INTEGRATED CIRCUITS

DATA SHEET

PCF8833
STN RGB - 132 × 132 × 3 driver
Objective specification 2003 Feb 14
Philips Semiconductors Objective specification

STN RGB - 132 × 132 × 3 driver PCF8833

CONTENTS 10 LIMITING VALUES

11 HANDLING
1 FEATURES
12 DC CHARACTERISTICS
2 GENERAL DESCRIPTION
13 AC CHARACTERISTICS
3 ORDERING INFORMATION
14 APPLICATION INFORMATION
4 BLOCK DIAGRAM
14.1 Supply and capacitor connection configuration
5 PINNING
15 MODULE MAKER PROGRAMMING
6 INSTRUCTIONS
15.1 VLCD calibration
6.1 Exit commands
15.2 Factory defaults
6.2 Function set
15.3 Seal bit
7 FUNCTIONAL DESCRIPTION 15.4 OTP architecture
7.1 MPU interfaces 15.5 Interface commands
7.2 Display data RAM and access arbiter 15.6 Suggestion on how to calibrate VLCD2 using
7.3 Command decoder MMVOP
7.4 Grey scale controller 15.7 Example of filling the shift register
7.5 Timing generator 15.8 Programming flow
7.6 Oscillator 15.9 Programming specification
7.7 Reset 16 INTERNAL PROTECTION CIRCUITS
7.8 LCD voltage generator and bias level generator
17 BONDING PAD INFORMATION
7.9 Column drivers, data processing and data
latches 18 TRAY INFORMATION
7.10 Row drivers 19 DATA SHEET STATUS
8 PARALLEL INTERFACE 20 DEFINITIONS
8.1 8080-series 8-bit parallel interface 21 DISCLAIMERS
9 SERIAL INTERFACE
9.1 Write mode
9.2 Read mode

2003 Feb 14 2
Philips Semiconductors Objective specification

STN RGB - 132 × 132 × 3 driver PCF8833

1 FEATURES • Analog supply voltage range for VLCD generation VDD2

to VSS2:
• Single chip LCD controller and driver
– 2.4 to 4.5 V.
• 132 rows and 396 column outputs (132 × RGB)
• Analog supply voltage range for reference voltage
• Low cross talk by Frame Rate Control (FRC)
generation VDD3 to VSS1:
• 4 kbyte colours (RGB) = 4 : 4 : 4 mode
– 2.4 to 3.5 V.
• 256 colours (RGB) = 3 : 3 : 2 mode using the 209 kbit
• Display supply voltage range VLCD to VSS1:
RAM and a Look-Up Table (LUT)
– 3.8 to 20 V.
• 65 kbyte colours (RGB) = 5 : 6 : 5 mode using the
209 kbit RAM with dithering • Low power consumption; suitable for battery operated
systems
• 8 colours Power-save mode
• CMOS compatible inputs
• Display data RAM 132 × 132 (RGB) (4 kbyte colour)
• Manufactured in silicon gate CMOS process
• Interfaces:
• Optimized layout for COF, Chip On Glass (COG) and
– 3-line serial interface
Transformer Coupled Plasma (TCP) assembly.
– 8-bit 8080 Intel CPU interface.
• Display features: 2 GENERAL DESCRIPTION
– Area scrolling
The PCF8833 is a single chip low power CMOS LCD
– 32-line partial Display mode controller driver, designed to drive colour Super-Twisted
– Software programmable colour depth mode Nematic (STN) displays of 132 rows and 132 RGB
– N-line inversion for low cross talk. columns. All necessary functions for the display are
provided in a single chip, including display RAM which has
• On-chip: a capacity of 209 kbit (132 × 12-bit × 132). The PCF8833
– Oscillator for display system, requires no external uses the Multiple Row Addressing (MRA) driving
components (external clock also possible) technique in order to achieve the best optical performance
– Generation of VLCD at the lowest power consumption. The PCF8833 offers
2 types of microcontroller interfaces namely the
– Segmented temperature compensation of VLCD and
8080 system interface and the 3-line serial interface.
frame frequency.
• Logic supply voltage range VDD1 to VSS1:
– 1.5 to 3.3 V.

3 ORDERING INFORMATION

PACKAGE
TYPE NUMBER
NAME DESCRIPTION VERSION
PCF8833U/2DA/1 − chip with bumps in tray −

2003 Feb 14 3
Philips Semiconductors Objective specification

STN RGB - 132 × 132 × 3 driver PCF8833

4 BLOCK DIAGRAM

handbook, full pagewidth C0 to C395 R0 to R131

34 to 429 2 to 33, 430 to 461,

464 to 495, 733 to 768

VLCDIN2 713, 719

731, 732
V2H
729, 730 LCD BIAS
V1H ROW
724 to 728 LEVEL COLUMN DRIVERS
VC DRIVERS
722, 723 GENERATOR
V1L
720, 721
V2L

VLCDSENSE 712 DATA PROCESSING

VLCDOUT1 674 to 683 ORTHOGONAL
VLCDIN1 684 to 690 FUNCTION
703 to 711 GENERATOR
VLCDOUT2
DATA LATCHES
VDD2 530 to 539
626 to 631 496
C1+ RESET RES
632 to 637
C1−
638 to 643 LCD 555
C2+ OSCILLATOR OSC
644 to 649 VOLTAGE
C2− GENERATOR
650 to 655 DISPLAY DATA RAM
C3+
C3−
656 to 661 132 × 132 × 12-bits TIMING
662 to 667 GENERATOR
C4+
668 to 673
C4− 578
691 to 696 T1
C5+ GREYSCALE 577
697 to 702 T2
C5− CONTROLLER 576
508 to 517 T3
VSS2
575
T4
X AND Y RAM WRITE DISPLAY ADDRESS
VOTP(gate) 565 to 572 574
ADDRESS COUNTER READ COUNTER T5
557 to 564 COMMAND 573
VOTP(drain) T6
ARBITER DECODER 625
T7
VDD3 525 to 529

VDD1 519 to 524

498 to 507 PCF8833
VSS1

256/64 KBYTES
256
TO 4 KBYTES
COLOUR MPU INTERFACES
COLOUR
LUT
MAPPING

556 579, 624 518 549 551 550 552 553 554 548 547 545 543 541 546 544 542 540 497

CS/SCE RD PS0 PS2 D0/SDIN D2 D4 D6 TE

VDD(tieoff) VSS(tieoff)
D/C/SCLK WR PS1 SDOUT D1 D3 D5 D7 MGU910

Fig.1 Block diagram.

2003 Feb 14 4
Philips Semiconductors Objective specification

STN RGB - 132 × 132 × 3 driver PCF8833

5 PINNING

SYMBOL PAD TYPE DESCRIPTION

R95 to R64 2 to 33 O LCD row driver outputs
C0 to C395 34 to 429 O LCD column driver outputs
R0 to R31 430 to 461 O LCD row driver outputs
R63 to R32 464 to 495 O LCD row driver outputs
RES 496 I external reset; this signal will reset the device and must be applied to properly
initialize the chip (active LOW)
TE 497 O/I tearing line (in Normal mode it is always an output)
VSS1 498 to 507 PS system ground
VSS2 508 to 517 PS system ground
CS/SCE 518 I chip select parallel interface or serial chip enable (active LOW)
VDD1 519 to 524 PS logic supply voltage
VDD3 525 to 529 PS VDD2 and VDD3 are the supply voltage pins for the internal voltage generator
VDD2 530 to 539 PS including the temperature compensation circuits; VDD2 and VDD3 can be
connected together but in this case care must be taken to respect the supply
voltage range (see Chapter 13); VDD1 is used as the supply for the rest of the
chip. VDD1 can be connected together with VDD2 and VDD3 but in this case care
must also be taken to respect the supply voltage range; see Chapter 13. VDD2
and VDD3 must not be applied before VDD1.
If the internal voltage generator is not used, pins VDD2 and VDD3 must be
connected to VDD1.
D7 540 I/O 8-bit parallel data; in Serial mode tie to VSS1 or VDD1
D3 541 I/O 8-bit parallel data; in Serial mode tie to VSS1 or VDD1
D6 542 I/O 8-bit parallel data; in Serial mode tie to VSS1 or VDD1
D2 543 I/O 8-bit parallel data; in Serial mode tie to VSS1 or VDD1
D5 544 I/O 8-bit parallel data; in Serial mode tie to VSS1 or VDD1
D1 545 I/O 8-bit parallel data; in Serial mode tie to VSS1 or VDD1
D4 546 I/O 8-bit parallel data; in Serial mode tie to VSS1 or VDD1
D0/SDIN 547 I/O 8-bit parallel data or serial data input
SDOUT 548 O serial data output; in Parallel mode tie to VDD1, VSS1 or D0
D/C/SCLK 549 I data/command indicator parallel interface or serial clock
WR 550 I write clock parallel interface; in Serial mode tie to VDD1 (active LOW)
RD 551 I read clock parallel interface; in Serial mode tie to VDD1 (active LOW)
PS0 552 I set serial or parallel interface mode PS1 and PS2 must tied to either VSS1 or
VDD1
PS1 553 I set serial or parallel interface mode PS1 and PS2 must tied to either VSS1 or
VDD1
PS2 554 I set serial or parallel interface mode PS1 and PS2 must tied to either VSS1 or
VDD1

2003 Feb 14 5
Philips Semiconductors Objective specification

STN RGB - 132 × 132 × 3 driver PCF8833

SYMBOL PAD TYPE DESCRIPTION

OSC 555 I oscillator input or external oscillator resistor connection; when the on-chip
oscillator is used this input must be connected to VDD1; an external clock signal,
if used, is connected to this input and the internal oscillator must be switched off
with a software command; if the oscillator and external clock are all inhibited by
connecting pin OSC to VSS1, the display is not clocked and may be left in a
DC state; to avoid this the chip should always be put into Power-down mode
before stopping the clock.
VDD(tieoff) 556 O can be used to tie inputs to VDD1
VOTP(drain) 557 to 564 PS supply voltage for OTP programming (write voltage), in Application mode must
be tied to VSS1 or left open-circuit
VOTP(gate) 565 to 572 PS supply voltage for OTP programming, in Application mode must be tied to VSS1
or left open-circuit
T6 573 I test pin; not accessible to user; must be connected to VSS1
T5 574 I test pin; not accessible to user; must be connected to VSS1
T4 575 O test pin; not accessible to user; must be left open-circuit
T3 576 O test pin; not accessible to user; must be left open-circuit
T2 577 I/O test pin; not accessible to user; must be also connected to VSS1
T1 578 I/O test pin; not accessible to user; must be also connected to VSS1
VSS(tieoff) 579 O can be used to tie inputs to VSS1
VSS(tieoff) 624 O can be used to tie inputs to VSS1
T7 625 I/O test pin; not accessible to user; must be connected to VSS1
C1+ 626 to 631 I positive input pump capacitor voltage multiplier 1
C1− 632 to 637 I negative input pump capacitor voltage multiplier 1
C2+ 638 to 643 I positive input pump capacitor voltage multiplier 1
C2− 644 to 649 I negative input pump capacitor voltage multiplier 1
C3+ 650 to 655 I positive input pump capacitor voltage multiplier 1
C3− 656 to 661 I negative input pump capacitor voltage multiplier 1
C4+ 662 to 667 I positive input pump capacitor voltage multiplier 1
C4− 668 to 673 I negative input pump capacitor voltage multiplier 1
VLCDOUT1 674 to 683 O output voltage multiplier 1
VLCDIN1 684 to 690 PS LCD supply input voltage 1
C5+ 691 to 696 I positive input pump capacitor voltage multiplier 2
C5− 697 to 702 I negative input pump capacitor voltage multiplier 2
VLCDOUT2 703 to 711 O output voltage multiplier 2
VLCDSENSE 712 I voltage multiplier regulation input; must be connected to VLCDOUT2
VLCDIN2 713 to 719 PS LCD supply input voltage 2
V2L 720, 721 O LCD bias level
V1L 722, 723 O LCD bias level
VC 724 to 728 O LCD bias level
V1H 729, 730 O LCD bias level

2003 Feb 14 6
Philips Semiconductors Objective specification

STN RGB - 132 × 132 × 3 driver PCF8833

SYMBOL PAD TYPE DESCRIPTION

V2H 731, 732 O LCD bias level
R96 to R131 733 to 768 O LCD row driver outputs
Dummy 1, 462, 463,
580 to 623,
769

6 INSTRUCTIONS
The PCF8833 communicates with the host using an 8-bit parallel interface or a 3-line serial interface. Processing of
instructions and data sent to the interface do not require the display clock. The display clock and interface clock are
independent from each other. The display clock is derived from the built-in oscillator.
The PCF8833 has 2 types of accesses; those defining the operating mode of the device (instructions) and those filling
the display RAM. Since writing to the RAM occurs more frequently, efficient data transfer is achieved by
autoincrementing the RAM address pointers.
There are 3 types of instructions:
1. For defining display configuration
2. For setting X and Y addresses
3. Miscellaneous.
Commands in the range of 00H to AFH not defined in Table 1 and command DDH have the same effect as no operation
(NOP).
All commands in range B0H to B9H and DEH to FFH are forbidden.

2003 Feb 14 7
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2003 Feb 14 Table 1 Command table; note 1

Philips Semiconductors
STN RGB - 132 × 132 × 3 driver
D/C 7 6 5 4 3 2 1 0 DEFAULT OTP DESCRIPTION SECTION
0 0 0 0 0 0 0 0 0 00H − no operation (NOP) 6.2.1
0 0 0 0 0 0 0 0 1 01H − software reset (SWRESET) 6.2.3
0 0 0 0 0 0 0 1 0 02H − booster voltage off (BSTROFF) 6.2.4
0 0 0 0 0 0 0 1 1 03H − booster voltage on (BSTRON) 6.2.5
0 0 0 0 0 0 1 0 0 04H − read display identification 6.2.6
(RDDIDIF)
0 0 0 0 0 1 0 0 1 09H − read display status (RDDST) 6.2.7
0 0 0 0 1 0 0 0 0 10H − Sleep_IN 6.2.8
0 0 0 0 1 0 0 0 1 11H − Sleep_OUT 6.2.9
0 0 0 0 1 0 0 1 0 12H − Partial mode on (PTLON) 6.2.10
0 0 0 0 1 0 0 1 1 13H − normal Display mode on 6.2.11
(NORON)
0 0 0 1 0 0 0 0 0 20H − display inversion off (INVOFF) 6.2.12
0 0 0 1 0 0 0 0 1 21H − display inversion on (INVON) 6.2.13
0 0 0 1 0 0 0 1 0 22H − all pixel off (DALO) 6.2.14
8

0 0 0 1 0 0 0 1 1 23H − all pixel on (DAL) 6.2.15

0 0 0 1 0 0 1 0 1 25H − set contrast (SETCON) 6.2.16
1 X VCON6 VCON5 VCON4 VCON3 VCON2 VCON1 VCON0 00H − set contrast 6.2.16
0 0 0 1 0 1 0 0 0 28H − display off (DISPOFF) 6.2.17
0 0 0 1 0 1 0 0 1 29H − display on (DISPON) 6.2.18
0 0 0 1 0 1 0 1 0 2AH − column address set (CASET) 6.2.19
1 xs[7] xs[6] xs[5] xs[4] xs[3] xs[2] xs[1] xs[0] 02H − X address start; 0 ≤ xs ≤ 83H 6.2.19
1 xe[7] xe[6] xe[5] xe[4] xe[3] xe[2] xe[1] xe[0] 81H − X address end; xs ≤ xe ≤ 83H 6.2.19
0 0 0 1 0 1 0 1 1 2BH − page address set (PASET) 6.2.20
1 ys[7] ys[6] ys[5] ys[4] ys[3] ys[2] ys[1] ys[0] 02H − Y address start; 0 ≤ ys ≤ 83H 6.2.20
1 ye[7] ye[6] ye[5] ye[4] ye[3] ye[2] ye[1] ye[0] 81H − Y address end; ys ≤ ye ≤ 83H 6.2.20

Objective specification
0 0 0 1 0 1 1 0 0 2CH − memory write (RAMWR) 6.2.21
−

PCF8833
1 D7 D6 D5 D4 D3 D2 D1 D0 XXH write data 6.2.21
0 0 0 1 0 1 1 0 1 2DH − colour set (RGBSET) 6.2.22
1 X X X X R3 R2 R1 R0 00H − red tone 000 6.2.22
1 6 bytes for 6 red tones − 6 red tones 6.2.22
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2003 Feb 14

Philips Semiconductors
D/C 7 6 5 4 3 2 1 0 DEFAULT OTP DESCRIPTION SECTION

STN RGB - 132 × 132 × 3 driver

1 X X X X R3 R2 R1 R0 0FH − red tone 111 6.2.22
1 X X X X G3 G2 G1 G0 00H − green tone 000 6.2.22
1 6 bytes for 6 green tones − 6 green tones 6.2.22
1 X X X X G3 G2 G1 G0 0FH − green tone 111 6.2.22
1 X X X X B3 B2 B1 B0 00H − blue tone 00 6.2.22
1 2 bytes for 2 blue tones − 2 blue tones 6.2.22
1 X X X X B3 B2 B1 B0 0FH − blue tone 11 6.2.22
0 0 0 1 1 0 0 0 0 30H − partial area (PTLAR) 6.2.23
1 AA1S7 AA1S6 AA1S5 AA1S4 AA1S3 AA1S2 AA1S1 AA1S0 00H − PTLAR active area start address 6.2.23
1 AA1E7 AA1E6 AA1E5 AA1E4 AA1E3 AA1E2 AA1E1 AA1E1 1FH − PTLAR active area end address 6.2.23
0 0 0 1 1 0 0 1 1 33H − vertical scroll definition 6.2.24
(VSCRDEF)
1 TF7 TF6 TF5 TF4 TF3 TF2 TF1 TF0 00H − top fixed area 6.2.24
1 SA7 SA6 SA5 SA4 SA3 SA2 SA1 SA0 82H − scroll area 6.2.24
1 BF7 BF6 BF5 BF4 BF3 BF2 BF1 BF0 00H − bottom fixed area 6.2.24
0 0 0 1 1 0 1 0 0 34H − tearing line off (TEOFF) 6.2.25
9

0 0 0 1 1 0 1 0 1 35H − tearing line on (TEON) 6.2.26

1 X X X X X X X X 00H − 6.2.26
0 0 0 1 1 0 1 1 0 36H − memory data access control 6.2.27
(MADCTL)
1 MY MX V LAO RGB X X X 00H − RAM data addressing/data 6.2.27
control
0 0 0 1 1 0 1 1 1 37H − set Scroll Entry Point (SEP) 6.2.24
1 SEP7 SEP6 SEP5 SEP4 SEP3 SEP2 SEP1 SEP0 00H − scroll entry point 6.2.24
0 0 0 1 1 1 0 0 0 38H − Idle mode off (IDMOFF) 6.2.28
0 0 0 1 1 1 0 0 1 39H − Idle mode on (IDMON) 6.2.29
0 0 0 1 1 1 0 1 0 3AH − interface pixel format (COLMOD) 6.2.30

Objective specification
1 X X X X X P2 P1 P0 03H − colour interface format 6.2.30
x (2) set VOP (SETVOP) 6.2.31

PCF8833
0 1 0 1 1 0 0 0 0 B0H
1 X X X X VPR8 VPR7 VPR6 VPR5 08H x VOP 6.2.31
1 X X X VPR4 VPR3 VPR2 VPR1 VPR0 01H x VOP 6.2.31
0 1 0 1 1 0 1 0 BRS B4H x Bottom Row Swap (BRS) 6.2.32
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2003 Feb 14

Philips Semiconductors
D/C 7 6 5 4 3 2 1 0 DEFAULT OTP DESCRIPTION SECTION

STN RGB - 132 × 132 × 3 driver

0 1 0 1 1 0 1 1 TRS B6H x Top Row Swap (TRS) 6.2.33
0 1 0 1 1 1 0 0 FINV B9H − super Frame INVersion (FINV) 6.2.34
0 1 0 1 1 1 0 1 DOR BAH − Data ORder (DOR) 6.2.35
0 1 0 1 1 1 1 0 TCDFE BDH − enable/disable DF temp comp 6.2.36
(TCDFE)
0 1 0 1 1 1 1 1 TCVOPE BFH − enable or disable VOP temp 6.2.37
comp (TCVOPE)
0 1 1 0 0 0 0 0 EC C0H − Internal or external oscillator 6.2.38
(EC)
0 1 1 0 0 0 0 1 0 C2H x set multiplication factor 6.2.39
(SETMUL)
1 X X X X X X S1 S0 03H x multiplication factor 6.2.39
0 1 1 0 0 0 0 1 1 C3H x set TCVOP slopes A and B 6.2.40
(TCVOPAB)
1 X SLB2 SLB1 SLB0 X SLA2 SLA1 SLA0 34H x 6.2.40
0 1 1 0 0 0 1 0 0 C4H x set TCVOP slopes C and D 6.2.40
(TCVOPCD)
10

1 X SLD2 SLD1 SLD0 X SLC2 SLC1 SLC0 75H x 6.2.40

0 1 1 0 0 0 1 0 1 C5H x set divider frequency (TCDF) 6.2.41
1 X DFA6 DFA5 DFA4 DFA3 DFA2 DFA1 DFA0 56H x set divider factor in region A 6.2.41
1 X DFB6 DFB5 DFB4 DFB3 DFB2 DFB1 DFB0 35H x set divider factor in region B 6.2.41
1 X DFC6 DFC5 DFC4 DFC3 DFC2 DFC1 DFC0 30H x set divider factor in region C 6.2.41
1 X DFD6 DFD5 DFD4 DFD3 DFD2 DFD1 DFD0 25H x set divider factor in region D 6.2.41
0 1 1 0 0 0 1 1 0 C6H x set divider frequency 8-colour 6.2.42
mode (DF8colour)
1 X DF86 DF85 DF84 DF83 DF82 DF81 DF80 35H x set divider factor in 8-colour 6.2.42
mode
0 1 1 0 0 0 1 1 1 C7H x set bias system (SETBS) 6.2.43

Objective specification
1 X X X X VB3 VB2 VB1 VB0 0BH x bias systems 6.2.43
− 6.2.44

PCF8833
0 1 1 0 0 1 0 0 0 C8H temperature read back
(RDTEMP)
0 1 1 0 0 1 0 0 1 C9H − N-Line Inversion (NLI) 6.2.45
1 NLI7 NLI6 NLI5 NLI4 NLI3 NLI2 NLI1 NLI0 13H x after NLI time slots inversion 6.2.45
0 1 1 0 1 1 0 1 0 DAH x read ID1 (RDID1) 6.2.46
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2003 Feb 14

Philips Semiconductors
D/C 7 6 5 4 3 2 1 0 DEFAULT OTP DESCRIPTION SECTION

STN RGB - 132 × 132 × 3 driver

0 1 1 0 1 1 0 1 1 DBH x read ID2 (RDID2) 6.2.46
0 1 1 0 1 1 1 0 0 DCH x read ID3 (RDID3) 6.2.46
0 1 1 1 0 1 1 1 SFD EFH x select factory defaults(3) 6.2.47
0 1 1 1 1 0 0 0 0 F0H − enter Calibration mode 15.5
1 X X ORA2 ORA1 ORA0 X OPE CALMM 00H − set calibration control settings 15.5
0 1 1 1 1 0 0 0 1 F1H − shift data in OTP shift registers 15.5
(OTPSHTIN)
1 OS7 OS6 OS5 OS4 OS3 OS2 OS1 OS0 XX − multiple data byte; any number 15.5
of bytes allowed
Notes
1. X = don’t care.
2. This function can be set by OTP.
3. If the OTP bit Enable Factory Defaults (EFD) has been programmed to logic 1 (default value is logic 0), then the Set Factory Defaults (SFD)
instruction is ignored and the device will always use the OTP default data.
11

Objective specification
PCF8833
Philips Semiconductors Objective specification

STN RGB - 132 × 132 × 3 driver PCF8833

6.1 Exit commands

Table 2 Command description
INPUT EXIT
PARAMETERS CONDITIONS
COMMAND COMMAND
Sleep_IN Power-down mode: power-down has priority over display and Sleep_OUT
(SLPIN) display off booster settings, but the setting is kept
display voltage generation off
Sleep_OUT exit power-down: after reset; BSTRON and DISPON is set, Sleep_IN reset
(SLPOUT) display → DISPON/DISPOFF but become active only with Sleep_OUT
display voltage
generation → BSTRON/BSTROFF
(refresh from OTP cells if CALMM = 0)
BSTROFF display voltage generation off display is switched on or off by BSTRON reset
DISPON/DISPOFF
BSTRON display voltage generation on display is switched on or off by BSTROFF
DISPON/DISPOFF
DISPOFF display off rows and columns are tied to VSS1 DISPON reset
DISPON display on DISPOFF
NORON Normal mode on full display is driven by RAM data PTLON SEP
PTLON Partial mode on partial display area is driven by RAM NORON SEP
data; display area outside partial area is reset
off
SEP Scroll mode on NORON
PTLON reset
PIXON (DAL) in full Display mode (NORON) all pixels command INVON is not effective when PIXOFF
are on; in partial Display mode only DAL is active (DALO)
partial area pixels are driven on; pixels NORON
outside partial area are off PTLON SEP
reset
PIXOFF all pixel off command INVON is not effective when PIXON (DAL)
(DALO) DALO is active NORON
PTLON SEP
reset
IDMOFF Idle mode off full colour resolution stored in the RAM is IDMON
written to the display
IDMON Idle mode on 8-colour mode became active: The MSB IDMOFF reset
of data stored in RAM is evaluated only
INVOFF inverted display off INVON
INVON inverted display on in Partial mode only pixels of partial area INVOFF reset
are inverted; INVON is not effective;
when DAL or DALO are active
TEOFF tearing pulse disabled TEON
TEON tearing pulse enabled TEOFF reset

2003 Feb 14 12
Philips Semiconductors Objective specification

STN RGB - 132 × 132 × 3 driver PCF8833

6.2 Function set

6.2.1 NO OPERATION
No operation (NOP) has no effect on internal data or settings. However, it can be used to terminate data transfer (read
and write).

Table 3 No operation command bits

D/C 7 6 5 4 3 2 1 0 DEFAULT
0 0 0 0 0 0 0 0 0 00H

6.2.2 RESET After a reset, care must be taken with respect to the reset
timing constraints (see Fig.50) when the PCF8833 is
The PCF8833 has a hardware and a software reset. After
powered-up. The power-up must be done by sending the
power-up a hardware reset (pin RES) must be applied; see
Sleep_OUT command.
Fig.50. The hardware and software resets give the same
results. After a reset, the chip has the following state: After a power-up the display RAM content is undefined.
• All LCD outputs are set to VSS (display off) Neither a hardware reset nor a software reset changes the
data that is stored in the display RAM. Sending display
• RAM data unchanged
data must stop 160 ns before issuing a hardware reset,
• Power-down mode (Sleep_IN) otherwise the last word written to the display RAM may be
• Command register set to default states; see Table 4 corrupted. The row and column outputs are tied to VSS1
with a reset because power-down (Sleep_IN) is in the
• Interface pins are set to inputs.
reset state.

Table 4 Reset state after hardware and software reset

COMMAND DESCRIPTION RESET STATE
Sleep_IN PCF8833 is in Sleep_IN mode (booster and display are switched off) −
INVOFF display inversion is off −
BSTRON when Sleep_OUT is active; booster is switched on −
DISPON when Sleep_OUT is active; display is turned on −
TEOFF tearing effect line pulse is turned off −
IDMOFF Idle mode is turned off (4 kbyte colour mode, not 8-colour mode) −
NORON Normal mode is active, not Scroll or Partial mode −
V RAM write in X direction 0
MY no mirror Y 0
RGB colour order is RGB 0
MX no mirror X 0
LAO line address order (top to bottom) 0
BRS bottom rows are not mirrored; note 1 0
TRS top rows are not mirrored; note 1 0
FINV super frame inversion is on 1
DOR normal data order 0
TCDFE DF temperature compensation switched on 1
TCVOPE VOP temperature compensation switched on 1
EC internal oscillator 0

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COMMAND DESCRIPTION RESET STATE

xs[7:0] x address start 2DEC
xe[7:0] x address end 129DEC
ys[7:0] y address start 2DEC
ye[7:0] y address end 129DEC
RGBSET 256 to 4 kbyte colour LUT see Section 6.2.22
AA1S[7:0] partial area start address 0DEC
AA1E[7:0] partial area end address 31DEC
TF[7:0] top fixed area 0DEC
SA[7:0] scroll area 130DEC
BF[7:0] bottom fixed area 0DEC
SEP[7:0] scroll entry point 0DEC
P[2:0] interface pixel format is 12-bit/pixel 011
VPR[8:0] programming of VLCD2 voltage; note 1 257DEC
S[1:0] charge pump multiplication factor; note 1 11
SLA[2:0] select slope for segment A; note 1 100
SLB[2:0] select slope for segment B; note 1 011
SLC[2:0] select slope for segment C; note 1 101
SLD[2:0] select slope for segment D; note 1 111
DFA[6:0] frame frequency for segment A is 80 Hz; note 1 56DEC
DFB[6:0] frame frequency for segment B is 130 Hz; note 1 35DEC
DFC[6:0] frame frequency for segment C is 150 Hz; note 1 30DEC
DFD[6:0] frame frequency for segment D is 180 Hz; note 1 25DEC
DF8[6:0] frame frequency for 8-colour mode is 130 Hz; note 1 35DEC
VB[3:0] bias system is F/Gmax = 2.5; note 1 1011
NLI[7:0] inversion is after 19 time slots (76 rows in Full mode); note 1 19DEC
VCON[6:0] no contrast setting is set (twos complement number); note 1 0DEC
SFD OTP programmed data is used; note 1 1
CALMM not in Calibration mode 0
OPE disable OTP programming voltage; note 2 0
ORA[2:0] OTP row address selection 000
Notes
1. These values can be set by the module maker. If the factory defaults OTP bit EFD have been set, the value cannot
be changed via the interface. Otherwise, the OTP data will be used if SFD is set to logic 1, which is the reset state.
2. Calibration mode may not be entered if the SEAL bit has been set. Programming is only possible when in Calibration
mode.

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6.2.3 SOFTWARE RESET

The software reset (SWRESET) has exactly the same effect as the hardware reset; see Section 6.2.2.
After sending SWRESET any command can be sent immediately without any additional delay in between, for instance:
Sleep_OUT, BSTRON and DISPON, etc.

Table 5 Software reset register bits

D/C 7 6 5 4 3 2 1 0 DEFAULT
0 0 0 0 0 0 0 0 1 01H

6.2.4 BOOSTER VOLTAGE OFF Command Sleep_IN does not effect the setting of
BSTRON/BSTROFF or DISPON/DISPOFF, but switches
The DC-to-DC converters are turned off and pins
off the DC-to-DC converter (booster) and ties the display
VLCDOUT1 and VLCDOUT2 become 3-state.
outputs to VSS1.
In order to avoid any optical effect on the display, the
For the effect of possible combinations of commands
sequence given in Fig.2 must be used before the internal
Sleep_IN/Sleep_OUT and BSTRON/BSTROFF; see
display supply generation circuits are turned off.
Table 17 and Fig.4. Figure 7 shows the effects of the
The external LCD supply input voltages (VLCDIN1 and combination of commands BSTRON and BSTROFF with
VLCDIN2) can be applied while the display voltage DISPON and DISPOFF.
generation (BSTROFF) is off. When BSTROFF, DISPON
and Sleep_OUT are set, the external LCD supply input
voltages (VLCDIN1 and VLCDIN2) must be applied, otherwise
the display outputs will be undefined.

Table 6 Booster voltage off register bits

D/C 7 6 5 4 3 2 1 0 DEFAULT
0 0 0 0 0 0 0 1 0 02H

handbook, halfpage
start

send DISPOFF (28H)

send BSTROFF (02H)

end

MGU911

Fig.2 Booster voltage off flow chart.

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6.2.5 BOOSTER VOLTAGE ON The status of the LCD supply generation circuits can be
monitored with the read display status (RDDST)
The LCD supply generation circuits will be switched on
command; see Section 6.2.7.
when the Booster voltage on (BSTRON) command is sent.
The BSTRON command has a direct effect only when the Figure 3 shows two sequences for using the BSTRON
PCF8833 is not in Power-down mode (Sleep_OUT is not command, assuming BSTROFF and DISPOFF were set
active). before sending Sleep_OUT. In sequence A the command
to switch the display on (DISPON) is sent to the PCF8833
With a reset DISPON (see Section 6.2.18) and BSTRON
before the BSTRON command is sent. Therefore the
are set, the PCF8833 will start-up with Sleep_OUT (see
display will only be switched on when the LCD supply
Section 6.2.7) following the built-in start-up sequence
generation circuit generates a stable VLCD. In sequence B
which generates the requested voltages and switches on
the RDDST command is used to monitor the LCD supply
the display, unless DISPOFF and/or BSTROFF was sent.
generation circuit and, after the D31 bit of the RDDST is
When the LCD supply generation circuits are switched on,
set to logic 1, the DISPON command will be sent;
it is necessary to wait for a certain time before the power
see Section 6.2.7.
circuits become stable and the display can be switched on.
Because this time is dependent on the required VLCD For the effect of possible combinations of commands
voltage, the external components used, the applied supply Sleep_IN/Sleep_OUT and BSTRON/BSTROFF; see
voltage and some other parameters, the PCF8833 Table 17 and Fig.4. Figure 7 shows the effects of the
monitors the LCD supply generation circuit internally and combination of commands BSTRON and BSTROFF with
will only switch-on the display when the LCD supply DISPON and DISPOFF.
generation circuits are stable.

Table 7 Booster voltage on register bits

D/C 7 6 5 4 3 2 1 0 DEFAULT
0 0 0 0 0 0 0 1 1 03H

handbook, full pagewidth

start start

send Sleep_OUT 11H send Sleep_OUT 11H

send DISPON 29H send BISTRON 03H

send BSTRON 03H

monitor D [31]
RDDST 09H D31 = 0
LCD will be switched on
when LCD supply D31 = 1
generation circuit
is stable send DISPON 29H

end end

sequence A sequence B MGU912

Fig.3 Booster voltage on flow charts.

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Philips Semiconductors Objective specification

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6.2.6 READ DISPLAY IDENTIFICATION INFORMATION When less than 25 read clock cycles are sent in Serial
mode, the identification information read must be
The Read Display Identification Information (RDDIDIF)
interrupted by a hardware reset or rising edge of SCE.
command returns a 24-bit display identification
information. The identification information is valid only The definition of the display identification bits is given in
5 ms after applying a hardware reset. Therefore the Table 11.
RDDIDIF command should not be sent earlier than 5 ms
after a hardware reset.
The input and output data format is given in Table 9. After
the command byte 04H is sent, the read starts with one
dummy clock cycle followed by the 3 status bytes (see
Fig.47).

Table 8 Read display identification information register bits

D/C 7 6 5 4 3 2 1 0 DEFAULT
0 0 0 0 0 0 1 0 0 04H

Table 9 RDDIDIF data format for Serial mode

BIT D/C 7 6 5 4 3 2 1 0 DEFAULT

(S)DIN 0 0 0 0 0 0 1 0 0 04H
(S)DOUT − X (only one dummy clock cycle, not a full byte) X
(S)DOUT − D23 D22 D21 D20 D19 D18 D17 D16 45H
− D15 D14 D13 D12 D11 D10 D9 D8 XX
− D7 D6 D5 D4 D3 D2 D1 D0 XX

Table 10 RDDIDIF data format for Parallel mode

D/C 7 6 5 4 3 2 1 0 DEFAULT
0 0 0 0 0 0 1 0 0 04H
1 X X X X X X X X XX
1 D23 D22 D21 D20 D19 D18 D17 D16 45H
1 D15 D14 D13 D12 D11 D10 D9 D8 XX
1 D7 D6 D5 D4 D3 D2 D1 D0 XX

Table 11 Description of the display identification bits

BIT BIT DESCRIPTION RD BYTE REMARK

D[23:16] manufacturer ID RDID1 hard wired = 45H
D15 driver/module ID RDID2 OTP programmed;
(STN B/W = 0 and see Chapter 15
STN Colour = 1)
D[14:8] driver/module version ID
D[7:0] driver/module code RDID3(1) OTP programmed;
see Chapter 15

Note
1. RDID3 will be programmed in OTP cells. This ID can be set to 03H by the module maker.

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6.2.7 READ DISPLAY STATUS When less than 33 read clock cycles are sent in Serial
mode the status read must be interrupted by a hardware
The Read Display Status (RDDST) command returns a
reset or a rising edge of SCE.
32-bit display status information and can be accessed
when the PCF8833 is in normal Display mode (see The definition of the display status bits is given in Table 11.
Section 6.2.11), in partial Display mode (see
Section 6.2.23) or in Sleep_IN mode; see Section 6.2.8.
The input and output data format is as follows: After the
command byte 09H is sent, the read starts with one
dummy clock cycle followed by the 4 status bytes (see
Fig.48).

Table 12 Read display status register bits

D/C 7 6 5 4 3 2 1 0 DEFAULT
0 0 0 0 0 1 0 0 1 09H

Table 13 RDDST data format for Serial mode

BIT D/C 7 6 5 4 3 2 1 0 DEFAULT

(S)DIN 0 0 0 0 0 1 0 0 1 09H
(S)DOUT − X (only one dummy clock cycle, not a full byte) XX
(S)DOUT − D31 D30 D29 D28 D27 D26 0 0 XX
− 0 D22 D21 D20 D19 D18 D17 D16 XX
− D15 0 D13 D12 D11 D10 D9 0 XX
− 0 0 0 0 0 0 0 0 XX

Table 14 RDDST data format for Parallel mode

D/C 7 6 5 4 3 2 1 0 DEFAULT
0 0 0 0 0 1 0 0 1 09H
1 X X X X X X X X XX
1 D31 D30 D29 D28 D27 D26 0 0 XX
1 0 D22 D21 D20 D19 D18 D17 D16 XX
1 D15 0 D13 D12 D11 D10 D9 0 XX
1 0 0 0 0 0 0 0 0 XX

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Table 15 Display identification bits description

BIT BIT DESCRIPTION STATUS
D31 booster voltage status logic 1 when BSTRON is selected and when the
LCD supply generation circuits are ready
logic 0 when BSTROFF is selected or when the
LCD supply generation circuits are not ready
D30 Y address order logic 1 when MY = 1
logic 0 when MY = 0
D29 X address order logic 1 when MX = 1
logic 0 when MX = 0
D28 vertical/horizontal addressing mode logic 1 when V = 1
logic 0 when V = 0
D27 line address order logic 1 when LAO = 1
logic 0 when LAO = 0
D26 RGB/BGR order logic 1 when RGB = 1
logic 0 when RGB = 0
D[25:23] no function, but can be read D[25:23] = 000
D[22:20] interface pixel format see Section 6.2.30
P2 = D22; P1 = D21 and P0 = D20
D19 Idle mode logic 1 when IDMON is selected
logic 0 when IDMOFF is selected
D18 Partial mode logic 1 when PTLON is selected
logic 0 otherwise
D17 Sleep_IN/OUT logic 1 when Sleep_OUT is selected
logic 0 when Sleep_IN is selected
D16 normal Display mode logic 1 when NORON is selected
logic 0 otherwise
D15 vertical Scroll mode logic 1 when SEP is selected
logic 0 otherwise
D14 no function; but can be read D14 = 0
D13 display inversion logic 1 when INVON is selected
logic 0 when INVOFF is selected
D12 all pixels on logic 1 when DAL is selected
logic 0 otherwise
D11 all pixels off logic 1 when DALO is selected
logic 0 otherwise
D10 display on/off logic 1 when DISPON is selected
logic 0 when DISPOFF is selected
D9 tearing effect line on/off logic 1 when TEON is selected
logic 0 when TEOFF is selected
D[8:0] no function; but can be read D[8:0] = 0:0000:0000

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6.2.8 SLEEP_IN While in Sleep_IN mode all commands and data can be
sent and will be executed as in the Sleep_OUT state,
By sending the Sleep_IN command, the PCF8833
except some OTP related commands and temperature
immediately enters the Power-down mode, also referred to
readout related commands. In the Sleep_IN mode no
as the Sleep mode. In the Sleep mode the output voltages
effect on the display can be seen.
of all LCD driver pins (rows and columns) are at VSS1
(ground, all pixels are in off state), and the LCD supply The Sleep_IN mode is exited by command Sleep_OUT;
generation circuit and the oscillator are switched off. The see Section 6.2.9.
Sleep_IN command does not change the state of the
DISPON/DISPOFF and BSTRON/BSTROFF commands,
but has the same effect as DISPOFF and BSTROFF;
see Table 17.

Table 16 Sleep_IN register bits

D/C 7 6 5 4 3 2 1 0 DEFAULT
0 0 0 0 1 0 0 0 0 10H

Table 17 Sleep_IN/OUT and BSTR_ON/OFF combination

BSTER_ON/BSTER_OFF Sleep_IN/Sleep_OUT Booster(1)
ON ON ON
ON OFF OFF
OFF ON OFF
OFF OFF OFF

Note
1. Booster is the built-in DC-to-DC converter also called voltage multiplier or charge pump.

6.2.9 SLEEP_OUT This time is self adapting and therefore dependent on

application conditions:
This command must be sent to allow the PCF8833 to
power-up (see Fig.4). • It is longer for:
– Low VDD2
DISPON and BSTRON are set with a reset, the PCF8833
will start-up with Sleep_OUT following the built-in start-up – Higher resistors in supply wires and/or external
sequence which generates the requested voltages and capacitors
switches on the display, unless DISPOFF and/or – Higher external capacitors
BSTROFF was sent after the last reset.
– Higher required VLCD2 voltage.
For the effects of possible combinations of commands • Some other conditions, which may affect start-up time
Sleep_IN/Sleep_OUT and BSTRON/BSTROFF; see are:
Table 17.
– Partial/full mode
Figure 4 illustrates the flow when sending the Sleep_OUT
– Selected bias system
command. The display is only switched on, when the
internally generated voltage VLCD2 is high enough. – Temperature
– Selected temperature coefficients.

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Table 18 Sleep_OUT register bits

D/C 7 6 5 4 3 2 1 0 DEFAULT
0 0 0 0 1 0 0 0 1 11H

handbook, full pagewidth reset

HW or SW

Sleep_IN

D31 = 0

send Sleep_OUT

Sleep_OUT

BSTROFF
booster

BSTRON

booster on

D31 = 0
wait for D31 bit

D31 = 1
DISPOFF
display

DISPON

ready
display on display off

MGU913

D31 is the booster voltage status bit; see Section 6.2.7.

Fig.4 Start-up, when leaving Power-down mode (i.e. after sending Sleep_OUT).

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6.2.10 PARTIAL MODE ON A normal Display mode command is used to exit the Partial
mode. How the partial display area can be programmed is
Partial mode on (PTLON) turns on the partial Display
given in Section 6.2.23.
mode. Only one partial display size can be chosen. Normal
mode, Scroll mode, DALO and DAL are exited with this A sequence showing how the command PTLON can be
command. When sending DAL after PTLON, only the used is illustrated in Fig.5.
pixels of partial area are driven on.

Table 19 Partial mode on register bits

D/C 7 6 5 4 3 2 1 0 DEFAULT
0 0 0 0 1 0 0 1 0 12H

handbook, full pagewidth

Initial state (1)
Sleep_OUT

booster on display on normal display

send PTLAR

send DISPOFF
partial area def
display off

send PTLON
wait until
display supply
partial mode on
voltage is settled

send DISPON
optional
send PTLAR
display on

partial area def

optional

MGU914

exit partial mode

send NORON send SEP

normal display scroll mode

(1) If the initial state is Sleep_IN, the same sequence is valid, but Sleep_OUT has to be sent to see the effect on the display (after display voltage has
settled).
When sending DAL after PTLON, only the pixels of partial area are driven on. When sending INVON, in Partial mode only the pixels of partial area are
inverted. INVON is over-ruled by DAL and DALO. Pixels outside partial area always stay off.

Fig.5 Sequence how PTLON can be used.

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6.2.11 NORMAL DISPLAY MODE ON

The normal Display mode on command (NORON) turns the display into Normal mode which is also the reset state.
An explanation of how the command NORON can be used is illustrated in Fig.6.

Table 20 Normal Display mode on register bits

D/C D7 D6 D5 D4 D3 D2 D1 D0 DEFAULT
0 0 0 0 1 0 0 1 1 13H

6.2.12 DISPLAY INVERSION OFF

The Display inversion off command (INVOFF) turns the display into a non-inverted screen without modifying the display
data RAM. Display inversion off is the reset state of the PCF8833.

Table 21 Display inversion off register bits

D/C 7 6 5 4 3 2 1 0 DEFAULT
0 0 0 1 0 0 0 0 0 20H

6.2.13 DISPLAY INVERSION ON

The Display inversion on command (INVON) turns the display into an inverted screen without modifying the display data
RAM. The RAM data is read out and inverted while writing to the display.
The display Inversion mode can be switched off by sending the INVOFF command; see Section 6.2.12.
When sending INVON, in Partial mode only, the pixels of a partial area are inverted. INVON is overruled by DAL and
DALO. In Partial mode the pixels outside of the partial are always off.

Table 22 Display inversion on register bits

D/C 7 6 5 4 3 2 1 0 DEFAULT
0 0 0 1 0 0 0 0 1 21H

6.2.14 ALL PIXELS OFF

The All pixels off command (DALO) can be switched off by sending the normal display on command (NORON) (see
Section 6.2.11) or by sending the partial Display mode on command (PTLON); see Section 6.2.10. Furthermore DALO
is left with the command DAL; see Section 6.2.15. When DALO is active all pixels are driven, as if the display RAM was
filled with all zeros (off-state). DALO does not change the data stored in the display RAM. Figure 6 illustrates how DAL
(all pixels on) and DALO (all pixels off) can be used.
All pixels will be switched off regardless of the display data RAM.

Table 23 All pixels off register bits

D/C 7 6 5 4 3 2 1 0 DEFAULT
0 0 0 1 0 0 0 1 0 22H

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Philips Semiconductors Objective specification

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6.2.15 ALL PIXELS ON When sending DAL after PTLON, only the pixels of the
partial area are driven on. When sending INVON in Partial
The All pixels on command (DAL) can be switched off by
mode only the pixels of the partial area are inverted.
sending the normal display on command (NORON); (see
INVON is over-ruled by DAL and DALO. Pixels outside the
Section 6.2.11) or by sending the partial Display mode on
partial are always off. Figure 6 illustrates how DAL (all
command (PTLON); see Section 6.2.10. Furthermore DAL
pixels on) and DALO (all pixels off) can be used.
is left with the command DALO; see Section 6.2.14. When
DAL is active all pixels are driven, as if the display RAM All pixels will be switched on regardless of the display data
was filled with all ones (on-state). DAL does not change RAM.
the data stored in the display RAM.

Table 24 All pixels on register bits

D/C 7 6 5 4 3 2 1 0 DEFAULT
0 0 0 1 0 0 0 1 1 23H

handbook, full pagewidth

Initial state (1)
Sleep_OUT

booster on display on all pixel on/off

send SEP send NORON send PTLON

exit pixel on/off exit pixel on/off exit pixel on/off

scroll mode on normal display partial mode on

send DAL/DALO send DAL/DALO

all pixel on/off all pixel on/off

effect in effect in
full display mode partial display mode

MGU915

(1) If the initial state is Sleep_IN, the same sequence is valid, but Sleep_OUT has to be sent to see the effect on the display (after display voltage
has settled).
When sending DAL after PTLON, only the pixels of partial area are driven on. When sending INVON, in Partial mode only the pixels of partial area
are inverted. INVON is over-ruled by DAL and DALO. Pixels outside partial area always stay off.

Fig.6 Flowchart representation of DAL and DALO.

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6.2.16 SET CONTRAST

Using the Set contrast command (SETCON) the VLCD voltage and the contrast of the LCD can be adjusted. The influence
of the VCON[6:0] register on the VLCD programming is explained in Section 6.2.31. The VCON[6:0] is a twos complement
number; see Table 26. An overview over the complete programming range of VLCD can be found in Section 15.1.

Table 25 Set contrast register bits

D/C 7 6 5 4 3 2 1 0 DEFAULT
0 0 0 1 0 0 1 0 1 25H
1 X VCON6 VCON5 VCON4 VCON3 VCON2 VCON1 VCON0 00H

Table 26 Possible VCON values

VCON[6:0] DECIMAL EQUIVALENT VLCD OFFSET
0111111 63 2520 mV
0111110 62 2480 mV
0111101 61 2440 mV
: : :
0000010 2 80 mV
0000001 1 40 mV
0000000 0 0 mV
1111111 −1 −40 mV
1111110 −2 −80 mV
: : :
1000010 −62 −2480 mV
1000001 −63 −2520 mV
1000000 −64 −2560 mV

6.2.17 DISPLAY OFF

The Display off command (DISPOFF) connects all rows and columns to VSS1, i.e. all the pixels have a voltage of 0 V.
Since the reset state of the PCF8833 is Sleep_IN (see Section 6.2.8) the display will be in the off state after a reset.
The DISPOFF command can be switched off by sending the Display on command (DISPON); see Section 6.2.18.
Figure 7 shows the effects of the combination of commands BSTRON and BSTROFF with DISPON and DISPOFF.

Table 27 Display off register bits

D/C 7 6 5 4 3 2 1 0 DEFAULT
0 0 0 1 0 1 0 0 0 28H

6.2.18 DISPLAY ON
Using the Display on command (DISPON) the rows and columns are driven according to the current display data RAM
content and according to the display timing and settings.
The DISPON command is used to exit the DISPOFF state; see Section 6.2.17.
Figure 4 gives additional information on the effect of the DISPON/DISPOFF command. Figure 7 shows the effects of the
combination of commands BSTRON and BSTROFF with DISPON and DISPOFF.

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Table 28 Display on register bits

D/C 7 6 5 4 3 2 1 0 DEFAULT
0 0 0 1 0 1 0 0 1 29H

handbook, full pagewidth

Initial state
Sleep_OUT

booster on display on

Booster off
send DISPOFF

display off

send BSTROFF (1)

D31 = 0 (2)

booster off

Booster on
send BSTRON

booster on

D31 = 0
wait for D31 bit

D31 = 1

send DISPON

display on

MGU916

(1) When an external VLCD is applied, BSTROFF needs to be sent after reset (default = booster on). The setting of Display
mode (Partial mode, Scroll mode, etc.) is not affected by sending DISPON/DISPOFF.
(2) D31 is the booster voltage status bit; see Section 6.2.7.

Fig.7 Recommendation for using commands BSTRON/BSTROFF in combination with DISPON/DISPOFF.

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6.2.19 COLUMN ADDRESS SET

The display data RAM parameters xs and xe define the column address range of the display data RAM for writing data.
Parameters xs and xe are defined between 0 and 131 (83H), and xs must be smaller then xe.

Table 29 Column address set register bits

D/C 7 6 5 4 3 2 1 0 DEFAULT
0 0 0 1 0 1 0 1 0 2AH
1 xs[7] xs[6] xs[5] xs[4] xs[3] xs[3] xs[3] xs[0] 02H
1 xe[7] xe[6] xe[5] xe[4] xe[3] xe[2] xe[1] xe[0] 81H

6.2.20 PAGE ADDRESS SET

The display data RAM parameters ys[7:0] and ye[7:0] define the page (row) address range of the display data RAM for
writing data. Parameters ys and ye are defined between 0 and 131 (83H), and ys must be smaller then ye.

Table 30 Page address set register bits

D/C 7 6 5 4 3 2 1 0 DEFAULT
0 0 0 1 1 1 0 1 1 2BH
1 ys[7] ys[6] ys[5] ys[4] ys[3] ys[3] ys[3] ys[0] 02H
1 ye[7] ye[6] ye[5] ye[4] ye[3] ye[2] ye[1] ye[0] 81H

6.2.21 MEMORY WRITE

Data written to the display memory (RAM) is validated by the Memory write (RAMWR) command. Entering this command
always returns the page address and column address to the start addresses xs[7:0] and ys[7:0] respectively. Content of
the display data RAM is written by the data entered following this command, with the page and/or column address
automatically incremented. The data Write mode turned on by this command can be automatically cancelled by entering
another command.
After a power-up the display RAM content is undefined. Neither a hardware reset nor a software reset changes the data
stored in display RAM. Sending display data must stop 160 ns before issuing a hardware reset, otherwise the last word
written to the display RAM may be corrupted.

Table 31 Memory write register bits

D/C 7 6 5 4 3 2 1 0 DEFAULT
0 0 0 1 0 1 1 0 1 2CH
1 D7 D6 D5 D4 D3 D2 D1 D0 XX

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6.2.22 COLOUR SET

With the Colour set (RGBSET) command the mapping from the 256-colour interface data is translated to the 4 kbyte
colour RAM data of the PCF8833 can be changed. The translation table must be changed, if necessary, before sending
256 colour data. For the red and green pixel 8 from the available 16 grey scales can be selected. For the blue pixel 4
from the 16 grey scales can be selected. The default or reset state of the colour mapping can be found in Table 32.
If the 256-to-4 kbyte colour mapping needs to be changed, the whole table must be sent. The mapping of colours is done
when writing data into the RAM, through the application of the Look-Up Table (LUT).

Table 32 Colour set register bits

D/C D7 D6 D5 D4 D3 D2 D1 D0 DEFAULT DESCRIPTION

0 0 0 1 0 1 1 0 1 2DH
1 X X X X R3 R2 R1 R0 00H red tone 000
1 X X X X R3 R2 R1 R0 02H red tone 001
1 X X X X R3 R2 R1 R0 04H red tone 010
1 X X X X R3 R2 R1 R0 06H red tone 011
1 X X X X R3 R2 R1 R0 09H red tone 100
1 X X X X R3 R2 R1 R0 0BH red tone 101
1 X X X X R3 R2 R1 R0 0DH red tone 110
1 X X X X R3 R2 R1 R0 0FH red tone 111
1 X X X X G3 G2 G1 G0 00H green tone 000
1 X X X X G3 G2 G1 G0 02H green tone 001
1 X X X X G3 G2 G1 G0 04H green tone 010
1 X X X X G3 G2 G1 G0 06H green tone 011
1 X X X X G3 G2 G1 G0 09H green tone 100
1 X X X X G3 G2 G1 G0 0BH green tone 101
1 X X X X G3 G2 G1 G0 0DH green tone 110
1 X X X X G3 G2 G1 G0 0FH green tone 111
1 X X X X B3 B2 B1 B0 00H blue tone 00
1 X X X X B3 B2 B1 B0 04H blue tone 01
1 X X X X B3 B2 B1 B0 0BH blue tone 10
1 X X X X B3 B2 B1 B0 0FH blue tone 11

6.2.23 PARTIAL AREA

The Partial area command (PTLAR) sets the partial display area and displays the RAM content of this area. In the partial
Display mode the drive voltage can be reduced.

Table 33 Partial area register bits

D/C 7 6 5 4 3 2 1 0 DEFAULT
0 0 0 1 1 0 0 0 0 30H
1 AA1S7 AA1S6 AA1S5 AA1S4 AA1S3 AA1S2 AA1S1 AA1S0 tbf
1 AA1E7 AA1E6 AA1E5 AA1E4 AA1E3 AA1E2 AA1E1 AA1E0 tbf

2003 Feb 14 28
Philips Semiconductors Objective specification

STN RGB - 132 × 132 × 3 driver PCF8833

The following steps must be followed to enter the Partial When setting the addresses the following conditions must
mode: be ensured:
• Set VOP (when the MMOTP cells are used the VOP for • (AA1E + 1) − AA1S = 32 (only 1 partial display size
the Partial mode is predefined) setting is possible)
• Set bias system (when the MMOTP cells are used the • AA1 ≥ 0 and AA1E ≤ 131.
bias system for the Partial mode is predefined) Figure 8 shows how to use the Partial mode with Line
• Set start address of active area AA1S[7:0]; can be set in Address Order (LAO) set to logic 0. Figure 9 gives an
multiples of 4 example of Partial mode with LAO set to logic 1, and
• Set end address of active area AA1E[7:0] + 1; can be Fig.10 shows the position of the partial area when the start
set in multiples of 4 address of the active area is AA1S ≥ (131 + 1) − 31, i.e.
AA1S ≥ 101 (AA1S must be set in multiples of 4).
• Enter Partial mode (PTLON).
Figure 11 shows how the Partial mode can be used.

handbook, full pagewidth RAM display

0 ROW 0
1 ROW 1
2 ROW 2
AA1S [7:0] = 4 3 ROW 3
4 ROW 4
5 ROW 5
6 ROW 6
7 ROW 7
8 ROW 8
9 ROW 9

partial area 10
11
ROW 10
ROW 11
partial area
12 ROW 12
13 ROW 13

32
rows 24 ROW 24
25 ROW 25
26 ROW 26
27 ROW 27
28 ROW 28
29 ROW 29
30 ROW 30
31 ROW 31
32 ROW 32
33 ROW 33
34 ROW 34
35 ROW 35
AA1E [7:0] +1 = 36 36 ROW 36
37 ROW 37
38 ROW 38
39 ROW 39
40 ROW 40
41 ROW 41
42 ROW 42

127 ROW 127

128 ROW 128
129 ROW 129
130 ROW 130
131 ROW 131

MGU917

Fig.8 Partial Display mode for LAO = 0.

2003 Feb 14 29
Philips Semiconductors Objective specification

STN RGB - 132 × 132 × 3 driver PCF8833

handbook, full pagewidth RAM display

0 ROW 0
1 ROW 1
2 ROW 2
3 ROW 3

AA1E [7:0] +1 = 128 4 ROW 4

5 ROW 5
6 ROW 6
7 ROW 7
8 ROW 8
9 ROW 9

partial area 10
11
ROW 10
ROW 11
partial area
12 ROW 12
13 ROW 13

32 24 ROW 24
rows 25 ROW 25
26 ROW 26
27 ROW 27
28 ROW 28
29 ROW 29
30 ROW 30
31 ROW 31
32 ROW 32
33 ROW 33
34 ROW 34
35 ROW 35
36 ROW 36
AA1S [7:0] = 96 37 ROW 37
38 ROW 38
39 ROW 39
40 ROW 40
41 ROW 41
42 ROW 42

127 ROW 127

128 ROW 128
129 ROW 129
130 ROW 130
131 ROW 131

MGU918

Fig.9 Partial Display mode for LAO = 1.

2003 Feb 14 30
Philips Semiconductors Objective specification

STN RGB - 132 × 132 × 3 driver PCF8833

handbook, full pagewidth RAM display

0 ROW 0
1 ROW 1
2 ROW 2
3 ROW 3
partial area 4 ROW 4 partial area
5 ROW 5

27 ROW 27
AA1E [7:0] +1 = 28 28 ROW 28
29 ROW 29
30 ROW 30
31 ROW 31
32 ROW 32
33 ROW 33
34 ROW 34
35 ROW 35
36 ROW 36
37 ROW 37
38 ROW 38
39 ROW 39
40 ROW 40
41 ROW 41
42 ROW 42
43 ROW 43
44 ROW 44
45 ROW 45
46 ROW 46
47 ROW 47
48 ROW 48
49 ROW 49
50 ROW 50
51 ROW 51
52 ROW 52
53 ROW 53

AA1S [7:0] = 128 127 ROW 127

128 ROW 128
32 129 ROW 129
rows 130 ROW 130
131 ROW 131

MGU919

Fig.10 Partial Display mode for LAO = 0 and AA1S[7:0] = 128.

2003 Feb 14 31
Philips Semiconductors Objective specification

STN RGB - 132 × 132 × 3 driver PCF8833

handbook, full pagewidth

Initial state (1)
Sleep_OUT

booster on display on normal display

send PTLAR

send DISPOFF
partial area def
display off

send PTLON
wait until
display supply
partial mode on
voltage is settled

send DISPON
optional
send PTLAR
display on

partial area def

optional

MGU920

exit partial mode

send NORON send SEP

normal display scroll mode

(1) If the initial state is Sleep_IN, the same sequence is valid, but Sleep_OUT has to be sent to see the effect on the display (after the display
voltage has settled).
When sending DAL after PTLON, only the pixels of partial area are driven on. When sending INVON, in Partial mode only the pixels of partial area
are inverted. INVON is over-ruled by DAL and DALO. Pixels outside partial area always stay off.

Fig.11 Recommended sequence for setting Partial mode.

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Philips Semiconductors Objective specification

STN RGB - 132 × 132 × 3 driver PCF8833

6.2.24 VERTICAL SCROLLING DEFINITION

In the PCF8833 three different scrolling modes can be used. These scrolling modes differ from each other in the way the
RAM to display mapping is done. The vertical scrolling is defined as follows:
• Vertical scrolling definition (VSCRDEF) command
• TF[7:0] defines the number of lines for the top fixed area on the display, there is no top fixed area when TF[7:0] = 0
• SA[7:0] defines the number of lines for the scrolling area on the display
• BF[7:0] defines the number of lines for the bottom fixed area on the display, there is no bottom fixed area when
BF[7:0] = 0.
Figure 12 illustrates the 4 scrolling configurations that can be defined.

Table 34 Vertical scrolling definition register bits

D/C 7 6 5 4 3 2 1 0 DEFAULT
0 0 0 1 1 0 0 1 1 33H
1 TF7 TF6 TF5 TF4 TF3 TF2 TF1 TF0 00H
1 SA7 SA6 SA5 SA4 SA3 SA2 SA1 SA0 82H
1 BF7 BF6 BF5 BF4 BF3 BF2 BF1 BF0 00H

handbook, full pagewidth centre screen scroll bottom screen scroll top screen scroll whole screen scroll

MGU921

Fixed area (RAM content displayed)

Scrolling area

Fig.12 Scrolling modes on the display.

There are 3 different scrolling modes, which are selected as follows:

1. TF + SA + BF = 130 rolling Scroll mode; see Section 6.2.24.1
2. TF + SA + BF = 131 non-rolling Scroll mode; see Section 6.2.24.2
3. TF + SA + BF = 132 non-rolling Scroll mode; see Section 6.2.24.3.
The recommended sequence for setting up the scroll modes is illustrated in Fig.13.

2003 Feb 14 33
Philips Semiconductors Objective specification

STN RGB - 132 × 132 × 3 driver PCF8833

handbook, full pagewidth

Initial state (1)
Sleep_OUT

booster on display on normal display

send VSCRDEF

scroll area def

send SEP

scroll mode on

set a new scroll area

send NORON

normal display

send VSCRDEF

scroll area def

send SEP

scroll mode on

exit scroll mode

send NORON send PLTON

normal display partial mode

MGU922

(1) If the initial state is Sleep_IN, the same sequence is valid, but Sleep_OUT has to be sent to see the effect on the display (after the
display voltage has settled).

Fig.13 Recommended sequence for setting up Scroll modes.

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Philips Semiconductors Objective specification

STN RGB - 132 × 132 × 3 driver PCF8833

6.2.24.1 Rolling Scroll mode Figure 15 gives an example for when the PCF8833 is
working in the rolling Scroll mode.
The RAM-to-display mapping for the rolling Scroll mode
when a 132 × 130 (columns × rows) display is connected When the rolling Scroll mode is used the following
to the PCF8833 is illustrated in Fig.14. In this case rows sequence can be applied:
0 and 131 must be left open. When a 132 × 132 display is • After the desired time interval increment the scroll
connected, there will be a one-to-one mapping between address to SEP + n for a n-line step
the RAM and the display, and there will be no unused
rows. • Keep incrementing the scroll address (SEP) at regular
intervals.
The rolling Scroll mode is activated when the Set Entry
Scroll Point (SEP) is set; see Table 35. The rolling Scroll mode is left when the normal Display
mode on (NORON) or the partial Display mode on
(PTLON) is selected.

Table 35 Set entry scroll point register bits

D/C 7 D6 5 4 3 2 1 0 DEFAULT
0 0 0 1 1 0 1 1 1 37H
1 SEP7 SEP6 SEP5 SEP4 SEP3 SEP2 SEP1 SEP0 00H

handbook, full pagewidth RAM (132 x 132) display (132 x 130)

0 0
1 0
2 1
3 2
TF [7:0] 4 3
5 4 TF [7:0]
6 5
7 6
8 7
8

SA [7:0]
SA [7:0]

121 120
2 unused 122 121
rows 123 124
124 125
125 126
126 127
127 128 BF [7:0]
BF [7:0] 128 129
129 130
130 131
131 131

MGU923

Fig.14 RAM to display mapping for the rolling Scroll mode (TF + SA + BF = 130) for LAO = 0.

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Philips Semiconductors Objective specification

STN RGB - 132 × 132 × 3 driver PCF8833

handbook, full pagewidth RAM (132 x 132) display (132 x 130)

0 0
1 0
2 1
3 2
TF = 8 4 3
5 4 TF = 8
6 5
7 6
8 7
SEP

SEP [7:0]

SA = 114

120
121
8
9

121
2 unused 122 SEP − 1
rows 123 124
124 125
125 126
126 127
127 128 BF = 8
BF = 8 128 129
129 130
130 131
131 131

MGU924

Fig.15 The rolling Scroll mode (TF + SA + BF = 130) for LAO = 0.

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Philips Semiconductors Objective specification

STN RGB - 132 × 132 × 3 driver PCF8833

6.2.24.2 Non-rolling Scroll mode An example is given in Figure 17 for the case when the
PCF8833 is working in the non-rolling Scroll mode
The RAM-to-display mapping for the non-rolling Scroll
(TF + SA + BF = 131).
mode when a 132 × 130 (columns × rows) display is
connected to the PCF8833 is illustrated in Fig.16. In this When the non-rolling Scroll mode is used the following
case unused rows and columns are to be left open, for sequence can be applied:
instance row 0 and 131. If a 132 × 132 display is • Fill the background memory
connected to the PCF8833 the content of row 0 and 131
will be the same as the content which is displayed in row 1 • After the desired time interval increment the scroll
address to SEP + n for a n-line step
and 130, respectively. By doing so, the display data RAM
will have 1 row in the background, whose content can be • Keep filling the background memory and incrementing
updated when it is not displayed. scroll address (SEP) at regular intervals to obtain a
smooth scrolling.
The non-rolling Scroll mode is activated when the Set
Entry Scroll point is set; see Table Fig.36. The non-rolling Scroll mode is left when the normal Display
mode on (NORON) or the partial Display mode on
(PTLON) is selected.

Table 36 Set entry scroll point register bits

D/C 7 6 5 4 3 2 1 0 DEFAULT
0 0 0 1 1 0 1 1 1 37H
1 SEP7 SEP6 SEP5 SEP4 SEP3 SEP2 SEP1 SEP0 00H

handbook, full pagewidth RAM (132 x 132) display (132 x 130)

0 0
1 0
2 1
3 2
TF [7:0] 4 3
5 4 TF [7:0]
6 5
7 6
8 7
8

SA [7:0] SA [7:0] − 1

1 buffer 121 120

row 122 121
123 124
1 unused 124 125
row 125 126
126 127
127 128 BF [7:0]
BF [7:0] 128 129
129 130
130 131
131 131

MGU925

Fig.16 RAM to display mapping for the non-rolling Scroll mode (TF + SA + BF = 131) for LAO = 0.

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Philips Semiconductors Objective specification

STN RGB - 132 × 132 × 3 driver PCF8833

handbook, full pagewidth RAM (132 x 132) display (132 x 130)

0 0
1 0
2 1
3 2
TF = 8 4 3
5 4 TF = 8
6 5
7 6
8 7
SEP

1 buffer row

SEP [7:0]

SA − 1 = 114

121
122
8
9

1 unused row 121

122 SEP − 2
123 124
124 125
125 126
126 127
127 128 BF = 8
BF = 8 128 129
129 130
130 131
131 131

MGU926

Fig.17 The non-rolling Scroll mode (TF + SA + BF = 131) for LAO = 0.

6.2.24.3 Non-rolling Scroll mode When the non-rolling Scroll mode is used the following
sequence can be applied.
The RAM-to-display mapping for the non-rolling Scroll
mode when a 132 × 130 (columns × rows) display is • Fill the background memory
connected to the PCF8833 is illustrated in Fig.18. In this • After the desired time interval increment the scroll
case unused rows and columns are to be left open, for address to SEP + n for a n-line step
instance row 0 and 131. If a 132 × 132 display is
• Keep filling the background memory and incrementing
connected to the PCF8833 the content of row 0 and 131
scroll address (SEP) at regular intervals to obtain a
will be the same as the content which is displayed in row smooth scrolling.
1 and 130, respectively. By doing so the display data RAM
will have 2 rows in the background, whose content can be The non-rolling Scroll mode is left when the normal Display
updated when they are not displayed. mode on (NORON) or the partial Display mode on
(PTLON) is selected.
The non-rolling Scroll mode is activated when the Set
Entry Scroll Point is set; see Table Fig.37.
Figure 19 shows an example for when the PCF8833 is
working in the non-rolling Scroll mode
(TF + SA + BF = 132).

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Philips Semiconductors Objective specification

STN RGB - 132 × 132 × 3 driver PCF8833

Table 37 Set entry scroll point register bits

D/C 7 6 5 4 3 2 1 0 DEFAULT
0 0 0 1 1 0 1 1 1 37H
1 SEP7 SEP6 SEP5 SEP4 SEP3 SEP2 SEP1 SEP0 00H

handbook, full pagewidth RAM (132 x 132) display (132 x 130)

0 0
1 0
2 1
3 2
TF [7:0] 4 3
5 4 TF [7:0]
6 5
7 6
8 7
8

SA [7:0] SA [7:0] − 2

121 120
2 buffer 122 121
rows 123 124
124 125
125 126
126 127
127 128 BF [7:0]
BF [7:0] 128 129
129 130
130 131
131 131

MGU927

Fig.18 RAM to display mapping for the non-rolling Scroll mode (TF + SA + BF = 132) for LAO = 0.

2003 Feb 14 39
Philips Semiconductors Objective specification

STN RGB - 132 × 132 × 3 driver PCF8833

handbook, full pagewidth RAM (132 x 132) display (132 x 130)

0 0
1 0
2 1
3 2
TF = 8 4 3
5 4 TF = 8
6 5
7 6
8 7
SEP

2 buffer rows

SEP [7:0]

SA − 2 = 114

122
123
8
9
121
122 SEP − 3
123 124
124 125
125 126
126 127
127 128 BF = 8
BF = 8 128 129
129 130
130 131
131 131

MGU928

Fig.19 The non-rolling Scroll mode (TF + SA + BF = 132) for LAO = 0.

2003 Feb 14 40
Philips Semiconductors Objective specification

STN RGB - 132 × 132 × 3 driver PCF8833

6.2.24.4 Effect of LAO on scroll modes

An example of when the PCF8833 is working in the non-rolling Scroll mode (TF + SA + BF = 132) with the Line Address
Order (LAO) bit set to logic 1, is illustrated in Fig.20. The Scroll modes described in Sections 6.2.24.1 and 6.2.24.2 also
work on the same principle when the LAO bit is set to logic 1.

handbook, full pagewidth RAM (132 x 132) display (132 x 130)

0 0
1 0
2 1
3 2
BF = 8 4 3
5 4 BF = 8
6 5
7 6
8 7
9 SEP + 3
10

123
8
9

SA − 2 = 114

SEP [7:0]

2 buffer rows

SEP − 1
SEP
123 124
124 125
125 126
126 127
127 128 TF = 8
TF = 8 128 129
129 130
130 131
131 131

MGU929

Fig.20 The non-rolling Scroll mode (TF + SA + BF = 132); with LAO = 1.

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Philips Semiconductors Objective specification

STN RGB - 132 × 132 × 3 driver PCF8833

6.2.25 TEARING EFFECT LINE OFF

The Tearing effect line off (TEOFF) command ties the TE pin LOW.

Table 38 Tearing effect line off register bits

D/C 7 6 5 4 3 2 1 0 DEFAULT
0 0 0 1 1 0 1 0 0 34H

6.2.26 TEARING EFFECT LINE ON

The Tearing effect line on (TEON) command turns the TE line of the display on.
The TE signal indicates the start of a super-frame (equals 16 frames). In 4 kbyte colour mode a whole super-frame is
needed to write full colour depth. In 8-colour mode the available colour depth is written in one frame. The tearing signal
goes HIGH when the last line of a super-frame is read. The HIGH time is 850 µs (see Fig.21).

Table 39 Tearing effect line on register bits; note 1

D/C 7 6 5 4 3 2 1 0 DEFAULT
0 0 0 1 1 0 1 0 1 35H
1 X X X X X X X X 00H

Note
1. X = don’t care.

handbook, full pagewidth superframe period

(16 frames )

TE signal

850 µs MGU930

Fig.21 Tearing effect line: distribution of pulses.

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Philips Semiconductors Objective specification

STN RGB - 132 × 132 × 3 driver PCF8833

6.2.27 MEMORY DATA ACCESS CONTROL

The display data RAM access conditions can be defined by using the Memory data access control (MADCTL) command.
The used single control bits together with their reset states are given in Table 41.

Table 40 Memory data access control register bits

D/C 7 6 5 4 3 2 1 0 DEFAULT
0 0 0 1 1 0 1 1 0 36H
1 MY MX V LAO(1) RGB X X X 00H

Note
1. Refer to Section 6.2.24.4 for an explanation of LAO on scroll modes and to Section 6.2.23 for an explanation of LAO
on Partial mode.

Table 41 Explanation of the memory data access control bits

BIT LOGIC 0 (RESET STATE) LOGIC 1

MY no mirror Y mirror Y
MX no mirror X mirror X
V RAM write in X direction vertical RAM write; in Y direction
LAO line address order (top to bottom) line address order (bottom to top)
RGB RGB BGR

The relationship between RAM and display for the MX, MY, RGB and LAO control bits is illustrated Fig.22.
Combinations of MX, MY and V are described in more detail in Section 7.2.

handbook, full pagewidth

column drivers DISPLAY

D3 = 0:RGB
D3 = 1:BGR
D7 = 0 D7 = 1 D4 = 0 D4 = 1
0 131 0,0 0 131
1 1
2 2
page address

row drivers

RAM

2 2
1 1
131 0 131 0

D6 = 0 0 1 2 131

D6 = 1 131 2 1 0

interface column address

MGU931

Fig.22 Display data RAM access control.

2003 Feb 14 43
Philips Semiconductors Objective specification

STN RGB - 132 × 132 × 3 driver PCF8833

6.2.28 IDLE MODE OFF

The Idle mode off (IDMOFF) command turns off the Idle mode and the PCF8833 is working in the 4 kbyte colour mode.
This command is similar to the Idle mode on command (IDMON); see Section 6.2.29.

Table 42 Idle mode off register bits

D/C 7 6 5 4 3 2 1 0 DEFAULT
0 0 0 1 1 1 0 0 0 38H

6.2.29 IDLE MODE ON

The Idle mode on (IDMON) command activates the Idle mode of the LCD driver in order to reduce the power
consumption. When the Idle mode is switched on, the number of colours is reduced to 8 (only the MSB of data stored in
the RAM is used). In addition to the reduction in the number of colours, the frame frequency can also be reduced. The
frame frequency for the Idle mode can be programmed separately from the frame frequency in 4 kbyte colour mode; see
Section 6.2.41.

Table 43 Idle mode on register bits

D/C 7 6 5 4 3 2 1 0 DEFAULT
0 0 0 1 1 1 0 0 1 39H

6.2.30 COLOUR INTERFACE PIXEL FORMAT

By using the Colour interface pixel format command (COLMOD) different interface RGB formats can be chosen. The
choice of an RGB format also influences the way display data is transferred to the display data RAM via the interface;
see Section 7.1.3.
The different interface RGB formats are given in Table 45.

Table 44 Colour interface pixel format register bits; note 1

D/C 7 6 5 4 3 2 1 0 DEFAULT
0 0 0 1 1 1 0 1 0 3AH
1 X X X X X P2 P1 P0 03H

Note
1. X = don’t care.

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Philips Semiconductors Objective specification

STN RGB - 132 × 132 × 3 driver PCF8833

Table 45 Interface formats The generated VLCD can be calculated with equation (1).
Figure 24 is the graphical equivalent to equation (1).
INTERFACE
P2 P1 P0 V LCD = a + 〈 MMVOPCAL [ 5:0 ] + VCON [ 6:0 ] + (1)
FORMATS
V PR [ 8:0 ]〉 × b
0 0 0 no action
0 0 1 no action Where:
• a is a fixed constant value; see Table 47
0 1 0 8-bit/pixel(1)
• b is a fixed constant value; see Table 47
0 1 1 12-bit/pixel(2)
• VPR[8:0] is the programmed VOP value; the
1 0 0 no action
programming range for VPR[8:0] is 5 to 410 (19AH)
1 0 1 16-bit/pixel(3)
• MMVOPCAL[5:0] is the value of the offset stored in the
1 1 0 no action OTP cells in twos complement format; see Section 15.1
1 1 1 no action • VCON[6:0] is the set contrast value which can be set via
Notes the interface and is in twos complement format; see
Section 6.2.16.
1. PCF8833 is switched into 256 colour mode,
256 colours are mapped to the 4 kbyte RAM with a The VOP[8:0] value must be in the VLCD programming
LUT; see Section 6.2.22. range as shown in Fig.24. Evaluating equation (1), values
outside of the programming range indicated in Fig.24 may
2. PCF8833 is switched into 4 kbyte colour mode, which
result. Calculated values below 0 will be mapped to
is also the reset state.
VOP = 0; resulting VOP values higher than 445 will be
3. PCF8833 is switched into 64 kbyte colour mode, which mapped to VOP = 445. An overview of the complete
is achieved by means of dithering. programming range of VLCD can be found in Section 15.1.

6.2.31 SET VOP As the programming range for the internally generated
VLCD allows values above the maximum allowed VLCD
The set VOP command (SETVOP) is used to program the (20 V) the user has to ensure, while setting the VPR
optimum LCD supply voltage VLCD. register and selecting the temperature compensation, that
The reset state of VPR[8:0] is 257DEC (13.88 V). under all conditions and including all tolerances the VLCD
remains below 20 V.
The optimum LCD supply voltage can be calculated as
explained in Section 6.2.43. The VOP value is programmed
via the VPR register. Besides the VPR register the VOP
value can be calibrated by means of OTP cells or changed
with the VCON register (see Fig.23).

Table 46 Set VOP register bits; note 1

D/C D7 D6 D5 D4 D3 D2 D1 D0 DEFAULT
0 1 0 1 1 0 0 0 0 B0H
1 X X X X VPR8 VPR7 VPR6 VPR5 08H
1 X X X VPR4 VPR3 VPR2 VPR1 VPR0 01H

Note
1. X = don’t care.

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Philips Semiconductors Objective specification

STN RGB - 132 × 132 × 3 driver PCF8833

Table 47 Parameters of VLCD

SYMBOL VALUE UNIT

b 0.04 V
a 3.6 V

handbook, full pagewidth VPR [8:0]

b a
8 7 6 5 4 3 2 1 0 VCON [6:0] MMVOPCAL [5:0]

VOP [8:0]
VLCD

MGU932

Fig.23 Setting of VOP.

handbook, full pagewidth programming range (05H to 19AH) MGU933

V LCD

00 01 02 03 04 05 06 ... V OP
410DEC

Fig.24 VLCD programming range of the PCF8833.

2003 Feb 14 46
Philips Semiconductors Objective specification

STN RGB - 132 × 132 × 3 driver PCF8833

6.2.32 BOTTOM ROW SWAP

The Bottom Row Swap (BRS) command enables the bottom rows of the PCF8833 to be swapped (mirrored) in order to
make an optimum glass layout.
The function of the BRS command in combination with the function of the Top Row Swap (TRS) is illustrated in
Figures 25, 26, 27 and 28. A description of the TRS function is given in Section 6.2.33.
The reset state of the BRS command is defined in Table 49.

Table 48 Bottom row swap register bits

D/C 7 6 5 4 3 2 1 0 DEFAULT
0 1 0 1 1 0 1 0 BRS B4H

Table 49 Bottom row swap reset state

BIT LOGIC 0 (RESET STATE) LOGIC 1

BRS bottom rows are not mirrored bottom rows are mirrored

6.2.33 TOP ROW SWAP

The Top Row Swap (TRS) command enables the top rows of the PCF8833 to be swapped (mirrored) in order to make
an optimum glass layout.
The function of the TRS command in combination with BRS is illustrated in Figures 25, 26, 27 and 28. The description
of BRS function can be found in Section 6.2.32.
The reset state of the TRS command is given in Table 51.

Table 50 Top row swap register bits

D/C D7 D6 D5 D4 D3 D2 D1 D0 DEFAULT
0 1 0 1 1 0 1 1 TRS B6H

Table 51 Top row swap reset state

BIT LOGIC 0 (RESET STATE) LOGIC 1
TRS top rows are not mirrored top rows are mirrored

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Philips Semiconductors Objective specification

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handbook, full pagewidth

36 rows 131 96 32 63 32 rows
PCF8833

32 rows 32 rows
95 64 columns 0 31

31
32

63
64 DISPLAY

95
96

131
MGU934

Fig.25 Row sequence for BRS = 0 and TRS = 0.

handbook, full pagewidth

36 rows 96 131 63 32 32 rows

PCF8833

32 rows 95 64 columns 0 31 32 rows

31
32

63
64 DISPLAY

95
96

131
MGU935

Fig.26 Row sequence for BRS = 0 and TRS = 1.

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handbook, full pagewidth

36 rows 131 96 32 63 32 rows
PCF8833

64 95 columns 32 0
32 rows 32 rows

31
32

63
64 DISPLAY

95
96

131
MGU936

Fig.27 Row sequence for BRS = 1 and TRS = 0.

handbook, full pagewidth

36 rows 96 131 63 32 32 rows

PCF8833

64 95 columns 31 0
32 rows 32 rows

31
32

63
64 DISPLAY

95
96

131
MGU937

Fig.28 Row sequence for BRS = 1 and TRS = 1.

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6.2.34 SUPER FRAME INVERSION

The Super frame inversion command (FINV), which is the inversion of the row functions after all rows are written to can
be switched off for the PCF8833. When switched off, the inversion of the row functions will then only be done with N-line
inversion. Inversion of the row functions is needed so as to avoid a DC component over the LCD display. A detailed
description of the N-line inversion is given in Section 6.2.45.
The FINV control bit reset state is defined in Table 52.

Table 52 Super frame inversion register bits

D/C 7 6 5 4 3 2 1 0 DEFAULT
0 1 0 1 1 1 0 0 FINV B9H

Table 53 Super frame inversion reset state

BIT LOGIC 0 LOGIC 1 (RESET STATE)
FINV super frame inversion is off super frame inversion is on

6.2.35 DATA ORDER

The data order (DOR) of the data which will be written into the RAM can be changed (swapped).
The DOR command is explained and the reset state defined in Table 55.

Table 54 Data order register bits

D/C 7 6 5 4 3 2 1 0 DEFAULT
0 1 0 1 1 1 0 1 DOR BAH

Table 55 Data order reset state

BIT LOGIC 0 (RESET STATE) LOGIC 1

DOR normal data order MSB/LSB transposed for RAM data

6.2.36 TEMPERATURE COMPENSATED FRAME FREQUENCY

The PCF8833 incorporates a temperature segmented frame frequency programming; see Section 6.2.41. This
segmented frame frequency can be disabled by using the temperature compensated frame frequency (TCDFE)
command.
The TCDFE control bit reset state is defined in Table 57.
When the non-segmented frame frequency is chosen, the frame frequency in segment B (DFB) is valid;
see Section 6.2.41.

Table 56 Temperature compensated frame frequency register bits

D/C 7 6 5 4 3 2 1 0 DEFAULT
0 1 0 1 1 1 1 0 TCDFE BDH

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Table 57 Temperature compensated frame frequency reset state

BIT LOGIC 0 LOGIC 1 (RESET STATE)

TCDFE non-segmented frame frequency segmented frame frequency

6.2.37 TEMPERATURE COMPENSATED VLCD

The PCF8833 incorporates a temperature segmented VOP programming; see Section 6.2.40. By using the temperature
compensated VLCD (TCVOPE) command the temperature segmented VLCD can be disabled.
The TCVOPE control bit reset state is defined in Table 59.
When the non-segmented VLCD programming is chosen the LCD supply voltage is flat, i.e. no compensation over the
specified temperature range (offset VT in Fig.30 is 0).
The TCVOPE command is also used to read back the temperature via the interface; see Section 6.2.44.

Table 58 Temperature segmented VLCD register bits

D/C 7 6 5 4 3 2 1 0 DEFAULT
0 1 0 1 1 1 1 1 TCVOPE BFH

Table 59 Temperature segmented VLCD reset state

BIT LOGIC 0 LOGIC 1 (RESET STATE)

TCVOPE no temperature compensated VLCD segmented temperature compensated VLCD

6.2.38 INTERNAL OR EXTERNAL OSCILLATOR

The Internal/external oscillator (EC) command selects the internal or external oscillator. When an external oscillator is
used the external clock signal has to be connected to the OSC pad; see Section 7.6.
The EC control bit reset state is defined in Table 61.

Table 60 Internal/external oscillator register bits

D/C 7 6 5 4 3 2 1 0 DEFAULT
0 1 1 0 0 0 0 0 EC C0H

Table 61 Internal/external oscillator reset state

BIT LOGIC 0 (RESET STATE) LOGIC 1
EC internal oscillator external clock applied

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6.2.39 SET MULTIPLICATION FACTOR

The Set multiplication factor (SETMUL) command sets the multiplication factor of voltage multiplier 1. A detailed
explanation of the LCD voltage supply architecture is given in Section 7.8.
The different multiplication factor settings for voltage multiplier 1 are given in Table 63.

Table 62 Set multiplication factor register bits; note 1

D/C D7 D6 D5 D4 D3 D2 D1 D0 DEFAULT
0 1 1 0 0 0 0 1 0 C2H
1 X X X X X X S1 S0 03H

Note
1. X = don’t care.

Table 63 Multiplication factor settings voltage multiplier

S1 S0 MULTIPLICATION FACTOR
0 0 2 × multiplication
0 1 3 × multiplication
1 0 4 × multiplication
1 1 5 × multiplication; note 1

Note
1. Reset state.

6.2.40 SET TCVOP SLOPES A, B, C AND D

The Set TCVOP slopes A, B, C and D (TCVOPAB and TCVOPCD) command splits the temperature range into 4 parts
and can be programmed by using the following commands.
Due to the temperature dependency of the liquid crystals viscosity, the LCD controlling voltage VLCD might have to be
adjusted at different temperatures to maintain optimum contrast.
There are four equally spaced temperature regions. For each temperature region a different temperature coefficient can
be selected. Each coefficient can be selected from a choice of eight different slopes, or multiplication factors
(see Table 66) by setting TCVOPAB and TCVOPCD. The controlled VLCD will not be changed linearly, but in 40 mV steps
(parameter b in Table 47). Slopes SLA, SLB, SLC and SLD are overwritten by OTP values if these are set.

Table 64 Set TCVOP slopes A and B register bits; note 1

D/C 7 6 5 4 3 2 1 0 DEFAULT
0 1 1 0 0 0 0 1 1 C3H
1 X SLB2 SLB1 SLB0 X SLA2 SLA1 SLA0 34H

Note
1. X = don’t care.

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Table 65 Set TCVOP slopes C and D register bits; note 1

D/C 7 6 5 4 3 2 1 0 DEFAULT
0 1 1 0 0 0 1 0 0 C4H
1 X SLD2 SLD1 SLD0 X SLC2 SLC1 SLC0 75H

Note
1. X = don’t care.

Table 66 Set TCVOP slopes multiplication factors; note 1

SLA[2:0] MA
SLB[2:0] MB
SLOPE
SLC[2:0] MC
SLD[2:0] MD
111 1.250 −53.33 mV/°C
110 1.000 −42.66 mV/°C
101 0.875 −37.33 mV/°C
100 0.750 −32.00 mV/°C
011 0.625 −26.66 mV/°C
010 0.500 −21.33 mV/°C
001 0.375 −16.00 mV/°C
000 0.250 −10.66 mV/°C

Note
1. For the reset state refer to Table 4. Values overwritten by OTP.

handbook, full pagewidth

MA MB MC MD MGU938

VLCD

−40 −10 20 50 80 T (°C)

Fig.29 Example of segmented temperature coefficients.

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Temperature compensation is implemented by adding an The resolution of the readout is

offset to the VOP value. Previously, in Section 6.2.31, VOP (−40 to +80 °C)/128 = 0.9375 °C/LSB; where 0
was calculated by adding VPR, VCON and MMVOPCAL represents −40 °C and 127 represents +79 °C;
settings together. Now, an additional offset VT is added. see Section 6.2.44.
The final result for VLCD calculation is a 9-bit positive The temperature readout function can also be used to read
number. Care must be taken by the user to ensure that the back the temperature value via the interface;
ranges of VPR, MMVOPCAL, VCON and temperature see equation (12).
compensation do not cause clipping, and hence undesired
The offset value may be calculated from Table 67. The
results (see Fig.24). The adders will not permit overflow or
effect on VLCD can be calculated by multiplying the offset
underflow and will clamp results to either end of the range
value with the value of b.
(VOP = 0 or 445). Also, temperatures outside the range
−40 to +79 °C will be clamped to the last valid offset. For example T = −8 °C: TD = 34 and MB = 0.5:
VLCD(OS) = 40 mV × (64 − 34) × 0.5 = 600 mV.
The temperature readout generates an 8-bit result TD[7:0].
This temperature readout number is used for temperature A complete overview of the programming range of VLCD
compensation. can be found in Section 15.1.

handbook, full pagewidth SLA SLB SLC SLD

TEMPERATURE TD 8 OFFSET 8
READOUT zero VT
offset

−40 0 +80 T (°C)

b a
VCON [5:0] MMVOPCAL [5:0]

VOP [8:0] 9
VPR [8:0] VLCD

MGU939

Fig.30 Segmented temperature compensation.

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Table 67 Offset value

TEMPERATURE RANGE TD EQUIVALENT OFFSET EQUATION VT
<−40 °C 0 32 × (MB + MA)
−40 °C to < −10 °C 0 to 31 (32 × MB) + MA × (32 − TD)
−10 to < 20 °C 32 to 63 (64 − TD) × MB
20 °C to < 50 °C 64 to 95 −(TD − 64) × MC
50 to < 80 °C 96 to 127 −((32 × MC) + MD × (TD − 96))
≥80 °C >127 −(32 × MC + 31 × MD)

6.2.41 FRAME FREQUENCY PROGRAMMING Where fosc is the oscillator frequency which is defined in
Chapter 13.
The PCF8833 incorporates temperature segmented
Frame frequency programming (TCDF). The temperature The Divider Factor (DF) is a 7-bit number so the upper
range is split into 4 areas as shown in Fig.31. programming range is limited to 127DEC resulting in a
minimum frame frequency of 35.8 Hz. The lower
In each of the segments a Division Factor (DF) can be
programming range is limited to 20DEC resulting in a
programmed which determines the Frame Frequency
maximum frame frequency of 227 Hz. The frame
(FF). In equation (2) the frame frequency can be
frequency is derived from the built-in oscillator, and thus
calculated from a given division factor.
the tolerance of the frame frequency has the same ratio as
1
---------- × f osc that given for the oscillator frequency; see Chapter 13.
132
FF = -------------------------- (2)
DF When Partial mode is selected (see Sections 6.2.10 and
6.2.23) the same segmented frame frequencies will be
used as for the full Display mode.

Table 68 Frame frequency programming register bits; note 1

D/C 7 6 5 4 3 2 1 0 DEFAULT
0 1 1 0 0 0 1 0 1 C5H
1 X DFA6 DFA5 DFA4 DFA3 DFA2 DFA1 DFA0 38H
1 X DFB6 DFB5 DFB4 DFB3 DFB2 DFB1 DFB0 35H
1 X DFC6 DFC5 DFC4 DFC3 DFC2 DFC1 DFC0 30H
1 X DFD6 DFD5 DFD4 DFD3 DFD2 DFD1 DFD0 25H

Note
1. X = don’t care.

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handbook, full pagewidth

DFA DFB DFC DFD MGU940

frame
frequency

−40 −11 35 49 79 T (°C)

Fig.31 Segmented temperature frame frequency.

6.2.42 FRAME FREQUENCY PROGRAMMING IN 8-COLOUR MODE

When the Idle mode is selected (see Section 6.2.29) the frame frequency is determined from division factor DF8. In the
Idle mode the PCF8833 works in 8-colour mode and therefore a lower frame frequency can be chosen which will be the
same over the whole temperature range. Calculation of the frame frequency and determining the division factor is the
same as explained in Section 6.2.41.
When Partial mode is selected (see Sections 6.2.10 and 6.2.23) the same frame frequency will be used as for the full
Display mode in Idle mode.

Table 69 Frame frequency programming in 8-colour mode register bits; note 1

D/C 7 6 5 4 3 2 1 0 DEFAULT
0 1 1 0 0 0 1 1 0 C6H
1 X DF86 DF85 DF84 DF83 DF82 DF81 DF80 35H

Note
1. X = don’t care.

6.2.43 SET BIAS SYSTEM

The LCD supply voltage and the bias voltages, which can be chosen, depend on the Liquid Crystal (LC) that is used. In
equation (3) the relationship between the VON/VOFF ratio of LC parameters and the bias system (a) for a given display
size (N) is given.
V ON 2
a + N + 2a
------------- = -----------------------------
2
(3)
V OFF a + N – 2a

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When the required bias system (a) is defined, the LCD The bias voltages needed in a MRA LCD driver depends
supply voltage for a display size N can be determined; see on the number of simultaneous selected rows (P). The
equation (4). bias voltages of the PCF8833 are given for P = 4 and
N P = 1; see Fig.32. In the PCF8833 the maximum column
V LCD = 2a × V ON × --------------------------------------
2
- (4) voltage (GMAX) is always lower or equal to the row
P ( a + N + 2a ) voltage F.
The parameter P in equation (4) is the number of
simultaneous selected rows. For the maximum number of
rows of 132, P = 4 is chosen. When partial Display mode
is selected the P value is set to 1 internally.

handbook, full pagewidth VLCD2 F VLCD2 F

V2H Gmax V2H Gmax

V1H
VC VC VC VC
V1L
V2L −Gmax V2L −Gmax

VSS −F VSS −F

P=4 P=1
MGU941

Fig.32 Bias levels for a MRA system with P = 4 and P = 1.

The bias voltage levels are a function of the row voltage The value of F is determined by (α + 2) × R and the value
F and a: of Gmax is determined by 2 × R.

V LCD The relationship between the ratio F/Gmax and α:

F = ------------
- (5) F a (α + 2) × R (α + 2) α
2 -------------- = --- = ----------------------------- = ------------------ = 1 + --- (9)
G max p 2×R 2 2
F ≥ G max (6)
or:
G max × a
α =  ------------- – 1 × 2
F = ----------------------
- (7) F
(10)
p  G max 
F a
-------------- = --- (8) The relation between a and α for a given p is the following:
G max p
α
a =  --- + 1 × p α =  --- – 1 × 2
a
(11)
Depending on the value of p, the bias levels are set in the 2  p 
ratio of:
This leads to the following bias systems given in Table 70.
p = 1: αR − 2R − 2R − αR
p = 4: αR − R − R − R − R − αR
Where the value of α is in the range from 0 to 4.

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Table 70 Bias system ratios

a
VB[3:0] F/Gmax α
P = 1 (N = 32)(1) P = 4 (N = 132)(1)
0000 1.000 0.00 not allowed not allowed
0001 1.250 0.50
0010 1.375 0.75
0011 1.500 1.00 1.500
0100 1.625 1.25 1.625
0101 1.750 1.50 1.750
0110 1.875 1.75 1.875
0111 2.000 2.00 2.000 8.0
1000 2.125 2.25 2.125 8.5
1001 2.250 2.50 2.250 9.0
1010 2.375 2.75 2.375 9.5
1011 2.500 3.00 2.500 10.0(2)
1100 2.625 3.25 2.625 not allowed
1101 2.750 3.50 2.750
1110 2.875 3.75 2.875
1111 3.000 4.00 3.000

Notes
1. For Partial mode internally P = 1 is set, otherwise P = 4 is selected. Limitations for Partial mode given in
Section 6.2.43.2 for respectively for full Display mode given in Section 6.2.43.1 have to be taken into account.
2. Reset state.

Table 71 Set bias system register bits; note 1

D/C 7 6 5 4 3 2 1 0 DEFAULT
0 1 1 0 0 0 1 1 1 C7H
1 X X X X VB3 VB2 VB1 VB0 0BH

Note
1. X = don’t care.

6.2.43.1 Limitations on bias voltages in Normal mode

V LCD2
- – V LCD1 = 0 to 0.5 V
VDD1: 1.5 to 3.3 V  ---------------
2

VLCD1: 5.5 to 11 V
6.2.43.2 Limitations on bias voltages in Partial mode
VLCD2: 10 to 20 V
VDD1: 1.5 to 3.3 V
(VLCD2 − VLCD1): 4.5 to 9 V
VLCD1: 2.9 to 12 V
V LCD2
 --------------- – V LVD1 = 0 to 1 V
VLCD2: 3.8 to 12 V
 2 - 
( V LCD2 – V LCD1 ) max = 0.5 V
but for VLCD2: 10 to 11 V:

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6.2.44 TEMPERATURE READBACK A measurement can be initiated by sending the instruction

to set TCVOPE (to either logic 1 or logic 0), irrespective of
The PCF8833 has a built-in temperature readback
whether temperature compensation is disabled or not.
(RDTEMP) measurement device. The measured value is
provided as an 8-bit digital value TD[7:0] which can be After initialization, the measurement will take
read back via the interface. approximately 5 ms to complete. It is recommended to
read the register twice to qualify the returned result,
The temperature can be determined from TD[7:0] using
especially if the measurement is triggered automatically.
the following formula:
T = ( 0.9375 × TD – 40 )°C (12) The input and output data format for the temperature
readback is given in Table 73.
Temperature measurements are started automatically
every ten seconds when the digital temperature
compensation is active (default).

Table 72 Temperature readback register bits

D/C 7 6 5 4 3 2 1 0 DEFAULT
0 1 1 0 1 1 0 0 0 C8H

Table 73 Temperature readback data format

SYMBOL D/C 7 6 5 4 3 2 1 0 DEFAULT
(S)DIN 0 1 1 0 1 1 0 0 0 C8H
(S)DOUT − TD[7] TD[6] TD[5] TD[4] TD[3] TD[2] TD[1] TD[0] XX

6.2.45 N-LINE INVERSION

The N-line inversion (NLI) command inverts the row functions after N-line row time slots in order to avoid a DC
component on the LCD display. Thus, when N-line is set to 19DEC inversion of the row functions will occur after 76 rows.
With FINV = 1 (see Section 6.2.34) the super-frame inversion is active and the NLI counter always starts at super-frame
start.
When FINV = 0 a DC voltage may remain on the display depending on the NLI setting. When FINV = 0 and NLI = 0 there
is no inversion, which results in a DC voltage on the display.

Table 74 N-line inversion register bits

D/C 7 6 5 4 3 2 1 0 DEFAULT
0 1 1 0 0 1 0 0 1 C9H
1 NLI7 NLI6 NLI5 NLI4 NLI3 NLI2 NLI1 NLI0 13H

Table 75 N-line inversion

NLI[7:0] DESCRIPTION
0000 0000 no N-line inversion (super frame inversion)
0000 0001 inversion after 4 rows in full Display mode or 1 row in Partial mode
0000 0010 inversion after 8 rows in full Display mode or 2 rows in Partial mode
: :

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6.2.46 READBACK ID1 is the manufacture ID and is hardwired in the

PCF8833.
The PCF8833 can be identified when the readback
commands (RDID1, RDID2 and RDID3) are sent via the ID2 is the version ID and is programmed in the module
interface. When the readback command is sent, the maker OTP cells; see Chapter 15.
PCF8833 will send back an 8-bit number.
ID3 is the module ID and is programmed in the module
Depending on the SCLK speed the readback bit D7 might maker OTP cells; see Chapter 15.
get corrupted. When the speed is reduced to at least half
of the specified maximum speed, at least for the D7 bit, the
transferred bit is valid.

Table 76 RDID1 data format

SYMBOL D/C 7 6 5 4 3 2 1 0 DEFAULT
(S)DIN 0 1 1 0 1 1 0 1 0 DAH
(S)DOUT − 0 1 0 0 0 1 0 1 45H

Table 77 RDID2 data format; note 1

SYMBOL D/C 7 6 5 4 3 2 1 0 DEFAULT
(S)DIN 0 1 1 0 1 1 0 1 1 DBH
(S)DOUT − X X X X X X X X 80H

Note
1. X = don’t care.

Table 78 RDID3 data format; note 1

SYMBOL D/C 7 6 5 4 3 2 1 0 DEFAULT
(S)DIN 0 1 1 0 1 1 1 0 0 DCH
(S)DOUT − X X X X X X X X 03H

Note
1. X = don’t care.

6.2.47 ENABLE OR DISABLE FACTORY DEFAULTS (SFD)

The Enable or disable factory defaults (SFD) command will enable or disable the factory defaults stored in the MMOTP
cells; see Section 15.2. These factory defaults can be set by the module maker. If the OTP bit EFD (enable factory
defaults) has been set, these values can not be changed via the interface and the SFD command will have no effect.
Otherwise, the data specified by commands will only be used if SFD is set to logic 0.
The reset state of the SFD is defined in Table 80.

Table 79 Enable/disable factory defaults register bits

D/C 7 6 5 4 3 2 1 0 DEFAULT
0 1 1 1 0 1 1 1 SFD EFH

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Table 80 Enable/disable factory defaults reset state

BIT LOGIC 0 LOGIC 1 (RESET STATE)
SFD registers must be set via the interface OTP programmed data is used

7 FUNCTIONAL DESCRIPTION
7.1 MPU interfaces
The PCF8833 can interface to a microcontroller with an 8-bit parallel or a serial interface to transmit both data and
commands to the PCF8833.

7.1.1 HARDWIRED INTERFACE SELECTION

The selection of a given interface is done by setting pins PS0, PS1 and PS2 as shown in Table 81. Inputs PS1 and PS2
must be connected to VDD1 or VSS1.

Table 81 Interface selection; note 1

PS2 PS1 PS0 INTERFACE READBACK SELECT
X X 0 serial (3-line) via the read instruction
X X 1 8080 MPU basic RD write strobe

Note
1. X = don’t care.

7.1.2 GENERAL PROTOCOL

The generally supported protocol for programming the LCD driver is shown in Fig.33.

handbook, full pagewidth

S TB TB TB TB TB P

MGU942

S = start data transmission; P = stop data transmission; TB = transmission byte.

Fig.33 Programming protocol.

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7.1.3 DISPLAY DATA FORMATTING There are 2 bytes used to transfer 1 pixel with the 16-bit
colour depth information; see Table 83. The most
Different display data formats are available because
significant bits are R4, G5 and B4. When the data transfer
different colour depths are supported by the PCF8833.
is stopped after the first write, the data is not transferred to
The colour depths supported are as follows:
the display data RAM. The 16-bit data coming from the
• 4 kbyte colours (12-bit/pixel), RGB 4 : 4 : 4 bits input; interface is mapped by means of dithering to 12-bit data.
see Table 82. The data coming from the interface is The dithered 12-bit data is then stored in the RAM.
directly stored in RAM.
In one byte, 1 pixel is transferred with the 8-bit colour
• 65 kbyte colours (16-bit/pixel), RGB 5 : 6 : 5 bits input;
depth information; see Table 84. The most significant bits
see Table 83. The 16-bit data coming from the interface
are R2, G2 and B1. The 8-bit data coming from the
is mapped by means of dithering to 12-bit data. The interface is mapped by means of a look-up table (see
dithered 12-bit data is then stored in the RAM.
Section 6.2.22) to 12-bit data. The mapped 12-bit data is
• 256 colours (8-bit/pixel), RGB 3 : 3 : 2 bits input; see then stored in the RAM.
Table 84. The 8-bit data coming from the interface is
mapped by means of the Look-Up Table (LUT) (see
Section 6.2.22) to 12-bit data. The mapped 12-bit data
is then stored in the RAM.
There are 3 bytes used to define 2 pixels with the 12-bit
colour depth information; see Table 82. The most
significant bits are R3, G3 and B3. Data is transferred to
the RAM only when all the information i.e. RGB data of that
particular pixel is sent.

Table 82 Write data for RGB 4 : 4 : 4 bits input

BYTE D/C 7 6 5 4 3 2 1 0
1st write 1 R3 R2 R1 R0 G3 G2 G1 G0
2nd write 1 B3 B2 B1 B0 R3 R2 R1 R0
3rd write 1 G3 G2 G1 G0 B3 B2 B1 B0

Table 83 Write data for RGB 5 : 6 : 5 bits input

BYTE D/C 7 6 5 4 3 2 1 0
1st write 1 R4 R3 R2 R1 R0 G5 G4 G3
2nd write 1 G2 G1 G0 B4 B3 B2 B1 B0

Table 84 Write data for RGB 3 : 3 : 2 bits input

BYTE D/C 7 6 5 4 3 2 1 0
1st write 1 R2 R1 R0 G2 G1 G0 B1 B0

7.2 Display data RAM and access arbiter

7.2.1 DISPLAY DATA RAM
The PCF8833 has an integrated 132 × 132 × 12-bit single port static RAM. This 209 kbit memory allows a 132 × 132
(RGB) image with a 12-bpp resolution (4 kbyte colour) to be stored on-chip.

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7.2.2 RAM ACCESS ARBITER For example, if the whole display content is written, the
window will be defined by the following values: xs = 0 (0H),
The function of the arbiter is to handle the data flow. If a
ys = 0 (0H), xe = 131 (83H) and ys = 131 (83H).
write access is done on the RAM and a read access is
requested at the same time, then the arbiter will ensure In the vertical addressing mode (V = 1), the Y address
that there are no data collisions. Writing data to the RAM increments after each pixel. After the last Y address
has priority. Therefore no handshaking is done at the (Y = ye), Y wraps around to ys and X increments to
interface side and the data can be applied to the interface address the next column. In horizontal addressing mode
without having data read/write errors on the RAM. (V = 0), the X address increments after each pixel. After
the last X address (X = xe), X wraps around to xs and
7.2.3 WR ADDRESS COUNTER Y increments to address the next row. After the very last
address (X = xe and Y = ye) the address pointers wrap
The address counter sets the addresses of the display
around to address (X = xs and Y = ys).
data RAM for writing.
For flexibility in handling a wide variety of display
Data is written pixel wise into the RAM of the PCF8833.
architectures, the command ‘Memory Data Access
The data for one pixel is collected (RGB 4 : 4 : 4 bit) before
Control (MADCTL)’ (see Section 6.2.27) defines flags
it is written into the display data RAM. The RAM locations
MX and MY, which allows mirroring of the X and
are addressed by the address pointers. The address
Y addresses. All combinations of flags are allowed.
ranges are X = 0 to X = 131 (83H) and Y = 0 to
Figures 34, 35 and 36 show the possible combinations of
Y = 131 (83H). Addresses outside of these ranges are not
writing to the display RAM. When MX, MY and V is
allowed.
changed, the data must be re-written to the display RAM.
Before writing to the RAM a window must be defined into
which data will be written. The window is programmable 7.2.4 DISPLAY ADDRESS COUNTER
via the command registers xs and ys (designating the start
The display address counter generates the addresses for
address) and xe and ye (designating the end address).
readout of the display data RAM.

xs xe MGU943 xs xe MGU944
handbook, halfpage
0 handbook, halfpage
0

ys ys
Y address

Y address

ye ye

131 131

0 X address 131 0 X address 131

V = 0; MX = 0 and MY = 0. V = 1; MX = 0 and MY = 0.

Fig.34 Sequence of writing data bytes into RAM showing function of V bit.

2003 Feb 14 63
Philips Semiconductors Objective specification

STN RGB - 132 × 132 × 3 driver PCF8833

xs xe MGU945 xe xs MGU946
handbook, halfpage
0 handbook, halfpage
0

ys ys
Y address

Y address
ye ye

131 131

0 X address 131 131 X address 0

V = 0; MX = 0 and MY = 1. V = 0; MX = 1 and MY = 0.

xs xe MGU947 xe xs MGU948
handbook, halfpage
131 handbook, halfpage
131

ye ye
Y address

Y address

ys ys

0 0

0 X address 131 131 X address 0

V = 0; MX = 0 and MY = 0. V = 0; MX = 1 and MY = 1.

Fig.35 Sequence of writing data bytes into RAM with horizontal addressing (V = 0) showing function MX and MY.

2003 Feb 14 64
Philips Semiconductors Objective specification

STN RGB - 132 × 132 × 3 driver PCF8833

xs xe MGU949 xe xs MGU950
handbook, halfpage
0 handbook, halfpage
0

ys ys
Y address

Y address
ye ye

131 131

0 X address 131 131 X address 0

V = 1; MX = 0 and MY = 0. V = 1; MX = 1 and MY = 0.

xs xe MGU951 xs xe MGU952
handbook, halfpage
131 handbook, halfpage
131

ye ye
Y address

Y address

ys ys

0 0

0 X address 131 131 X address 0

V = 1; MX = 0 and MY = 1. V = 1; MX = 1 and MY = 1.

Fig.36 Sequence of writing data bytes into RAM with vertical addressing (V = 1) showing function MX and MY.

2003 Feb 14 65
Philips Semiconductors Objective specification

STN RGB - 132 × 132 × 3 driver PCF8833

7.3 Command decoder • All column and row outputs are set to VSS1 (display off)
The command decoder identifies command words arriving • RAM data undefined
at the interface and routes the following data bytes to their • Power-down mode
destination. The command set is given in Chapter 6.
• Command register set to default states; see Table 4.
7.4 Grey scale controller
7.8 LCD voltage generator and bias level generator
For a grey scale driving scheme, Frame Rate Control The LCD voltage generator and the bias level generator is
(FRC) with carefully controlled mixing of the FRC pattern
illustrated in Fig.37. The VLCD is generated by means of
on each pixel is used. The special mixing ensures that the two voltage multipliers, with voltage multiplier 1 being
pattern placed on each pixel is different from each of its programmable; see Section 6.2.39.
neighbours. In frame rate control 16 frames form together
to produce a super-frame. All 16 frames have the same Behaviour of voltage multiplier 2 depends on the mode.
duration. In the full Display mode, voltage multiplier 2 behaves as a
doubler. In the partial Display mode voltage multiplier 2
7.5 Timing generator feeds the voltage of VLCDIN1 directly to VLCDOUT2.

The timing generator produces the various signals The LCD voltage generator requires in total 9 external
required to drive the internal circuitry. Internal chip components (capacitors). The recommended values and
operation is not affected by operations on the data bus. voltage ranges for the external components are specified
in Table 85. The given values should be referred to as
7.6 Oscillator information only. It is recommended to check how patterns
with high load are displayed before finalizing the values.
The on-chip oscillator provides the clock signal for the
display system. No external components are required and The bias level generator generates the required bias levels
the OSC input must be connected to VDD1. An external according to the programmed bias systems; see
clock signal, if used, is connected to the OSC input. In this Section 6.2.43.
case the internal oscillator must be switched off by a
To save power it is recommended to apply capacitors to
software command; see Section 6.2.38.
bias level pads (V2H, V1H, VC, V1L and V2L) of
approximately 1 µF. A capacitor at VC pad is expected to
7.7 Reset
be the most effective. Depending on the application of the
The chip has a hardware and a software reset. After VC capacitor it might be advantageous or even necessary
power-up a hardware reset (pin RES) must be applied. to set the OPT bit VCBW = 1; see Table 97 and
The hardware and software reset give the same results. Section 15.8.
After a reset, the chip has the following state; see
Section 6.2.2:

Table 85 External components

ITEM CAPACITOR VALUE VOLTAGE RANGE

C1 to C4; CVLCD1 1 to 4.7 µF 16 V
C5; CVLCD2 1 to 4.7 µF 25 V
CVDD2 1 to 4.7 µF 4.5 V
CVDD1 1 µF 3.3 V

2003 Feb 14 66
Philips Semiconductors Objective specification

STN RGB - 132 × 132 × 3 driver PCF8833

handbook, full pagewidth VLCDOUT2

C5+
C5 VLCD

VOLTAGE C5− CVLCD2 VLCDIN2

MULTIPLIER 1 V2H
VLCDIN1 VOLTAGE
C4+ MULTIPLIER 2
VLCDOUT1
C4
C4−
C3+ CVLCD1
V1H
C3
C3−
C2+
C2
VLCDSENSE
C2−
BIAS VC
C1+
LEVEL
C1
GENERATION
C1−
VDD2
V1L
VSS2
MONITOR

VDD3 VDD1
CVDD2 VSS1 CVDD1 V2L
VSS1

VSS
MGU953

Fig.37 LCD voltage and bias level generator.

7.9 Column drivers, data processing and data 8 PARALLEL INTERFACE

latches
The 8080-series 8-bit bidirectional interface can be used
The column drivers section includes 132 × 3 column for communication between the microcontroller and the
outputs (C0 to C395) which should be connected directly PCF8833. The selection of this interfaces is done with pins
to the LCD. When less than 396 columns are required, the PS2, PS1 and PS0; see Section 7.1.1.
unused column outputs must be left open-circuit.
The interface functions of the 8080-series parallel
The column output signals are generated in the data interface are given in Table 86.
processing block by reading out data from the display RAM
and processing with the appropriate orthogonal function Table 86 8080-series parallel interface function; note 1.
which represents the simultaneously selected rows.
D/C RD WR OPERATION
7.10 Row drivers 0 1 R command write
The row drivers section includes 132 row outputs which 1 1 R command data write
should be connected directly to the LCD. When less than 1 1 R display data write
132 rows are required the unused column outputs must be 0 R 1 read status register
left open-circuit.
1 R 1 none
When the PCF8833 is operating in full Display mode, 1 R R forbidden
4 rows are always selected simultaneously. In partial
Display mode the active row output signals are selected Note
one after the other. 1. R = rising edge.

2003 Feb 14 67
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STN RGB - 132 × 132 × 3 driver PCF8833

When sending commands to the PCF8833 the D/C line When using the RDDIDIF (see Section 6.2.6) or RDDST
must be pulled HIGH when the command data is (see Section 6.2.7) commands the PCF8833 sends
transferred (see Fig.38). The same is valid when RAM 24 or 32 data bits respectively back to the microcontroller.
data is sent to the PCF8833 (see Fig.39). The protocol for the RDDIDIF and RDDST commands is
illustrated in Fig.41.
The PCF8833 can send data back to the microcontroller in
2 different ways. The protocol for the RDID1, RDID2, The parallel interface timing diagram is illustrated in
RDID3 and RDTEMP commands is illustrated in Fig.40. Fig.52. For the dummy read cycle the time tACC is
Descriptions of these commands is given in Chapter 6. referenced to the rising edge of the RD signal.
When reading out RDTEMP it is recommended to read this
data several times to validate the readout number.

handbook, full pagewidth

S TB TB TB TB TB TB P

CS

D/C

WR

D7 to D0 command
command data command command command command

MGU954

Fig.38 Parallel bus protocol, write to register (PS[2:0] = XX1).

handbook, full pagewidth

S command RAM data RAM data RAM data RAM data RAM data P

CS

D/C

WR

D7 to D0
command RAM data RAM data RAM data RAM data RAM data
(input)
MGU955

Fig.39 Parallel bus protocol, write to display RAM (PS[2:0] = XX1).

2003 Feb 14 68
Philips Semiconductors Objective specification

STN RGB - 132 × 132 × 3 driver PCF8833

handbook, full pagewidth dummy dummy

S TB read TB read TB TB TB P

CS

D/C

WR

RD

D7 to D0 read
command command command
(input)

D7 to D0
(output)
MGU956

Fig.40 Parallel bus protocol, read from register (PS[2:0] = XX1) for RDID1, RDID2, RDID3 and RDTEMP
commands.

handbook, full pagewidth dummy

S TB RDDIDIF = 24 bits, RDDST = 32 bits TB TB P
read

CS

D/C

WR

RD

D7 to D0 read
command command command
(input)

D7 to D0
RDDIDIF = 24 bits, RDDST = 32 bits
(output)
MGU957

Fig.41 Parallel bus protocol, read from register (PS[2:0] = XX1) for the RDDIDIF and RDDST commands.

2003 Feb 14 69
Philips Semiconductors Objective specification

STN RGB - 132 × 132 × 3 driver PCF8833

9 SERIAL INTERFACE Any instruction can be sent in any order to the PCF8833;
the MSB is transmitted first. The serial interface is
Communication with the microcontroller can also occur via
initialized when SCE is HIGH. In this state, SCLK pulses
a clock-synchronized serial peripheral interface. The
have no effect and no power is consumed by the serial
selection of this interface is achieved with pin PS0; see
interface. A falling edge on pin SCE enables the serial
Section 7.1.1.
interface and indicates the start of data transmission.
The serial interface is a 3-line bidirectional interface for
Figure 42 shows the protocol of the Write mode:
communication between the microcontroller and the LCD
driver chip. The 3 lines are chip enable (SCE), Serial • When SCE is HIGH, SCLKs are ignored. The serial
Clock (SCLK) and Serial Data (SD). The PCF8833 is interface is initialized during the HIGH time of SCE.
connected to the SD pin of the microcontroller by two pins • At the falling edge of SCE SCLK must be LOW (see
SDIN (data input) and SDOUT (data output) which are Fig.51)
connected together. • SDIN is sampled at the rising edge of SCLK

9.1 Write mode • D/C indicates, whether the byte is a command (D/C = 0)
or data (D/C = 1). It is sampled with the first rising SCLK
The Write mode of the interface means that the edge.
microcontroller writes commands and data to the
• If SCE stays LOW after the last bit of a data/command
PCF8833. Each data packet contains a control bit D/C and
byte, the serial interface will receive the D/C bit of the
a transmission byte. If bit D/C is logic 0, the following byte
next byte at the next rising edge of SCLK (see Fig.43).
is interpreted as a command byte. The command set is
given in Table 1. If bit D/C is logic 1, the following bytes are • A reset pulse at pin RES interrupts the transmission.
stored in the display data RAM or registers. After every The data being written into the RAM may be corrupted.
RAM data byte the address counter increments The registers are cleared. If SCE is LOW after the rising
automatically. Figure 42 shows the general format of the edge of RES, the serial interface is ready to receive the
Write mode and the definition of the transmission byte. D/C bit of a data/command byte; see Figs 44 and 50.

handbook, full pagewidth transmission byte (TB)

may be a command OR a data byte

D/C D7 D6 D5 D4 D3 D2 D1 D0

MSB LSB

D/C TB D/C TB D/C TB

MGU958

Fig.42 Serial data stream, Write mode.

2003 Feb 14 70
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STN RGB - 132 × 132 × 3 driver PCF8833

handbook, full pagewidth

S TB TB P

SCE

SCLK

SDIN DC b7 b6 b5 b4 b3 b2 b1 b0 DC b7 b6 b5 b4 b3 b2 b1 b0

MGU959

Fig.43 Serial bus protocol, write to register with control bit in transmission (PS[2:0] = XX0).

handbook, full pagewidth

S TB P

SCE

RES

SCLK

SDIN DC b7 b6 b5 b4 b3 b2 DC b7 b6 b5 b4 b3 b2 b1 b0

MGU960

Fig.44 Serial bus protocol, Write mode, interrupted by reset (RES); (PS[2:0] = XX0).

handbook, full pagewidth

S TB P

SCE

RES

SCLK

SDIN DC b7 b6 b5 b4 b3 b2 DC b7 b6 b5 b4 b3 b2 b1 b0

MGU961

Fig.45 Serial bus protocol, Write mode, interrupted by chip enable (SCE); (PS[2:0] = XX0).

2003 Feb 14 71
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2003 Feb 14 9.2 Read mode

Philips Semiconductors
STN RGB - 132 × 132 × 3 driver
The Read mode of the serial interface means that the microcontroller reads data from the PCF8833. The PCF8833 can send data back to the
microcontroller in two different ways. The serial bus protocol for the RDID1, RDID2, RDID3 and RDTEMP commands is illustrated in Fig.46. Descriptions
of these commands are given in Section 6.2. After a command has been issued, a byte is transmitted in the opposite direction (using SDOUT). In order
to reach the timing characteristics as given in Chapter 13 data bit b7 must be handled as a don’t care. When the speed of the clock is slowed down to
at least half of maximum speed, at least for reading b7, the reading of data bit b7 is valid.
The PCF8833 samples the SDIN data at rising SCLK edges, but shifts SDOUT data at falling SCLK edges. Thus the microcontroller is supposed to
read SDOUT data at rising SCLK edges.
After the read command has been sent, the SDIN line must be set to 3-state not later than the falling SCLK edge of the last bit (see Fig.46).
When using the RDDIDIF (see Section 6.2.6) or RDDST (see Section 6.2.7) commands the PCF8833 sends 24 or 32 data bits respectively back to the
microcontroller. The serial bus protocols for the RDDIDIF and RDDST commands are illustrated in Figs. 47 and 48. After one of these commands has
been sent 3 or 4 bytes respectively are transmitted in the opposite direction (using SDOUT) after one dummy clock cycle is given.
The 8th read bit is shorter than the others because it is terminated by the rising SCLK edge; see Figs 46, 47 and 48. The last rising SCLK edge sets
SDOUT to 3-state.
The serial interface timing diagram is illustrated in Fig.51. For the dummy read cycle the time tACC is referenced to the rising edge of the SCLK signal.
72

S TB TB TB P

SCE

SCLK

SDIN DC b7 b6 b5 b4 b3 b2 b1 b0 DC b7 b6 b5 b4 b3 b2 b1 b0

SDOUT b7 b6 b5 b4 b3 b2 b1 b0

MGU962

Objective specification
Fig.46 Serial bus protocol, Read mode (PS[2:0] = XX0) for RDID1,RDID2, RDID3 and RDTEMP commands.

PCF8833
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2003 Feb 14

Philips Semiconductors
STN RGB - 132 × 132 × 3 driver
S TB TB TB P

SCE

SCLK

SDIN DC b7 b6 b5 b4 b3 b2 b1 b0 DC b7 b6 b5 b4 b3 b2 b1 b0

SDOUT d23 d22 d21. . . d3 d2 d1 d0

MGU963

Fig.47 Serial bus protocol, Read mode (PS[2:0] = XX0) for the RDDIDIF command.
73

S TB TB TB P

SCE

SCLK

SDIN DC b7 b6 b5 b4 b3 b2 b1 b0 DC b7 b6 b5 b4 b3 b2 b1 b0

SDOUT d31 d30 d29. . . d3 d2 d1 d0

Objective specification
MGU964

PCF8833
Fig.48 Serial bus protocol, Read mode (PS[2:0] = XX0) for the RDDST command.
Philips Semiconductors Objective specification

STN RGB - 132 × 132 × 3 driver PCF8833

10 LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134); note 1.
SYMBOL PARAMETER MIN. MAX. UNIT
VSS2 system ground voltage −0.5 +0.5 V
VDD1 logic supply voltage 1 −0.5 +4.0 V
VDD2 supply voltage 2 for the internal voltage generator −0.5 +6.5 V
VDD3 analog supply 3 for the internal voltage generator −0.5 +4.0 V
VLCDIN1 LCD supply voltage input 1 −0.5 +16 V
VLCDIN2 LCD supply voltage input 2 −0.5 +20 V
VLCDSENSE voltage multiplier input voltage −0.5 +20 V
VOTP(gate) supply voltage 1 for OPT programming −0.5 +10 V
VOTP(drain) supply voltage 2 for OPT programming (Vwrite) −0.5 +10 V
IDDn supply current at all VDD pins −50 +50 mA
ISSn negative supply current at all VSS pins −50 +50 mA
VI, VO input/output voltage except for row and column outputs −0.5 VDD + 0.5 V
output voltage for row and column outputs −0.5 VLCD2 + 0.5 V
II DC input current −10 +10 mA
IO DC output current −10 +10 mA
Ptot total power dissipation − 300 mW
Tstg storage temperature −55 +125 °C
Tj junction temperature − 125 °C

Note
1. Parameters are valid over the operating temperature range; all voltages are referenced to VSS1; unless otherwise
specified.

11 HANDLING
Inputs and outputs are protected against electrostatic discharge in normal handling. However, to be totally safe, it is
recommended to take normal precautions appropriate to handling MOS devices (see “Handling MOS Devices”).

2003 Feb 14 74
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STN RGB - 132 × 132 × 3 driver PCF8833

12 DC CHARACTERISTICS
VDD1 = 1.5 to 3.3 V; VDD2 = VDD3 = 2.4 to 3.5 V; VSS = 0 V; VLCD = 3.8 to 20.0 V; Tamb = −40 to +85 °C; unless
otherwise specified.
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Supplies
VDD1 logic supply voltage 1 1.5 − 3.3 V
VDD2 supply voltage 2 for the internal note 1 2.4 − 4.5 V
voltage generator
VDD3 supply voltage 3 for the internal note 1 2.4 − 3.5 V
voltage generator
VLCDIN1 LCD supply voltage input 1 LCD input voltage 1 − − 16.0 V
externally supplied (both
voltage multipliers are
disabled)
VLCDIN2 LCD supply voltage input 2 LCD input voltage 2 − − 20.0 V
externally supplied (both
voltage multipliers are
disabled)
VLCDOUT1 LCD supply voltage output 1 LCD voltage internally 3.8 − 10.0 V
generated with voltage
multiplier 1 (voltage
generator enabled); note 2
VLCDOUT2 LCD supply voltage output 2 LCD voltage internally 3.8 − 20.0 V
generated with voltage
multiplier 2 (voltage
generator enabled); note 2
VLCD(tol) tolerance of generated VLCD with calibration; note 3 −70 − +70 mV
Static current consumption
IDD1 logic supply current notes 5 and 6 − 1.5 5 µA
IDD2, IDD3 supply current for the internal notes 5 and 6 − 0.5 1 µA
voltage generator
Dynamic current consumption
IDD1 logic supply current Normal mode; note 5 − 100 − µA
IDD1 logic supply current during RAM Normal mode; notes 5 and 7; − 1000 − µA
access see Fig.49
IDD2, IDD3 supply current for the internal Normal mode; note 5 − tbf − µA
voltage generator
IDD(tot) total supply current (VDD1 + VDD2, Normal mode; note 5 − tbf − µA
VDD3)
Logic inputs and outputs
VOL LOW-level output voltage IOL = 0.5 mA VSS1 − 0.2VDD1 V
VOH HIGH-level output voltage IOH = −0.5 mA 0.8VDD1 − VDD1 V
VIL LOW-level input voltage VSS1 − 0.3VDD1 V
VIH HIGH-level input voltage 0.7VDD1 − VDD1 V
IL leakage current VI = VDD1 or VSS1 −1 − +1 µA

2003 Feb 14 75
Philips Semiconductors Objective specification

STN RGB - 132 × 132 × 3 driver PCF8833

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Column and row outputs
Ro(col) column output resistance VLCD2 = 10 V − − 5 kΩ
C0 to C395
Ro(row) row output resistance R0 to R131 VLCD2 = 10 V − − 5 kΩ
Vbias(col) bias tolerance C0 to C395 −100 0 100 mV
Vbias(row) bias tolerance R0 to R131 −100 0 100 mV
Notes
1. VDD2 and VDD3 always have to be higher than or equal to VDD1.
2. The maximum possible VLCD voltage that may be generated is dependent on supply voltage VDD2, temperature and
(display) load.
3. Valid for values of temperature, VPR and TC used at the calibration and with temperature calibration disabled.
4. Power-save mode.
5. Conditions are: VDD1 = 2.75 V, VDD2 = 2.75 V, VLCD2 = 13.9 V, voltage multiplier 1 at 5 × VDD2, inputs at VDD1 or
VSS1, interface inactive, internal VLCD generation, VLCD2 output is loaded by 400 µA and VLCD1 output is loaded by
0 µA and Tamb = 25 °C.
6. During power-down all static currents are switched off.
7. VDD1 = 1.8 V and interface cycle time Tcyc = 333 ns.

MGU965
8
handbook, halfpage
I DD1, I DD3
(mA)

6
(4)

(3)

2
(2)

(1)

0
0 2 4 6 8
fcyc (MHz)
(1) VDD1 = 1.5 V
(2) VDD1 = 1.8 V
(3) VDD1 = 2.5 V
(4) VDD1 = 3.3 V

Fig.49 Dynamic current consumption IDD1, IDD3 for different VDD1 supplies when writing data from interface to
display RAM at ambient temperature.

2003 Feb 14 76
Philips Semiconductors Objective specification

STN RGB - 132 × 132 × 3 driver PCF8833

13 AC CHARACTERISTICS
VDD1 = 1.5 to 3.3 V; VDD2 = VDD3 = 2.4 to 3.5 V; VSS1 = VSS2 = 0 V; Tamb = −40 to +85 °C; note 1; unless otherwise
specified.
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
fframe LCD frame frequency (internal clock) VDD1 = 3.0 V − tbf − Hz
fosc oscillator frequency notes 2 and 3 − 600 − kHz
fclk(ext) external clock frequency − tbf − kHz
Reset; see Fig.50
tW(RESL) reset LOW pulse width note 4 500 − − ns
tRSS reset spike suppression − − 100 ns
tSU;RESL reset LOW pulse set-up time after power-on 0 − 1 µs
tRT initialization note 5 0 − 5 ms
tRI interface ready after reset pulse 0 − 1 µs
Serial interface; VDD1(min) = 1.65 V; note 6; see Fig.51
TSCYC serial clock SCLK period (SCLK) 150 − − ns
tSHW SCLK pulse width HIGH 60 − − ns
tSLW SCLK pulse width LOW 60 − − ns
tSDS SDIN data set-up time 60 − − ns
tSDH SDIN data hold time 60 − − ns
tACC SDOUT access time CL = 30 pF 10 − 50 ns
tOH SDOUT output disable time CL = 5 pF; 25 − 50 ns
R = 3 kΩ
tSCC SCLK to SCE time 20 − − ns
tCHW SCE pulse width HIGH 40 − − ns
tCSS SCE to SCLK set-up time 60 − − ns
tCSH SCE to SCLK hold time 65 − − ns
8-bit parallel (8080-type) interface; VDD1(min) = 1.65 V; note 6; see Fig.52
tCS CS-WR and CS-RD time note 7 10 − − ns
tAH D/C address hold time 10 − − ns
tAS address set-up time 10 − − ns
TCYC system cycle time 160 − − ns
tCCLW WR control pulse width LOW Write mode 38 − − ns
tCCLR RD control pulse width LOW Read mode 38 − − ns
tCCHW WR control pulse width HIGH Write mode 90 − − ns
tCCHR RD control pulse width HIGH Read mode 90 − − ns
tDS D0 to D7 data set-up time 10 − − ns
tDH D0 to D7 data hold time 10 − − ns
tACC read access time note 8; CL = 30 pF − − 30 ns
tOH output disable time note 8; CL = 5 pF; 30 − 160 ns
R = 3 kΩ; note 9

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Philips Semiconductors Objective specification

STN RGB - 132 × 132 × 3 driver PCF8833

Notes
1. VDD2 and VDD3 always have to be larger than or equal to VDD1.
2. Not directly observable at any pin.
3. After calibration the following fosc can be expected at 25 °C: 600 kHz ±4%; at different temperatures an additional
variation of +0.12%/°C will not be exceeded.
4. All timing values are valid within the operating supply voltage and ambient temperature range and are referenced to
VIL and VIH with an input voltage swing of VSS1 to VDD1.
5. The initialization incorporates the start-up of the internal circuitry including the readout of the OTP cells. The start-up
time for the internal voltage generation is not included.
6. The input signal rise time and fall time (tr and tf) are specified at 15 ns or less. When the cycle time is used at high
speed, the specification is tr + tf ≤ (tCYC − tCCLW − tCCHW) or tr + tf ≤ (tCYC – tCCLR − tCCHR).
7. CS can be permanently tied LOW.
8. The output disable time and read access time is applicable after the second read cycle (see Fig.40).
9. For VDD1 = 1.8 V possible variation of tOH is between 40 and 80 ns for a temperature range of −40 to +85 °C.

handbook, full pagewidth

VDD1

t RSS

VIH
RES VIL

t SU;RESL t W(RESL) t RT

Status resetting normal operation

VDD1

VIH
RES
VIL

t W(RESL) t W(RESL) t RT

Status resetting normal operation

t RI t RI

Interface:
commands/data not accepted accepted not accepted accepted

MGU966

Fig.50 Reset timing.

2003 Feb 14 78
Philips Semiconductors Objective specification

STN RGB - 132 × 132 × 3 driver PCF8833

handbook, full pagewidtht CHW t CSS t CSH t CHW

SCE

T SCYC t SCC
t SLW t SHW

SCLK

tr tr
t SDS t SDH

SDIN

t ACC t OH

high-impedance
SDOUT
MGU967

Fig.51 Serial interface timing.

handbook, full pagewidth

D/C

t AS t AH t CS

CS

T CYC
t CCLR, t CCLW t CCHR, t CCHW

WR, RD

t DS t DH

D0 to D7
(Write)

t ACC t OH

D0 to D7
(Read)
MGU968

Fig.52 Parallel interface timing (8080 type).

2003 Feb 14 79
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STN RGB - 132 × 132 × 3 driver PCF8833

14 APPLICATION INFORMATION

handbook, full pagewidth

DISPLAY 132 × 132 (RGB)

66 396 66

VLCDSENSE
PCF8833

VLCDOUT2

VLCDOUT1
VLCDIN2

VLCDIN1
VDD3
VDD2
VDD1

VSS1
VSS2

MGU969

I/O

Fig.53 Application configuration.

Figure 54 shows a typical supply and capacitor connections for the PCF8833.

2003 Feb 14 80
Philips Semiconductors Objective specification

STN RGB - 132 × 132 × 3 driver PCF8833

handbook, full pagewidth common ITO/connector

resistance resistance

12 Ω
VOTP(drain)
600 Ω
VOTP(gate)
15 Ω
<2Ω VSS1
15 Ω
VSS2
200 Ω
<2Ω VDD3
15 Ω
VDD2
GND 30 Ω
VDD1
60 Ω
GND VLCDOUT2
5Ω 15 Ω
VLCDIN2
< 1 kΩ
GND VLDSENSE
60 Ω
C5+
C5 60 Ω PCF8833
C5−
30 Ω
5Ω VLCDOUT1
15 Ω
VLCDIN1
GND 30 Ω
C4+
C4 30 Ω
C4−
30 Ω
C3+
C3 30 Ω
C3−
30 Ω
C2+
C2 30 Ω
C2−
30 Ω
C1+
C1 30 Ω
C1−

MGU970

The indicated resistor values are the maximum recommended values. The recommended capacitor values are given in Table 85.

Fig.54 I/O configuration for the PCF8833.

2003 Feb 14 81
Philips Semiconductors Objective specification

STN RGB - 132 × 132 × 3 driver PCF8833

15 MODULE MAKER PROGRAMMING • Identification bits ID2[7:0] and ID3[7:0]

The One Time Programmable (OTP) technology has been • TRS and BRS
implemented in the PCF8833. It enables the module • Factory default bit EFD
maker to perform an LCD supply voltage calibration after it • Seal bit.
has been assembled on an LCD module. The module
maker can also pre-define command set registers in order 15.1 VLCD calibration
to provide the setmaker with a ‘plug and play’ module
where only display related data has to be sent. The first feature included is the ability to adjust the VLCD
voltage with a 6-bit code (MMVOPCAL). This code is
The PCF8833 features the following module maker
implemented in twos complement notation giving rise to a
programming facilities:
positive or negative offset to the VPR register. The adder in
• VLCD calibration the circuit has underflow and overflow protection. In the
• Multiplication factor S[1:0] to FS[1:0] for full Display event of an overflow, the output will be clamped to
mode and PS[1:0]) for partial Display mode VOP = 445; during an underflow the output will be clamped
to 0.
• Set VPR[8:0] to FVPR[8:0] for full Display mode and
PVPR[8:0] for partial Display mode Figure 55 illustrates how the high voltage generator setting
• Set bias system VB[3:0] to FVB[3:0] for full Display VOP is controlled. Compared to equation (1) in
mode and PVB[3:0] for partial Display mode Section 6.2.31, Fig.55 also takes the temperature
compensation VT into account (see Section 6.2.40), which
• Segmented temperature compensation slopes for VLCD,
is reflected in the following equation:
SLA [2:0], SLB[2:0], SLC[2:0] and SLD[2:0]
VLCD = a + (VT[7:0] + MMVOPCAL[5:0] +
• Segmented temperature frame frequencies DFA[6:0], VCON[6:0] + VPR[8:0]) × b
DFB[6:0], DFC[6:0] and DFD[6:0]
• Frame frequency 8-colour mode DF8[6:0]

handbook, full pagewidth range − 128 to + 127

Temperature compensation VT, 8-bit value

VT [7:0]

range −32 to + 31
OTP VLCD calibration, 6-bit offset

MMVOPCAL [5:0]

range − 64 to + 63
+
VOP
to high voltage
VCON register, 7-bit generator
range 0 to 445
VCON [6:0]

VPR register, 9-bit value

range 0 to 445
VPR [8:0] usable range 5 to 410 MGU971

Fig.55 VLCD calibration.

2003 Feb 14 82
Philips Semiconductors Objective specification

STN RGB - 132 × 132 × 3 driver PCF8833

Table 87 Possible MMVOPCAL values

MMVOPCAL[5:0] DECIMAL EQUIVALENT VLCD OFFSET
011111 31 +1240 mV
011110 30 +1200 mV
011101 29 +1160 mV
: : :
000010 2 +80 mV
000001 1 +40 mV
000000 0 0 mV
111111 −1 −40 mV
111110 −2 −80 mV
: : :
100010 −30 −1200 mV
100001 −31 −1240 mV
100000 −32 −1280 mV

15.2 Factory defaults It is possible to change to settings defined by registers

which can be set via the interface, except ID2[7:0] and
The factory default setting of the following features can be
ID3[7:0] which are defined only by OTP cells. The
predefined with OTP cells:
selection of the factory defaults mode is made by setting
• Multiplication factor S[1:0] for full and partial Display the factory default OTP bit EFD.
mode
The operation can be thought of as a switch that selects
• Set VPR[8:0] for full and partial Display mode
between two sources for the data. When the factory
• Set bias system VB[3:0] for full and partial Display mode defaults are selected (EFD = 1), changing the values via
• Segmented temperature compensation slopes for VLCD, the interface is not possible, not even by sending the SFD
SLA[2:0], SLB[2:0], SLC[2:0] and SLD[2:0] command.
• Segmented temperature frame frequencies DFA[6:0],
DFB[6:0], DFC[6:0] and DFD[6:0]
• Frame frequency 8-colour mode DF8[6:0]
• TRS and BRS
• Identification bits ID2[7:0] and ID3[7:0].

Table 88 Factory default bit EFD

EFD ACTION
0 configuration data is taken from the interface if SFD = 0 or from the OTP if SFD = 1
1 OTP values are used for configuration

2003 Feb 14 83
Philips Semiconductors Objective specification

STN RGB - 132 × 132 × 3 driver PCF8833

handbook, full pagewidth

INTERFACE
SFD
default = 1

OR
OTP CELL
EFD
default = 0

INTERFACE 0
INTERFACE
REGISTERS
e.g. SLA [2:0]
to temperature
compensation circuit
OTP DEFAULTS 1
e.g. SLA [2:0]
MGU972

Fig.56 Factory defaults.

15.3 Seal bit Bit 7 of every data byte is not used. An example sequence
on how to fill the matrix is given in Table 96.
The module maker programming is performed in the
Calibration mode. This mode is entered via a special The default value of the OTP cells is shown in Table 91.
interface command (CALMM). To prevent erroneous These values may be changed by programming the OTP
programming, a seal bit has been implemented which cell. The programming of a cell will invert the default value.
prevents the device from entering Calibration mode. This This inversion may only happen once per cell, as the
seal bit, once programmed, cannot be reversed, thus programming is irreversible.
further changes in programmed values are not possible.
Table 93 shows an example on how to program the OTP
Applying the programming voltage when not in CALMM
cells to receive the values given in Table 92. Some
mode will have no effect on the programmed values.
examples are given below:
Table 89 Seal bit definition 1. The default for DFA[0] is 0; see Table 91, and it is
required to have DFA[0] = 1; see Table 92. This
SEAL BIT ACTION means that the value needs to be inverted. Therefore
0 Calibration mode enabled the OTP cell has to be programmed (a 1 in Table 93).
1 Calibration mode disabled 2. The default for DFA[4] is 1; see Table 91, and it is
required to have DFA[4] = 0; see Table 92. This
15.4 OTP architecture means that the value needs to be inverted. Therefore
the OTP cell has to be programmed (a 1 in Table 93).
An OTP cell is divided into a non-volatile programmable
3. The default for DFA[5] is 1; see Table 91, and it is
instance containing the value and a register, where the
required to have DFA[5] = 1; see Table 92. This
value is made accessible to the rest of the chip.
means that it is not necessary to change the value.
In the PCF8833 104 OTP cells are available for the Therefore it is not necessary to program the OTP cell
module maker. These cells are organised in a matrix of (a 0 in Table 93).
7 rows and 15 columns, where the last row is only partially 4. The default for DFA[6] is 0; see Table 91, and it is
used; see Table 90. All the rows of one particular column required to have DFA[6] = 0; see Table 92. This
of the matrix are filled in parallel by sending 1 byte of data means that it is not necessary to change the value.
with the OTPSHTIN command. Byte 15 is sent first Therefore it is not necessary to program the OTP cell
(containing PVB[3:0], BRS and TRS) and byte 0 last (a 0 in Table 93).
(containing MMVOP[5:0] or SEAL).

2003 Feb 14 84
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2003 Feb 14 Table 90 OTP array: content

Philips Semiconductors
STN RGB - 132 × 132 × 3 driver
BIT 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15
0 SEAL DFA0 DFB0 DFC0 DFD0 DF80 ID20 ID27 ID36 SLA0 SLC0 FVPR0 FVPR6 PVPR3 EFD TRS
1 MMVOP0 DFA1 DFB1 DFC1 DFD1 DF81 ID21 ID30 ID37 SLA1 SLC1 FVPR1 FVPR7 PVPR4 VCBW BRS
2 MMVOP1 DFA2 DFB2 DFC2 DFD2 DF82 ID22 ID31 FS0 (1) SLA2 SLC2 FVPR2 FVPR8 PVPR5 FVB0 PVB0
3 MMVOP2 DFA3 DFB3 DFC3 DFD3 DF83 ID23 ID32 FS1(1) SLB0 SLD0 FVPR3 PVPR0 PVPR6 FVB1 PVB1
4 MMVOP3 DFA4 DFB4 DFC4 DFD4 DF84 ID24 ID33 PS0(2) SLB1 SLD1 FVPR4 PVPR1 PVPR7 FVB2 PVB2
5 MMVOP4 DFA5 DFB5 DFC5 DFD5 DF85 ID25 ID34 PS1(2) SLB2 SLD2 FVPR5 PVPR2 PVPR8 FVB3 PVB3
6 MMVOP5 DFA6 DFB6 DFC6 DFD6 DF86 ID26 ID35 not used

Notes
1. FS[1:0] is the multiplication factor used in full Display mode, compare to S[1:0]; see Section 6.2.39.
2. PS[1:0] is the multiplication factor used in partial Display mode, compare to S[1:0]; see Section 6.2.39.
85

Objective specification
PCF8833
Philips Semiconductors Objective specification

STN RGB - 132 × 132 × 3 driver PCF8833

Table 91 OTP array: default values

BIT 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15
0 0 0 1 0 1 1 0 1 0 0 1 1 0 1 0 0
1 0 0 1 1 0 1 0 1 0 0 0 0 0 1 0 0
2 0 0 0 1 0 0 0 1 1 1 1 0 1 0 1 1
3 0 1 0 1 1 0 0 0 1 1 1 0 1 0 1 1
4 0 1 0 1 1 0 0 0 1 1 1 0 0 1 0 1
5 0 1 1 0 0 1 0 0 1 0 1 0 1 0 1 1
6 0 0 0 0 0 0 0 0 not used

Table 92 OTP array: desired values

BIT 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15
0 0 1 0 0 1 1 0 1 0 0 1 1 0 1 0 0
1 1 0 0 1 0 1 0 1 0 0 0 0 0 1 0 0
2 0 0 1 1 0 0 0 1 1 1 1 0 1 0 1 1
3 1 1 0 1 1 0 0 0 1 1 1 0 1 0 1 1
4 1 0 0 1 1 0 0 0 1 1 1 0 0 1 0 1
5 0 1 1 0 0 1 0 0 1 0 1 0 1 0 1 1
6 0 0 0 0 0 0 0 0 not used

Table 93 OTP array: values to be programmed

BIT 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15
0 0 1 1 0 0 0 0 0 0 0 0 0 0 0 0 0
1 1 0 1 0 0 0 0 0 0 0 0 0 0 0 0 0
2 0 0 1 0 0 0 0 0 0 0 0 0 0 0 0 0
3 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0
4 1 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0
5 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0
6 0 0 0 0 0 0 0 0 not used

2003 Feb 14 86
Philips Semiconductors Objective specification

STN RGB - 132 × 132 × 3 driver PCF8833

15.5 Interface commands

Table 94 contains a list of all OTP related commands.

Table 94 OTP related commands

COMMAND BYTE(1)
NAME D/C HEX DESCRIPTION
D7 D6 D5 D4 D3 D2 D1 D0
CALMM 0 1 1 1 1 0 0 0 0 F0 CALMM command
1 X X ORA2 ORA1 ORA0 X OPE CALMM entry CALMM mode
(CALMM) enable
programming (OPE) set
address (ORA)
Sleep_OUT 0 0 0 0 1 0 0 0 1 11 generate a refresh of the
OTP if CALMM = 0
OTPSHTIN 0 1 1 1 1 0 0 0 1 F1 start shifting data in the shift
1 X D6 D5 D4 D3 D2 D1 D0 register; the shifting is
executed as long as D/C = 1
SFD 0 1 1 1 0 1 1 1 SFD EE/EF set factory default (see
Sections 6.2.47 and 15.2)

Note
1. X = don’t care. For hexadecimal representation, don’t care bits are assumed to be 0.

15.5.1 CALIBRATION MODULE MAKER MODE 15.5.3 SHIFT IN

When CALMM = 1 the device enters the calibration The OTP matrix (see Table 90) is filled using the
module maker mode. This mode enables the filling of the OTPSHTIN command, which is similar to the RAM write
OTP matrix and allows programming of the non-volatile command. First the appropriate command is sent, then the
OTP cells to take place. following data bytes are shifted bytewise into the OTP
matrix from left to right, i.e. the new byte is loaded into
The VOTP(drain) pad is not connected directly to the OTP
byte 0, whereas the data of byte 0 is shifted into byte 1 and
cells, but through a switch that must be closed for
so on. Bit 7 of the data is not used. The shifting is enabled
programming by setting OPE to logic 1.
as long as D/C remains at logic 1.
The OTP row to be programmed may be chosen by setting
the OTP row address ORA[2:0]. 15.6 Suggestion on how to calibrate VLCD2 using
MMVOP
15.5.2 REFRESH
In order to calibrate the programming of VLCD2, the
The action of the refresh instruction is to force the registers sequence in Table 95 is suggested to determine what
of the OTP matrix to load the value from the non-volatile MMVOP value has to be programmed.
part of the OTP cell. This instruction takes up to 1 ms to
It is assumed that the relevant parameters, the VLCD2
complete. During this time all other instructions may be
programming, VPR and the number of stages S, are set via
sent.
the interface. This implies that SFD is set to logic 0 and
In the PCF8833 the refresh instruction is associated with that all OTP settings except MMVOP are ignored.
the Sleep_OUT instruction such that the shift register is
automatically refreshed every time the Sleep_OUT
instruction is sent.
No refresh may be started when in CALMM mode, i.e.
whenever CALMM = 1.

2003 Feb 14 87
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2003 Feb 14 Table 95 Sequence to determine MMVOP

Philips Semiconductors
STN RGB - 132 × 132 × 3 driver
COMMAND BYTE(1)
STEP D/C ADDR DESCRIPTION
7 6 5 4 3 2 1 0
1 0 0 0 0 0 0 0 0 1 01H reset (may also be hardware reset)
2 − − − − − − − − − − wait 1 ms for refresh to take effect
3 0 1 1 1 0 1 1 1 0 EEH set SFD = 0 in order to use interface
values
4 0 0 0 1 0 1 0 0 0 28H send DISPOFF to prevent rows and
columns to toggle
5 0 1 0 1 1 0 0 0 0 B0H set VPR to desired value
1 X X X X VPR8 VPR7 VPR6 VPR5 −
1 X X X VPR4 VPR3 VPR2 VPR1 VPR0 −
6 0 1 1 0 0 0 0 1 0 C2H set multiplication stages to desired
value
1 X X X X X X S1 S0 −
7 0 1 1 1 1 0 0 0 0 F0H enter CALMM mode
1 X X 0 0 0 x 0 1 01H ORA = 000 OPE = 0 CALMM = 1
88

8 0 0 0 0 1 0 0 0 1 11H send Sleep_OUT (no refresh

because CALMM = 1)
9 − − − − − − − − − − wait until D31 = 1 (V stable); note 2
10 0 1 1 1 1 0 0 0 1 F1H send OTPSHTIN; note 3
1 X MMVOP5 MMVOP4 MMVOP3 MMVOP2 MMVOP1 MMVOP0 0 − set MMVOP[5:0] and SEAL = 0
11 − − − − − − − − − − check VLCD2 after VLCD2 has settled
12 − − − − − − − − − − repeat steps 10 to 11 until desired
VLCD2 is reached
13 0 1 1 1 1 0 0 0 0 F0H exit CALMM mode; if required
1 X X 0 0 0 x 0 0 00H ORA = 000 OPE = 0 CALMM = 0

Notes

Objective specification
1. X = don’t care. For hexadecimal representation, don’t care bits are assumed to be logic 0.

PCF8833
2. D31 is the booster voltage status bit; see Section 6.2.7.
3. The chip stays in shift operation as long as D/C is logic 1.
Philips Semiconductors Objective specification

STN RGB - 132 × 132 × 3 driver PCF8833

15.7 Example of filling the shift register

Table 96 shows the sequence of commands to fill the OTP matrix as defined in Table 93.

Table 96 Sequence for filling the OTP matrix

COMMAND BYTE(1)
STEP D/C ADDR DESCRIPTION
7 6 5 4 3 2 1 0
1 0 0 0 0 0 0 0 0 1 01H reset (may also be hardware
reset)
2 wait 1 ms for refresh to take
effect
3 0 1 1 1 1 0 0 0 0 F0H enter CALMM mode
1 X X 0 0 0 X 0 1 01H ORA = 000; OPE = 0;
CALMM = 1
4 0 1 1 1 1 0 0 0 1 F1H send OTPSHTIN; note 2
shift15 1 X X 0 0 0 0 0 0 00H set PVB[3:0]; BRS and TRS
shift14 1 X X 0 0 0 0 0 0 00H set FVB[3:0]; 0 and EFD
shift13 1 X X 0 0 0 0 0 0 00H set PVPR[8:3]
shift12 1 X X 0 0 0 0 0 0 00H set PVPR[2:0] and FVPR[8:6]
shift11 1 X X 0 0 0 0 0 0 00H set FVPR[5:0]
shift10 1 X X 0 0 0 0 0 0 00H set SLD[2:0] and SLC[2:0]
shift9 1 X X 0 0 0 0 0 0 00H set SLB[2:0] and SLA[2:0]
shift8 1 X X 0 0 0 0 0 0 00H set PS[1:0]; FS[1:0] and ID3[7:6]
shift7 1 X 0 0 0 0 0 0 0 00H set ID3[5:0] and ID2[7]
shift6 1 X 0 0 0 0 0 0 0 00H set ID2[6:0]
shift5 1 X 0 0 0 0 0 0 0 00H set DF8[6:0]
shift4 1 X 0 0 0 0 0 0 0 00H set DFD[6:0]
shift3 1 X 0 0 0 0 0 0 0 00H set DFC[6:0]
shift2 1 X 0 0 0 0 1 1 1 07H set DFB[6:0]
shift1 1 X 0 0 1 0 0 0 1 11H set DFA[6:0]
shift0 1 X 0 0 1 1 0 1 0 1AH set MMVOP[5:0] and SEAL
5 0 1 1 1 1 0 0 0 0 F0H exit CALMM mode; if required
1 X X 0 0 0 X 0 0 00H ORA = 000; OPE = 0;
CALMM = 0

Notes
1. X = don’t care. For hexadecimal representation, don’t care bits are assumed to be logic 0.
2. The chip stays in shift operation as long as D/C is logic 1.

15.8 Programming flow

In order to program an OTP cell, the associated register must be set to logic 1 and a programming voltage of 8 V should
to be applied to pins VOTP(gate) and VOTP(drain) for 50 ms. It is strongly recommended to use the sequence shown in
Table 97 to program the OTP cells. In any event the requirements stated in Section 15.9 must be met.
Important: Whenever a new row in the OTP matrix is selected (change of ORA[2:0]), the OTP cells must not be
connected to pin VOTP(drain) (set OPE = 0). For an example see steps 9 to 11 in Table 97.

2003 Feb 14 89
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2003 Feb 14 Table 97 Sequence to program OTP cells

Philips Semiconductors
STN RGB - 132 × 132 × 3 driver
COMMAND BYTE(1)
STEP D/C ADDR DESCRIPTION
7 6 5 4 3 2 1 0
0 set VOTP(gate) = 0 V; VOTP(drain) = 0 V
1 0 0 0 0 0 0 0 0 1 01 reset (may also be hardware reset)
2 wait 1 ms for refresh to take effect
3 set VOTP(gate) = 8 V; VOTP(drain) = 8 V
4 0 1 1 1 1 0 0 0 0 F0 enter CALMM mode
1 X X 0 0 0 X 0 1 01 ORA = 000; OPE = 0; CALMM = 1
5 0 1 1 1 1 0 0 0 1 F1 send OTPSHTIN; note 2
shift15 1 X X PVB3 PVB2 PVB1 PVB0 BRS TRS set PVB[3:0]; BRS and TRS
shift14 1 X X FVB3 FVB2 FVB1 FVB0 VCBW EFD set FVB[3:0]; VCBW and EFD; note 3
:
shift0 1 x MMVOP5 MMVOP4 MMVOP3 MMVOP2 MMVOP1 MMVOP0 0 set MMVOP[5:0] and SEAL = 0
6 0 1 1 1 1 0 0 0 0 F0 select row 0 in OTP matrix
1 X X 0 0 0 X 0 1 01 ORA = 000; OPE = 0; CALMM = 1
90

7 0 1 1 1 1 0 0 0 0 F0 enable programming
1 X X 0 0 0 X 1 1 03 ORA = 000; OPE = 1; CALMM = 1
8 wait for 50 ms until OTP cells are
programmed
9 0 1 1 1 1 0 0 0 0 F0 disable programming
1 X X 0 0 0 X 0 1 01 ORA = 000; OPE = 0; CALMM = 1
10 0 1 1 1 1 0 0 0 0 F0 select row 1 in OTP matrix
1 X X 0 0 1 X 0 1 09 ORA = 001; OPE = 0; CALMM = 1
11 0 1 1 1 1 0 0 0 0 F0 enable programming
1 X X 0 0 1 X 1 1 0B ORA = 001; OPE = 1; CALMM = 1

Objective specification
PCF8833
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2003 Feb 14

Philips Semiconductors
COMMAND BYTE(1)

STN RGB - 132 × 132 × 3 driver

STEP D/C ADDR DESCRIPTION
7 6 5 4 3 2 1 0
12 wait for 50 ms until OTP cells are
programmed
13 0 1 1 1 1 0 0 0 0 F0 disable programming
1 X X 0 0 1 X 0 1 09 ORA = 001; OPE = 0; CALMM = 1
14 repeat steps 10 to 13 for rows 2 to 6
15 0 1 1 1 1 0 0 0 0 F0 exit CALMM mode
1 X X 0 0 0 X 0 0 00 ORA = 000; OPE = 0; CALMM = 0
16 set VOTP(gate) = 0 V; VOTP(drain) = 0 V
Notes
1. X = don’t care. For hexadecimal representation, don’t care bits are assumed to be logic 0.
2. The chip stays in shift operation as long as D/C is logic 1.
3. When VCBW = 1 the VC buffer is switched to a weak buffer. Default is VCBW = 0, where the VC buffer is powerful. To save power a capacitor could
be connected to VC pad. Depending on the application it might be advantageous or even necessary to program VCBW = 1.
91

Objective specification
PCF8833
Philips Semiconductors Objective specification

STN RGB - 132 × 132 × 3 driver PCF8833

15.9 Programming specification

For programming OTP cells, the VOTP(gate) and VOTP(drain) voltages have to be applied as indicated in Fig.57. Voltages
VOTP(gate) and VOTP(drain) can be applied at the same time or can have a staggered sequence as indicated by cases
a and b of Fig.57.
Depending on the series resistance in the supply wires, up to 16 OTP bits can be programmed at the same time. Each
OTP cell can only be programmed once.

Table 98 Programming specification (see Fig.57)

SYMBOL PARAMETER CONDITION MIN. TYP. MAX. UNIT

VOTP(gate) voltage applied to VOTP(gate) pin programming active; tbf 8 tbf V
relative to VSS1 note 1
programming inactive tbf 0 tbf V
VOTP(drain) voltage applied to VOTP(drain) pin programming active; tbf 8 tbf V
relative to VSS1 note 1
programming inactive tbf 0 tbf V
IOTP(gate) current drawn by VOTP(gate) during tbf 100 tbf µA
programming
IOTP(drain) current drawn by VOTP(drain) during per programmed OTP tbf 500 tbf µA
programming cell
Tamb(prog) ambient temperature during 0 25 40 °C
programming
tOPESU set-up time of OPE as a function of VOTP(gate) and 1 − − ms
VOTP(gate) and VOTP(drain) VOTP(drain) > 0 V
tOPEHD hold time of OPE as a function of VOTP(gate) and 1 − − ms
VOTP(gate) and VOTP(drain) VOTP(drain) > 0 V
tWRITEPW pulse width of programming voltage 45 50 55 ms

Note
1. The voltage drop across the ITO track and any connector must be taken into account to guarantee a sufficiently high
voltage at the chip pins.

2003 Feb 14 92
Philips Semiconductors Objective specification

STN RGB - 132 × 132 × 3 driver PCF8833

handbook, full pagewidth t OPESU t OPEHD

OPE

VOTP(gate)

VOTP(drain)
t WRITEPW

(a) VOTP(drain) applied before VOTP(gate)

t OPESU t OPEHD

OPE

VOTP(gate)

VOTP(drain)
t WRITEPW
MGU973

(b) VOTP(gate) applied before VOTP(drain)

Fig.57 Programming waveforms, OPE rises after VOTP(gate) and VOTP(drain).

2003 Feb 14 93
Philips Semiconductors Objective specification

STN RGB - 132 × 132 × 3 driver PCF8833

16 INTERNAL PROTECTION CIRCUITS

handbook, full pagewidth VDD1 VDD2 VDD3

VSS1 VSS1 VSS1

VSS2

VSS2 -SUPPLY VLCDIN1 VLCDOUT1

VDD2 VLCDIN1 VLCDOUT1

VSS1 VSS1
VSS2
VSS1

VLCDIN2 VLCDOUT2, VLCDSENSE

VLCDIN2 VLCDOUT2

VLCDSENSE
4 MΩ
4 MΩ

VSS1 VSS1

V2L, V1L V2H, V1H, VC T7

VLCDIN1 VLCDIN2 VLCDIN2

VLCDIN2

VSS1 VSS1

VSS1 MGU977

Fig.58 Protection circuit diagram; part 1.

2003 Feb 14 94
Philips Semiconductors Objective specification

STN RGB - 132 × 132 × 3 driver PCF8833

WR, DC/SCLK, RD,

handbook, full pagewidth
PS [2:0], OSC, CS/SCE,
T1, T2, T3, T4, T5, T6, RES, VDD(tieoff),
SDOUT, D [7:1], TE, D0/SDIN VSS(tieoff) VOTP(gate), VOTP(drain)

VDD1 VDD1

200 kΩ

VSS1

VSS1 VSS1

C1+, C2+, C3+, C4+, C0 to C395,

C5+, C5– C1–, C2–, C3–, C4– R0 to R131
VDD1 VLCDIN2

VSS1

VSS1 VSS1

MGU978

Fig.59 Protection circuit diagram; part 2.

2003 Feb 14 95
Philips Semiconductors Objective specification

STN RGB - 132 × 132 × 3 driver PCF8833

17 BONDING PAD INFORMATION

handbook, full pagewidth pad 463 pad 462

R63 R31

C191

R32 R0
C395 VSS(tieoff)
RES
TE T7
C384
C383 C1+
VSS1

C1− C144
VSS2 C143
C2+

CS/SCE C2−
VDD1
C3+
VDD3
C336 C3−
VDD2 C335
C4+
C96
D7
C4− C95
D3
D6
D5
VLCDOUT1
D2
D1
D4
D0/SDIN VLCDIN1
SDOUT
D/C/SCLK
WR C288 C5+
RD C287
PS0
PS1 C5−
PS2 C48
OSC C47
VDD(tieoff) VLCDOUT2

VLCDSENSE
VOTP(drain)
VLCDIN2

VOTP(gate)
V2L
V1L
T6 C240 VC
T5 C239
T4 V1H
T3 V2H
T2 C0
R96
T1
VSS(tieoff) R64

C192
R131 R95
pad 769 pad 1

active pads
dummy pads MGU976
alignment marks

Fig.60 Bonding pad location.

2003 Feb 14 96
Philips Semiconductors Objective specification

STN RGB - 132 × 132 × 3 driver PCF8833

Table 99 Bonding pad locations

COORDINATES
All x and y coordinates are referenced to the centre of the SYMBOL PAD
chip (dimensions in µm; see Fig.61). x y

COORDINATES C4 38 −9183.592 −1030.568

SYMBOL PAD C5 39 −9137.128 −1030.568
x y
C6 40 −9090.664 −1030.568
dummy 1 −11351.208 −1035.694
C7 41 −9044.200 −1030.568
R95 2 −11231.880 −1035.694
C8 42 −8997.736 −1030.568
R94 3 −11179.080 −1035.694
C9 43 −8951.272 −1030.568
R93 4 −11126.280 −1035.694
C10 44 −8904.808 −1030.568
R92 5 −11073.480 −1035.694
C11 45 −8858.344 −1030.568
R91 6 −11020.680 −1035.694
C12 46 −8811.880 −1030.568
R90 7 −10967.880 −1035.694
C13 47 −8765.416 −1030.568
R89 8 −10915.080 −1035.694
C14 48 −8718.952 −1030.568
R88 9 −10862.280 −1035.694
C15 49 −8672.488 −1030.568
R87 10 −10809.480 −1035.694
C16 50 −8626.024 −1030.568
R86 11 −10756.680 −1035.694
C17 51 −8579.560 −1030.568
R85 12 −10703.880 −1035.694
C18 52 −8533.096 −1030.568
R84 13 −10651.080 −1035.694
C19 53 −8486.632 −1030.568
R83 14 −10598.280 −1035.694
C20 54 −8440.168 −1030.568
R82 15 −10545.480 −1035.694
C21 55 −8393.704 −1030.568
R81 16 −10492.680 −1035.694
C22 56 −8347.240 −1030.568
R80 17 −10439.880 −1035.694
C23 57 −8300.776 −1030.568
R79 18 −10387.080 −1035.694
C24 58 −8254.312 −1030.568
R78 19 −10334.280 −1035.694
C25 59 −8207.848 −1030.568
R77 20 −10281.480 −1035.694
C26 60 −8161.384 −1030.568
R76 21 −10228.680 −1035.694
C27 61 −8114.920 −1030.568
R75 22 −10175.880 −1035.694
C28 62 −8068.456 −1030.568
R74 23 −10123.080 −1035.694
C29 63 −8021.992 −1030.568
R73 24 −10070.280 −1035.694
C30 64 −7975.528 −1030.568
R72 25 − 10017.480 −1035.694
C31 65 −7929.064 −1030.568
R71 26 −9964.680 −1035.694
C32 66 −7882.600 −1030.568
R70 27 −9911.880 −1035.694
C33 67 −7836.136 −1030.568
R69 28 −9859.080 −1035.694
C34 68 −7789.672 −1030.568
R68 29 −9806.280 −1035.694
C35 69 −7743.208 −1030.568
R67 30 −9753.480 −1035.694
C36 70 −7696.744 −1030.568
R66 31 −9700.680 −1035.694
C37 71 −7650.280 −1030.568
R65 32 −9647.880 −1035.694
C38 72 −7603.816 −1030.568
R64 33 −9595.080 −1035.694
C39 73 −7557.352 −1030.568
C0 34 −9369.448 −1030.568
C40 74 −7510.888 −1030.568
C1 35 −9322.984 −1030.568
C41 75 −7464.424 −1030.568
C2 36 −9276.520 −1030.568
C42 76 −7417.960 −1030.568
C3 37 −9230.056 −1030.568

2003 Feb 14 97
Philips Semiconductors Objective specification

STN RGB - 132 × 132 × 3 driver PCF8833

COORDINATES COORDINATES
SYMBOL PAD SYMBOL PAD
x y x y
C43 77 −7371.496 −1030.568 C82 116 −5502.200 −1030.568
C44 78 −7325.032 −1030.568 C83 117 −5455.736 −1030.568
C45 79 −7278.568 −1030.568 C84 118 −5409.272 −1030.568
C46 80 −7232.104 −1030.568 C85 119 −5362.808 −1030.568
C47 81 −7185.640 −1030.568 C86 120 −5316.344 −1030.568
C48 82 −7081.976 −1030.568 C87 121 −5269.880 −1030.568
C49 83 −7035.512 −1030.568 C88 122 −5223.416 −1030.568
C50 84 −6989.048 −1030.568 C89 123 −5176.952 −1030.568
C51 85 −6942.584 −1030.568 C90 124 −5130.488 −1030.568
C52 86 −6896.120 −1030.568 C91 125 −5084.024 −1030.568
C53 87 −6849.656 −1030.568 C92 126 −5037.560 −1030.568
C54 88 −6803.192 −1030.568 C93 127 −4991.096 −1030.568
C55 89 −6756.728 −1030.568 C94 128 −4944.632 −1030.568
C56 90 −6710.264 −1030.568 C95 129 −4898.168 −1030.568
C57 91 −6663.800 −1030.568 C96 130 −4794.504 −1030.568
C58 92 −6617.336 −1030.568 C97 131 −4748.040 −1030.568
C59 93 −6570.872 −1030.568 C98 132 −4701.576 −1030.568
C60 94 −6524.408 −1030.568 C99 133 −4655.112 −1030.568
C61 95 −6477.944 −1030.568 C100 134 −4608.648 −1030.568
C62 96 −6431.480 −1030.568 C101 135 −4562.184 −1030.568
C63 97 −6385.016 −1030.568 C102 136 −4515.720 −1030.568
C64 98 −6338.552 −1030.568 C103 137 −4469.256 −1030.568
C65 99 −6292.088 −1030.568 C104 138 −4422.792 −1030.568
C66 100 −6245.624 −1030.568 C105 139 −4376.328 −1030.568
C67 101 −6199.160 −1030.568 C106 140 −4329.864 −1030.568
C68 102 −6152.696 −1030.568 C107 141 −4283.400 −1030.568
C69 103 −6106.232 −1030.568 C108 142 −4236.936 −1030.568
C70 104 −6059.768 −1030.568 C109 143 −4190.472 −1030.568
C71 105 −6013.304 −1030.568 C110 144 −4144.008 −1030.568
C72 106 −5966.840 −1030.568 C111 145 −4097.544 −1030.568
C73 107 −5920.376 −1030.568 C112 146 −4051.080 −1030.568
C74 108 −5873.912 −1030.568 C113 147 −4004.616 −1030.568
C75 109 −5827.448 −1030.568 C114 148 −3958.152 −1030.568
C76 110 −5780.984 −1030.568 C115 149 −3911.688 −1030.568
C77 111 −5734.520 −1030.568 C116 150 −3865.224 −1030.568
C78 112 −5688.056 −1030.568 C117 151 −3818.760 −1030.568
C79 113 −5641.592 −1030.568 C118 152 −3772.296 −1030.568
C80 114 −5595.128 −1030.568 C119 153 −3725.832 −1030.568
C81 115 −5548.664 −1030.568 C120 154 −3679.368 −1030.568

2003 Feb 14 98
Philips Semiconductors Objective specification

STN RGB - 132 × 132 × 3 driver PCF8833

COORDINATES COORDINATES
SYMBOL PAD SYMBOL PAD
x y x y
C121 155 −3632.904 −1030.568 C160 194 −1763.608 −1030.568
C122 156 −3586.440 −1030.568 C161 195 −1717.144 −1030.568
C123 157 −3539.976 −1030.568 C162 196 −1670.680 −1030.568
C124 158 −3493.512 −1030.568 C163 197 −1624.216 −1030.568
C125 159 −3447.048 −1030.568 C164 198 −1577.752 −1030.568
C126 160 −3400.584 −1030.568 C165 199 −1531.288 −1030.568
C127 161 −3354.120 −1030.568 C166 200 −1484.824 −1030.568
C128 162 −3307.656 −1030.568 C167 201 −1438.360 −1030.568
C129 163 −3261.192 −1030.568 C168 202 −1391.896 −1030.568
C130 164 −3214.728 −1030.568 C169 203 −1345.432 −1030.568
C131 165 −3168.264 −1030.568 C170 204 −1298.968 −1030.568
C132 166 −3121.800 −1030.568 C171 205 −1252.504 −1030.568
C133 167 −3075.336 −1030.568 C172 206 −1206.040 −1030.568
C134 168 −3028.872 −1030.568 C173 207 −1159.576 −1030.568
C135 169 −2982.408 −1030.568 C174 208 −1113.112 −1030.568
C136 170 −2935.944 −1030.568 C175 209 −1066.648 −1030.568
C137 171 −2889.480 −1030.568 C176 210 −1020.184 −1030.568
C138 172 −2843.016 −1030.568 C177 211 −973.720 −1030.568
C139 173 −2796.552 −1030.568 C178 212 −927.256 −1030.568
C140 174 −2750.088 −1030.568 C179 213 −880.792 −1030.568
C141 175 −2703.624 −1030.568 C180 214 −834.328 −1030.568
C142 176 −2657.160 −1030.568 C181 215 −787.864 −1030.568
C143 177 −2610.696 −1030.568 C182 216 −741.400 −1030.568
C144 178 −2507.032 −1030.568 C183 217 −694.936 −1030.568
C145 179 −2460.568 −1030.568 C184 218 −648.472 −1030.568
C146 180 −2414.104 −1030.568 C185 219 −602.008 −1030.568
C147 181 −2367.640 −1030.568 C186 220 −555.544 −1030.568
C148 182 −2321.176 −1030.568 C187 221 −509.080 −1030.568
C149 183 −2274.712 −1030.568 C188 222 −462.616 −1030.568
C150 184 −2228.248 −1030.568 C189 223 −416.152 −1030.568
C151 185 −2181.784 −1030.568 C190 224 −369.688 −1030.568
C152 186 −2135.320 −1030.568 C191 225 −323.224 −1030.568
C153 187 −2088.856 −1030.568 C192 226 −219.560 −1030.568
C154 188 −2042.392 −1030.568 C193 227 −173.096 −1030.568
C155 189 −1995.928 −1030.568 C194 228 −126.632 −1030.568
C156 190 −1949.464 −1030.568 C195 229 −80.168 −1030.568
C157 191 −1903.000 −1030.568 C196 230 −33.704 −1030.568
C158 192 −1856.536 −1030.568 C197 231 +12.760 −1030.568
C159 193 −1810.072 −1030.568 C198 232 +59.224 −1030.568

2003 Feb 14 99
Philips Semiconductors Objective specification

STN RGB - 132 × 132 × 3 driver PCF8833

COORDINATES COORDINATES
SYMBOL PAD SYMBOL PAD
x y x y
C199 233 +105.688 −1030.568 C238 272 +1917.784 −1030.568
C200 234 +152.152 −1030.568 C239 273 +1964.248 −1030.568
C201 235 +198.616 −1030.568 C240 274 +2067.912 −1030.568
C202 236 +245.080 −1030.568 C241 275 +2114.376 −1030.568
C203 237 +291.544 −1030.568 C242 276 +2160.840 −1030.568
C204 238 +338.008 −1030.568 C243 277 +2207.304 −1030.568
C205 239 +384.472 −1030.568 C244 278 +2253.768 −1030.568
C206 240 +430.936 −1030.568 C245 279 +2300.232 −1030.568
C207 241 +477.400 −1030.568 C246 280 +2346.696 −1030.568
C208 242 +523.864 −1030.568 C247 281 +2393.160 −1030.568
C209 243 +570.328 −1030.568 C248 282 +2439.624 −1030.568
C210 244 +616.792 −1030.568 C249 283 +2486.088 −1030.568
C211 245 +663.256 −1030.568 C250 284 +2532.552 −1030.568
C212 246 +709.720 −1030.568 C251 285 +2579.016 −1030.568
C213 247 +756.184 −1030.568 C252 286 +2625.480 −1030.568
C214 248 +802.648 −1030.568 C253 287 +2671.944 −1030.568
C215 249 +849.112 −1030.568 C254 288 +2718.408 −1030.568
C216 250 +895.576 −1030.568 C255 289 +2764.872 −1030.568
C217 251 +942.040 −1030.568 C256 290 +2811.336 −1030.568
C218 252 +988.504 −1030.568 C257 291 +2857.800 −1030.568
C219 253 +1034.968 −1030.568 C258 292 +2904.264 −1030.568
C220 254 +1081.432 −1030.568 C259 293 +2950.728 −1030.568
C221 255 +1127.896 −1030.568 C260 294 +2997.192 −1030.568
C222 256 +1174.360 −1030.568 C261 295 +3043.656 −1030.568
C223 257 +1220.824 −1030.568 C262 296 +3090.120 −1030.568
C224 258 +1267.288 −1030.568 C263 297 +3136.584 −1030.568
C225 259 +1313.752 −1030.568 C264 298 +3183.048 −1030.568
C226 260 +1360.216 −1030.568 C265 299 +3229.512 −1030.568
C227 261 +1406.680 −1030.568 C266 300 +3275.976 −1030.568
C228 262 +1453.144 −1030.568 C267 301 +3322.440 −1030.568
C229 263 +1499.608 −1030.568 C268 302 +3368.904 −1030.568
C230 264 +1546.072 −1030.568 C269 303 +3415.368 −1030.568
C231 265 +1592.536 −1030.568 C270 304 +3461.832 −1030.568
C232 266 +1639.000 −1030.568 C271 305 +3508.296 −1030.568
C233 267 +1685.464 −1030.568 C272 306 +3554.760 −1030.568
C234 268 +1731.928 −1030.568 C273 307 +3601.224 −1030.568
C235 269 +1778.392 −1030.568 C274 308 +3647.688 −1030.568
C236 270 +1824.856 −1030.568 C275 309 +3694.152 −1030.568
C237 271 +1871.320 −1030.568 C276 310 +3740.616 −1030.568

2003 Feb 14 100

Philips Semiconductors Objective specification

STN RGB - 132 × 132 × 3 driver PCF8833

COORDINATES COORDINATES
SYMBOL PAD SYMBOL PAD
x y x y
C277 311 +3787.080 −1030.568 C316 350 +5656.376 −1030.568
C278 312 +3833.544 −1030.568 C317 351 +5702.840 −1030.568
C279 313 +3880.008 −1030.568 C318 352 +5749.304 −1030.568
C280 314 +3926.472 −1030.568 C319 353 +5795.768 −1030.568
C281 315 +3972.936 −1030.568 C320 354 +5842.232 −1030.568
C282 316 +4019.400 −1030.568 C321 355 +5888.696 −1030.568
C283 317 +4065.864 −1030.568 C322 356 +5935.160 −1030.568
C284 318 +4112.328 −1030.568 C323 357 +5981.624 −1030.568
C285 319 +4158.792 −1030.568 C324 358 +6028.088 −1030.568
C286 320 +4205.256 −1030.568 C325 359 +6074.552 −1030.568
C287 321 +4251.720 −1030.568 C326 360 +6121.016 −1030.568
C288 322 +4355.384 −1030.568 C327 361 +6167.480 −1030.568
C289 323 +4401.848 −1030.568 C328 362 +6213.944 −1030.568
C290 324 +4448.312 −1030.568 C329 363 +6260.408 −1030.568
C291 325 +4494.776 −1030.568 C330 364 +6306.872 −1030.568
C292 326 +4541.240 −1030.568 C331 365 +6353.336 −1030.568
C293 327 +4587.704 −1030.568 C332 366 +6399.800 −1030.568
C294 328 +4634.168 −1030.568 C333 367 +6446.264 −1030.568
C295 329 +4680.632 −1030.568 C334 368 +6492.728 −1030.568
C296 330 +4727.096 −1030.568 C335 369 +6539.192 −1030.568
C297 331 +4773.560 −1030.568 C336 370 +6642.856 −1030.568
C298 332 +4820.024 −1030.568 C337 371 +6689.320 −1030.568
C299 333 +4866.488 −1030.568 C338 372 +6735.784 −1030.568
C300 334 +4912.952 −1030.568 C339 373 +6782.248 −1030.568
C301 335 +4959.416 −1030.568 C340 374 +6828.712 −1030.568
C302 336 +5005.880 −1030.568 C341 375 +6875.176 −1030.568
C303 337 +5052.344 −1030.568 C342 376 +6921.640 −1030.568
C304 338 +5098.808 −1030.568 C343 377 +6968.104 −1030.568
C305 339 +5145.272 −1030.568 C344 378 +7014.568 −1030.568
C306 340 +5191.736 −1030.568 C345 379 +7061.032 −1030.568
C307 341 +5238.200 −1030.568 C346 380 +7107.496 −1030.568
C308 342 +5284.664 −1030.568 C347 381 +7153.960 −1030.568
C309 343 +5331.128 −1030.568 C348 382 +7200.424 −1030.568
C310 344 +5377.592 −1030.568 C349 383 +7246.888 −1030.568
C311 345 +5424.056 −1030.568 C350 384 +7293.352 −1030.568
C312 346 +5470.520 −1030.568 C351 385 +7339.816 −1030.568
C313 347 +5516.984 −1030.568 C352 386 +7386.280 −1030.568
C314 348 +5563.448 −1030.568 C353 387 +7432.744 −1030.568
C315 349 +5609.912 −1030.568 C354 388 +7479.208 −1030.568

2003 Feb 14 101

Philips Semiconductors Objective specification

STN RGB - 132 × 132 × 3 driver PCF8833

COORDINATES COORDINATES
SYMBOL PAD SYMBOL PAD
x y x y
C355 389 +7525.672 −1030.568 C394 428 +9394.968 –1030.568
C356 390 +7572.136 −1030.568 C395 429 +9441.432 –1030.568
C357 391 +7618.600 −1030.568 R0 430 +9596.664 –1035.694
C358 392 +7665.064 −1030.568 R1 431 +9649.464 –1035.694
C359 393 +7711.528 −1030.568 R2 432 +9702.264 –1035.694
C360 394 +7757.992 −1030.568 R3 433 +9755.064 –1035.694
C361 395 +7804.456 −1030.568 R4 434 +9807.864 –1035.694
C362 396 +7850.920 −1030.568 R5 435 +9860.664 –1035.694
C363 397 +7897.384 −1030.568 R6 436 +9913.464 –1035.694
C364 398 +7943.848 −1030.568 R7 437 +9966.264 –1035.694
C365 399 +7990.312 –1030.568 R8 438 +10019.064 –1035.694
C366 400 +8036.776 –1030.568 R9 439 +10071.864 −1035.694
C367 401 +8083.240 –1030.568 R10 440 +10124.664 −1035.694
C368 402 +8129.704 –1030.568 R11 441 +10177.464 −1035.694
C369 403 +8176.168 –1030.568 R12 442 +10230.264 −1035.694
C370 404 +8222.632 –1030.568 R13 443 +10283.064 −1035.694
C371 405 +8269.096 –1030.568 R14 444 +10335.864 −1035.694
C372 406 +8315.560 –1030.568 R15 445 +10388.664 −1035.694
C373 407 +8362.024 –1030.568 R16 446 +10441.464 −1035.694
C374 408 +8408.488 –1030.568 R17 447 +10494.264 −1035.694
C375 409 +8454.952 –1030.568 R18 448 +10547.064 −1035.694
C376 410 +8501.416 –1030.568 R19 449 +10599.864 −1035.694
C377 411 +8547.880 –1030.568 R20 450 +10652.664 −1035.694
C378 412 +8594.344 –1030.568 R21 451 +10705.464 −1035.694
C379 413 +8640.808 –1030.568 R22 452 +10758.264 −1035.694
C380 414 +8687.272 –1030.568 R23 453 +10811.064 −1035.694
C381 415 +8733.736 –1030.568 R24 454 +10863.864 −1035.694
C382 416 +8780.200 –1030.568 R25 455 +10916.664 −1035.694
C383 417 +8826.664 –1030.568 R26 456 +10969.464 −1035.694
C384 418 +8930.328 –1030.568 R27 457 +11022.264 −1035.694
C385 419 +8976.792 –1030.568 R28 458 +11075.064 −1035.694
C386 420 +9023.256 –1030.568 R29 459 +11127.864 −1035.694
C387 421 +9069.720 –1030.568 R30 460 +11180.664 −1035.694
C388 422 +9116.184 –1030.568 R31 461 +11233.464 −1035.694
C389 423 +9162.648 –1030.568 dummy 462 +11358.424 −1035.694
C390 424 +9209.112 –1030.568 dummy 463 +11358.424 +1035.694
C391 425 +9255.576 –1030.568 R63 464 +11233.464 +1035.694
C392 426 +9302.040 –1030.568 R62 465 +11180.664 +1035.694
C393 427 +9348.504 –1030.568 R61 466 +11127.864 +1035.694

2003 Feb 14 102

Philips Semiconductors Objective specification

STN RGB - 132 × 132 × 3 driver PCF8833

COORDINATES COORDINATES
SYMBOL PAD SYMBOL PAD
x y x y
R60 467 +11075.064 +1035.694 VSS1 506 +8540.664 +1035.694
R59 468 +11022.264 +1035.694 VSS1 507 +8487.864 +1035.694
R58 469 +10969.464 +1035.694 VSS2 508 +8329.464 +1035.694
R57 470 +10916.664 +1035.694 VSS2 509 +8276.664 +1035.694
R56 471 +10863.864 +1035.694 VSS2 510 +8223.864 +1035.694
R55 472 +10811.064 +1035.694 VSS2 511 +8171.064 +1035.694
R54 473 +10758.264 +1035.694 VSS2 512 +8118.264 +1035.694
R53 474 +10705.464 +1035.694 VSS2 513 +8065.464 +1035.694
R52 475 +10652.664 +1035.694 VSS2 514 +8012.664 +1035.694
R51 476 +10599.864 +1035.694 VSS2 515 +7959.864 +1035.694
R50 477 +10547.064 +1035.694 VSS2 516 +7907.064 +1035.694
R49 478 +10494.264 +1035.694 VSS2 517 +7854.264 +1035.694
R48 479 +10441.464 +1035.694 CS/SCE 518 +7643.064 +1035.694
R47 480 +10388.664 +1035.694 VDD1 519 +7431.864 +1035.694
R46 481 +10335.864 +1035.694 VDD1 520 +7379.064 +1035.694
R45 482 +10283.064 +1035.694 VDD1 521 +7326.264 +1035.694
R44 483 +10230.264 +1035.694 VDD1 522 +7273.464 +1035.694
R43 484 +10177.464 +1035.694 VDD1 523 +7220.664 +1035.694
R42 485 +10124.664 +1035.694 VDD1 524 +7167.864 +1035.694
R41 486 +10071.864 +1035.694 VDD3 525 +7009.464 +1035.694
R40 487 +10019.064 +1035.694 VDD3 526 +6956.664 +1035.694
R39 488 +9966.264 +1035.694 VDD3 527 +6903.864 +1035.694
R38 489 +9913.464 +1035.694 VDD3 528 +6851.064 +1035.694
R37 490 +9860.664 +1035.694 VDD3 529 +6798.264 +1035.694
R36 491 +9807.864 +1035.694 VDD2 530 +6639.864 +1035.694
R35 492 +9755.064 +1035.694 VDD2 531 +6587.064 +1035.694
R34 493 +9702.264 +1035.694 VDD2 532 +6534.264 +1035.694
R33 494 +9649.464 +1035.694 VDD2 533 +6481.464 +1035.694
R32 495 +9596.664 +1035.694 VDD2 534 +6428.664 +1035.694
RES 496 +9332.664 +1035.694 VDD2 535 +6375.864 +1035.694
TE 497 +9174.264 +1035.694 VDD2 536 +6323.064 +1035.694
VSS1 498 +8963.064 +1035.694 VDD2 537 +6270.264 +1035.694
VSS1 499 +8910.264 +1035.694 VDD2 538 +6217.464 +1035.694
VSS1 500 +8857.464 +1035.694 VDD2 539 +6164.664 +1035.694
VSS1 501 +8804.664 +1035.694 D7 540 +5953.464 +1035.694
VSS1 502 +8751.864 +1035.694 D3 541 +5795.064 +1035.694
VSS1 503 +8699.064 +1035.694 D6 542 +5636.664 +1035.694
VSS1 504 +8646.264 +1035.694 D2 543 +5478.264 +1035.694
VSS1 505 +8593.464 +1035.694 D5 544 +5319.864 +1035.694

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COORDINATES COORDINATES
SYMBOL PAD SYMBOL PAD
x y x y
D1 545 +5161.464 +1035.694 dummy 584 +825.880 +1035.694
D4 546 +5003.064 +1035.694 dummy 585 +773.080 +1035.694
D0/SDIN 547 +4844.664 +1035.694 dummy 586 +720.280 +1035.694
SDOUT 548 +4686.264 +1035.694 dummy 587 +667.480 +1035.694
DC/SCLK 549 +4527.864 +1035.694 dummy 588 +614.680 +1035.694
WR 550 +4369.464 +1035.694 dummy 589 +561.880 +1035.694
RD 551 +4211.064 +1035.694 dummy 590 +509.080 +1035.694
PS0 552 +4052.664 +1035.694 dummy 591 +456.280 +1035.694
PS1 553 +3894.264 +1035.694 dummy 592 +403.480 +1035.694
PS2 554 +3735.864 +1035.694 dummy 593 +350.680 +1035.694
OSC 555 +3577.464 +1035.694 dummy 594 +297.880 +1035.694
VDDTIEOFF 556 +3419.064 +1035.694 dummy 595 +245.080 +1035.694
VOTPdrain 557 +3207.864 +1035.694 dummy 596 +192.280 +1035.694
VOTPdrain 558 +3155.064 +1035.694 dummy 597 +139.480 +1035.694
VOTPdrain 559 +3102.264 +1035.694 dummy 598 +86.680 +1035.694
VOTPdrain 560 +3049.464 +1035.694 dummy 599 +33.880 +1035.694
VOTPdrain 561 +2996.664 +1035.694 dummy 600 −18.920 +1035.694
VOTPdrain 562 +2943.864 +1035.694 dummy 601 −71.720 +1035.694
VOTPdrain 563 +2891.064 +1035.694 dummy 602 −124.520 +1035.694
VOTPdrain 564 +2838.264 +1035.694 dummy 603 −177.320 +1035.694
VOTPgate 565 +2679.864 +1035.694 dummy 604 −230.120 +1035.694
VOTPgate 566 +2627.064 +1035.694 dummy 605 −282.920 +1035.694
VOTPgate 567 +2574.264 +1035.694 dummy 606 −335.720 +1035.694
VOTPgate 568 +2521.464 +1035.694 dummy 607 −388.520 +1035.694
VOTPgate 569 +2468.664 +1035.694 dummy 608 −441.320 +1035.694
VOTPgate 570 +2415.864 +1035.694 dummy 609 −494.120 +1035.694
VOTPgate 571 +2363.064 +1035.694 dummy 610 −546.920 +1035.694
VOTPgate 572 +2310.264 +1035.694 dummy 611 −599.720 +1035.694
T6 573 +2099.064 +1035.694 dummy 612 −652.520 +1035.694
T5 574 +1940.664 +1035.694 dummy 613 −705.320 +1035.694
T4 575 +1782.264 +1035.694 dummy 614 −758.120 +1035.694
T3 576 +1623.864 +1035.694 dummy 615 −810.920 +1035.694
T2 577 +1465.464 +1035.694 dummy 616 −863.720 +1035.694
T1 578 +1307.064 +1035.694 dummy 617 −916.520 +1035.694
VSSTIEOFF 579 +1148.664 +1035.694 dummy 618 −969.320 +1035.694
dummy 580 +1037.080 +1035.694 dummy 619 −1022.120 +1035.694
dummy 581 +984.280 +1035.694 dummy 620 −1074.920 +1035.694
dummy 582 +931.480 +1035.694 dummy 621 −1127.720 +1035.694
dummy 583 +878.680 +1035.694 dummy 622 −1180.520 +1035.694

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STN RGB - 132 × 132 × 3 driver PCF8833

COORDINATES COORDINATES
SYMBOL PAD SYMBOL PAD
x y x y
dummy 623 −1233.320 +1035.694 C4+ 662 −4375.976 +1035.694
VSSTIEOFF 624 −1410.904 +1035.694 C4+ 663 −4428.776 +1035.694
T7 625 −1683.176 +1035.694 C4+ 664 −4481.576 +1035.694
C1+ 626 −1841.576 +1035.694 C4+ 665 −4534.376 +1035.694
C1+ 627 −1894.376 +1035.694 C4+ 666 −4587.176 +1035.694
C1+ 628 −1947.176 +1035.694 C4+ 667 −4639.976 +1035.694
C1+ 629 −1999.976 +1035.694 C4– 668 −4798.376 +1035.694
C1+ 630 −2052.776 +1035.694 C4– 669 −4851.176 +1035.694
C1+ 631 −2105.576 +1035.694 C4– 670 −4903.976 +1035.694
C1− 632 −2263.976 +1035.694 C4– 671 −4956.776 +1035.694
C1− 633 −2316.776 +1035.694 C4– 672 −5009.576 +1035.694
C1− 634 −2369.576 +1035.694 C4– 673 −5062.376 +1035.694
C1− 635 −2422.376 +1035.694 VLCDOUT1 674 −5220.776 +1035.694
C1− 636 −2475.176 +1035.694 VLCDOUT1 675 −5273.576 +1035.694
C1− 637 −2527.976 +1035.694 VLCDOUT1 676 −5326.376 +1035.694
C2+ 638 −2686.376 +1035.694 VLCDOUT1 677 −5379.176 +1035.694
C2+ 639 −2739.176 +1035.694 VLCDOUT1 678 −5431.976 +1035.694
C2+ 640 −2791.976 +1035.694 VLCDOUT1 679 −5484.776 +1035.694
C2+ 641 −2844.776 +1035.694 VLCDOUT1 680 −5537.576 +1035.694
C2+ 642 −2897.576 +1035.694 VLCDOUT1 681 −5590.376 +1035.694
C2+ 643 −2950.376 +1035.694 VLCDOUT1 682 −5643.176 +1035.694
C2− 644 −3108.776 +1035.694 VLCDOUT1 683 −5695.976 +1035.694
C2− 645 −3161.576 +1035.694 VLCDIN1 684 −5854.376 +1035.694
C2− 646 −3214.376 +1035.694 VLCDIN1 685 −5907.176 +1035.694
C2− 647 −3267.176 +1035.694 VLCDIN1 686 −5959.976 +1035.694
C2− 648 −3319.976 +1035.694 VLCDIN1 687 −6012.776 +1035.694
C2− 649 −3372.776 +1035.694 VLCDIN1 688 −6065.576 +1035.694
C3+ 650 −3531.176 +1035.694 VLCDIN1 689 −6118.376 +1035.694
C3+ 651 −3583.976 +1035.694 VLCDIN1 690 −6171.176 +1035.694
C3+ 652 −3636.776 +1035.694 C5+ 691 −6329.576 +1035.694
C3+ 653 −3689.576 +1035.694 C5+ 692 −6382.376 +1035.694
C3+ 654 −3742.376 +1035.694 C5+ 693 −6435.176 +1035.694
C3+ 655 −3795.176 +1035.694 C5+ 694 −6487.976 +1035.694
C3− 656 −3953.576 +1035.694 C5+ 695 −6540.776 +1035.694
C3− 657 −4006.376 +1035.694 C5+ 696 −6593.576 +1035.694
C3− 658 −4059.176 +1035.694 C5− 697 −6751.976 +1035.694
C3− 659 −4111.976 +1035.694 C5− 698 −6804.776 +1035.694
C3− 660 −4164.776 +1035.694 C5− 699 −6857.576 +1035.694
C3− 661 −4217.576 +1035.694 C5− 700 −6910.376 +1035.694

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STN RGB - 132 × 132 × 3 driver PCF8833

COORDINATES COORDINATES
SYMBOL PAD SYMBOL PAD
x y x y
C5− 701 −6963.176 +1035.694 R103 740 −9753.480 +1035.694
C5− 702 −7015.976 +1035.694 R104 741 −9806.280 +1035.694
VLCDOUT2 703 −7174.376 +1035.694 R105 742 −9859.080 +1035.694
VLCDOUT2 704 −7227.176 +1035.694 R106 743 −9911.880 +1035.694
VLCDOUT2 705 −7279.976 +1035.694 R107 744 −9964.680 +1035.694
VLCDOUT2 706 −7332.776 +1035.694 R108 745 −10017.480 +1035.694
VLCDOUT2 707 −7385.576 +1035.694 R109 746 −10070.280 +1035.694
VLCDOUT2 708 −7438.376 +1035.694 R110 747 −10123.080 +1035.694
VLCDOUT2 709 −7491.176 +1035.694 R111 748 −10175.880 +1035.694
VLCDOUT2 710 −7543.976 +1035.694 R112 749 −10228.680 +1035.694
VLCDOUT2 711 −7596.776 +1035.694 R113 750 −10281.480 +1035.694
VLCDSENSE 712 −7649.576 +1035.694 R114 751 −10334.280 +1035.694
VLCDIN2 713 −7807.976 +1035.694 R115 752 −10387.080 +1035.694
VLCDIN2 714 −7860.776 +1035.694 R116 753 −10439.880 +1035.694
VLCDIN2 715 −7913.576 +1035.694 R117 754 −10492.680 +1035.694
VLCDIN2 716 −7966.376 +1035.694 R118 755 −10545.480 +1035.694
VLCDIN2 717 −8019.176 +1035.694 R119 756 −10598.280 +1035.694
VLCDIN2 718 −8071.976 +1035.694 R120 757 −10651.080 +1035.694
VLCDIN2 719 −8124.776 +1035.694 R121 758 −10703.880 +1035.694
V2L 720 −8341.212 +1035.694 R122 759 −10756.680 +1035.694
V2L 721 −8394.012 +1035.694 R123 760 −10809.480 +1035.694
V1L 722 −8499.612 +1035.694 R124 761 −10862.280 +1035.694
V1L 723 −8552.412 +1035.694 R125 762 −10915.080 +1035.694
VC 724 −8658.012 +1035.694 R126 763 −10967.880 +1035.694
VC 725 −8710.812 +1035.694 R127 764 −11020.680 +1035.694
VC 726 −8763.612 +1035.694 R128 765 −11073.480 +1035.694
VC 727 −8816.412 +1035.694 R129 766 −11126.280 +1035.694
VC 728 −8869.212 +1035.694 R130 767 −11179.080 +1035.694
V1H 729 −8974.812 +1035.694 R131 768 −11231.880 +1035.694
V1H 730 −9027.612 +1035.694 dummy 769 −11351.208 +1035.694
V2H 731 −9133.212 +1035.694 Alignment marks (see Fig.62)
V2H 732 −9186.012 +1035.694 Alignment circle 1 −11175.032 +593.120
R96 733 −9383.880 +1035.694 Alignment circle 2 +11184.888 +593.120
R97 734 −9436.680 +1035.694 Alignment circle 3 −8717.192 +746.240
R98 735 −9489.480 +1035.694 Alignment circle 4 +9362.408 +746.240
R99 736 −9542.280 +1035.694
R100 737 −9595.080 +1035.694
R101 738 −9647.880 +1035.694
R102 739 −9700.680 +1035.694

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STN RGB - 132 × 132 × 3 driver PCF8833

Table 100 Bonding pad dimensions

ITEM DIMENSIONS UNIT
Minimum bump pitch columns: 46.464 µm
all other: 52.800
Bump dimensions columns: 28.424 × 105.248 µm
all other: 32.736 × 95.348
Bump height 15 µm
Wafer thickness (excluding bumps) 381 µm

handbook, full pagewidth 22.93 mm

2.34
mm PC8833-1

pitch

Fig.61 Bonding pads dimensions. x

MGU974

handbook, halfpage

y center 80
µm

x center
MGU975

Fig.62 Alignment circle detail (80 µm diameter).

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STN RGB - 132 × 132 × 3 driver PCF8833

18 TRAY INFORMATION

handbook, full pagewidth x

C

y
D

E
MGU979

Fig.63 Tray details.

Table 101 Tray dimensions

handbook, halfpage DIMENSIONS DESCRIPTION VALUE
B pocket pitch y direction 4.45 mm
C pocket width x direction 23.07 mm
D pocket width y direction 2.47 mm
PC8833-1

E tray width x direction 50.8 mm

F tray width y direction 50.8 mm
x number of pockets in 1
x direction
y number of pockets in 10
MGU980 y direction

The orientation of the IC in a pocket is indicated by the position of the

IC type name on the die surface with respect to the chamfer on the
upper left corner of the tray. Refer to the bonding pad location
diagram for the orientating and position of the type name on the die
surface.

Fig.64 Tray alignment.

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19 DATA SHEET STATUS

DATA SHEET PRODUCT

LEVEL DEFINITION
STATUS(1) STATUS(2)(3)
I Objective data Development This data sheet contains data from the objective specification for product
development. Philips Semiconductors reserves the right to change the
specification in any manner without notice.
II Preliminary data Qualification This data sheet contains data from the preliminary specification.
Supplementary data will be published at a later date. Philips
Semiconductors reserves the right to change the specification without
notice, in order to improve the design and supply the best possible
product.
III Product data Production This data sheet contains data from the product specification. Philips
Semiconductors reserves the right to make changes at any time in order
to improve the design, manufacturing and supply. Relevant changes will
be communicated via a Customer Product/Process Change Notification
(CPCN).
Notes
1. Please consult the most recently issued data sheet before initiating or completing a design.
2. The product status of the device(s) described in this data sheet may have changed since this data sheet was
published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.
3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.

20 DEFINITIONS 21 DISCLAIMERS
Short-form specification  The data in a short-form Life support applications  These products are not
specification is extracted from a full data sheet with the designed for use in life support appliances, devices, or
same type number and title. For detailed information see systems where malfunction of these products can
the relevant data sheet or data handbook. reasonably be expected to result in personal injury. Philips
Semiconductors customers using or selling these products
Limiting values definition  Limiting values given are in
for use in such applications do so at their own risk and
accordance with the Absolute Maximum Rating System
agree to fully indemnify Philips Semiconductors for any
(IEC 60134). Stress above one or more of the limiting
damages resulting from such application.
values may cause permanent damage to the device.
These are stress ratings only and operation of the device Right to make changes  Philips Semiconductors
at these or at any other conditions above those given in the reserves the right to make changes in the products -
Characteristics sections of the specification is not implied. including circuits, standard cells, and/or software -
Exposure to limiting values for extended periods may described or contained herein in order to improve design
affect device reliability. and/or performance. When the product is in full production
(status ‘Production’), relevant changes will be
Application information  Applications that are
communicated via a Customer Product/Process Change
described herein for any of these products are for
Notification (CPCN). Philips Semiconductors assumes no
illustrative purposes only. Philips Semiconductors make
responsibility or liability for the use of any of these
no representation or warranty that such applications will be
products, conveys no licence or title under any patent,
suitable for the specified use without further testing or
copyright, or mask work right to these products, and
modification.
makes no representations or warranties that these
products are free from patent, copyright, or mask work
right infringement, unless otherwise specified.

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Philips Semiconductors Objective specification

STN RGB - 132 × 132 × 3 driver PCF8833

Bare die  All die are tested and are guaranteed to comply with all data sheet limits up to the point of wafer sawing for
a period of ninety (90) days from the date of Philips' delivery. If there are data sheet limits not guaranteed, these will be
separately indicated in the data sheet. There are no post packing tests performed on individual die or wafer. Philips
Semiconductors has no control of third party procedures in the sawing, handling, packing or assembly of the die.
Accordingly, Philips Semiconductors assumes no liability for device functionality or performance of the die or systems
after third party sawing, handling, packing or assembly of the die. It is the responsibility of the customer to test and qualify
their application in which the die is used.

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Philips Semiconductors Objective specification

STN RGB - 132 × 132 × 3 driver PCF8833

NOTES

2003 Feb 14 111

Philips Semiconductors – a worldwide company

Contact information

For additional information please visit http://www.semiconductors.philips.com. Fax: +31 40 27 24825

For sales offices addresses send e-mail to: [email protected].

© Koninklijke Philips Electronics N.V. 2003 SCA75

All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.

Printed in The Netherlands 403512/01/pp112 Date of release: 2003 Feb 14 Document order number: 9397 750 10059