOSED 1.5V S2 OPEN
0 S3 = +1.5V RE 0 S3 = -1.5V
tRZH, tRZH(SHDN)
tRZL, tRZL(SHDN)

RO VOH VCC
VCC VCC
2 2
0 RO VOL

VCC VCC
S1 OPEN S1 CLOSED
RE 1.5V S2 CLOSED 1.5V S2 OPEN
S3 = +1.5V S3 = -1.5V
0 RE 0
tRHZ tRLZ

RO VOH VCC
0.25V

0 RO 0.25V VOL

Figure 8. Receiver Enable and Disable Times

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MAX14783E High-Speed 3.3V/5V RS-485/RS-422 Transceiver
with ±35kV HBM ESD Protection

Typical Operating Characteristics

(VCC = +5V, TA = +25°C, unless otherwise specified.)

NO-LOAD SUPPLY CURRENT SHUTDOWN SUPPLY CURRENT

SUPPLY CURRENT vs. DATA RATE
vs. TEMPERATURE vs. TEMPERATURE
120
3.0 10

MAX14783E toc03
DE = VCC VCC = 5V, 54Ω LOAD
MAX14783E toc01

MAX14783E toc02
DE = VCC DE = GND
RE = GND 9 RE = VCC 100
2.5 VCC = 5V 8

SUPPLY CURENT (mA)

SUPPLY CURENT (mA)

SUPPLY CURENT (µA)

7 80
2.0 VCC = 3.3V, 54Ω LOAD
6
60
1.5 5
VCC = 3.3V 4 VCC = 5V 40 VCC = 5V, NO LOAD
1.0
3 VCC = 3.3V
2 20
0.5
1 VCC = 3.3V, NO LOAD
0
0 0 0 10 20 30 40
-40 -25 -10 5 20 35 50 65 80 95 110 125 -40 -25 -10 5 20 35 50 65 80 95 110 125
DATA RATE (Mbps)
TEMPERATURE (°C) TEMPERATURE (°C)

RECEIVER-OUTPUT HIGH VOLTAGE RECEIVER-OUTPUT LOW VOLTAGE DRIVER OUTPUT CURRENT

vs. OUTPUT CURRENT vs. OUTPUT CURRENT vs. DIFFERENTIAL OUTPUT VOLTAGE
5 5 160

MAX14783E toc06
MAX14783E toc04

MAX14783E toc05

OUTPUT SOURCING CURRENT OUTPUT SINKING CURRENT DRIVER OUTPUT CURRENT (mA)

4 4
OUTPUT HIGH VOLTAGE (V)

OUTPUT LOW VOLTAGE (V)

120

3 VCC = 5V 3
80 VCC = 5V
2 2

VCC = 3.3V VCC = 3.3V

40 VCC = 3.3V
1 1
VCC = 5V

0 0 0
0 -10 -20 -30 -40 -50 -60 0 10 20 30 40 50 60 0 1 2 3 4 5
OUTPUT CURRENT (mA) OUTPUT CURRENT (mA) DIFFERENTIAL OUTPUT VOLTAGE (V)

DIFFERENTIAL DRIVER OUTPUT DRIVER OUTPUT CURRENT

VOLTAGE vs. TEMPERATURE vs. OUTPUT HIGH VOLTAGE
5.0 -180
DIFFERENTIAL DRIVER OUTPUT VOLTAGE (V)

MAX14783E toc08
MAX14783E toc07

RL = 54Ω VCC = 5V
4.5 CL = 50pF -160
VCC = 5V
4.0 -140
OUTPUT CURRENT (mA)

3.5
-120
3.0
-100 VCC = 3.3V
2.5
-80
2.0
-60
1.5
VCC = 3.3V
1.0 -40

0.5 -20

0 0
-40 -25 -10 5 20 35 50 65 80 95 110 125 -7 -6 -5 -4 -3 -2 -1 0 1 2 3 4 5
TEMPERATURE (°C) OUTPUT HIGH VOLTAGE (V)

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MAX14783E High-Speed 3.3V/5V RS-485/RS-422 Transceiver
with ±35kV HBM ESD Protection

Typical Operating Characteristics (continued)

(VCC = +3.0V to +5.5V, TA = TMIN to TMAX, unless otherwise specified. Typical values are at VCC = +5V and TA = +25°C.) (Notes 1, 2)

DRIVER OUTPUT CURRENT DRIVER PROPAGATION DELAY DIFFERENTIAL DRIVER SKEW

vs. OUTPUT LOW VOLTAGE vs. TEMPERATURE vs. TEMPERATURE
180 30 10
MAX14783E toc09

MAX14783E toc11
MAX14783E toc10
VCC = 5V RL = 54Ω RL = 54Ω
160 CL = 50pF 9 CL = 50pF

DIFFERENTIAL DRIVER SKEW (ns)

25
DRIVER OUTPUT CURENT (mA)

140 8
PROPAGATION DELAY (ns)

tDPHL, VCC = 3.3V 7

120 20
tDPLH, VCC = 3.3V 6
100 VCC = 3.3V
15 5
80
4
60 10
3 VCC = 3.3V
tDPHL, VCC = 5V
40 2
5 tDPLH, VCC = 5V
20 1
VCC = 5V
0 0 0
0 2 4 6 8 10 12 -40 -25 -10 5 20 35 50 65 80 95 110 125 -40 -25 -10 5 20 35 50 65 80 95 110 125
OUTPUT LOW VOLTAGE (V) TEMPERATURE (°C) TEMPERATURE (°C)

DRIVER-OUTPUT RISE /FALL TIME DRIVER-OUTPUT TRANSITION SKEW RECEIVER PROPAGATION DELAY
vs. TEMPERATURE vs. TEMPERATURE vs. TEMPERATURE
8 3.0 20
MAX14783E toc12

RL = 54Ω
MAX14783E toc13

MAX14783E toc14
RL = 54Ω CL = 15pF
DRIVER-OUTPUT TRANSITION SKEW (ns)

CL = 50pF 18
DRIVER-OUTPUT RISE/FALL TIME (ns)

7 tHL, VCC = 3.3V CL = 50pF

2.5
16
tRPLH, VCC = 3.3V
PROPAGATION DELAY (ns)

6 tHL, VCC = 5V
14 tRPHL, VCC = 3.3V
2.0
5 12
4 1.5 10
VCC = 3.3V tRPHL, VCC = 5V
3 8
tLH, VCC = 5V 1.0
tLH, VCC = 3.3V 6
2 tRPLH, VCC = 5V
4
0.5
1 2
VCC = 5V
0 0 0
-40 -25 -10 5 20 35 50 65 80 95 110 125 -40 -25 -10 5 20 35 50 65 80 95 110 125 -40 -25 -10 5 20 35 50 65 80 95 110 125
TEMPERATURE (°C) TEMPERATURE (°C) TEMPERATURE (°C)

DRIVER/RECEIVER DIFFERENTIAL INPUT CAPACITANCE

PROPAGATION DELAY vs. FREQUENCY
MAX14783E toc15
30
MAX14783E toc16

VCC = 3.3V DE = GND

CL = 8pF 5V/div
DI
CAPACITANCE (pF)

20

A /B 2V/div

10
RO
5V/div

0
10ns/div 0 3 30
FREQUENCY (MHz)

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MAX14783E High-Speed 3.3V/5V RS-485/RS-422 Transceiver
with ±35kV HBM ESD Protection

Pin Configuration

TOP VIEW

VCC B A GND

8 7 6 5
+
RO 1 8 VCC

RE 2 7 B
MAX14783E MAX14783E

DE 3 6 A

*EP
+
DI 4 5 GND
1 2 3 4
RO RE DE DI
µMAX/SO
TDFN-EP
*CONNECT EXPOSED PAD (EP) TO GND

Pin Description
PIN NAME FUNCTION
1 RO Receiver Output. See Function Tables.
Receiver Output Enable. Drive RE low to enable RO. Drive RE high to disable the receiver. RO is high
2 RE
impedance when RE is high. Drive RE high and pull DE low to enter low-power shutdown mode.
Driver Output Enable. Drive DE high to enable the driver. Drive DE low to disable the driver. Driver
3 DE outputs are high-impedance when the driver is disabled. Drive RE high and pull DE low to enter low-
power shutdown mode.
Driver Input. With DE high, a low on DI forces the A output low and the B output high. Similarly, a high
4 DI
on DI forces the A output high and B output low.
5 GND Ground
6 A Noninverting RS-485/RS-422 Receiver Input and Driver Output
7 B Inverting RS-485/RS-422 Receiver Input and Driver Output
8 VCC Positive Supply Voltage Input. Bypass VCC with a 0.1µF ceramic capacitor to ground.
— EP Exposed Pad (TDFN only). Connect EP to GND.

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MAX14783E High-Speed 3.3V/5V RS-485/RS-422 Transceiver
with ±35kV HBM ESD Protection

Function Tables
TRANSMITTING
INPUTS OUTPUTS
MODE
RE DE DI B A
X 1 1 0 1 Active
X 1 0 1 0 Active
0 0 X High Impedance Driver Disabled
1 0 X High Impedance Shutdown

RECEIVING
INPUTS OUTPUTS
MODE
RE DE A-B RO
0 X ≥ -10mV 1 Active
0 X ≤ -200mV 0 Active
0 X Open/Shorted 1 Active
1 1 X High Impedance Receiver Disabled
1 0 X High Impedance Shutdown
X = Don’t care

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MAX14783E High-Speed 3.3V/5V RS-485/RS-422 Transceiver
with ±35kV HBM ESD Protection

Detailed Description Hot-Swap Capability

The MAX14783E is a 3.3V/5V ESD-protected RS-485/ Hot-Swap Inputs
RS-422 transceiver intended for high-speed, half-duplex When circuit boards are inserted in a hot or powered
communications. Integrated hot-swap functionality elimi- backplane, disturbances on the enable inputs and dif-
nates false transitions on the bus during power-up or hot ferential receiver inputs can lead to data errors. Upon
insertion. initial circuit board insertion, the processor undergoes its
The device features fail-safe receiver inputs guaranteeing power-up sequence. During this period, the processor
a logic-high receiver output when inputs are shorted or output drivers are high impedance and are unable to drive
open. The IC has a 1-unit load receiver input impedance, the DE and RE inputs of the MAX14783E to a defined
allowing up to 32 transceivers on the bus. logic level. Leakage currents up to 10µA from the high-
impedance outputs of a controller could cause DE and RE
True Fail Safe to drift to an incorrect logic state. Additionally, parasitic
The MAX14783E guarantees a logic-high receiver output circuit board capacitance could cause coupling of VCC
when the receiver inputs are shorted or open, or when or GND to DE and RE. These factors could improperly
they are connected to a terminated transmission line with enable the driver or receiver. The MAX14783E features
all drivers disabled. If the differential receiver input voltage integrated hot-swap inputs that help to avoid these poten-
(A–B) is greater than or equal to -10mV, RO is logic-high. tial problems.
Driver Single-Ended Operation When VCC rises, an internal pulldown circuit holds DE
The A and B outputs can either be used in the standard low and RE high. After the initial power-up sequence, the
differential operating mode, or can be used as single- pulldown circuit becomes transparent, resetting the hot-
ended outputs. Since the A and B driver outputs swing swap-tolerable inputs.
rail-to-rail, they can individually be used as standard TTL Hot-Swap Input Circuitry
logic outputs. The DE and RE enable inputs feature hot-swap capabil-
ity. At the input, there are two nMOS devices, M1 and M2
(Figure 9). When VCC ramps from 0V, an internal 10µs
timer turns on M2 and sets the SR latch that also turns

VCC

10µs
TIMER

TIMER

5kΩ (typ) DRIVER

DE ENABLE
(HOT SWAP)
100µA 500µA

M1 M2

Figure 9. Simplified Structure of the Driver Enable (DE) Pin

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MAX14783E High-Speed 3.3V/5V RS-485/RS-422 Transceiver
with ±35kV HBM ESD Protection

on M1. Transistors M2 (a 500µA current sink) and M1 (a ● ±35kV HBM

100µA current sink) pull DE to GND through a 5kΩ (typ) ● ±20kV using the Air-Gap Discharge method specified
resistor. M2 is designed to pull DE to the disabled state in IEC 61000-4-2
against an external parasitic capacitance up to 100pF that
can drive DE high. After 10µs, the timer deactivates M2 ● ±12kV using the Contact Discharge method specified
while M1 remains on, holding DE low against three-state in IEC 61000-4-2
leakages that can drive DE high. M1 remains on until an ESD Test Conditions
external source overcomes the required input current.
ESD performance depends on a variety of conditions.
At this time, the SR latch resets and M1 turns off. When
Contact Maxim for a reliability report that documents test
M1 turns off, DE reverts to a standard, high-impedance
setup, test methodology, and test results.
CMOS input. Whenever VCC drops below 1V, the hot-
swap input is reset. Human Body Model (HBM)
A complementary circuit employing two pMOS devices Figure 10 shows the HBM, and Figure 11 shows the cur-
pulls RE to VCC. rent waveform it generates when discharged into a low-
impedance state. This model consists of a 100pF capaci-
±35kV ESD Protection tor charged to the ESD voltage of interest, which is then
ESD protection structures are incorporated on all pins discharged into the test device through a 1.5kΩ resistor.
to protect against electrostatic discharges encountered
during handling and assembly. The driver outputs and IEC 61000-4-2
receiver inputs of the MAX14783E have extra protection The IEC 61000-4-2 standard covers ESD testing and per-
against static electricity. The ESD structures withstand formance of finished equipment. However, it does not spe-
high ESD in all states: normal operation, shutdown, and cifically refer to integrated circuits. The MAX14783E helps
powered down. After an ESD event, the MAX14783E in designing equipment to meet IEC 61000-4-2 without the
keeps working without latch-up or damage. need for additional ESD protection components.
ESD protection can be tested in various ways. The trans- The major difference between tests done using the HBM
mitter outputs and receiver inputs of the MAX14783E are and IEC 61000-4-2 is higher peak current in IEC 61000-
characterized for protection to the following limits: 4-2 because series resistance is lower in the IEC 61000-
4-2 model. Hence, the ESD withstand voltage measured
to IEC 61000-4-2 is generally lower than that measured
using the HBM.

RC RD PEAK-TO-PEAK RINGING
IP 100% IR
1MΩ 1.5kΩ (NOT DRAWN TO SCALE)
90%

CHARGE CURRENT- DISCHARGE

LIMIT RESISTOR RESISTANCE AMPERES

HIGH- DEVICE 36.8%

VOLTAGE CS STORAGE UNDER
DC 100pF CAPACITOR TEST 10%
SOURCE 0
0 TIME
tRL
tDL
CURRENT WAVEFORM

Figure 10. Human Body ESD Test Model Figure 11. Human Body Current Waveform

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MAX14783E High-Speed 3.3V/5V RS-485/RS-422 Transceiver
with ±35kV HBM ESD Protection

Figure 12 shows the IEC 61000-4-2 model, and Figure RE and DE can be connected together and driven simul-
13 shows the current waveform for IEC 61000-4-2 ESD taneously. The MAX14783E is guaranteed not to enter
Contact Discharge test. shutdown if RE is high and DE is low for less than 50ns.
If the inputs are in this state for at least 800ns (max), the
Applications Information device is guaranteed to enter shutdown.
Driver Output Protection Typical Applications
Two mechanisms prevent excessive output current and The MAX14783E transceiver is designed for bidirectional
power dissipation caused by faults or by bus connec- data communications on multipoint bus transmission
tion. The first, a current limit on the output stage provides lines. Figure 14 shows a typical network application cir-
immediate protection against short circuits over the whole cuit. To minimize reflections, terminate the line at both
common-mode voltage range. The second, a thermal-shut- ends with its characteristic impedance and keep stub
down circuit, forces the driver outputs into a high-imped- lengths off the main line as short as possible.
ance state if the die temperature exceeds +160°C (typ).
Low-Power Shutdown Mode
Low-power shutdown mode is initiated by bringing RE
high and DE low. In shutdown, the devices draw less than
10µA of supply current.

RC RD I
50MΩ TO 100MΩ 330Ω 100%
90%
CHARGE CURRENT- DISCHARGE
LIMIT RESISTOR RESISTANCE
IPEAK

HIGH- DEVICE
VOLTAGE CS STORAGE UNDER
DC 150pF CAPACITOR TEST
SOURCE 10%

tR = 0.7ns TO 1ns t
30ns
60ns

Figure 12. IEC 61000-4-2 ESD Test Model Figure 13. IEC 61000-4-2 ESD Generator Current Waveform

120Ω 120Ω
DE
B B
DI
D D
DI
DE A B A B A A

RO R R RO
RE RE

R R
D D
MAX14783E

DI DE RO RE DI DE RO RE

Figure 14. Typical Half-Duplex RS-485 Network

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MAX14783E High-Speed 3.3V/5V RS-485/RS-422 Transceiver
with ±35kV HBM ESD Protection

Ordering Information
PART SUPPLY RANGE DATA RATE (MAX) TEMP RANGE PIN-PACKAGE

MAX14783EEUA+ 3.0V to 5.5V 30Mbps -40°C to +85°C 8 µMAX

MAX14783EESA+ 3.0V to 5.5V 40Mbps -40°C to +85°C 8 SO
MAX14783EATA+ 3.0V to 5.5V 42Mbps -40°C to +125°C 8 TDFN-EP*
3.0V to 3.6V 42Mbps
MAX14783EASA+ -40°C to +125°C 8 SO
3.0V to 5.5V 16Mbps
3.0V to 3.6V 42Mbps
MAX14783EAUA+ -40°C to +125°C 8 µMAX
3.0V to 5.5V 6Mbps
+Denotes lead(Pb)-free/RoHS-compliant package.
*EP = Exposed paddle.

Chip Information
PROCESS: BiCMOS

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MAX14783E High-Speed 3.3V/5V RS-485/RS-422 Transceiver
with ±35kV HBM ESD Protection

Revision History
REVISION REVISION PAGES
DESCRIPTION
NUMBER DATE CHANGED
0 6/13 Initial release —
1 1/15 Updated page 1 content 1
2 7/20 Updated the Benefits and Features and Electrical Characteristics sections 1, 3

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Maxim Integrated cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim Integrated product. No circuit patent licenses
are implied. Maxim Integrated reserves the right to change the circuitry and specifications without notice at any time. The parametric values (min and max limits)
shown in the Electrical Characteristics table are guaranteed. Other parametric values quoted in this data sheet are provided for guidance.

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