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Brazing & Soldering: Fundamental Manufacturing Processes Study Guide, DV03PUB124 - 5

The document contains 8 review questions about brazing and soldering processes. Question topics include advantages of brazing and soldering, the essential difference between the processes, common joint clearances, another term for capillary action, a brazing process that does not use torches or furnaces, limitations of soldering, what materials soldering is not used to join, and how excess heat is avoided in wave soldering. The answer key provides the correct response for each multiple choice question.

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416 views

Brazing & Soldering: Fundamental Manufacturing Processes Study Guide, DV03PUB124 - 5

The document contains 8 review questions about brazing and soldering processes. Question topics include advantages of brazing and soldering, the essential difference between the processes, common joint clearances, another term for capillary action, a brazing process that does not use torches or furnaces, limitations of soldering, what materials soldering is not used to join, and how excess heat is avoided in wave soldering. The answer key provides the correct response for each multiple choice question.

Uploaded by

lastjohn
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PDF, TXT or read online on Scribd
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Review Questions

1. An advantage of both brazing and soldering is:


a. Lower production costs
b. Less operator skill needed
c. Many similar and dissimilar materials can be joined
d. Joints have excellent mechanical strength
2. The essential difference between brazing and soldering is the:
a. Types of filler materials
b. Means of automation
c. Melting temperature of the filler metals
d. Melting temperature of the fluxes
3. Joint clearances for both brazing and soldering commonly range from:
a. 0.001 - 0.006 of an inch / 0.025 - 0.15 of a millimeter
b. 0.003 - 0.008 of an inch / 0.08 - 0.20 of a millimeter
c. 0.005 - 0.010 of an inch / 0.127 - 0.254 of a millimeter
d. 0.010 - 0.015 of an inch / 0.254 - 0.381 of a millimeter
4. Another term for capillary action is:
a. Flow
b. Bonding
c. Spreading
d. Wetting
5. A brazing process that does not use torches, brazing furnaces or electric
coils is:
a. Braze welding
b. Silver brazing
c. Dip brazing
d. Electrical bonding
6. A limitation of the soldering process is:
a. Joint brittleness
b. Joints are corrosion prone
c. Joints retain excessive flux residue
d. Lack of mechanical strength
7. Soldering is not used to join:
a. Thermoplastics
b. Metal to ceramics
c. Metal to glass
d. Ferrous to non-ferrous metals
8. In wave soldering excess heat and distortion of the PCB’s is avoided by:
a. The amount of flux applied before soldering
b. Exposing only a small area of the board to the solder at any one time
c. Using special low melting point solder
d. Employing cooling fans as the boards travel through the machine
Brazing & Soldering
Fundamental Manufacturing Processes Study Guide, DV03PUB124 - 5 -
Answer Key
1. c
2. c
3. a
4. d
5. c
6. d
7. a
8. b

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