Multicore® Solder Pastes

MP200 Solder Paste Wide Process Window

TACK PRINT SPEED IPC/J-STD

DESCRIPTION/APPLICATION ALLOY % METAL LOAD (G./MM2) mm/sec. CLASSIFICATION

A high activity, soft, colorless, low residue, no-clean solder paste that
exhibits excellent print definition with long open and abandon time SN62/SN63
90
capabilities. High activity of the MP200 flux offers excellent wetting to a 63S4 1.1 25 - 200 ROL0
wide range of surface finishes, and an exceptional reflow process window. 90.5
(Anti-Tombstoning)
Is suitable for fine pitch, high speed printing applications. Pin testable.

Item number Product Description Package size Item number Product Description Package size
M00439 Sn63 MP200 AGS 90 500 Gram Jar M00443 Sn62 MP200 AGS 90 500 Gram Jar
M00440 Sn63 MP200 AGS 90 700 Gram Semco M00444 Sn62 MP200 AGS 90 700 Gram Semco
M00441 Sn63 MP200 AGS 90 1300 Gram Semco M00445 Sn62 MP200 AGS 90 1300 Gram Semco
M00447 Sn63 MP200 AGS 90 20CC EFD Cartridge M00448 Sn62 MP200 AGS 90 30CC EFD Cartridge
M00505 Sn63 MP200 AGS 90.5 750 Gram Proflow M00506 Sn62 MP200 AGS 90.5 750 Gram Proflow

M00449 Multi-Tak MP 200 30CC Cartridge M00479 63S4 MP200 ACP 90 500 Gram Jar
(Rework Flux) M00480 63S4 MP200 ACP 90 700 Gram Semco
M00481 63S4 MP200 ACP 90 1300 Gram Semco

CR36 No-Clean Solder Paste Highest Activity Offering

TACK PRINT SPEED IPC/J-STD

DESCRIPTION/APPLICATION ALLOY % METAL LOAD (G./MM2) mm/sec . CLASSIFICATION

A high activity, colorless residue, no-clean solder paste. CR36 exhibits

good abandon time, long stencil life, and minimal hot slump. It has excellent
wetting to a wide range of surface finishes. The activity of CR36 gives it an SN62/SN63 89.5 1.3 - 1.6 20 - 200 ROLO
exceptional reflow process window, making it suitable for both volume and
high mix manufacturing.

Item number Product Description Package size

M00086 Sn63 CR36 AGS 89.5 500 Gram Jar
M00219 Sn63 CR36 AGS 89.5 500 Gram Semco

LF320 Lead Free Paste Wide Process Window

TACK PRINT SPEED IPC/J-STD

DESCRIPTION/APPLICATION ALLOY % METAL LOAD (G./MM2) mm/sec . CLASSIFICATION

A no-clean flux system specially formulated for Pb-free

alloys. High temperature tolerance and wide printing capability. 96SC alloy 96SC 88 1.2 20-150 ROMO
(Sn 95.5, Ag 3.5, Cu 0.7%) reflows at 217°C.

Item number Product Description Package size

M00501 96SC LF320 AGS88 500 Gram Jar
M00502 96SC LF320 AGS88 600 Gram Semco

WS200 Water Wash Paste

TACK PRINT SPEED IPC/J-STD

DESCRIPTION/APPLICATION ALLOY % METAL LOAD (G./MM2) mm/sec . CLASSIFICATION

High performance water washable solder paste. Residues are readily

removed with DI water, without the need for a saponifier. WS200 has good SN62/SN63 90.5 0.8 25-100 ORH1
open time with excellent print definition and soldering activity.

Item number Product Description Package size Item number Product Description Package size
M00486 Sn63 WS200 AGS 90.5 500 Gram Jar M00488 Sn62 WS200 AGS 90.5 500 Gram Jar
M00487 Sn63 WS200 AGS 90.5 700 Gram Semco M00489 Sn62 WS200 AGS 90.5 700 Gram Semco
M00508 Sn63 WS200 AGS 90.5 1300 Gram Semco M00509 Sn62 WS200 AGS 90.5 1300 Gram Semco

21
Multicore® No-Clean Fluxes
X32-10 No-Clean Flux Clear Residue-Wide Process Window

DESCRIPTION/APPLICATION % SOLIDS % HALIDES ACID VALUE IPC CLASS APPLICATION

A general purpose halide-free low solids flux which leaves clean, dry boards 2.2 Zero 15.3 REMO Spray/Foam
after wave soldering. Suitable for foam and spray flux application systems.

Item number Package size

M00322 1 Gallon
M00320 5 Gallon
M00323 55 Gallon

MF200 Liquid Flux General Purpose - Lead-Free Compatible

DESCRIPTION/APPLICATION % SOLIDS % HALIDES ACID VALUE IPC CLASS APPLICATION

A general purpose halide-free flux with sustained activity to extend flux life in
dual wave and Pb-free wave soldering aplications. Suitable for spray flux 6.4 Zero 37 ORMO Spray/Foam
application systems.

Item number Package size

M00490 1 Gallon
M00491 5 Gallon
M00492 55 Gallon

MF300 VOC-free Clear Residue Resin Free

DESCRIPTION/APPLICATION % SOLIDS % HALIDES ACID VALUE IPC CLASS APPLICATION

General purpose VOC-free (water based), no-clean, halide-free and resin-free

flux with special formulation to minimize solder balling. Compatible with Pb- 4.6 Zero 48.5 ORMO Spray/Foam
free processes.

Item number Package size

M00469 1 Gallon
M00470 5 Gallon
M00471 55 Gallon

MFR301 IPA Based Rosin Flux

DESCRIPTION/APPLICATION % SOLIDS % HALIDES ACID VALUE IPC CLASS APPLICATION

Higher solids flux for better wetting on reduced solderability surfaces and to
minimize bridging on complex geometries. Fully Pb-free and dual 6.5 Zero 41 ROMO Spray/Foam
wave compatible.

Item number Package size

M00472 1 Gallon
M00473 5 Gallon
M00474 55 Gallon

22
Multicore® No-Clean VOC-Free Fluxes
MF101 Liquid Flux No Clean - VOC Free - Rosin Based Emulsion

DESCRIPTION/APPLICATION % SOLIDS % HALIDES ACID VALUE IPC CLASS APPLICATION

A unique rosin emulsion technology flux which combines the benefits of a

VOC-free flux with the sustained activity of rosin. This can be used in dual
wave applications for soldering bottom side SMD components. Excellent 6.5 - 7.0 Zero 40 ROMO Spray
activity produces a wide process window reducing defects and improving
hole-fill. Can be used in lead-free wave applications.

Item number Package size

M00372 1 Gallon
M00373 5 Gallon

Multicore® Water Wash Fluxes - IPA Based

Hydro-X/20 High Activity Flux

DESCRIPTION/APPLICATION % SOLIDS % HALIDES ACID VALUE APPLICATION

A high activity water washable flux designed for the soldering of the most
difficult electronic assemblies. Unique activator package enables a wider
process window and the soldering of all common electronic surfaces with 20 1.0 24 Spray/Foam
ease. Residues are readily and completely removed by water wash after
soldering. Suitable for lead-free wave soldering.

Item number Package size

M00274 1 Gallon
M00272 5 Gallon
M00273 55 Gallon

Multicore® Cored Wire

The Multicore® line of cored wire features the renowned multiple flux
cores technology to ensure even and consistent distribution of flux
throughout the solder wire. This reliability makes multicore solder
wire the first choice for automated wire soldering processes.

ALLOY OPTIONS ALLOY OPTIONS CONTENT

ITEM DESCRIPTION HALIDE CONTENT IPC CLASS
(SN/PB) (PB-FREE) (BY WEIGHT)*

X39 Halide free, no-clean, clear residues Zero ROLO 60/40, 63/37, SN62 96SC, 99C 1%

Halide free, no-clean, clear residue, increased

400 Zero ROLO 60/40, 63/37, SN62 96SC, 99C 2.2%
flux content for improved wetting.

No-clean, clear residue, minimal activation for

502 0.2% ROM1 60/40, 63/37, SN62 96SC, 99C 3%
increased wetting speed.

309 General purpose high activity for fast wetting. <1% ROM1 60/40, 63/37, SN62 96SC, 99C 3%

Hydro-X High activity water washable. 3% ORH1 60/40, 63/37, SN62 96SC, 99C 2%

*Flux content is nominal and may vary regionally due to market requirements. Please check with your regional supplier.

23
Multicore® Cleaners
Prozone SC01

DESCRIPTION/APPLICATION

Prozone SC01 is designed for the stencil cleaning and hand cleaning of process
soldering residues. A highly effective cleaner that dries rapidly (fast evaporation).

Item number Package size

M00290 1 Gallon
M00297 5 Gallon
M00296 55 Gallon

Other Multicore® Product Offerings

Solder Mask No-Clean Desoldering Wicks
Temporary solder resists used with circuit boards prior to soldering. Will withstand
flux and wave soldering operations. Suitable for use with copper, hand, robotic, Item number Description Length Width
pneumatic or template screening applications and brush. M293366 NCAA 5 ft. (1.524m) 1.5 mm (0.06in.)
M290996 NCAA 10 ft.(3.048m) 1.5 mm (0.06 in)
Item number Description Package size
M00390 NCAA 100 ft.(30.48 m) 1.5 mm (0.06 in.)
M292961 Spot-On Solder Mask 250 ml
M290998 NCAB 5 ft.(1.524m) 2.2 mm (0.08 in.)
M292967 Spot-On Solder Mask 5 liters
M291001 NCAB 100 ft.(3.048m) 2.2 mm (0.08 in.)
Mini Fluxers and Cleaners M291005 NCBB 5 ft.(1.524m) 2.7 mm (0.10 in.)
Perfect for SMT re-work
M291008 NCBB 10 ft.(30.48m) 2.7 mm (0.10 in.)
Controlled release flux and cleaner pen applicators. Range of compatible flux types M00393 NCBB 100 ft.(30.48 m) 2.7 mm (0.10 in.)
available. Ideal for controlled application of flux when carrying out SMT re-work. M291013 NCOO 5 ft.(1.524m) 0.8 mm (0.03 in.)
Cleaner pen easily removes residues.
M291017 NCOO 10 ft.(3.048m) 0.8 mm (0.03 in.)
Item number Description
M00385 MF-X33-04 No-Clean Tip Tinner Extends solder iron tip life
M293319 MF-X33S-07i No-Clean
M00387 MF-638125 RMA Type Handy, non-abrasive solder iron tip-tinner. Easily wets hot solder irons leaving a
brightly tinned tip. Improves hand soldering efficiency and extends tip life.
M293321 MF-Prozone Cleaner Adhesive pad allows easy mounting on or near the solder iron holder.

Item number Description

M293011 Tip-Tinner

24
 Technical Data Sheet

Product 3888
July 2003

PRODUCT DESCRIPTION TYPICAL PROPERTIES OF CURED MATERIAL

LOCTITE® 3888 Silver Filled Conductive Adhesive Cured for 24 hours @ 22°C.
provides the following product characteristics: Physical Properties:
Technology Epoxy Coefficient of Thermal Expansion, ASTM E <50×10-6
831-93, µm/(m°C)
Chemical Type Epoxy
Coefficient of Thermal Conductivity, W/m°C >1.50
Appearance (Resin) Silver pasteLMS Glass Transition Temperature, Tg, ASTM D 50
Appearance (Hardener) Clear to amber liquidLMS 3418-82, °C
Components Two part - Resin & Hardener Extractable Ionic Content:
Viscosity Thick paste Flourine, ppm <6.00
Cure Room Temperature Cure Chloride, ppm 95.80
Application Bonding Potassium, ppm 4.20
Key Substrates Electronic components Sodium, ppm 2.80
Other Application Areas Thermally conductive
Dispense Method Syringe Electrical Properties:
Operating Temperature Up to +80°C Volume Resistivity, MIL 883 E, Method 5011, <0.001
Ωcm
Product 3888 is designed for bonding of metals, ceramics,
rubbers and plastics as used in electronic parts, where good
adhesion combined with electrical and thermal conductivity is Cured for 1 hour @ 125°C.
required. Typical applications include solder replacement, Electrical Properties:
repair/rework of interconnections, and bonding of heat Volume Resistivity, MIL 883 E, Method 5011, ≤0.0005LMS
sensitive components where solder temperatures are Ωcm
impractical.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Specific Gravity @ 25°C 2.50 PERFORMANCE OF CURED MATERIAL
Hardness, Shore D 89 Cured for 24 hours @ 22°C.
Mix Ratio, Resin: Hardener 100:6 Adhesive Properties:
Pot life, minutes 90 Shear Strength, ASTM D 1002, N/mm²:
Aluminum ≥12

TYPICAL CURING PERFORMANCE

Recommended conditions for curing are exposure to room
temperature heat for 24 - 48 hours. Rate of cure and final GENERAL INFORMATION
strength will depend on the residence time at the cure This product is not recommended for use in pure oxygen
temperature. and/or oxygen rich systems and should not be selected as
a sealant for chlorine or other strong oxidizing materials.
Cure Speed vs. Time, Temperature
The following graph shows the rate of torque strength For safe handling information on this product, consult the
developed with time at different temperatures. These times are Material Safety Data Sheet (MSDS).
defined from the moment the adhesive reaches cure
temperature. In practice, total oven time may be longer to allow Storage
for heat up period. Store product in the unopened container in a dry location.
100 Storage information may be indicated on the product container
% Full Cured Strength @ RT

150°C 125°C 65°C labeling.

If supplied as separate containers of parts A and B, store
75 at room temperature for up to 6 months. If supplied
pre-mixed and frozen, store at -40°C for up to 1 year. Shelf
life will vary with speciality packages
50 Material removed from containers may be contaminated during
use. Do not return product to the original container. Loctite
cannot assume responsibility for product which has been
25 contaminated or stored under conditions other than those
previously indicated. If additional information is required,
please contact your local Technical Service Center or
0 Customer Service Representative.
0 20 40 60 80 100 120
Time at Temperature, minutes
 TDS Product 3888, July 2003

Loctite Material SpecificationLMS

LMS dated July 15, 2003. Test reports for each batch are
available for the indicated properties. LMS test reports include
selected QC test parameters considered appropriate to
specifications for customer use. Additionally, comprehensive
controls are in place to assure product quality and
consistency. Special customer specification requirements may
be coordinated through Henkel Loctite Quality.
Conversions
(°C x 1.8) +32 = °F
kV/mm x 25.4 = V/mil
mm x 0.039 = inches
mPas = cP
N/mm² x 145 = psi
N x 0.225 = lbs
Note
The data contained herein are furnished for information only
and are believed to be reliable. We cannot assume
responsibility for the results obtained by others over whose
methods we have no control. It is the user's responsibility to
determine suitability for the user's purpose of any production
methods mentioned herein and to adopt such precautions as
may be advisable for the protection of property and of persons
against any hazards that may be involved in the handling and
use thereof. In light of the foregoing, Henkel Loctite
Corporation specifically disclaims all warranties
expressed or implied, including warranties of
merchantability or fitness for a particular purpose, arising
from sale or use of Henkel Loctite Corporation’s products.
Henkel Loctite Corporation specifically disclaims any
liability for consequential or incidental damages of any
kind, including lost profits. The discussion herein of various
processes or compositions is not to be interpreted as
representation that they are free from domination of patents
owned by others or as a license under any Henkel Loctite
Corporation patents that may cover such processes or
compositions. We recommend that each prospective user test
his proposed application before repetitive use, using this data
as a guide. This product may be covered by one or more
United States or foreign patents or patent applications.
Trademark usage
LOCTITE is a Trademark of Henkel Loctite
Reference 0.0

Henkel Loctite Americas Henkel Loctite Europe Henkel Loctite Asia Pacific
+860.571.5100 +49.89.9268.0 +852.2233.0000
For the most direct access to local sales and technical support visit: www.loctite.com
MO218 Sell Sheet 7/3/05 5:36 pm Page 1

Multicore MP218

The solder paste you can rely on in any MP218 Attribute Process Benefit
environment Outstanding humidity resistance Reduces process variation due to
Reduce process variation in challenging climatic environments; – exhibits high coalescence environmental factors, a particular
even after 24 hours exposure to advantage where assembly is
cut down on paste wastage and minimize inventory and scrap–
75%RH. In independent testing carried out in hot and humid
just some of the advantages you can expect from using to IPC ANSI/J-STD-005 and conditions
Multicore MP218 solder paste from Henkel. JIS-Z-3284 standards
Superior slump resistance Reduced bridging
Today, it’s the norm for major electronics manufacturers to
Colorless residues Better cosmetic appearance
carry out assembly in several global locations, whether for
delivery expediency or to achieve economical advantage. But Soft, non-stick pin-testable Improves ease and reliability of in-
residues circuit testing and reduces
going through the source-and-trial process in each market to
frequency with which test probes
find solder products that give consistent results can be both require cleaning
time-consuming and expensive.
Optimized paste viscosity Suitable for fine pitch, high speed
printing up to 150 mm/s (6 in/s)
This is especially true of solder pastes, which are highly
Extended open time & tack-life Reduces material scrap
sensitive to temperature and humidity variations in the
operating environment. A non-ideal combination can cause Halide-free flux classification: High reliability of finished assembly
ROL0 to ANSI/J-STD-004 without cleaning
premature drying or promote excessive moisture absorption by
the paste, leading to problems with printing and component High tack force Resists acceleration forces during
placement, or creating solderballing defects during reflow. high speed placement, eliminating
skewed and missing component
and need for rework
Engineered for dependable performance, Long printer abandon times Reduces solder paste wastage,
wherever you must produce increases process efficiency

If you need a solder paste you can depend on to work under Excellent solderability Suitable for use on a wide range of
surface finishes including HASL,
various harsh climate conditions, and you’re not switching to
Ni/Au, immersion Sn, immersion Ag
lead-free manufacture just yet, then Multicore MP218 solder and OSP Cu
paste is designed for you. (If you need an equivalent lead-free
Wide printing and reflow Accommodates a wide range of
product, ask us about LF318 solder paste). Here are some of the process windows printer settings and reflow profiles.
benefits you’ll enjoy: Suitable for use in air and nitrogen
MO218 Sell Sheet 7/3/05 5:36 pm Page 2

Multicore MP218

Alloy powder data Reliability data

Available alloys Sn62, Sn63, 63S4* (Anti-tombstone) Test Specification Results
Powder particle size, µm 15-38 15-45 (63S4) 25-45 Copper Plate Corrosion ANSI/J-STD-004 Pass
Multicore powder size coding ADP ACP AGS Copper Mirror Corrosion ANSI/J-STD-004 Pass

Metal loading (% weight) 89.5% 89.5% 89.5 & 90% Chlorides and Bromides ANSI/J-STD-004 Pass

*63S4 (Anti-Tombstone Alloy): A drop-in replacement for standard lead alloys, the Surface Insulation Resistance ANSI/J-STD-004 Pass
anti-tombstone alloy works using a phased reflow process where a small amount (without cleaning) Telcordia GR-78-Core Pass
of SN62 wets both sides of the termination before the SN63 melting point is JIS-Z-3284 Pass
reached, tack-soldering components to the PCB and delivering a larger assembly
process window. Electromigration Telcordia GR-78-Core Pass
(without cleaning) JIS-Z-3284 Pass

Flux Activity Classification ANSI/J-STD-004 ROL0

Printing (without cleaning)

Multicore MP218 solder paste is available for stencil printing

down to 0.4 mm (0.016 in) pitch devices, with type 3 (AGS)
powder. Printing at speeds between 25 mm/s (1.0 in/s) & 150 mm/s Packaging
(6 in/s) can be achieved using laser cut, electro-polished, or Multicore MP218 solder paste is supplied in plastic jars, and
electroformed stencils and metal squeegees (preferably 60°). Semco cartridges. Other packaging types may be available on
request.
Reflow
Any available method of heating to effect reflow may be used, Storage and shelf life
including IR, convection, hot belt, vapor phase and laser
soldering. Please consult the MP218 Engineering Manual, Multicore MP218 should be stored at 0-10°C. Shelf life is 6
available from your local Henkel office, for examples of suitable months, provided the solder paste is stored tightly sealed in the
reflow profiles. original container at 0-10°C.

Cleaning Further product information

Multicore MP218 solder paste residues are no-clean and are A comprehensive engineering manual containing detailed
designed to be left on the PCB, since they do not pose a hazard technical data and application notes is available for Multicore
to long-term reliability. Should there be a specific requirement MP218 solder paste. For safe handling information on this
for residue removal, this may be achieved using conventional product, consult the Material Safety Data Sheet appropriate to
cleaning processes based on solvents such as Multicore MCF800, your region. Contact your local Henkel technical service
or suitable saponifying agents. For stencil cleaning and cleaning helpdesk to obtain copies.
board misprints, Multicore SC-01 Solvent Cleaner is
recommended.

Henkel Americas: +1 949 789 2500 Henkel Europe: +44 1442 278 000 Henkel Asia: +852 2233 0000 henkelelectronics.com
LT-4146
 Multicore LF318

The lead-free solder paste you can rely on in Engineered for dependable performance,
any production environment wherever or whatever you manufacture
Reduce process variation under challenging lead-free operating Helping manufactures to keep the competitive edge while
conditions; cut down on paste wastage; minimize inventory and moving towards lead-free, Multicore LF318 solder paste is
scrap – you can expect all of these advantages and more by designed to contribute flexibility and reliability to your
choosing Henkel’s Multicore® LF318 solder paste for your lead- manufacturing process – from printing to final testing -
free manufacturing. providing consistent results under various harsh climate
conditions that would normally cause process variation. If you
Multicore LF318 is the result of continuous improvement of need an equivalent Sn/Pb alloy product for use in a conventional
Henkel’s solder paste technology and offers an extremely wide process, ask us about MP218 solder paste.
process window and performance aspects that are important for
all electronics manufacturers carrying out assembly in several LF318 attribute Process Benefit
global locations. Outstanding humidity resistance Reduces process variation due to
– exhibits high coalescence environmental factors, a particular
Multicore LF318 also helps to ensure robust production even after 72 hours exposure to advantage where assembly is
27°C/80%RH carried out in hot and humid
processes under varying production conditions. Less forgiving
conditions
solder paste technologies may cause production downtime due
to temperature and humidity variations, but LF318's resistance Superior slump resistance Reduced bridging
to premature drying or moisture absorption prevents printing Colorless residues Improves cosmetic appearance,
or placement problems and solderballing defects from allows easy post-reflow inspection
occurring. Soft, non-stick pin-testable Improves ease and reliability of in-
residues circuit testing and reduces
frequency with which test probes
require cleaning

Optimized paste viscosity Suitable for fine pitch, high speed

printing up to 150 mm/s (6 in/s)

Extended open time & tack-life Reduces solder paste wastage

 Multicore LF318
Continued Reliability data
LF318 attribute Process Benefit
Test Specification Results
Low voiding Reduced risk of bridging on small
pitch BGA’s or CSP’s. Reduced risk Copper Plate Corrosion ANSI/J-STD-004 Pass
of decreased joint reliability and/or
outgassing Copper Mirror Corrosion ANSI/J-STD-004 Pass

Halide-free flux classification: High reliability of finished assembly Chlorides and Bromides ANSI/J-STD-004 Pass
ROL0 to ANSI/J-STD-004 without cleaning
Surface Insulation Resistance ANSI/J-STD-004 Pass
High tack force Resists acceleration forces during (without cleaning) Telcordia GR-78-Core Pass
high speed placement, eliminating JIS-Z-3284 Pass
the need for rework due to skewed
or missing components Electromigration Telcordia GR-78-Core Pass
(without cleaning) JIS-Z-3284 Pass
Long printer abandon times Reduces solder paste wastage,
increases process efficiency Flux Activity Classification ANSI/J-STD-004 ROL0
(without cleaning)
Excellent solderability Compatible with a wide range of
surface finishes including HASL,
Ni/Au, immersion Sn, immersion Ag
and OSP Cu Packaging
Wide printing and reflow Accommodates a wide range of Multicore LF318 solder paste is supplied in plastic jars and
process windows printer settings and reflow profiles. Semco cartridges. Other packaging types may be available on
Suitable for use in air and nitrogen request.

Storage and shelf life

Alloy powder data Multicore LF318 should be stored at 0-10°C. Shelf life is 6
months, provided the solder paste is stored tightly sealed in the
Available alloys 96SC (SAC387), 97SC (SAC305)
original container at 0-10°C.
Powder particle size, µm 20 - 45
Further product information
Multicore powder size coding AGS
A comprehensive engineering manual containing detailed
Metal loading (% weight) 88.5% technical data and application notes is available for Multicore
LF318 solder paste. For safe handling information on this
Printing product, consult the Material Safety Data Sheet appropriate to
your region. Contact your local Henkel technical service
Multicore LF318 solder paste is available for stencil printing
helpdesk to obtain copies.
down to 0.4 mm (0.016 in) pitch devices, with type 3 (AGS)
powder. Printing at speeds between 25 mm/s (1.0 in/s) & 150
Cleaning
mm/s (6 in/s) can be achieved using laser cut, electro-polished,
Multicore LF318 solder paste residues are no-clean and are
or electroformed stencils and metal squeegees (preferably 60°).
designed to be left on the PCB, since they do not pose a hazard
Reflow to long-term reliability. Should there be a specific requirement
for residue removal, this may be achieved using conventional
Any available method of heating to effect reflow may be used,
cleaning processes based on solvents such as Multicore MCF800,
including IR, convection, hot belt, vapor phase and laser
or suitable saponifying agents. For stencil cleaning and cleaning
soldering. Please consult the LF318 Engineering Manual,
board misprints, Multicore SC-01 Solvent Cleaner is
available from your local Henkel office, for examples of suitable
recommended.
reflow profiles.

Henkel Americas: +1 949 789 2500 Henkel Europe: +44 1442 278 000 Henkel Asia: +852 2233 0000 henkelelectronics.com