Integrated Circuit Design: Master of Science
Integrated Circuit Design: Master of Science
MASTER OF SCIENCE
Integrated
Circuit Design
www.tum-asia.edu.sg
At a Glance
and worldwide
The Technical University of Munich (TUM) was founded in With the changing needs of the economy, the specialised
1868 and is one of Europe’s leading technical universities. Master programmes that are offered keep pace with
Serving as an entrepreneurial university that promotes industry needs through an Asian-European perspective.
talents and creates value for society, TUM has produced Lecturers and professors hail from as far as Germany to
17 Nobel Prize winners since 1927, most notably Ernst Otto equip students with their rich knowledge and experience.
Fischer (Chemistry) and Rudolf Mößbauer (Physics). Its
focus areas are engineering sciences, natural sciences, More than a thousand students have come through the
life sciences, medicine, management and political and doors of TUM Asia and now ply their trades in top research
social sciences. institutes and companies across the globe.
TUM promotes talents with its network of strong partners Nanyang Technological University (NTU)
in research and industry. It is represented worldwide with
the TUM Asia campus in Singapore, as well as offices in Inaugurated in 1991, Nanyang Technological University
Beijing, Brussels, Cairo, Mumbai, San Francisco and São (NTU) has grown to become a full-fledged research
Paulo. university and has been ranked the world’s best young
university (under 50 years old) by Quacquarelli Symonds
In international rankings, TUM regularly places among for the sixth consecutive year in 2019.
the best universities in Germany and worldwide. It is the
only university to have won recognition as a German NTU’s academic and research programmes, which bear
‘Excellence University’ in every round since 2006. strong real-world relevance, have garnered strong
support from major corporations and industry leaders. As
the main Science and Technology university in Singapore,
NTU has made substantial contributions to Singapore’s
drive for research and innovation.
NO.
1
university
TUM is ranked as
the no. 1 University
in Germany+
6
TUM ranked no.
NO.
6 in the Global
Employability
in employability
Survey^
17 17 scientists and
Master of Science | Integrated Circuit Design
alumni of TUM
Nobel Prize have received the
recipients Nobel Prize
50
+
As rated by QS World Ranking 2015 -2019 and Academic Ranking
TUM is ranked of World Universities (Shanghai ranking) 2011 - 2013, 2016
As ranked in the 2018 & 2019 Global University Employability
among the world’s
^
Awarded by TUM and NTU, the Master of Science in Integrated Circuit Design
(MSc in ICD) equips students with the academic proficiency and hands-on
knowledge required in the design, development, and manufacture of integrated
circuit and integrated electronic products.
14 45
• 6 Core Technical Electives
for every Core and
• 4 Specialisation Technical Electives
Specialisation Elective
• 2 Non-Technical Elective Modules
Module
modules • 2 Lab Courses contact hours
Note: This outline is a general reference to the duration of study. A student’s actual duration of study may or may not follow this general reference. This outline is subject
to change during the course timetable.
Programme
Modules
Compulsory Laboratory Digital Signal Processing of long channel and short channel
Introduction to Discrete Fourier MOSFETs, hot carrier effects; short
Modules transform (DFT) and fast Fourier channel effects, scaling rules; basics
transform (FFT). Z transform. Digital of charge carrier transport (quantum
Laboratory 1 Analog IC Design
filters. Linear prediction and optimum mechanical, hydro dynamics,
Introduction to Cadence design tools;
linear filters. Power spectrum ballistics); proposed new MOSFET
CMOS high speed analog circuits; HF
estimation. structures (strain engineering, metal-
characteristics of CMOS Transistors
gate, high-k, vertical MOSFETs,
and more.
IC Packaging double gate MOSFETs); hot electron
Plastic Packaging Materials transistors; tunneling transistors; low
Laboratory 2 Digital IC Design
Manufacturing Processes for Plastic dimensional devices; single electron
Synchronous digital circuit concept;
Encapsulated Microelectronics. State- transistors, single electron memories,
description of sequential and
of-the-art Packaging Techniques. quantum electronics.
combinational logic cells; basic
Failure Mechanisms, Sites, and Modes.
components of digital circuits; state
Qualification Process. Accelerated Design for Testability of VLSI
machines; simulation; synthesis, static
Testing for Packaging. Effects Fault Models and Testability concepts.
timing analysis; implementation and
of Packaging on the Electrical Test Generation and Fault Simulation
testing.
Performance. Future Trends and Algorithms. Shift-register polynomial
Challenges in Packaging. division. Pseudo-random sequence
Core Technical Elective generators. Special purpose shift-
Mixed Signal Circuit Design register circuits. Random pattern BIST.
Modules Specifics of semiconductor process Build-in boundary scan structure.
(Choose 6 out of 7 modules)
technology and devices for the building Limitations and other concerns of
of integrated circuits. Transistor level random pattern test. Test techniques
Analog IC Design
circuits and the implementation in for automatic test equipment.
Review of fundamentals: Noise,
CMOS technology: amplifier, current
Modeling, Analog Building Blocks,
and voltage reference, power supply Embedded Systems
Components Layout, Switched
as well as clock generation, regulation The lectures cover the topics: Basics
Capacitor Circuits, Current Mode
and distribution, A/D and D/A of embedded processor architectures;
Circuits, Transconductors, Auto-
converters. Bus and memory architectures;
tuning, Gm-C and MOSFET-C Filters,
Performance/Timing analysis of
Continuous-Time Filters, Switch
System-on-Chip Solutions & embedded systems; Models for real-
Current Circuits and Class D Amplifiers.
Architecture time systems; Principles of embedded
Basics of CMOS integrated circuits software development; Basic real-time
Design Methodology & Automation
from a system´s perspective: From programming language concepts (e.g.
Computer-aided design of primarily
MOSFET transistor to realization of Esterel); real-time operating systems;
digital integrated circuits; VLSI design
combinatorial/sequential logic, Finite Power management; Design space
flow; Overview of system level,
State Machines (FSM), SRAM, DRAM, exploration.
algorithmic level, register transfer
FLASH, FPGA, CPU core building blocks.
level, logic level, and circuit level
Packaging and I/O technology; System IC Marketing / Business
VLSI design methods. Focus on: logic
modelling; Projection of IC technology Management
synthesis, digital simulation, testing.
scaling and implementation Trends in the IC industry: technology
Techniques from discrete mathematics
alternatives; Moore´s law and what it and manufacturing trends, demand
and computer science. Emphasis
will mean for different IC technologies applications and product trends.
is placed on techniques that are
today and in future. Market characteristics: the customers,
applicable to very complex, industrially
business cycles, demand lead and
Master of Science | Integrated Circuit Design
relevant circuits.
supply lag (the bull-whip effect),
Specialisation Technical IC industry, supply and value
Digital IC Design
Review of integrated circuit
Elective Modules* chain, stakeholders, geographical
(Choose 4 out of 7 modules) distribution of excellence centres,
fundamentals: Layout and design
technology centres, design centres,
issues, CMOS digital circuits,
Advanced MOSFET & Novel Devices fabrication centres, the disintegration
BiCMOS digital circuits, Sub-system
Historical development of of the value chain and outsourcing
design in digital circuits and Design
mainstream MOSFETs until today; trends. Managing the marketing
methodologies.
economical, technological and function: the sources of product
physical fundamentals; properties ideas, the role of standards, formats,
and intellectual property. Strategic
partnership, distributorship, demand Modern Developments in Industry
forecast, matching supply with
Non-Technical The module will provide insights in the
demand. Elective Modules core elements of Industry 4.0 such as:
(Choose 2 out of 6 modules) introduction to Cyber-Physical System,
Nano-Electronics Radio Frequency Identification (RFID)
Low dimensional structures: quantum Business Administration technologies, information collection
wells, quantum wires and quantum The primary purpose of the module is with intelligent sensors, industrial
dots. Electronic, optical, transport to introduce students to the different networking to connect the machines
properties of nanostructures. Quantum areas of business administration with and processes together, Manufacturing
semiconductor devices. Fabrication the final objective to give them a Execution System (MES) for order
and characterisation techniques basic understanding of how to face management, production control and
of nanotechnology. Applications decision problems in a company. Most value adding to the complete supply
of nanostructures, nanodevices importantly, we will analyse long-term chain management.
and nanosystems. The bottom- investment decisions, how to set up
up approach to nanotechnology: strategic planning in a company, how Production Planning In Industry
to gather timely information about the Manufacturers are confronted
introduction to molecular electronics
current situation of a company, and with special requirements of their
and optoelectronics. Organic
how to set up its long-term financial production processes. Cycles, by-
materials for
structure. products, batches and campaigns
electronics: self-assembled
are difficult to handle by Enterprise
monolayers, conducting polymers,
Industrial Marketing Resource Planning (ERP) software
carbon nanotubes. Circuit
Marketing strategies are developed packages nowadays. Concepts of
implementations and architectures
for a typical commodity and speciality material requirements planning,
for nanostructures: quantum cellular
business. Students will work in teams supply chain management (SCM)
automata and cellular non-linear
to develop business cases, make their combined with basics in cost
networks. Introduction to quantum own business decisions and develop accounting will be explained.
computing. marketing concepts based on provided
information of a real case study.
RF IC Design
System design considerations, Innovation and Technology
CMOS RF components and devices, Management
Low-noise amplifier (LNA), Mixers, This module presents the dynamics
Voltagecontrolled oscillators (VCOs), of technological development
RF power amplifiers, Phase-Locked through innovation and the related
Loops and Frequency Synthesizers. management issues, the difference
between creating a new product
Simulation and Optimisation of (invention) and improving an existing
Analog Circuits product/idea (innovation), start-
Principles of circuit simulation: ups and financing of innovation,
DC/AC/TR analysis. Basic analog innovation-driven economic cycles
optimization tasks: worst-case and innovation impact on growth and
analysis, yield analysis, nominal jobs.
design and design centring. Basic
principles of optimisation: optimality International Intellectual Property
conditions, line search, Nelder-Mead Law
method, Newton approach, Conjugate This module will give a brief
Gradient approach, Quadratic introduction to intellectual property
Programming and Sequential rights and focus on insights into
Quadratic Programming. Structural general principles of patent law and
analysis of analog circuits. international conventions governing
the patent law. Current developments
and criticism of the current patent *Disclaimer: Elective modules available for selection
law system will also be addressed. In are subject to availability. Unforeseen circumstances
addition, practical (legal) aspects of that affect the availability of the module include an
insufficient number of students taking up the module
the commercialisation of patents will
and/or the unavailability of the professor. TUM Asia
be dealt with. reserve the right to cancel or postpone the module
under such circumstances.
The TUM
Experience
The Integrated Circuit
Design programme
offered a module
that was related to
intellectual property
and invited a German
professional patent
attorney to teach it. The
module opened a new
window for me and
helped me to discover a
career path that I was
passionate about.
Minghui Sun
Alumni
Master of Science
in Integrated Circuit Design
20
semiconductor industries in Asia Pacific.
Industry
Some of the world’s biggest pure-play
foundries have manufacturing facilities
breakdown
here, as do many other top outsourced of our
semiconductor assembly and
semiconductor assembly and test graduates test operations.
companies. Beyond semiconductors,
Singapore is also a key node in the
global supply chain for products
ranging from storage and memory In 2015, Singapore’s Electronics
products, to microelectromechanical industry achieved an output of
systems (MEMS). These manufacturers over
$64.8 billion
are supported by a rich ecosystem of
Semiconductor 60%
leading materials and equipment and
Computing and IT 14%
electronics manufacturing services
Academic 9%
players. Looking ahead, the Electronics
Electronics 8% This accounts for 31.6% of
Industry Transformation Map (ITM)
Research 5% Singapore’s total manufacturing
aims to grow the sector by transforming
Integrated Circuit Products 2% output.
companies through productivity,
Others 2%
automation, and upgrading the
manufacturing product mix.
Source: Singapore Economic Development Board The Singapore industry trains
over
13,000
Our Graduates engineers and technicians
regularly to ensure a steady
Our graduates in Integrated Circuit Design are employed all over the stream of talent to the industry
world, with a majority in Singapore, China and Europe.
2% - 5%
Product Development Engineer.
Processing Fee
SGD79 per application
Tuition Fee
SGD42,800+
+
The tuition fee includes teaching fees,
• Bachelor Degree in Electrical or Electronics Engineering or a closely laboratory expenses and cost of mandatory
related discipline events. The tuition fee does not include
airfare, accommodation, living expenses, and
• Bachelor Degree certificate or enrolment letter* miscellaneous fees (registration, IT facilities,
(if you have not completed your Bachelor Degree) matriculation, examination, amenities, copy
• Academic transcripts or mark sheets* right, sports, insurance and medical).
Technical University of Munich (TUM) Asia All information is accurate at the time of printing
510 Dover Road, #05-01 SIT@SP Building, Singapore 139660 and is subject to change without prior notice.
Tel: +65 6777 7407 Published in January 2020.
Fax: +65 6777 7236
Email: [email protected] www.tum-asia.edu.sg