System-Level ESD/EMI

Protection Guide

www.ti.com/esd 2010
 System-Level ESD/EMI Protection Guide
➔ Table of Contents/Introduction

Introduction
System-level electrostatic discharge Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
(ESD) protection has become very
Why External ESD? . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
important in today’s world as devices
become portable, contain multiple ESD Protection for USB Charger Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
interface connectors, have touch- ESD Protection for High-Speed USB 2.0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
screens, and are continually exposed
ESD Protection for Super-Speed USB 3.0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
to the external world. It only takes one
ESD strike to permanently damage ESD Protection for VGA and DVI-I Ports . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
a product, making ESD protection a ESD Protection for HDMI/DVI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
critical component of system design. ESD Protection for Portable HDMI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
ESD Protection for High-Speed Video and Data Interface . . . . . . . . . . . . . . . . . . 11
Electromagnetic interference (EMI)
is another challenge often faced ESD Protection for 1394 Ports . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
in system design. EMI is a radio ESD Protection for Keypads . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
frequency (RF) (800 MHz to 2 GHz)
EMI Filters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
disturbance that affects an electrical
circuit due to electromagnetic Resources
conduction from an external source.
Packaging Solutions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
EMI can be avoided by using EMI
filters that eliminate RF noise and ESD/EMI Protection Device List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
maintain signal integrity. TI Worldwide Technical Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

ESD/EMI Protection Solutions Applications

• USB 2.0/3.0*
TI produces ESD/EMI devices with
• HDMI*
solutions that protect the majority
of external connections to the outside • DVI*
world. Learn more about our ESD/EMI • DisplayPort
product portfolio. • eSATA
• 1394*
• LVDS
• Gigabit Ethernet*
• Audio headphones
• Microphone ports
• Speaker ports
• SDIO
• SIM
www.ti.com/esd
*Featured section within this guide.

System-Level ESD/EMI Protection Guide 2 Texas Instruments 2010

 System-Level ESD/EMI Protection Guide
➔ Why External ESD?
Semiconductor devices based off CDM. This difference in silicon area cost-effective solutions to protect
of advanced processes only offer translates to additional cost. As system interconnects from external
device-level ESD specifications like technology nodes become smaller, ESD strikes while maintaining signal
the charge device model (CDM) it becomes more difficult and costly integrity.
and the human body model (HBM) to integrate robust system-level ESD
shown below. Device-level ESD protection with microcontroller or core Often ESD protection is considered at
specifications are not sufficient to chipsets. This is illustrated below. the last phase of system design.
protect devices in a system. Designers need flexibility to select
System-level ESD protection can an ESD component that does not
The energy associated with a system- be implemented using discrete compromise the PCB layout or
level ESD strike is much higher than diodes or capacitors. However, consume additional board space.
a device-level ESD strike. In order to in many applications, discrete Texas Instruments ESD solutions
protect against this excess energy, solutions consume board space, with flow-through packaging allow
a more robust design is required. complicate layout, and compromise designers to add ESD components
The silicon area required to design signal integrity at high data rates. in the final stages of a design without
system-level ESD protection is much Texas Instruments stand-alone any change in the board layout.
larger than is required for HBM or ESD devices provide space-saving,

48 A Legend
Charge Device Model (CDM)
Human Body Model (HBM)
System Level IEC
Standard Model
24 A

50 ns 100 ns
Pad
ESD models.

Silicon die areas for device-

level ESD (I2 KV HBM).

VCC

CH N CH N-1

CH6 CH4 CH2 CH1 CH3 CH5

Pad

GND
Typical circuit diagram for N number of channels.
Silicon die areas for system-level ESD (IEC 8-KV contact).

System-Level ESD/EMI Protection Guide 3 Texas Instruments 2010

 System-Level ESD/EMI Protection Guide
➔ ESD Protection for USB Charger Interface
4-Channel USB ESD Solution with Power Clamp
TPD4S012
Get samples, datasheets and evaluation modules at www.ti.com/sc/device/TPD4S012

Key Features The TPD4S012 is a single-chip ESD protection solution for the USB charger
• Integrated ESD clamps for D+, interface. Many after-market chargers generate more than 5 V at the USB VBUS pin.
D–, VBUS and ID pins to provide A common industry solution is to use a high-voltage clamp for the VBUS line. The
single-chip ESD protection TPD4S012 offers a combination of two separate clamps: a 6-V clamp for the D+,
• IEC 61000-4-2 (level 4) system-level D– and ID pins and a 20-V clamp for the VBUS pin.
ESD compliance measured at the
D+, D– and ID Pins The TPD4S012 allows single-layer flow-through PCB layout. This simplifies
PCB design and allows for flexible design with a small form factor. It supports
±10-kV contact discharge
data rates in excess of 480 Mbps. Snap-back technology allows high-voltage
±10-kV air-gap discharge
tolerance during normal operation while reducing the clamp voltage during
• 3 amps peak pulse current system-level ESD stress.
(8/20-µs pulse)
• USB signal pins (D+, D–, ID)
0.8-pF line capacitance
Tolerates 6-V signal
VBUS = 20 V
• VBUS line (VBUS)
11-pF line capacitance
Tolerates 20-V signal VBUS
USB
IO D+
Charger/Controller
Applications IO
D-
IO
• Cellular phones GND
• Digital cameras
• Global positioning systems (GPS)
• Portable digital assistants (PDAs) TPD4S012 in a USB charger application.
GND

1.8

1.6
TPD4S012 DRY Package TPD4S012 YFP Package
1.4
(Top View) (Top View)
1.2
D+ 1 6 VBUS
D+ GND
Current (A)

A1 A2
1.0

D– 2 5 N.C. D– B1
0.8 B2 ID

VBUS C1
0.6 C2 VBUS
ID 3 4 GND
0.4

0.2

0
0 5 10 15 20 25 30
Voltage (V)

VBUS clamp voltage under ESD event.

GND
Core PMU ID
Chip/USB Controller
D+
VBUS D-

System-Level ESD/EMI Protection Guide 4 Texas Instruments 2010

 System-Level ESD/EMI Protection Guide
➔ ESD Protection for High-Speed USB 2.0

Low-Capacitance, Multiple-Channel ESD Protection Arrays for High-Speed Interfaces

TPD2E001, TPD3E001, TPD4E001, TPD6E001
Get samples, datasheets and evaluation modules at www.ti.com/sc/device/PARTnumber

Key Features The TPD2E001, TPD3E001, TPD4E001 and TPD6E001 are designed to protect
• 2-, 3-, 4- and 6-channel ESD I/O lines bearing the sensitive capacitive loads of USB 2.0, Ethernet LAN,
solutions FireWireTM and video VGA interfaces with rail-to-rail diodes. They are compliant
• IEC 61000-4-2 (level 4) ESD with IEC 61000-4-2, with a ±15-kV HBM, a ±8-kV contact discharge and a
protection ±15-kV air-gap discharge.
±8-kV contact discharge Vcc
The TPDxE001 is a low-capacitanceTPD2E001 ESD protection diode array designed to
±15-kV air-gap discharge .1µF
protect sensitive electronics attached to communication lines. Each channel
±15-kV human body model consists of a pairR- of diodes that steers ESD current pulses to VCC or VGND. The
BUS
IO1
• Low 1.5-pF input capacitance TPDxE001
USB protects against ESD pulses up to ±15-kV human-body model D+ (HBM),
RT
• Low 1-nA supply and leakage Controller
±8-kV contact discharge, and ±15-kV air-gap discharge, as specified D- in IEC
currents 61000-4-2. This device has a typical IO2 1.5-pF capacitance per channel, making it
GND

• 0.9 V to 5.5 V supply voltage range ideal for use in high-speed data I/O interfaces. The TPDxE001 comes in two-,
three-, four- or six-channel solutions making it ideal for Ethernet and FireWireTM
Applications applications. GND

• USB 2.0
VBUS
• Ethernet .1µF D+
Vcc
• FireWireTM (IEEE 1394) TPD4E001
D-
• Video GND
• Cell phones
USB IO4 IO1
• SVGA connections Controller/
µProcessor
• Blood glucose meters
IO3 IO2

VBUS

D+
GND
D-
TPD4E001 in USB 2.0 (480-Mbps) applications protecting two ESD. GND

RJ 45

TPD2E001 DRY Package

(Top View) TPD6E001 RSE Package
TX+
(Top View)
Vcc 1 6 IO2
Vcc

N.C. 2 5 N.C.
10 +V CC
TPD4E001
IO1 3 4 GND N.C. TX-
IO1 1 9
IO1 VCC
IO2 2 8 IO6 .1µF
IO2 IO3
TPD4E001 DRL Package Ethernet
IO3 3 7 IO5 Transceiver
(Top View) GND IO4
N.C 4 6 IO4
IO1 1 6 Vcc
5
IO2 2 5 IO4
GND

RX+
GND 3 4 IO3

RX-

TPD4E001 Ethernet ESD protection.

System-Level ESD/EMI Protection Guide 5 Texas Instruments 2010

 System-Level ESD/EMI Protection Guide
➔ ESD Protection for High-Speed USB 2.0
2-Channel ESD Solution with Series-Resistor Isolation
TPD2S017
Get samples, datasheets and evaluation modules at www.ti.com/sc/device/TPD2S017

Key Features The TPD2S017 is a two-channel ESD solution with series resistor isolation to
• Ultra-low clamp voltage ensures provide two-stage ESD protection for ultra-ESD-sensitive IOs. This architecture
the protection of low voltage core allows the device to generate very low clamp voltage during system-level ESD
chipsets during ESD events strikes and provides a controlled filter roll-off for spurious EMI suppression and
• Exceeds IEC61000-4-2 (level 4) signal integrity. This device offers flow-through pin mapping for ease of board
ESD Protection layout. The monolithic silicon technology allows matching component values,
including clamp capacitance and series resistor matching between the differential
±11-kV contact discharge
signal pairs. Tight matching of the line capacitance and series resistors ensure
±15-kV human body model
that the differential signal distortion due to the added ESD clamp remains minimal,
• 0.02 pF (typ) differential channel while also allowing the part to operate at high-speed differential data rates (in
input capacitance excess of 1.5 Gbps).
• ±1% deviation of series resistors
(±8 mΩ)

Applications Vcc
TPD2S017
• High-speed USB
• IEEE 1394 VBUS
1Ω
• LVDS
• Mobile Digital Display Interface D+
(MDDI)/Mobile Industry Processor USB
Interface (MIPI) Controller
1Ω D-

GND

Usage model for TPD2S017.

0
6-DBV
(Top View) -1

Ch1_Out Ch2_Out -2
-3-dB data = 2.74G Hz
GND Vcc -3

Ch1_In Ch2_In -4

-5

-6

-7

-8

-9
1.000E+06 1.000E+07 1.000E+08 1.000E+09 1.000E+10
Frequency (Hz)
TPD2S017DBVR insertion loss data (S21).

System-Level ESD/EMI Protection Guide 6 Texas Instruments 2010

 System-Level ESD/EMI Protection Guide
➔ ESD Protection for Super-Speed USB 3.0

2- or 4-Channel ESD Solution for Super-Speed USB 3.0 Interface

TPDxEUSB30
Get samples, datasheets and evaluation modules at: www.ti.com/sc/device/PARTnumber

Key Features The TPDxEUSB30 provides two ESD clamp circuits with flow-through pin
• Single-pair differential lines to mapping for ease of board layout. This device has been designed to protect
protect the differential data and sensitive components that are connected to ultra high-speed data and
clock lines of the USB 3.0, eSATA, transmission lines. The TPDxEUSB30 offers protection from stress caused by
or LVD interface ESD. This device also offers 5-A (8/20-µs) peak pulse current ratings per IEC
• ESD protection meets or exceeds 61000-4-5 (lightning) specification.
IEC 61000-4-2 (level 4)
This device has 0.05-pF matching capacitance between differential lines and pin
±8-kV contact discharge
capacitance less than 0.7 pF. These features enable the TPDxEUSB30 to support
±8-kV air-gap discharge
data rates in excess of 6 Gbps supporting applications such as USB 3.0, eSATA or
• 5-A peak pulse current (8/20-µs LVDS interface.
pulse) for D+, D– lines
• 0.05-pF matching capacitance The TPDxEUSB30 conforms to IEC61000-4-2 (level 4) ESD protection.
between the differential signal pair
• Supports data rates in excess of
6 Gbps

Applications
• USB 3.0 high-speed TX+
• eSATA VRUS
• HDMI D+ 1
TX-

• LVDS 3 GND
USB 3.0 D-
Host/
1.05 mm

D- 2
GND 8 mm
Controller D+
RX+
1.05 mm

GND
RX-

Three TPD2EUSB30 to protect USB 3.0 Class A connector (requires only one layer of routing).

TX+
D1+ N.C.
VRUS

D1- N.C.
TX-
D-
USB 3.0
GND
GND GND 2.5 mm
Host/ 8 mm
D+
Controller
D2+ N.C. RX+

GND
D2- N.C.
RX-
1 mm

TPD4EUSB30 package. One TPD4EUSB30 and one TPD2EUSB30 to protect USB 3.0 Class A connector (two-layer routing).

System-Level ESD/EMI Protection Guide 7 Texas Instruments 2010

 System-Level ESD/EMI Protection Guide
➔ ESD Protection for VGA and DVI-I Ports
Integrated 7-Channel ESD Solution for the VGA Port
TPD7S019
Get samples, datasheets and evaluation modules at www.ti.com/sc/device/TPD7S019

Key Features The TPD7S019 is TI’s first integrated ESD solution for the VGA port. The
• Integrated 7-channel ESD solution device incorporates all of the necessary items for VGA lines: level shifting, ESD
with level shifting, buffering and protection, buffering and impedance matching. All of this combined gives the
sync impedance designer a single-chip device for the VGA port, eliminating the need for additional
• Exceeds IEC61000-4-2 (level 4) ESD ICs to complete the same functions that the TPD7S019 performs.
protection
±8-kV contact discharge
±15-kV human body model
• 4-pF loading cap on video lines
Level Level
• Buffer and impedance matching Shifting Shifting
resistor option for SYNC signals
15 Ω
EDS ESD
65 Ω Protection Protection TPD7S019
55 Ω

Applications Impedance Impedance

Matching Matching
• VGA and DVI-I ports in:
PCs
Graphics cards Signal Signal
Buffering Buffering
Set top boxes
TVs

Preview: TPD7S019-15
RSV Package
(Top View)
VCC_VIDEO
SYNC_Out2
VCC_VIDEO
VCC_SYNC

SYNC_IN2

16 15 14 13

VIDEO1 1 12 SYNC_Out1 VIDEO1 VIDEO2 VIDEO3

VIDEO2 2 11 SYNC_IN1

VIDEO3 3 10 DDC_Out2

GND 4 9 DDC_IN2 GND

5 6 7 8

BYP VBYNC
VCC_DDC
BYP
DDC_IN1

DDC_Out1

VCC_DDC

DDC_IN1 DDC_Out1 SYNC_IN1 SYNC_Out1

VCC_SYNC 1 16 SYNC_Out2
VCC_VIDEO 2 15 SYNC_IN2
VIDEO1 3 14 SYNC_Out1
VIDEO2 4 13 SYNC_IN1
DDC_IN2 DDC_Out2 SYNC_IN2 SYNC_Out2
VIDEO3 5 12 DDC_Out2
GND 6 11 DDC_IN2
VCC_DDC 7 10 DDC_IN1
BYP 8 9 DDC_Out1

System-Level ESD/EMI Protection Guide 8 Texas Instruments 2010

 System-Level ESD/EMI Protection Guide
➔ ESD Protection for HDMI/DVI

HDMI Receiver/Transmitter Port Protection and Interface Devices

TPD12S520/1
Get samples, datasheets and evaluation modules at www.ti.com/sc/device/PARTnumber

Key Features The TPD12S520 and TPD12S521 are single-chip ESD solutions for HDMI receiver
• TPD12S520: single-chip ESD and transmitter ports. In many cases, the core ICs, such as the scalar chipset,
solution for HDMI reveiver ports may not have robust ESD cells to sustain system-level ESD strikes. In these
• TPD12S521: single-chip ESD cases, the TPD12S520 and TPD12S521 provide the desired system-level ESD
solution for HDMI transmitter ports; protection, such as the IEC61000-4-2 (level 4) ESD, by absorbing the energy
offers on-chip regulator with 55-mA associated with the ESD strike.
current limit feature
While providing ESD protection, these devices add little to no glitch in the high-
• Meets IEC61000-4-2 (Level 4) ESD
speed differential signals due to the low I/O capacitance. Both of these devices
protection
offer a pin layout that is mapped to an HDMI connector, eliminating routing and
±8-kV contact discharge
reducing board layout complexity and cost. These devices also support Ioff
• Integrated level shifting for control (backdrive) protection for current in-rush events.
pins with additional LV supply
• Supports HDMI 1.3 data rate The TPD12S521 for transmitter ports provides an on-chip regulator with current
• 0.8-pF ultra-low cap for I/O output ratings of 55 mA for pin 38. This current enables HDMI receiver detection
• 0.05-pF matching cap between even when the receiver device is powered off. This enables the TPD12S521 to
TMDS provide ESD protection and line-drive capabilities on a single-chip solution.
• Backdrive protection
ESD_BYP
5-V_SUPPLY
Applications
• PCs TMDS_D2+ TMDS_D1+ TMDS_D0+ TMDS_CK+ Ioff
• Consumer electronics TMDS_GND TMDS_GND TMDS_GND TMDS_GND

• Set-top boxes TMDS_D2– TMDS_D1– TMDS_D0– TMDS_CK–

• DVDRW players
• HDTVs
LV Supply LV Supply

DDC_DAT_IN
1 38
CE_REMOTE_IN CE_REMOTE_OUT DDC_DAT_OUT

D2+
GND LV Supply LV Supply
D2–
D1+
GND
TPD12S520 D1– DDC_CLK_IN DDC_CLK_OUT HOTPLUG_DET_IN HOTPLUG_DET_OUT
D0+
GND
HDMI D0–
Core Chip CLK+
GND TPD12S520/1 electrical schematic.
CLK–
CE_R
NC
D_CK VCC VCC
19 20 D_DT
GND
5OUT
HTDT Off
Board layout example for TPD12S520. HDMI VCC = 0
Connector Connector
and
Cable
HDMI
HDMI
(Active)
Power Down
I (Backdrive) Power On

Ioff (backdrive protection) is very important for any data-cable connection where one side may
be in power-on mode while the other is in power-down mode. This prevents the current back-
flows to the power-down circuit from any damage, eliminating the need for an external diode.

System-Level ESD/EMI Protection Guide 9 Texas Instruments 2010

 System-Level ESD/EMI Protection Guide
➔ ESD Protection for Portable HDMI

HDMI Companion Chip with Step-Up Converter, I2C Level Shifter and High-Speed ESD Clamps
TPD12S015
Get samples, datasheets and evaluation modules at www.ti.com/sc/device/TPD12S015

Key Features The TPD12S015 integrates a unique combination of eight low-capacitance ESD
• Integration of DC/DC charge pump, clamps, I2C level shifters, and a power-saving DC/DC converter, saving system
voltage translation level shifter and designers almost three times the board space and significantly reducing overall
ESD protection reduces 76% board system cost. The integrated ESD clamps and resistors provide good matching
space and 30% cost compared to between each differential signal pair to provide an advantage over discrete ESD
discrete solutions. clamp solutions, where variations between ESD clamps degrade the differential
• Pin layout matches HDMI type C/D signal quality. The TPD12S015 allows HDMI 1.3 data rates and provides
connector which allows for single- IEC61000-4-2 (level 4) ESD protection.
board layout design
The TPD12S015 has an internal boost converter circuit. This DC/DC converter
• The DDC and CEC control lines
generates a steady 5-V output from a 2.3 to 5.5-V source to drive the HDMI
can drive a 750-pF load, resulting in
5V_Out pin. This eliminates the need for an external DC/DC converter for portable
longer cable lengths
applications. The TPD12S015 also has a directionless level shifter with integrated
• Meets IEC 61000-4-2 (level 4)
pull-up resistors and one-shot circuits. There are three non-inverting bidirectional
system-level ESD protection
translation circuits for the SDA, SCL and CEC lines. Each has a common power
±8-kV contact discharge rail (VCCA) on the A side from 1.1 V to 3.6 V. On the B side, the SCL_B and SDA_B
• 1-pF I/O capacitance for 8-channel each have an internal 1.75 kΩ pullup connected to the regulated 5-V rail (5VOUT).
ESD protection The SCL and SDA pins meet the I2C specification and drive up to 750-pF loads.
• Differential matching capacitance The CEC_B pin has an internal 27 kΩ pullup to an internal 3.3 V.
of .05 pF
5V 3.5 V (internal)

ERC ERC
Applications 1.75 kΩ 26 kΩ±15%
• Smart phones
SCL_A SCL_B CEC_A CEC_B
• Multimedia phones
5V
• Digital camcorders
ERC
• Digital still cameras 1.75 kΩ
• Portable game consoles
SDA_A SDA_B
YFF Package
(Top View)

1 2 3 4

A TPD12S015 directionless level shifter with integrated pull-ups +5-V Power

B and one-shot circuits.
C

E
CLK- CLK+ D2- D2+ D1- D1+ D0- D0+
F

YFF Package Pin Mapping

1 2 3 4 GND

VBAT DC/DC
A LS_OE VCCA D2+ D2–
Converter
+5-V Power
B SCL_A CEC_A GND D1+ CT_CP_HPD*
C SDA_A HPD_A GND D1–
LS_OE*
D CT_CP_HPD GND CEC_B D0+ LDO
3.3 V (internal)
E FB GND SCL_B D0– VCCA 5-V
HPD_A HPD_B
F 5VOUT SW SDA_B CLK+
G PGND VBAT HPD_B CLK– 10 kΩ

TPD12S015 internal boost converter circuit.

System-Level ESD/EMI Protection Guide 10 Texas Instruments 2010

 System-Level ESD/EMI Protection Guide
➔ ESD Protection for High-Speed Video and Data Interface

Ultra-Low, 0.8-pF Capacitance for High-Speed Differential Interface Applications

TPD8S009, TPD4S009, TPD4S010
Get samples, datasheets and evaluation modules at: www.ti.com/sc/device/PARTnumber

Key Features The TPD8S009, TPD4S009 and TPD4S010 provide ESD protection for high-speed
• Complies with the HDMI 1.3 and differential bus interfaces. These devices are ideal for any high-speed application
DisplayPort data rate up to 6 Gbps.
• System-level IEC-61000-4-2 (level 4) These interfaces provide ESD protection with ultra-low, 0.8-pF capacitance
ESD protection for less distortion during data transfer. They also provide ultra-low matching
±8-kV contact discharge capacitance to help improve the signal quality. All of these devices except for
• Differential matching of less than the TPD4S010 support Ioff (backdrive) protection circuits with an additional diode
0.05 pF on the VCC line.
• Pin capacitance less than 0.8 pF
• Ioff feature for TPD8S009 and
TPD4S009 D0+ 1 D1+ 1 6 D1– D1+ 1 10 N.C.

GND 2 D1– 2 9 N.C.

Applications D0– 3
GND 2 5 VCC
GND 3 8 VCC
15 VCC
• LVDS D1+ 4 D2+ 4 7 N.C.
D2+ 3 4 D2–
• HDMI/DVI GND 5 D2– 5 6 N.C.

• DisplayPort D1– 6 TPD4S009 (PGV or DCK)

14 N.C. TPD4S009 (DGS)
• eSATA interface D2+ 7

• Serial link GND 8 D1+ 1 6 D1– D1+ 1 10 N.C.

D2– 9
• Ethernet 13 VCC 2 5 VCC
D1– 2 9 N.C.
GND
10
• PCI Express® D3+
GND 3 8 GND
GND 11 3 4 D2–
D2+ 4 7 N.C.
D2+
D3– 12
TPD4S009 (DRY)
D2– 5 6 N.C.
TPD8S009 (DSM)
TPD4S010 (DQA)
Package options.

TPD8S009

1
2
3
4
5
6
7
8
9
Core Scalar/
10
Switch
11
12
13
14
TPD4S010
15
16
17
18
19
20

TPD8S009 and TPD4S010 in DisplayPort application.

System-Level ESD/EMI Protection Guide 11 Texas Instruments 2010

 System-Level ESD/EMI Protection Guide
➔ ESD Protection for 1394 Ports
Firewire ESD Clamp with Live-Insertion Detection Circuit
TPD4S1394
Get samples, datasheets and evaluation modules at www.ti.com/sc/device/TPD4S1394

Key Features The TPD4S1394 provides a robust system-level ESD solution for the IEEE
• Integrated late Vg detection 1394 port along with a live insertion detection mechanism for high-speed lines
mechanism generates FWPWR_EN interfacing a low-voltage, ESD-sensitive core chipset. This device protects and
flag monitors up to two differential input pairs. The optimized line capacitance allows
• System-level IEC 61000-4-2 ESD it to protect the data lines with data rates in excess of 1.6 GHz without degrading
protection for high-speed signal integrity.
applications
The TPD4S1394 incorporates a live insertion circuit whose output state changes
Passes 8 KV in 1394 system
when improper voltage levels are present on the input data lines. The FWPWR_EN
interface
signal controls an external FireWireTM port power switch. During the live insertion
±15-kV human body model
event, if there is a floating GND or a high-level signal at the D+, D– pins, the
• Low I/O capacitance internal comparator will detect the changes and pull the FWPWR_EN signal to
1.5 pF pin capacitance low state. When FWPWR_EN is driven low, there is an internal delay mechanism
• On-chip 600-ms timer delay preventing it from being driven to the high state regardless of the inputs to the
mechanism comparator.
• Flow-through, single-in-line pin
mapping Additionally, it performs ESD protection on the four input pins: D1+, D1–, D2+ and
D2–. It conforms to the IEC61000-4-2 (level 4) ESD protection and ±15-kV HBM
Applications ESD protection. The TPD4S1394 is characterized for operation over ambient air
temperatures of –40°C to 85°C.
• IEEE 1394 live insertion protection
• LVDS

D1+
Vcc

D1–
GND
1394
Controller TPD4S1394
VCLMP
D2+
FWPWR_EN
D2–

1394 Connector.

System-Level ESD/EMI Protection Guide 12 Texas Instruments 2010

 System-Level ESD/EMI Protection Guide
➔ ESD Protection for Keypads
8-Channel ESD Clamp Array
TPD8E003
Get samples, datasheets and evaluation modules at www.ti.com/sc/device/TPD8E003

Key Features The TPD8E003 is an array of eight ESD clamps in a space-saving SON (DQD)
• Eight-channel ESD clamp array to package. This integrated transient voltage suppressor device is designed for
enhance system-level ESD applications requiring system-level ESD robustness. It is intended for use
protection in space-constrained equipment such as portable computers, cell phones,
• Exceeds IEC61000-4-2 (level 4) ESD communication keypad systems and other applications. Its integrated design
protection offers superior matching between multiple lines over discrete ESD clamp
solutions.
± 12-kV contact discharge
± 15-kV air-gap discharge
The TPD8E003 includes ESD protection circuitry that prevents damage to the
• 3.5-A peak pulse current (8/20 µsec) application when subjected to ESD stress exceeding IEC 61000-4-2 (level 4). The
• Low breakdown voltage of 6 V TPD8E003 is specified for –40°C to 85°C operation.

Applications
• Keypad
• Touch-screen interface
• Memory interface
• Docking connector interface

A Through via (6 mils)

B GND via (6 mils)

C Top layer trace (4 mils wide)

DQD Package
D Bottom layer trace (4 mils wide)
(Top View) E
F
IO1 1 8 IO8
G
IO2 2 7 IO7 Keypad H
GND Controller I
IO3 3 6 IO6
J
D2+
IO4 4 5 IO5 K
D2–
L
M
N
O
P

Y
Z
TPD8E003DQDR at keypad interface.

System-Level ESD/EMI Protection Guide 13 Texas Instruments 2010

 System-Level ESD/EMI Protection Guide
➔ EMI Filters
2-Channel EMI Filter for Audio Headphones
TPD2F702
Get samples, datasheets and evaluation modules at www.ti.com/sc/device/TPD2F702

Key Features The TPD2F702 is a two-channel EMI filter for audio interface applications. With
• 2-channel EMI filtering for audio the integration of a 5000-pF capacitor in a space-saving low-noise WCSP
ports package, the TPD2F702 offers superior EMI noise suppression (2 MHz to 6 GHz)
AVIF connector, headphone compared to discrete implementation. The device is optimized for AVIF connector
or speaker port interfaces. This low-pass filter array also provides system level
• Exceeds level 4 ESD protection on
ESD protection to eliminate the need for external ESD clamps. The TPD2F702
connector
exceeds ±30-kV ratings per IEC61000-4-2 contact and air-gap specifications.
±30-kV contact discharge
±30-kV air-gap discharge The TPD2F702 is a highly integrated device designed to suppress EMI/RFI noise
• Pi-style (C-R-C) filter configuration in all systems subjected to electromagnetic interferences. This filter includes ESD
with -3-dB bandwidth at 1.2 MHz protection circuitry, which prevents damage to the application when subjected to
(R=15 Ω, CTOTAL = 5000 pF) ESD surges far exceeding IEC 61000-4-2 (level 4).
• Low 10-nA leakage current
• WCSP packages and flow-through
pinout

Applications
• Mobile phones
• Headsets TPD2F702

• PDAs Out R
• Portable gaming 5000 pf
Audio Amp/
Audio Codec 5000 pf
Out L

SGND

Sample TPD2F702 application.

0.0
3dB drop/bias of 0.0V
TPD2F702 YFK Package -5.0 -3dB = 1.18 MHz
(Top View)
3dB drop/bias of 2.5V
-10.0
0.9 mm -3dB = 1.28 MHz

-15.0 Legend
(DC Bias @ 0.0V)
Insertion Loss (dB)

-20.0 (DC Bias @ 2.5V)

1.3 mm
-25.0

-30.0

0.625 mm -35.0

-40.0
0.9 mm

-45.0

-50.0
1.00E+05 1.00E+06 1.00E+07 1.00E+08 1.00E+09
Frequency (Hz)
Frequency vs. dB for TPD2F702.

System-Level ESD/EMI Protection Guide 14 Texas Instruments 2010

 System-Level ESD/EMI Protection Guide
➔ EMI Filters
Space-Saving EMI Filters
TPDxF003
Get samples, datasheets and evaluation modules at www.ti.com/sc/device/PARTnumber

Key Features The TPD4F003, TPD6F003 and TPD8F003 are four-, six-, and eight-channel EMI
• 4-, 6-, or 8-channel EMI filter with filters in space-saving 0.4-mm pitch DQD packages. The low-pass filter arrays
greater than 25-dB attenuation reduce EMI emissions and provide system-level ESD protection.
at 1 GHz
• System-level IEC 61000-4-2 ESD Because of its small package and easy-to-use pin assignments, TPDxF003 filters
protection are suitable for a wide array of applications, such as mobile handsets, PDAs,
video consoles, notebook computers, etc. In particular, these filters are ideal for
± 12-kV contact discharge
EMI filtering and protecting data lines from ESD at the LCD display, keypad and
± 20-kV air-gap discharge
memory interfaces.
± 15-kV human body model
• Pi-style C-R-C topology with 26 Pin SD Card
-3-db bandwidth at 200 MHz MicroSD Card
(R = 100 Ω, CTOTAL = 17 pF)
34 mm ExpressCard | 34 32 mm 11 mm
• Flow-through package layout
• Operating I/O voltage range up
15 mm
to 5.5 V 75 mm 24 mm
• Low 10-nA leakage current

Applications
• LCD display interface
• Keypad
• Memory interface
• Cell phones GND Memory
Memory Connector
• SVGA video connections Controller
• PDAs

TPDxF003 typical use circuit.

TPD4F003 (DQD) TPD6F003 (DQD) TPD8F003 (DQD)

Ch1_In 1 8 Ch1_Out Ch1_In 1 12 Ch1_Out Ch1_In 1 16 Ch1_Out

Ch2_In 2 7 Ch2_Out Ch2_In 2 11 Ch2_Out Ch2_In 2 15 Ch2_Out

GND
Ch3_In 3 6 Ch3_Out Ch3_In 3 10 Ch3_Out Ch3_In 3 14 Ch3_Out
GND
Ch4_In 4 5 Ch4_Out Ch4_In 4 9 Ch4_Out Ch4_In 4 13 Ch4_Out
GND
1.7mm x 1.35mm x 0.75mm Ch5_In 5 8 Ch5_Out Ch5_In 5 12 Ch5_Out
(0.4mm pitch)
Ch6_In 6 7 Ch6_Out Ch6_In 6 11 Ch6_Out

Ch7_In 7 10 Ch7_Out
2.5 mm x 1.35 mm x 0.75 mm
(0.4 mm pitch)
Ch8_In 8 9 Ch8_Out

3.3 mm x 1.35 mm x 0.75 mm

Functional TPDxF003 board. (0.4 mm pitch)

System-Level ESD/EMI Protection Guide 15 Texas Instruments 2010

 System-Level ESD/EMI Protection Guide
➔ EMI Filters
4- and 6-Channel EMI Filters for LCD Display
TPDxF202
Get samples, datasheets and evaluation modules at www.ti.com/sc/device/PARTnumber

Key Features The TPDxF202 is a four- and six-channel EMI filter in space-saving SON
• Low 10-nA leakage current packages. This low-pass filter array reduces EMI emissions and provides
• Ultra-thin YFU package system-level ESD protection. It is used on mobile-phone LCD or memory
interfaces. The pi-style (C-R-C) filter provides at least 30-dB attenuation in the
1.06 mm x 1.57 mm x 0.3 mm
carrier frequency range (800 to 2700 MHz).
• Exceeds IEC 61000-4-2 system-
level ESD protection
The TPDxF202 is a highly integrated device designed to suppress EMI/RFI noise
± 25-kV contact discharge in all systems subjected to electromagnetic interferences. This filter includes an
± 25-kV air-gap discharge ESD protection circuitry that prevents damage to the application when subjected
• Pi-style (C-R-C) filter configuration to ESD strikes up to IEC 61000-4-2 (level 4).
with greater than -32 dB attenuation
at 1 GHz (R = 100 Ω, CTOTAL = 15 The TPDxF202 is specified for –40°C to 85°C operation.
pF)
• Cut-off frequency at 108 MHz TPD4F202 TPD6F202
YFU Packaging YFU Packaging
(Top View) (Top View)
Applications 1 2 3 Pin Mapping 1 2 3 Pin Mapping
• LCD interface A Pin No. Name A Pin No. Name

• Cell phones B A1 Ch1_In B A1 Ch1_In

C C
• SVGA video connections A3 Ch1_Out A3 Ch1_Out
• PDAs D B2 GND D B2 GND
E C1 Ch2_In E C1 Ch2_In
F F C3 Ch2_Out
C3 Ch2_Out

D1 Ch3_In G D1 Ch3_In

H D3 Ch3_Out
D3 Ch3_Out
I E2 GND
E2 GND
F1 Ch4_In
F1 Ch4_In
F3 Ch4_Out
F3 Ch4_Out
G1 Ch5_In

G3 Ch5_Out

H2 GND

J1 Ch6_In

J3 Ch6_Out

Display LCD
Controller

Top view of TPD6F202 usage example.

System-Level ESD/EMI Protection Guide 16 Texas Instruments 2010

 Resources
➔ Packaging Solutions
TI offers the most robust packaging layout.
solutions for ESD/EMI devices. With
over eight package types ranging from
0.18 mm2 PicoStarTM packages to
62 mm2 TSSOP, we have packaging
solutions that can fit into any design. 1 12

From the PicoStarTM package that can

2 11

3 10

be embedded into the PCB to 38-pin 4 9

Package Size
TSSOP designed for easy board layout 5 8
(6.5 mm x 2.5 mm)
6 7

(see page 9), there are options for 1

2
6

5 (2.5 mm x 1.35 mm)

every design. A1 A2
3 4
(1.053 mm x 2.35 mm)
B2
(1.45 mm x 1 mm)
C1 C2

TM
PicoStar Package Solutions: (1 mm x 1 mm) (1 mm x 1 mm)
(0.8 mm x 0.8 mm)
Portable consumer electronics (0.6 mm x 0.3 mm)

designers can save board space

Bit Width
with intergrated circuits (ICs) in the TI packages for ESD/EMI solutions.
PicoStarTM package from Texas
Instruments. The ultra-thin package,
about as thin as a human hair, is the
first to give system designers the
Normal top layer mounting
option to embed silicon components
inside the printed circuit board (PCB)
to maximize board space. Devices
in this form factor are 50 percent
thinner than similar chips in traditional 1 mm
packages and enable smaller, thinner <0.15 mm
end equipment.
PCB Metal Layers
The PicoStarTM package is thin enough PicoStarTM Package
to be embedded inside the PCB,
PicoStarTM package embedded in PCB board. Height of the total PCB board is 1 mm.
mounted under a connector, or placed
under some discrete components. The
images here show the space-saving
capabilities of this package for board

0.3 mm (height) YFU package under the Zif connector.

0.13 mm (height) PicoStarTM package under

ceramic inductor.

System-Level ESD/EMI Protection Guide 17 Texas Instruments 2Q 2010

 Resources
➔ ESD/EMI Protection Device List
General-Purpose ESD Protection
IEC61000-4-2 I/O
No. of Supply Voltage VBR (min)
Device Level 4 Diagram Cap Packages
Channels (Vdd) (V)
Protection (pF)

IO

*TPD1E14A4 Yes 1 n/a -8 to +15 4 2-0201 (YFW)

GND

VCC

TPD2E001 Yes IO 1 IO 2 5-SOT, 6-SON,

2 0.9 to 5.5 11 1.5 4-SOP

GND

IO 1 IO 2
TPD2E009 Yes 2 –0.3 to 6 9 0.8 3-SOT, 6-SON

GND

VCC

IO 1 IO 2 IO 3
TPD3E001 Yes 3 0.9 to 5.5 11 1.5 5-SOT, 6-SON

GND

VCC

IO 1 IO 2 IO 3 IO 4
TPD4E001 Yes 4 0.9 to 5.5 11 1.5 6-SOT, 6-SON

GND

VCC

IO 1 IO 2 IO 3 IO 4 IO 5 IO 6
TPD6E001 Yes 6 0.9 to 5.5 11 1.5 10-/12-QFN

GND

*Subject to change. Call Product Information Center. See page 24 for contact information. Preview products are listed in bold blue.

System-Level ESD/EMI Protection Guide 18 Texas Instruments 2010

 Resources
➔ ESD/EMI Protection Device List

General-Purpose ESD Protection (continued)

IEC61000-4-2
No. of Supply Voltage VBR (min) I/O Cap
Device Level 4 Diagram Packages
Channels (Vdd) (V) (pF)
Protection

VCC

IO 1 IO 2 IO 3 IO 4
TPD4E004 Yes 6 0.9 to 5.5 6 1.6 6-SOT, 6-SON

GND

VCC

IO 1 IO 2 IO 3 IO 4 IO 5 IO 6
TPD6E004 Yes 6 0.9 to 5.5 6 1.6 8-QFN

GND

VCC

TPD4S009 Yes D1+ 6-SOT, 6-SC70,

D2+ 4 0.9 to 5.5 9 0.9 6-SON
D2– D1–

GND

D2+ D1+
TPD4S010 Yes D2– D1– 4 0.9 to 5.5 9 0.9 10-QFN

GND

IO1 IO2

4-DSLGA (YFM)
TPD2E007 Yes 2 n/a ±14 10 3-SC70 (3-DCK)

GND

System-Level ESD/EMI Protection Guide 19 Texas Instruments 2010

 Resources
➔ ESD/EMI Protection Device List

General-Purpose ESD Protection (continued)

IEC61000-4-2
No. of Supply Voltage VBR (min) I/O Cap
Device Level 4 Diagram Packages
Channels (Vdd) (V) (pF)
Protection

D- D+
TPD2EUSB30 Yes 2 n/a 9 0.7 3-SOT

GND

Vcc (Optional)

Ch1_In Ch1_Out

TPD2S017 Yes 2 0 to 5 11 1 6-SOT-23

Ch2_In Ch2_Out

GND

IO1 IO2 IO3 IO4

TPD4E002 Yes 4 n/a 6 11 5-SOT

IO4
IO1
IO2 IO3 6-PicoStarTM
*TPD4E281 Yes 4 n/a 4.5 2.5 Package

GND

VBUS

D+
D+, D-, ID
D-
TPD4S012 Yes 4 –0.3 to 20 =6 0.8 6-SON
ID VBUS = 20

GND

*Subject to change. Call Product Information Center. See page 24 for contact information. Preview products are listed in bold blue.

System-Level ESD/EMI Protection Guide 20 Texas Instruments 2010

 Resources
➔ ESD/EMI Protection Device List

General-Purpose ESD Protection (continued)

IEC61000-4-2
No. of Supply Voltage VBR (min) I/O Cap
Device Level 4 Diagram Packages
Channels (Vdd) (V) (pF)
Protection

VCMLP
VCC FWPER_EN
D2+ D2- D1+ D1-

TPD4S1394 Yes 4 0 to 4.6 4.2 1.5 8-SON

GND

Vcc

GND

TPD8S009 Yes 8 –0.3 to 6 9 0.8 15-SON

D3- D3+ D2- D2+ D1- D1+ D0- D0+

GND

General-Purpose EMI Protection

IEC61000-4-2 Supply I/O
No. of VBR (min) -3-dB
Device Contact Diagram Voltage Cap Packages
Channels (V) Bandwidth
(kV) (Vdd) (pF)

Ch_In 15 Ω Ch_Out

IEC 6100-4-2 30 pF IEC 6100-4-2

TPD2F702 ±8 (Level 1) ESD (Level 4) ESD 2 ±14 15 5,000 5-WCSP 1.2 MHz
5000 pF

GND

100 Ω
Ch_In Ch_Out

8.5 pF
TPD4F003 ±8 4 6 100 17 8-WSON 200 MHz
8.5 pF

GND

System-Level ESD/EMI Protection Guide 21 Texas Instruments 2010

 Resources
➔ ESD/EMI Protection Device List

General-Purpose EMI Protection (continued)

IEC61000-4-2 Supply I/O
No. of VBR (min) -3-dB
Device Contact Diagram Voltage Cap Packages
Channels (V) Bandwidth
(kV) (Vdd) (pF)

100 Ω
Ch_In Ch_Out

TPD6F002 ±20 C1 = 17 pF 6 6 100 34 12-SON 100 MHz

C2 = 17 pF

GND

100 Ω
Ch_In Ch_Out

8.5 pF
TPD6F003 ±8 6 6 100 17 12-WSON 200 MHz
8.5 pF

GND

100 Ω
Ch_In Ch_Out

8.5 pF
TPD8F003 ±8 8 6 100 17 16-WSON 200 MHz
8.5 pF

GND

ESD Protection Device List

IEC61000-4-2 IEC61000- No. Of Supply VBR (min) I/O Capacitance
Device Pin/Package   Application
Contact (kV) 4-2 Level 4 Channels   Voltage (V) (pF)

Audio, industrial, portable

*TPD1E14A4 ±15 Yes 1 n/a -8 to +15 4 2-0201 (YFW)
computer, cell phones

4-SOP (DZD) 5-SOT (DRL)

TPD2E001 ±8 Yes 2 0.9 to 5.5 11 1.5 USB 2.0, Ethernet, FireWireTM
6-SON (DRS,DRY)

4-DSLGA (YFM), 3-SC70

TPD2E007 ±8 Yes 2 n/a ±14 10 RS-232/RS-485, audio port
(3-DCK)

TPD2E009 ±8 Yes 2 n/a 7 0.7 3-SOP (DBZ), 3-SOT (DRT) FirewireTM, eSATA, LVDS signaling

TPD2EUSB30 ±8 Yes 2 n/a 7 0.7 3-SOT (DRT) USB 3.0

TPD2S017 ±11 Yes 2 0 to 5 11 1 6-SOT-23 (DBV) USB 2.0 High Speed

5-SOT (DRL)
TPD3E001 ±8 Yes 3 0.9 to 5.5 11 1.5 USB OTG
6-SON (DRS,DRY)

USB 2.0, Ethernet,

TPD4E001 ±8 Yes 4 0.9 to 5.5 11 1.5 6-SON (DRS), 6-SOT (DRL)
FireWireTM, eSATA

TPD4E002 ±15 Yes 4 n/a 6.1 11 5-SOT (DLR) USB 2.0 Full Speed

*Subject to change. Call Product Information Center. See page 24 for contact information. Preview products are listed in bold blue.

System-Level ESD/EMI Protection Guide 22 Texas Instruments 2010

 Resources
➔ ESD/EMI Protection Device List
ESD Protection Device List (continued)
IEC61000-4-2 IEC61000- No. Of Supply VBR (min) I/O Capacitance
Device Pin/Package   Application
Contact (kV) 4-2 Level 4 Channels   Voltage (V) (pF)

USB 2.0 High Speed, Ethernet,

TPD4E004 ±8 Yes 4 0.9 to 5.5 6 1.6 6-SON (DRY)
FireWireTM, eSATA

*TPD4E281 ±8 Yes 4 n/a 4.5 2.5 6-PicoStarTM Package (YFM) Memory, USB 2.0 High Speed

10-MSOP (DGS) 
TPD4S009 ±8 Yes 4 0 to 5.5 9 0.8 6-SC-70 (DCK), 6-SON (DRY), eSATA, LVDS signaling, HDMI
6-SOT-23 (DBV)

TPD4S010 ±8 Yes 4 n/a 9 0.8 6-SON (DQA) eSATA, LVDS signaling, HDMI

D+, D-, ID = 6 USB 2.0 High Speed (charging

TPD4S012 ±10 Yes 4 0 to 20 0.8 6-SON (DRY)
VBUS = 20 applications)

TPD4S1394 **±8 Yes 4 0 to 4.6 4.2 1.5 8-X2SON (DQL) 1394/FireWireTM

10-UQFN (RSE), USB 2.0, Ethernet,

TPD6E001 ±8 Yes 6 0.9 to 5.5 11 1.5
12-WQFN (RSF) FireWireTM, eSATA

USB 2.0, Ethernet, FireWireTM,

TPD6E004 ±8 Yes 6 0.9 to 5.5 6 1.6 8-UQFN (RSE)
eSATA
16-SSOP (DBQ),
TPD7S019 ±8 Yes 7 0 to 5.5 9 2.5 VGA DisplayPort
16-UQFN (RSE)

Keypad, touch-screen interface,

TPD8E003 ±12 Yes 8 n/a 6 7 8-WSON (DQD)
Memory, SDIO, SIM card

TPD8S009 ±8 Yes 8 0 to 55 9 0.8 15-SON (DSM) HDMI, DisplayPort, LVDS signaling

TPD12S015 ±8 Yes 12 2.3 to 5.5 9 1.3 28-DSBGA (YFP) HDMI Class C/D connector

TPD12S520 ±8 Yes 12 0 to 5.5 9 0.8 38-TSSOP (DBT) HDMI receiver port

TPD12S521 ±8 Yes 12 0 to 5.5 9 0.8 38-TSSOP (DBT) HDMI transmit port

*Subject to change. Call Product Information Center. See page 24 for contact information. Preview products are listed in bold blue.
**Passes 8 KV in 1394 system interface.

EMI Protection Device List

Air-Gap Contact No. of VBR (min) Rline (typ) Ctotal (typ) -3-dB
Device Pin/Package Application
(kV) (kV) Channels (V) (Ohms)   (pF)   Bandwidth

TPD2F702 ±30 ±30 2 ±14 15 5,030 5-WCSP (YFK) 1.2 MHz Audio

TPD4F003 ±20 ±12 4 6 100 17 WSON (8-DQD) 200 MHz Memory, LCD display, keypad

TPD4F202 ±25 ±25 4 6 100 30 DSBGA (10-YFU) 108 MHz Memory, LCD display, keypad

TPD6F002 ±30 ±20 6 6 100 34 SON (12-DSV) 100 MHz Memory, LCD display, keypad

TPD6F003 ±20 ±12 6 6 100 17 WSON (12-DQD) 200 MHz Memory, LCD display, keypad

TPD6F202 ±25 ±25 6 6 100 30 DSBGA (15-YFU) 108 MHz Memory, LCD display, keypad

TPD8F003 ±20 ±12 8 6 100 17 WSON (16-DQD) 200 MHz Memory, LCD display, keypad

TPD3F303 ±15 ±8 3 6 47 20 SON (8-DQD) 300 MHz SIM interface

TPD6F301 ±15 ±8 6 6 45 12 SON (16-DQD) 300 MHz SDIO interface

Preview products are listed in bold blue.

System-Level ESD/EMI Protection Guide 23 Texas Instruments 2010

TI Worldwide Technical Support
Internet Asia
Phone
TI Semiconductor Product Information Center Home Page International +91-80-41381665
support.ti.com Domestic Toll-Free Number
TI E2ETM Community Home Page Australia 1-800-999-084
e2e.ti.com China 800-820-8682
Hong Kong 800-96-5941
India 1-800-425-7888
Product Information Centers Indonesia 001-803-8861-1006
Americas Phone +1(972) 644-5580 Korea 080-551-2804
Brazil Phone 0800-891-2616 Malaysia 1-800-80-3973
New Zealand 0800-446-934
Mexico Phone 0800-670-7544 Philippines 1-800-765-7404
Fax +1(972) 927-6377 Singapore 800-886-1028
Internet/Email support.ti.com/sc/pic/americas.htm Taiwan 0800-006800
Thailand 001-800-886-0010
Europe, Middle East, and Africa Fax +886-2-2378-6808
Phone Email [email protected]
European Free Call 00800-ASK-TEXAS [email protected]
(00800 275 83927) Internet support.ti.com/sc/pic/asia.htm
International +49 (0) 8161 80 2121
Russian Support +7 (4) 95 98 10 701 Important Notice: The products and services of Texas Instruments
Incorporated and its subsidiaries described herein are sold subject to TI’s
Note: The European Free Call (Toll Free) number is not active in all ­countries. standard terms and conditions of sale. Customers are advised to obtain
If you have technical difficulty calling the free call number, please use the the most current and complete information about TI products and services
­international number above. before placing orders. TI assumes no liability for applications assistance,
Fax +(49) (0) 8161 80 2045 customer’s applications or product designs, software performance, or
infringement of patents. The publication of information regarding any
Internet support.ti.com/sc/pic/euro.htm other company’s products or services does not constitute TI’s approval,
Japan warranty or endorsement thereof.
Phone Domestic 0120-92-3326
B121709
Fax International +81-3-3344-5317 The E2E Community, platform bar and PicoStar are trademarks of
Domestic 0120-81-0036
Texas Instruments. All other trademarks are the property of their
Internet/Email International support.ti.com/sc/pic/japan.htm
Domestic www.tij.co.jp/pic respective owners.

© 2010 Texas Instruments Incorporated

Printed in U.S.A. by (Printer, City, State)

PRSRT STD
U.S. POSTAGE

14950 F.A.A. Blvd. PAID

Fort Worth, Texas 76155 DALLAS, TEXAS
PERMIT NO.
2758
Address service requested

SSZB130A
 IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are
sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard
warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where
mandated by government requirements, testing of all parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,
or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a
warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual
property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied
by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive
business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional
restrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all
express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not
responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably
be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing
such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products
and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be
provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in
such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at
the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are
designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated
products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:

Products Applications
Amplifiers amplifier.ti.com Audio www.ti.com/audio
Data Converters dataconverter.ti.com Automotive www.ti.com/automotive
DLP® Products www.dlp.com Communications and www.ti.com/communications
Telecom
DSP dsp.ti.com Computers and www.ti.com/computers
Peripherals
Clocks and Timers www.ti.com/clocks Consumer Electronics www.ti.com/consumer-apps
Interface interface.ti.com Energy www.ti.com/energy
Logic logic.ti.com Industrial www.ti.com/industrial
Power Mgmt power.ti.com Medical www.ti.com/medical
Microcontrollers microcontroller.ti.com Security www.ti.com/security
RFID www.ti-rfid.com Space, Avionics & www.ti.com/space-avionics-defense
Defense
RF/IF and ZigBee® Solutions www.ti.com/lprf Video and Imaging www.ti.com/video
Wireless www.ti.com/wireless-apps

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2010, Texas Instruments Incorporated